WO2002054480A1 - Systeme d'eclairage pour dispositif d'inspection de microcircuits montes en applique - Google Patents

Systeme d'eclairage pour dispositif d'inspection de microcircuits montes en applique Download PDF

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Publication number
WO2002054480A1
WO2002054480A1 PCT/KR2001/001888 KR0101888W WO02054480A1 WO 2002054480 A1 WO2002054480 A1 WO 2002054480A1 KR 0101888 W KR0101888 W KR 0101888W WO 02054480 A1 WO02054480 A1 WO 02054480A1
Authority
WO
WIPO (PCT)
Prior art keywords
camera
illumination
disc
connection
component
Prior art date
Application number
PCT/KR2001/001888
Other languages
English (en)
Inventor
Peter W. Newman
Original Assignee
Yeint Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yeint Co., Ltd filed Critical Yeint Co., Ltd
Priority to JP2002555473A priority Critical patent/JP2004523743A/ja
Publication of WO2002054480A1 publication Critical patent/WO2002054480A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices

Definitions

  • the invention is a part of system which can accurately and reliably inspect the surface of surface mount electrical components such as MLCC (Multi-Layer Ceramic Capacitor).
  • the system consist of the housing block and the rotating assembly that can supply compressed air and vacuum, the lower and upper discs along with the a set of cameras.
  • the invention, the illumination system is placed near and around the v-slot of disc along with a set of camera, RGB frame grabber, the computer system attached to each camera, and the connecting fiber optic cables for illumination.
  • the invention is designed to accurately and reliably inspect the surface of surface mount electrical components such as MLCC (Multi-Layer Ceramic Capacitor).
  • MLCC Multi-Layer Ceramic Capacitor
  • the most commonly used inspection system employs a rotating glass plate to position and inspect the component. As the glass plate is rotated, the components are placed on the outer edge of the glass plate. At this point, the system takes a picture and analyzes the component for any defect.
  • Chip component consists of body and electrode which the surface of the two are of different material and surface. Therefore vision inspection algorithm should be different for the two types of surface. This distinct surface different and inspection requirements requires two separate inspection machine, which is a costly prospect. Moreover, the component is illuminate from one angled illumination source; therefore, the system cannot effectively detect all types of surface defects on the surfaces.
  • the invention is designed to illuminate the body and contact areas of component from one light source and yet maintain high inspection capability.
  • the invention the illumination system, is placed near and around the v-slot of disc along with a set of camera, RGB frame grabber, the computer system attached to each camera, and the connecting fiber optic cables for illumination.
  • the color camera employed collects the reflective lights off the component surface.
  • Each camera is attached to the computer which digitally filters red and blue lights.
  • Surrounding the camera lens is the bracket that holds lighting sources.
  • the bracket has slight angles and holes in the center and on the sides to hold the lighting instrument.
  • the system consist of the housing block and the rotating assembly that can supply compressed air and vacuum, the lower and upper discs along with the a set of cameras.
  • the invention the illumination system, is placed near and around the v-slot of disc along with a set of camera, RGB frame grabber, the computer system attached to each camera, and the connecting fiber optic cables for illumination.
  • the vision inspection system consist of housing block, which two discs can be attached on the face and rotated, the compressed air and vacuum supply system, and the set of camera.
  • the component feeder is attached to the system to continuously supply the component reliably.
  • the discs consist of two round flat plate put together.
  • the disc has a number of slots through which the vacuum is supplied. Air holes equal to the number of vacuum slots are found on one side of the disc through. On the edge of disc is the v-slot in which the components are placed. Air holes are placed approximately 0.03 to 0.05mm apart.
  • the housing block houses the compressed air and vacuum chambers Please refer to the attached Fig.
  • Fig 1 is a side view of the vision inspection machine while Fig 2 is the frontal view.
  • base (2) On top of base (2) is the fixed housing block (4) which can be rotated and is connected to lower and upper discs (14, 16).
  • Attached to the upper disc (14) is the feeder (12). Near the discs are the four cameras (18a, 18b, 18c, 18d). Inside the housing block (4) is the rotational axle (42) which is connected to moor and vacuum supply unit, and compressed air supply unit. Solenoid sorting mechanism (20) is located below the lower disc. Attached to the solenoid sorting mechanism (20) is the guide block (50) which directs the sorted components to the collection bins.
  • Fig 3 is a schematic diagram of the lower and upper discs (14, 16).
  • the Fig details the connecting point of the lower (14) and the upper disc (16).
  • the disc contains 50 vacuum slots (44) which are directed to the center of the disc.
  • the two plates forming the disc are held air tight to prevent vacuum leakage.
  • At the top where the two plates are forging is the v-slot where the 6-side component can be placed.
  • the disc is attached to the rotational axle (42) which is attached to the protrusion (6) of the housing block (42).
  • the upper disc (14) rotates in counter-clockwise direction while the lower disc (16) rotates in clockwise direction.
  • Fig 3 only contains simplified a diagram of the main plate.
  • Fig 4 contains a schematic diagram of the upper and lower discs and housing blocks.
  • the protrusions (6) of the housing block (4) is in contact with 50 air holes (62) located on the surface of the supporting plate on the discs (14, 16).
  • the holes (44) are connected to the vacuum chambers located inside the discs which are connected to the vacuum slots (62). As shown in the Fig,, the distance between each air hole is approximately 0.03 to 0.05mm.
  • Fig 5 is a view of compressed air/vacuum separation chamber insider the housing block.
  • Air/vacuum separation chamber (64) inside the housing block (4) is connected to the compressed air supply via air duct (42).
  • the cameras (18a, 18b, 18c, 18d) are positioned around the discs (14, 16).
  • the components supplied to the upper disc (16) are placed on the v-slot, exposing the two sides.
  • the camera (18a, 18b) takes the picture of the two exposed sides.
  • the component is transfer to the lower disc (16) and placed on the v-slot of the lower disc.
  • cameras (18c, 18d) takes the picture of the two exposed surface of the component.
  • Components (1) being supplied continuously through the feeder (12) on to the rotating disc (14) and placed on the v-slot evenly.
  • the components are located at the tip of the vacuum channels (46). Vacuum is supplied to the channels (46) which are connected to the air duct (44) and vacuum slots. Therefore, the components are held by the vacuum and are able to rotate with the disc without falling off the disc surface.
  • Fig 3 is a schematic diagram of the illumination system. As described in Fig 3, the invention requires at least 4 color cameras (18a, 18b, 18c, 18d), RGB frame grabber, the computers (300) connected to the color cameras, and fiber optic cables that supplies optical lights (304, 306).
  • the selected filtered red light is supplied via the fiber optic cable, which originats from the light source (304).
  • the positions of optical cables are as shown in Fig 4.
  • Surrounding the camera head/lens (182) is the pair of bracket (184) that contains light illumination instrument (186).
  • the bracket is slightly bent to have an angle, and the sides and the center area holds the lighting instrument via hole (188).
  • the red light is illuminated on the component (1) surface - the body and electrode areas - and the reflected lights are used to analyze the surface.
  • Fiber cable carrying blue light from the light source (306) which the light is filtered via filter (310) is aligned in the same direction as the camera lens. The blue light is illuminated on the component surface.
  • the image grabber (302) captures the component image, and the data is stored and analyzed by the computer which digitally filter the blue, red and green lights.
  • the software used to analyze the component surfaced contains algorithm to analyze the surface.
  • Fig 1 and 2 are the side and frontal views of the vision inspection machine.
  • Fig 3 is a schematic diagram of the illumination system.
  • Fig 4 is the side view of camera with the optical cable that transports the illumination from the source.
  • the illumination system consists of illumination source, camera, RGB frame grabber, the computer connected to each camera, and the optical system that illuminated the components.
  • the illumination lights are pre-filtered and is supplied via optical fiber cable.
  • the color camera employed is aligned in the same direction of the fiber optical cable which carries the pre-filtered lights. Surrounding the camera head/lens is the fixed bracket which holds the lighting instrument.
  • the brackets are slight bent to have an angle, in which the center and side areas contain the holes which contains the lighting instruments.
  • the housing block in which the rotating disc along with the camera sets are attached are the elements of the illumination system.
  • the cameras which are positioned to collect images of component located near and around the disc v-slots, RGB frame grabber and optical cable attached to the computer complete the illumination system.
  • the illumination can effectively inspect the different surfaces of component which are located in the v-slot of the lower and upper discs.

Landscapes

  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

Les composants de microcircuit comprennent un corps et une électrode dont les surfaces respectives sont faites de matériaux différents et présentent des caractéristiques superficielles différentes. C'est pourquoi l'algorithme de vision de la surface doit être différent en fonction de la surface considérée. Par suite de ces différences superficielles et de critères d'inspection distincts, il faudrait utiliser deux machines d'inspection différentes, ce qui est potentiellement coûteux. Avec ce nouveau système d'éclairage, il est possible d'inspecter deux surfaces différentes ou plus avec un seul et même système.
PCT/KR2001/001888 2000-12-29 2001-11-07 Systeme d'eclairage pour dispositif d'inspection de microcircuits montes en applique WO2002054480A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002555473A JP2004523743A (ja) 2000-12-29 2001-11-07 表面実装チップ検査用装置に用いる照明装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020000085407A KR100353905B1 (ko) 2000-12-29 2000-12-29 표면 실장용 칩 검사 장치에 사용되는 조명 시스템
KR2000-0085407 2000-12-29

Publications (1)

Publication Number Publication Date
WO2002054480A1 true WO2002054480A1 (fr) 2002-07-11

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PCT/KR2001/001888 WO2002054480A1 (fr) 2000-12-29 2001-11-07 Systeme d'eclairage pour dispositif d'inspection de microcircuits montes en applique

Country Status (4)

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JP (1) JP2004523743A (fr)
KR (1) KR100353905B1 (fr)
TW (1) TW561240B (fr)
WO (1) WO2002054480A1 (fr)

Cited By (10)

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DE102015013494B3 (de) * 2015-10-16 2017-04-06 Mühlbauer Gmbh & Co. Kg Bauteilhandhabungsvorrichtung und Verfahren zum Entnehmen von Bauteilen von einem strukturierten Bauteilvorrat und zum Ablegen an einer Empfangseinrichtung
DE102015013500A1 (de) 2015-10-16 2017-04-20 Mühlbauer Gmbh & Co. Kg Bildgebender Sensor für eine Bauteilhandhabungsvorrichtung
WO2017063838A1 (fr) * 2015-10-16 2017-04-20 Muehlbauer GmbH & Co. KG Dispositif et procédé d'auto-ajustage d'un dispositif de manipulation de composants pour des composants électroniques
WO2018188731A1 (fr) 2017-04-11 2018-10-18 Muehlbauer GmbH & Co. KG Dispositif de réception pour composant pourvu d'un capteur optique
DE102017008869B3 (de) 2017-09-21 2018-10-25 Mühlbauer Gmbh & Co. Kg Bauteilzentrierung
WO2020043612A1 (fr) * 2018-08-27 2020-03-05 Muehlbauer GmbH & Co. KG Inspection de composants électroniques au cours de leur transfert d'un premier support à un second
DE102019125127A1 (de) * 2019-09-18 2021-03-18 Mühlbauer Gmbh & Co. Kg Bauteilhandhabung, Bauteilinspektion
WO2021052745A1 (fr) 2019-09-18 2021-03-25 Muehlbauer GmbH & Co. KG Dispositif de manipulation de pièces et dispositif d'inspection de pièces
CN114453279A (zh) * 2021-12-17 2022-05-10 山东创典智能科技有限公司 一种用于支架网的视觉检测方法
WO2022233521A1 (fr) 2021-05-07 2022-11-10 Muehlbauer GmbH & Co. KG Inspection optique d'un composant

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KR101032721B1 (ko) * 2008-01-03 2011-05-06 (주)제이티 반도체칩검사장치 및 그 방법
WO2009129668A1 (fr) * 2008-04-23 2009-10-29 中茂电子(深圳)有限公司 Machine et procédé de détection de plaquettes de silicium photovoltaïques

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JPH11295236A (ja) * 1998-04-06 1999-10-29 Nitto Kogyo Co Ltd チップの６面検査装置

Patent Citations (2)

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US5850472A (en) * 1995-09-22 1998-12-15 Color And Appearance Technology, Inc. Colorimetric imaging system for measuring color and appearance
JPH11295236A (ja) * 1998-04-06 1999-10-29 Nitto Kogyo Co Ltd チップの６面検査装置

Cited By (30)

* Cited by examiner, † Cited by third party
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US10529601B2 (en) 2015-10-16 2020-01-07 Muehlbauer GmbH & Co. KG Receiving system for components
WO2017063838A1 (fr) * 2015-10-16 2017-04-20 Muehlbauer GmbH & Co. KG Dispositif et procédé d'auto-ajustage d'un dispositif de manipulation de composants pour des composants électroniques
KR102067203B1 (ko) 2015-10-16 2020-01-17 뮐바우어 게엠베하 운트 콤파니 카게 전자 부품용 부품-핸들링 장치의 자가-조절 장치 및 방법
DE102015013495A1 (de) 2015-10-16 2017-04-20 Mühlbauer Gmbh & Co. Kg Empfangseinrichtung für Bauteile
WO2017063836A1 (fr) 2015-10-16 2017-04-20 Muehlbauer GmbH & Co. KG Capteur d'imagerie pour un dispositif de manipulation d'élément
WO2017063835A1 (fr) 2015-10-16 2017-04-20 Muehlbauer GmbH & Co. KG Dispositif de réception de composants
DE102015013495B4 (de) 2015-10-16 2018-04-26 Mühlbauer Gmbh & Co. Kg Empfangseinrichtung für Bauteile und Verfahren zum Entnehmen fehlerhafter Bauteile aus dieser
KR20180071264A (ko) * 2015-10-16 2018-06-27 뮐바우어 게엠베하 운트 콤파니 카게 전자 부품용 부품-핸들링 장치의 자가-조절 장치 및 방법
CN108352346A (zh) * 2015-10-16 2018-07-31 米尔鲍尔有限两合公司 用于电子元件的元件操控装置的自主调整的设备和方法
DE102015013494B3 (de) * 2015-10-16 2017-04-06 Mühlbauer Gmbh & Co. Kg Bauteilhandhabungsvorrichtung und Verfahren zum Entnehmen von Bauteilen von einem strukturierten Bauteilvorrat und zum Ablegen an einer Empfangseinrichtung
CN108352346B (zh) * 2015-10-16 2022-09-30 米尔鲍尔有限两合公司 用于电子元件的元件操控装置的自主调整的设备和方法
US11232961B2 (en) 2015-10-16 2022-01-25 Muehlbauer GmbH & Co. KG Component handling device for removing components from a structured supply
US10347514B2 (en) 2015-10-16 2019-07-09 Muehlbauer GmbH & Co. KG Device and method for self-adjustment of a component-handling device for electronic components
EP3576138A1 (fr) 2015-10-16 2019-12-04 Mühlbauer GmbH & Co. KG. Dispositif de manipulation de composants
US10804123B2 (en) 2015-10-16 2020-10-13 Muehlbauer GmbH & Co. KG Component handling system
DE102015013500A1 (de) 2015-10-16 2017-04-20 Mühlbauer Gmbh & Co. Kg Bildgebender Sensor für eine Bauteilhandhabungsvorrichtung
TWI704851B (zh) * 2015-10-16 2020-09-11 德商紐豹有限責任合資公司 自主調整式電子元件操控裝置的裝置和方法
US11217465B2 (en) 2017-04-11 2022-01-04 Muehlbauer GmbH & Co. KG Component receiving device with optical sensor
WO2018188731A1 (fr) 2017-04-11 2018-10-18 Muehlbauer GmbH & Co. KG Dispositif de réception pour composant pourvu d'un capteur optique
WO2019057469A1 (fr) 2017-09-21 2019-03-28 Muehlbauer GmbH & Co. KG Dispositif d'orientation et de contrôle optique d'un composant à semi-conducteur
US11152243B2 (en) 2017-09-21 2021-10-19 Muehlbauer GmbH & Co. KG Device for aligning and optically inspecting a semiconductor component
DE102017008869B3 (de) 2017-09-21 2018-10-25 Mühlbauer Gmbh & Co. Kg Bauteilzentrierung
WO2020043612A1 (fr) * 2018-08-27 2020-03-05 Muehlbauer GmbH & Co. KG Inspection de composants électroniques au cours de leur transfert d'un premier support à un second
WO2021052756A1 (fr) 2019-09-18 2021-03-25 Muehlbauer GmbH & Co. KG Manipulation de pièce comportant une inspection de pièce
WO2021052745A1 (fr) 2019-09-18 2021-03-25 Muehlbauer GmbH & Co. KG Dispositif de manipulation de pièces et dispositif d'inspection de pièces
DE102019125127A1 (de) * 2019-09-18 2021-03-18 Mühlbauer Gmbh & Co. Kg Bauteilhandhabung, Bauteilinspektion
US11856705B2 (en) 2019-09-18 2023-12-26 Muehlbauer GmbH & Co. KG Apparatus for handling components
WO2022233521A1 (fr) 2021-05-07 2022-11-10 Muehlbauer GmbH & Co. KG Inspection optique d'un composant
DE102021111953A1 (de) 2021-05-07 2022-11-10 Mühlbauer Gmbh & Co. Kg Optische Bauteilinspektion
CN114453279A (zh) * 2021-12-17 2022-05-10 山东创典智能科技有限公司 一种用于支架网的视觉检测方法

Also Published As

Publication number Publication date
KR100353905B1 (ko) 2002-09-28
TW561240B (en) 2003-11-11
JP2004523743A (ja) 2004-08-05
KR20020007124A (ko) 2002-01-26

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