TW561240B - Illumination system used for apparatus for inspecting surface-mounted chip - Google Patents

Illumination system used for apparatus for inspecting surface-mounted chip Download PDF

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Publication number
TW561240B
TW561240B TW091113918A TW91113918A TW561240B TW 561240 B TW561240 B TW 561240B TW 091113918 A TW091113918 A TW 091113918A TW 91113918 A TW91113918 A TW 91113918A TW 561240 B TW561240 B TW 561240B
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Taiwan
Prior art keywords
color image
wafer
image
camera
digitizer
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TW091113918A
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Chinese (zh)
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Peter W Newman
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Yient Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices

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  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Disclosed is an illumination system for an electrical chip component vision inspection system that is designed to inspect chip components at high speed. The illumination system includes an RGB color camera, an RGB color image digitizer that captures an image of the component taken by the camera and transfers it to a computer, a computer connected to the RGB color image digitizer for the purposes of image processing and analysis, primary color filtered illumination sources, and optical fiber cables to transport light from the illumination sources and distribute it at specific orientations to the chip component.

Description

561240 五、發明說明（1) 發明背景 1. 發明領域 本發明是有關於一表面黏著長方形構件處理，視覺檢 查以及分類系統。特別是，本發明是有關於一種照明系 統，其係用於會正確地且可靠地檢查表面黏著電氣構件 例如 MLCC(Multi-Layer Ceramic Capacitor)表面的設備。 2. 習知技術之描述 現今，隨著更快和更加輕薄的各電子產品之需求持續 不斷地增加，電子工業一直需要更小且更有效率的電氣 構件。各電氣構件例如MLCC的尺寸大小已在幾個厘米 左右。在一典型的電腦化設備中，通常使用數百個至數 千個此種構件。高的製造產量和小的構件尺寸使得吾人 需要在生產過程中的自動化檢查。 大多數的自動化檢查系統會把各構件放置在一或更多 的旋轉圓盤上，藉此它們通過能擷取該構件影像以進行 數位分析的各黑白照像機（c a m e r a s)。由於需要有高的檢 查速度之故，所以一般說來，衹有該構件的每一面之一 的畫面會被實質地擷取，因此，吾人需要有一照明系統 ，其可同時地且儘可能地揭露出各種不同構件缺陷型式 (defect types)至該照像機。由於需要揭露出缺陷型式的 此種型式的照明系統可能遮蓋住另一個同樣地重要的缺 陷型式，所以此裝置根本無法達成。此缺陷已使大部 561240 五、 發明說明 ( 2 ) 份 的 白 動 化 檢 查 系 統 的能力 受限於 衹 能 檢 查 出 大 部 份 明 顯 的 構 件 缺 陷 〇 本 發 明 描 述 因 此 本 發 明 的 巨 標是要 來解決 包 含 在 習 知 技 術 的 各 問 題 而 且 也 要 提 供 一種用 於一自 動 化 視 覺 檢 查 系 統 的 眧 J V \\ 明 系 統 ， 其 中 該 檢 查系統 能使得 該 系 統 收 集 和 分 析 出 晶 片 構 件 ( 其 係 在 各 種不同 狀況下 同 時 受 到 照 明 ) 的 數 個 正 確 的 影 像 0 爲 了 要 完 成 上 述 巨 標，根 據本發 明 的 眧 j\ \\ 明 系 統 包 含 有 一 RGB彩色照像機 、鏡頭 ，一 RGB 彩 色 影 像 數 位 器 ， 其 會 捕 捉 由 該 個 別 的 照像機 所照得 的 該 晶 片 構 件 之 影 像 — 電 腦 > 其 係 連 接 至該個 別的數 位 器 和 眧 / \ \\ 像 機 以 及 複 數 個 紅 和 藍 彩 色 的 照明源 。（其係 包 括 有 兩 個 鹵 素 織 熱 白 光 源 紅 和 藍 光 過 濾器， 其係從 該 白 光 中 移 除 所 不 欲 的 各 彩 色 成 份 一 對 光纖電 纜束以 導 引 且 也 把 分 別 地 來 白 該 紅 和 藍 過 濾 器 中 所射出 的紅和 藍 光 分 配 至 固 定 在 該 照 像 機 鏡 頭 上 的 照 明 托座， 以及在 該 托 座 中 的 各 固 定 點 以 調 整 來 白 該 光 纖 電 纜的各 分配束 (distributed b un die 中 所 射 出 的 光 朝 向 該 晶片構^ 件之角度 〇 該 等 彩 色 光 源 皆 被 設置， 使得由 每 個 紅 色 和 藍 色 彩 色 構 件 所 提 供 的 昭 明 能 以不同 的角度 眧 j\w 射 至 該 晶 片 構 件 > 以 便 分 別 地 露 出 各 種 不同組1 (s e t s)的 晶 片 構 件 缺 陷 資 訊 0 該 等 紅 光 源 是 以; 大約 4 5度的角度朝向 I該 ;晶 片 構 件 表 面 ， 且 因 此 從 該 晶. 片] _件邊緣中也會產生 -4- :反射 而 且 也 會 把從 該561240 V. Description of the invention (1) Background of the invention 1. Field of the invention The present invention relates to a system for processing, visual inspection and classification of a rectangular member adhered to a surface. In particular, the present invention relates to a lighting system, which is an apparatus for accurately and reliably inspecting the surface of a surface adhering to an electrical component such as an MLCC (Multi-Layer Ceramic Capacitor) surface. 2. Description of the Conventional Technology Nowadays, as the demand for faster and thinner electronic products continues to increase, the electronics industry has always required smaller and more efficient electrical components. The dimensions of various electrical components, such as MLCCs, have been around several centimeters. In a typical computerized device, hundreds to thousands of such components are commonly used. High manufacturing yields and small component sizes require us to automate inspections during production. Most automated inspection systems place components on one or more rotating disks, whereby they pass through black and white cameras (c a m r a s) that can capture images of the component for digital analysis. Because of the need for high inspection speeds, generally speaking, only one picture of each side of the component will be captured substantially. Therefore, we need a lighting system that can be exposed simultaneously and as much as possible Various defect types to the camera. This type of lighting system cannot be achieved at all because it is necessary to expose a defective type of lighting system that may cover another equally important defective type. This defect has caused most of the 561240 of the fifth and fifth invention description (2) of the capability of the white dynamic inspection system to be limited to only detect most of the obvious component defects. The description of the present invention, therefore, the huge standard of the present invention is to come To solve the problems involved in the conventional technology and to provide a JV system for an automated visual inspection system, the inspection system enables the system to collect and analyze wafer components (which are in various conditions) Under the simultaneous illumination) several correct images 0 In order to complete the above-mentioned huge target, the 眧 j \ \\ Ming system according to the present invention includes an RGB color camera, a lens, and an RGB color image digitizer, which will capture Image of the wafer component taken by the individual camera — computer> which is connected to the individual digitizer and 眧 / \ \\ camera And a number of complex red and blue color of the illumination source. (It includes two halogen weave white light source red and blue light filters, which removes unwanted color components from the white light. A pair of fiber optic cable bundles are used to guide and white and red respectively. The red and blue light emitted from the blue and blue filters are distributed to the lighting bracket fixed to the camera lens, and the fixed points in the bracket are adjusted to whiten the distributed bundles of the optical fiber cable (distributed b The angle of the light emitted from the un die towards the wafer structure. The colored light sources are set so that the bright light provided by each of the red and blue colored components can be projected at different angles 眧 j \ w. Wafer components> In order to expose various pieces of wafer component defect information of different sets 1 (sets), the red light sources are at an angle of about 45 degrees toward I; the surface of the wafer components, and therefore from the crystal.] _ Also produces -4- : Reflection and will

561240 五、 發明說明 (3) 晶 片 構 件 表 面中的反射擴散，其淸楚地揭露出 尺 寸 大 小 細 節 和 表 面 彩色缺陷。該藍光源是以大約70 度 的 角 度 朝 向 該 晶 片 構件表面，其從該晶片構件表面（ 其 淸 楚 地 揭 露 出 表 面 組織細節（textural detail))中產生 大 部 份 的 反 射 〇 因 此 ，反射至該彩色照像機的影像包含 有 在 該 可 見 光 譜 的 每 個紅和藍色部份中的大部份不同組 的 資 訊 〇 此 資 訊 則 爲 該照像機所需，而且也是以RGB成 份 形 式 而 被 傳 輸 至 該 彩色數位器，以及也以RGB成份形 式 藉 由 該 彩 色 數 位 器 而被數位化。該RGB數位彩色影像 的 紅 和 藍 單 色 成 份 也 能用於缺陷分析。當該等影像隨著 一 起 使 用 相 同 的 照 像 機鏡頭爲人們所需時，則此兩彩色 成 份 影 像 是 兀 美 地 對 齊（aligned)而且也能分別地使用或 組 合 使 用 以 揭 露 出 大 量的影像缺陷細節。 圖 式 簡 單 描 述 第 1 圖 是 此照明系統的槪要圖。 第 2 圖 是 該照像機和各鏡頭（lens)以及照明托 座 總 成 〇 較 佳 實 施 例 之詳細說明 第 1 圖 是 此照明系統的槪要圖。如第1圖所 描 述 的 根 據 本 發 明 的照明系統至少包含有一彩色照像機 18 ； 一 RGB 彩 色 數 位器3 02 ’其係擷取由該照像機！ 8 所 取 得 的 晶 片 構 件 之 影像；一電腦3 00，其係連接至該] RGB 彩 色 數 位 器 302 ，熾熱鹵素照明光源3 0 4和3 0 6， 其 分 別 地 提 供 白 光 至 過濾器3 0 8和3 1 〇 ;光纖電纜i 8 7 和 1 88 其 係把 分 別 來自過濾器308和310中所發出的 -5- 紅 和 藍 光 561240 五、發明說明（4) 分別地導引且也分配至照明托座1 8 5和1 8 6。該等照明 托座1 8 5和1 8 6把來自該等光纖1 8 7和1 8 8的末端中所 射出的光分別地朝向該電子構件1。 該等光纖電纜1 8 7和1 8 8的射出末端的各位置和各角 度是如第2圖中所示。圍繞著該照像機鏡頭丨82的是照 明托座184和185。在該托座184的頂端之上固定有光 電纜夾鉗 190 (其係用來固定住光纖電纜188 ,而且也 把來自光纖電纜1 8 8中所射出的該紅光以大約45度的 角度朝向該晶片構件1而至該晶片構件1的表面上）。 托座185是用來固定住光纖電纜187的各末端，而且也 把來自該光纖電纜1 8 7中所射出的藍光以大約7 〇度的 角度朝向該晶片構件1而至該晶片構件丨的表面上。該 晶片構件是固定在旋轉圓盤1 4上，而且當該圓盤轉動 時，則該構件1的各影像是藉由RGB彩色照像機丨8所 擷取。 符號說明 1 晶片構件 14 圓盤 18 照像機 182 照像機鏡頭 184、185、186 托座 187 光纖/光纖電纜 188 光纖電纜/光纖 夾鉗 190 561240 五、發明說明（5) 300 電腦 302 數位器 304 、 306 光源 308 、 310 過濾器561240 V. Description of the invention (3) The reflection and diffusion in the surface of the wafer structure clearly reveals the size and detail and the surface color defects. The blue light source is directed toward the surface of the wafer component at an angle of about 70 degrees, and generates most of the reflection from the surface of the wafer component, which exposes the surface textural details. Therefore, the reflection to the surface The image of the color camera contains most of the different sets of information in each of the red and blue parts of the visible spectrum. This information is required by the camera and is also in the form of RGB components. Transmitted to the color digitizer and digitized by the color digitizer also in the form of RGB components. The red and blue monochromatic components of this RGB digital color image can also be used for defect analysis. When these images use the same camera lens with people's needs, the two color component images are beautifully aligned and can be used separately or combined to expose a large number of image defects. detail. Schematic description Description Figure 1 is the essential diagram of this lighting system. Figure 2 is a detailed description of the camera, the lenses, and the lighting bracket assembly 〇 a better embodiment. Figure 1 is the essential diagram of this lighting system. The lighting system according to the present invention as described in FIG. 1 includes at least one color camera 18; an RGB color digitizer 3 02 ', which is captured by the camera! 8 The image of the obtained chip component; a computer 3 00, which is connected to the] RGB color digitizer 302, a hot halogen lighting source 3 0 4 and 3 6 which provide white light to the filter 3 0 8 and 3 1 〇; fiber optic cables i 8 7 and 1 88 which send -5- red and blue light 561240 emitted from filters 308 and 310 respectively. 5. Description of the invention (4) are separately guided and also assigned to the lighting support Blocks 1 8 5 and 1 8 6. The lighting brackets 1 8 5 and 1 8 direct the light emitted from the ends of the optical fibers 1 8 7 and 1 8 to the electronic component 1 respectively. The positions and angles of the exit ends of the optical fiber cables 1 8 and 1 8 are shown in FIG. 2. Surrounding the camera lens 82 are illumination brackets 184 and 185. An optical cable clamp 190 (which is used to fix the optical fiber cable 188) is also fixed on the top of the bracket 184, and the red light emitted from the optical fiber cable 188 is also directed at an angle of about 45 degrees The wafer member 1 onto the surface of the wafer member 1). The bracket 185 is used to fix each end of the optical fiber cable 187, and also directs the blue light emitted from the optical fiber cable 187 toward the wafer member 1 at an angle of about 70 degrees to the surface of the wafer member. on. The wafer component is fixed on the rotating disk 14 and when the disk is rotated, each image of the component 1 is captured by an RGB color camera 8. DESCRIPTION OF SYMBOLS 1 Wafer member 14 Disc 18 Camera 182 Camera lens 184, 185, 186 Holder 187 Optical fiber / fiber cable 188 Optical fiber cable / fiber clamp 190 561240 V. Description of the invention (5) 300 Computer 302 Digitizer 304, 306 light source 308, 310 filter

Claims (1)

561240 六、申請專利範圍 第9 1 1 1 3 9 1 8號「用於檢查表面黏著晶片的儀器的照明系 統」專利案 (92年8月修正） 六、申請專利範圍： 1· 一種用於檢查小的電氣晶片構件表面黏著晶片的儀 器的照明系統，包括有 一 RGB彩色照像機； 一 RGB彩色影像數位器，其係擷取由該照像機所 照得的該晶片構件之彩色影像； 一電腦，其係連接至該RGB彩色影像數位器以達 成分析由該RGB彩色影像數位器所數位化的該晶片 構件影像之彩色影像的目的； 各熾熱照明源；以及 光纖電纜，其係把來自該等照明源中所供應的光 傳送出以照明該晶片構件。 2. 如申請專利範圍第1項之系統，其中該等照明源是 藉由設置在各出口點上的各初始彩色光過濾而被過 濾以用於該光，該光係由該等照明源所產生的而且 也是透過該等光纖電纜而供應至該等晶片構件。 3. 如申請專利範圍第2項之系統，其中圍繞著該等照 像機鏡頭而設置的各托座會夾住每個光纖電纜而且 也會分別地以一預先設定的角度把從該光纖電纜中 所射出的光朝向該晶片構件。 561240 六、申請專利範圍 4. 如申請專利範圍第3項之系統，其中從每個光纖電 纜中所射出的光之角度是設計出以在該照像機上產 生該晶片構件的不同的反射影像，以便分別地揭露 出每個反射影像的不同缺陷資訊。 5. 如申請專利範圍第4項之系統，其中由每個已過濾 照明源所產生的不同的反射影像會佔有（occupy)該 視覺光譜的不同的和分離的各部份。 6. 如申請專利範圍第5項之系統，其中該晶片影像的 反射影像是同時地爲一彩色照像機所需要，而且該 彩色影像機所產生的彩色影像是藉一彩色影像數位 器而被數位化。 7. 如申請專利範圍第6項之系統，其中該已數位化的 彩色影像是傳送至該電腦。 8. 如申請專利範圍第7項之系統，其中該電腦會分離 出該已數位化的彩色影像而且也會轉換成單色影像 (m ο η 〇 c h r ◦ m e )，以分別地代表出該等晶片構件的每 個彩色影像，因此能把該該晶片構件的不同的反射 影像恢復。561240 VI. Patent Application No. 9 1 1 1 3 9 1 8 "Patent for Illumination System of Instrument for Inspecting Surface Adhesive Chips" (Amended in 1992) VI. Patent Application Scope: 1 · One type for inspection The lighting system of a small electrical chip component with a wafer attached to the surface of the device includes an RGB color camera; an RGB color image digitizer that captures a color image of the chip component taken by the camera; A computer connected to the RGB color image digitizer to achieve the purpose of analyzing the color image of the wafer component image digitized by the RGB color image digitizer; each hot lighting source; and a fiber optic cable, The light supplied from the illumination source is transmitted to illuminate the wafer member. 2. If the system of item 1 of the patent scope is applied, wherein the illumination sources are filtered for the light by filtering the initial colored light provided at each exit point, the light is provided by the illumination sources. Produced and also supplied to the wafer components through the fiber optic cables. 3. If the system of item 2 of the patent application is applied, each bracket provided around the lens of the camera will clamp each optical fiber cable and will separate the optical fiber cable from a predetermined angle. The light emitted from is directed toward the wafer member. 561240 VI. Patent Application Range 4. The system of the third patent application range, in which the angle of light emitted from each optical fiber cable is designed to produce different reflected images of the wafer member on the camera To expose different defect information for each reflected image separately. 5. The system of claim 4 in which the different reflected images generated by each filtered illumination source occupy different and separated parts of the visual spectrum. 6. If the system of claim 5 is applied, the reflected image of the wafer image is simultaneously required by a color camera, and the color image produced by the color image machine is obtained by a color image digitizer. Digitize. 7. If the system of claim 6 is applied for, the digitized color image is transmitted to the computer. 8. If the system of claim 7 is applied for, the computer will separate the digitized color image and convert it into a monochrome image (m ο η 〇chr ◦ me) to represent these Each color image of the wafer component can therefore restore a different reflected image of the wafer component.
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