WO2002043853A1 - Einrichtung zum temperieren von mikrokomponenten - Google Patents
Einrichtung zum temperieren von mikrokomponenten Download PDFInfo
- Publication number
- WO2002043853A1 WO2002043853A1 PCT/EP2001/013649 EP0113649W WO0243853A1 WO 2002043853 A1 WO2002043853 A1 WO 2002043853A1 EP 0113649 W EP0113649 W EP 0113649W WO 0243853 A1 WO0243853 A1 WO 0243853A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- temperature control
- control element
- microcomponent
- microcomponents
- heat
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/0093—Microreactors, e.g. miniaturised or microfabricated reactors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
- B01J2219/00851—Additional features
- B01J2219/00871—Modular assembly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
- B01J2219/0095—Control aspects
- B01J2219/00952—Sensing operations
Definitions
- the invention relates to a device for tempering microcomponents, in particular microreactors, which are preferably plate-shaped and preferably consist of silicon.
- microcomponents have become known, with the aid of which the experiments can be carried out in small quantities.
- the modular structure of these microcomponents for example microreactors and other components for treating different substances, makes it easy to put together systems for the respective task.
- Such modular chemical microsystems are described in DE 198 54 096 A1 and DE 199 17 398 A1.
- the object of the present invention is to advantageously temperature control microcomponents, in particular microreactors, while maintaining the flexibility of the systems consisting of microcomponents. This object is achieved in that a temperature control element is provided and that there is a flat heat-conducting connection between the microcomponent and the temperature control element.
- the temperature control element is a Peltier element.
- This configuration has the advantage, among other things, that a relatively rapid change in the thermal power supplied or removed is possible.
- a heat exchanger is arranged on the side of the Peltier element facing away from the microcomponents, to which a cooling or heating medium can be supplied.
- the heat exchanger can preferably have an enlarged surface for heat exchange be formed with the ambient air.
- a blower can be used to support the heat exchange.
- temperature control is achieved in that the temperature control element is a heat exchanger to which a cooling or heating medium can be supplied.
- the cooling or heating medium can be, for example, water or a heat transfer oil.
- the heat exchanger can be hollow and can be provided with line connections for the cooling or heating medium.
- the heat transfer surface of the temperature control element has essentially the size of the adjacent surface of the microcomponent.
- the device according to the invention can also be developed in such a way that the heat-transferring surface of the temperature control element is smaller than the adjacent surface of the microcomponent.
- a holder has a U-shaped receiving part for the microcomponent and for the temperature control element with two legs, the ends of which can be screwed to a pressure plate.
- the pressure plate has a reinforced middle part which fits between the legs of the U-shaped receiving part.
- a structurally clever arrangement of the temperature control element, in particular a Peltier element, is the result of another advantageous embodiment possible that an opening for receiving the temperature control element is arranged in the area of the U-shaped receiving part opposite the pressure plate.
- Another advantageous embodiment enables connections to the outside in that holes are provided in the pressure plate for receiving connection elements.
- the handling of the device according to the invention in particular the laying of electrical lines, can be facilitated by providing electrical connections for the temperature control element on the receiving part.
- the holder consists of thermally resistant plastic.
- microcomponents can be put together and connected to one another.
- temperature control can be carried out in such a way that a plurality of microcomponents are held against one another and that an external microcomponent is thermally conductive to the temperature control element or that the other external microcomponent is thermally conductive to another temperature control element.
- the temperature control from both sides of the stack can be carried out in the same direction in order to heat several of the microcomponents in the same direction, for example to cool or heat them.
- Nenten plates are arranged with low thermal conductivity. It can be provided that the plates have openings for the passage of substances between the adjacent microcomponents, which are also provided with openings.
- At least one sensor for detecting the temperature of at least one microcomponent is provided, which controls at least one controller of the temperature control element.
- An advantageous arrangement of a sensor in which a good heat transfer from the microcomponent to the sensor is ensured, can be achieved in that the at least one sensor is arranged in a groove of a holder which is open in the direction of the adjacent microcomponent.
- FIG. 1 shows the parts of a device according to the invention in an exploded view
- FIG. 1 the embodiment of FIG. 1 in the assembled state in two different views
- Fig. 5 shows a third embodiment
- Fig. 6 shows part of the embodiment of FIG. 1 with a sensor.
- 1 consists of a U-shaped receiving part 1 for receiving at least one micro component 2 and a pressure plate 3, which can be screwed to side webs 5, 6 (leg) of the receiving part 1.
- the pressure plate 3 is reinforced in a central area 4. In the exemplary embodiment, one microcomponent is shown, but several microcomponents can also be held.
- the receiving part 1 has two flange-like extensions 7, 8 for attachment to a suitable base.
- Connection elements 10 can be screwed into the pressure plate 3, each of which has a sealing washer 11 at its front end and forms liquid-tight or possibly gas-tight connections with the surface of the microcomponent.
- a cutout 12 in the receiving part 1 is shaped on two opposite edges 13, 14 in such a way that a positive connection is formed with the lateral contours of a Peltier element 15.
- a cable connection 16 shown interrupted in Fig. 1 is used to supply electrical energy to the Peltier element 15 via a multiple connector 17.
- the connection 16 can be passed through a bore, not shown, of the receiving part 1, so that the multiple connector 17 can be mounted directly on the receiving part 1 (Fig. 2 and Fig. 3).
- the Peltier element 15 generates a temperature difference as a function of the applied voltage and can therefore be used for supplying and removing heat to and from the microcomponent 2. A simple and quick reversal of the heat flow is possible.
- a body 18 is provided for heat exchange with the surroundings, the surface of which is enlarged with a series of ribs. An air flow of a blower 19 is guided between the ribs.
- the cooling / heating power is limited in the Peltier elements available on the market, which are suitable, for example, in terms of their size, for the device according to the invention. Should higher powers, especially temperature differences If necessary, several Peltier elements can be connected in series or put together in the form of a step pyramid.
- a heat exchanger 20 (FIG. 1a) can also be connected to the pelletizing element 15, which has a cavity for flow through with a cooling / heating medium which can be supplied and removed via connections 21, 22.
- a heat sink 20 according to FIG. 1a is provided instead of the ribbed body 18 (FIGS. 1 to 3) for supplying and removing the heat transported by the Peltier element 15.
- the exemplary embodiment according to FIG. 5 shows a device according to the invention, in which two microcomponents 2, 2 'are arranged in the holder 1, 3' and are separated by a plate 23. This serves to seal substances carried between the microcomponents 2, 2 'and for thermal insulation.
- the pressure plate 3 'in the embodiment according to FIG. 5 is provided with channels not visible in the figure, so that it can be flowed through by an oil or heating medium which is supplied or discharged at 21 and 22.
- two Peltier elements or two heat exchangers through which a cooling or heating medium flows can also be provided for tempering microcomponents or stacking microcomponents on both sides.
- Fig. 6 shows a pressure plate 3 ', in which a groove 25 for a temperature sensor 24 is made. The sensor then closes approximately flat with the side of the pressure plate 3 1 facing the microcomponent, so that good heat-conducting contact with the microcomponent arises.
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002227942A AU2002227942A1 (en) | 2000-11-29 | 2001-11-23 | Device for controlling the temperature of microcomponents |
EP01989505A EP1337326A1 (de) | 2000-11-29 | 2001-11-23 | Einrichtung zum temperieren von mikrokomponenten |
KR10-2003-7006631A KR20030065515A (ko) | 2000-11-29 | 2001-11-23 | 마이크로컴퍼넌트의 온도 제어 장치 |
JP2002545819A JP4316877B2 (ja) | 2000-11-29 | 2001-11-23 | 超小型構成要素の温度制御装置 |
US10/432,843 US7431891B2 (en) | 2000-11-29 | 2001-11-23 | Device for controlling the temperature of chemical microreactors |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10059295 | 2000-11-29 | ||
DE10059295.3 | 2000-11-29 | ||
DE10118030A DE10118030A1 (de) | 2000-11-29 | 2001-04-11 | Einrichtung zum Temperieren von Mikrokomponenten |
DE10118030.6 | 2001-04-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002043853A1 true WO2002043853A1 (de) | 2002-06-06 |
Family
ID=26007835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2001/013649 WO2002043853A1 (de) | 2000-11-29 | 2001-11-23 | Einrichtung zum temperieren von mikrokomponenten |
Country Status (6)
Country | Link |
---|---|
US (1) | US7431891B2 (de) |
EP (1) | EP1337326A1 (de) |
JP (1) | JP4316877B2 (de) |
AU (1) | AU2002227942A1 (de) |
TW (1) | TW574065B (de) |
WO (1) | WO2002043853A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018522407A (ja) * | 2015-06-10 | 2018-08-09 | ジェンサーム インコーポレイテッドGentherm Incorporated | 車両バッテリ用の熱的隔離特徴を備える熱電モジュール |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004059210A1 (de) * | 2004-12-09 | 2006-06-14 | Merck Patent Gmbh | Herstellung oxidischer Nanopartikel |
IT1403791B1 (it) * | 2010-12-30 | 2013-10-31 | St Microelectronics Srl | Metodo per la calibrazione di un sensore di temperatura di un microreattore chimico e analizzatore per analisi biochimiche |
DE102013101176B4 (de) * | 2013-02-06 | 2018-04-05 | Cybio Ag | Kühlbox mit einem mit röhrchenförmigen Gefäßen bestückten Rack zum automatischen Befüllen mit einem Pipettierautomaten |
CN107690726A (zh) | 2015-06-10 | 2018-02-13 | 金瑟姆股份有限公司 | 具有集成冷板组件的车辆电池热电装置及其组装方法 |
DE112016002625T9 (de) * | 2015-06-10 | 2018-08-23 | Gentherm Inc. | Für eine Fahrzeugbatterie bestimmtes thermoelektrisches Modul mit verbesserten Wärmeübertragungs- und Thermoisolierungseigenschaften |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989012502A1 (en) * | 1988-06-23 | 1989-12-28 | Lep Scientific Limited | Biochemical reaction machine |
US5641400A (en) * | 1994-10-19 | 1997-06-24 | Hewlett-Packard Company | Use of temperature control devices in miniaturized planar column devices and miniaturized total analysis systems |
WO1998050147A1 (en) * | 1997-05-09 | 1998-11-12 | The Regents Of The University Of California | Peltier-assisted microfabricated reaction chambers for thermal cycling |
DE19812067A1 (de) * | 1998-03-19 | 1999-10-14 | Manfred J Hampe | Mikroplant zur experimentellen Simulation verfahrenstechnischer Prozesse |
EP1174182A1 (de) * | 1999-02-18 | 2002-01-23 | Toyo Kohan Co., Ltd. | Mikrochip für chemische reaktionen |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4402185A (en) * | 1982-01-07 | 1983-09-06 | Ncr Corporation | Thermoelectric (peltier effect) hot/cold socket for packaged I.C. microprobing |
EP0342155A3 (de) * | 1988-05-13 | 1990-06-27 | Agrogen-Stiftung | Laboratoriumsgerät zum wahlweisen Heizen und Kühlen |
US4865986A (en) * | 1988-10-06 | 1989-09-12 | Coy Corporation | Temperature control apparatus |
US6057149A (en) * | 1995-09-15 | 2000-05-02 | The University Of Michigan | Microscale devices and reactions in microscale devices |
US6657169B2 (en) | 1999-07-30 | 2003-12-02 | Stratagene | Apparatus for thermally cycling samples of biological material with substantial temperature uniformity |
US6734401B2 (en) | 2000-06-28 | 2004-05-11 | 3M Innovative Properties Company | Enhanced sample processing devices, systems and methods |
DE10031558A1 (de) * | 2000-06-28 | 2002-01-10 | Clariant Gmbh | Verfahren zur Konditionierung von organischen Pigmenten |
-
2001
- 2001-11-23 JP JP2002545819A patent/JP4316877B2/ja not_active Expired - Fee Related
- 2001-11-23 AU AU2002227942A patent/AU2002227942A1/en not_active Abandoned
- 2001-11-23 TW TW90129080A patent/TW574065B/zh not_active IP Right Cessation
- 2001-11-23 WO PCT/EP2001/013649 patent/WO2002043853A1/de active Application Filing
- 2001-11-23 US US10/432,843 patent/US7431891B2/en not_active Expired - Fee Related
- 2001-11-23 EP EP01989505A patent/EP1337326A1/de not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989012502A1 (en) * | 1988-06-23 | 1989-12-28 | Lep Scientific Limited | Biochemical reaction machine |
US5641400A (en) * | 1994-10-19 | 1997-06-24 | Hewlett-Packard Company | Use of temperature control devices in miniaturized planar column devices and miniaturized total analysis systems |
WO1998050147A1 (en) * | 1997-05-09 | 1998-11-12 | The Regents Of The University Of California | Peltier-assisted microfabricated reaction chambers for thermal cycling |
DE19812067A1 (de) * | 1998-03-19 | 1999-10-14 | Manfred J Hampe | Mikroplant zur experimentellen Simulation verfahrenstechnischer Prozesse |
EP1174182A1 (de) * | 1999-02-18 | 2002-01-23 | Toyo Kohan Co., Ltd. | Mikrochip für chemische reaktionen |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018522407A (ja) * | 2015-06-10 | 2018-08-09 | ジェンサーム インコーポレイテッドGentherm Incorporated | 車両バッテリ用の熱的隔離特徴を備える熱電モジュール |
Also Published As
Publication number | Publication date |
---|---|
US7431891B2 (en) | 2008-10-07 |
JP4316877B2 (ja) | 2009-08-19 |
EP1337326A1 (de) | 2003-08-27 |
TW574065B (en) | 2004-02-01 |
JP2004525746A (ja) | 2004-08-26 |
AU2002227942A1 (en) | 2002-06-11 |
US20040028562A1 (en) | 2004-02-12 |
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