WO2002032198A3 - Structure magnetique microelectronique, dispositif comprenant cette structure et procedes de production de cette structure et de ce dispositif - Google Patents

Structure magnetique microelectronique, dispositif comprenant cette structure et procedes de production de cette structure et de ce dispositif Download PDF

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Publication number
WO2002032198A3
WO2002032198A3 PCT/US2001/031457 US0131457W WO0232198A3 WO 2002032198 A3 WO2002032198 A3 WO 2002032198A3 US 0131457 W US0131457 W US 0131457W WO 0232198 A3 WO0232198 A3 WO 0232198A3
Authority
WO
WIPO (PCT)
Prior art keywords
magnetic
forming
methods
layer
magnetic structure
Prior art date
Application number
PCT/US2001/031457
Other languages
English (en)
Other versions
WO2002032198A2 (fr
Inventor
Thomas P Duffy
Original Assignee
Primarion Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Primarion Inc filed Critical Primarion Inc
Priority to AU2001296724A priority Critical patent/AU2001296724A1/en
Publication of WO2002032198A2 publication Critical patent/WO2002032198A2/fr
Publication of WO2002032198A3 publication Critical patent/WO2002032198A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/06—Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49075—Electromagnet, transformer or inductor including permanent magnet or core
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

La présente invention concerne une structure magnétique améliorée, qui est adaptée à des applications électroniques. Cette structure magnétique peut être produite sur ou à l'intérieur d'un substrat tel qu'une carte à circuits imprimés. Le procédé de production consiste à former une couche de matériau magnétique, à former des motifs sur la couche en matériau magnétique, puis à graver la couche afin de former la structure magnétique. Diverses couches isolantes et/ou couches conductrices peuvent ensuite être produites sur les structures magnétiques sous forme de parties du substrat. Les structures magnétiques selon cette invention permettent de produire des bobines d'induction adaptées à un usage dans des unités d'alimentation.
PCT/US2001/031457 2000-10-10 2001-10-09 Structure magnetique microelectronique, dispositif comprenant cette structure et procedes de production de cette structure et de ce dispositif WO2002032198A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001296724A AU2001296724A1 (en) 2000-10-10 2001-10-09 Microelectronic magnetic structure, device including the structure, and methods of forming the structure and device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23899400P 2000-10-10 2000-10-10
US60/238,994 2000-10-10

Publications (2)

Publication Number Publication Date
WO2002032198A2 WO2002032198A2 (fr) 2002-04-18
WO2002032198A3 true WO2002032198A3 (fr) 2002-06-13

Family

ID=22900179

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/031457 WO2002032198A2 (fr) 2000-10-10 2001-10-09 Structure magnetique microelectronique, dispositif comprenant cette structure et procedes de production de cette structure et de ce dispositif

Country Status (4)

Country Link
US (1) US20020047768A1 (fr)
AU (1) AU2001296724A1 (fr)
TW (1) TW511419B (fr)
WO (1) WO2002032198A2 (fr)

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JP2003534657A (ja) 2000-05-19 2003-11-18 フィリップ エイ． ハーディング スロット付きコア変圧器およびインダクタ
US8749054B2 (en) 2010-06-24 2014-06-10 L. Pierre de Rochemont Semiconductor carrier with vertical power FET module
US7135952B2 (en) 2002-09-16 2006-11-14 Multi-Fineline Electronix, Inc. Electronic transformer/inductor devices and methods for making same
US7405698B2 (en) 2004-10-01 2008-07-29 De Rochemont L Pierre Ceramic antenna module and methods of manufacture thereof
US7436282B2 (en) 2004-12-07 2008-10-14 Multi-Fineline Electronix, Inc. Miniature circuitry and inductive components and methods for manufacturing same
JP2008523627A (ja) 2004-12-07 2008-07-03 マルティ−ファインライン エレクトロニクス インコーポレイテッド 小型回路、誘導部品、及びそれらの製造方法
US7642628B2 (en) * 2005-01-11 2010-01-05 Rosemount Inc. MEMS packaging with improved reaction to temperature changes
CN102255143B (zh) 2005-06-30 2014-08-20 L.皮尔·德罗什蒙 电子元件及制造方法
US8350657B2 (en) 2005-06-30 2013-01-08 Derochemont L Pierre Power management module and method of manufacture
US10431367B2 (en) * 2005-09-22 2019-10-01 Radial Electronics, Inc. Method for gapping an embedded magnetic device
TWI295102B (en) * 2006-01-13 2008-03-21 Ind Tech Res Inst Multi-functional substrate structure
US8354294B2 (en) 2006-01-24 2013-01-15 De Rochemont L Pierre Liquid chemical deposition apparatus and process and products therefrom
US7645941B2 (en) 2006-05-02 2010-01-12 Multi-Fineline Electronix, Inc. Shielded flexible circuits and methods for manufacturing same
US7352270B1 (en) 2006-10-27 2008-04-01 Itt Manufacturing Enterprises, Inc. Printed circuit board with magnetic assembly
US7959598B2 (en) 2008-08-20 2011-06-14 Asante Solutions, Inc. Infusion pump systems and methods
US8952858B2 (en) 2009-06-17 2015-02-10 L. Pierre de Rochemont Frequency-selective dipole antennas
US8922347B1 (en) 2009-06-17 2014-12-30 L. Pierre de Rochemont R.F. energy collection circuit for wireless devices
US8456266B2 (en) * 2009-06-22 2013-06-04 Engineered Products Of Virginia, Llc Transformer coil assembly
US8598797B2 (en) * 2010-05-18 2013-12-03 Luxera, Inc. LED driver for driving LED lighting device at high frequency
US8552708B2 (en) 2010-06-02 2013-10-08 L. Pierre de Rochemont Monolithic DC/DC power management module with surface FET
US9023493B2 (en) 2010-07-13 2015-05-05 L. Pierre de Rochemont Chemically complex ablative max-phase material and method of manufacture
WO2012027412A1 (fr) 2010-08-23 2012-03-01 De Rochemont L Pierre Transistor à effet de champ de puissance ayant une grille de transistor résonante
EP2636069B1 (fr) 2010-11-03 2021-07-07 L. Pierre De Rochemont Porte-puces à semi-conducteurs présentant des dispositifs à points quantiques intégrés de manière monolithique, et leur procédé de fabrication
US20140253279A1 (en) * 2013-03-08 2014-09-11 Qualcomm Incorporated Coupled discrete inductor with flux concentration using high permeable material
CN105359233A (zh) * 2013-03-11 2016-02-24 伯恩斯公司 与层叠聚合物平面磁器件相关的器件和方法
WO2016111282A1 (fr) * 2015-01-07 2016-07-14 株式会社村田製作所 Composant à bobine
GB2535765B (en) * 2015-02-26 2019-06-19 Murata Manufacturing Co Embedded magnetic component transformer device
EP3374905A1 (fr) 2016-01-13 2018-09-19 Bigfoot Biomedical, Inc. Interface utilisateur pour système de gestion du diabète
CA3009351A1 (fr) 2016-01-14 2017-07-20 Bigfoot Biomedical, Inc. Ajustement des debits d'administration d'insuline
EP3568859A1 (fr) 2017-01-13 2019-11-20 Bigfoot Biomedical, Inc. Procédés, systèmes et dispositifs d'administration d'insuline
US10923417B2 (en) 2017-04-26 2021-02-16 Taiwan Semiconductor Manufacturing Company Limited Integrated fan-out package with 3D magnetic core inductor
US10003337B1 (en) * 2017-05-17 2018-06-19 International Business Machines Corporation Resonant virtual supply booster for synchronous logic circuits and other circuits with use of on-chip integrated magnetic inductor
USD874471S1 (en) 2017-06-08 2020-02-04 Insulet Corporation Display screen with a graphical user interface
USD928199S1 (en) 2018-04-02 2021-08-17 Bigfoot Biomedical, Inc. Medication delivery device with icons
USD920343S1 (en) 2019-01-09 2021-05-25 Bigfoot Biomedical, Inc. Display screen or portion thereof with graphical user interface associated with insulin delivery
USD977502S1 (en) 2020-06-09 2023-02-07 Insulet Corporation Display screen with graphical user interface

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Publication number Priority date Publication date Assignee Title
US3898595A (en) * 1970-11-02 1975-08-05 Cunningham Corp Magnetic printed circuit
US5070317A (en) * 1989-01-17 1991-12-03 Bhagat Jayant K Miniature inductor for integrated circuits and devices
EP0756298A2 (fr) * 1995-07-24 1997-01-29 Autosplice Systems, Inc. Dispositif inductif électronique et procédé de fabrication
JPH10116746A (ja) * 1996-10-09 1998-05-06 Kokusai Electric Co Ltd 薄膜インダクタ素子の製造方法
US5942965A (en) * 1996-09-13 1999-08-24 Murata Manufacturing Co., Ltd. Multilayer substrate
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JP2000182851A (ja) * 1998-12-15 2000-06-30 Matsushita Electric Ind Co Ltd インダクタ

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US3898595A (en) * 1970-11-02 1975-08-05 Cunningham Corp Magnetic printed circuit
US5070317A (en) * 1989-01-17 1991-12-03 Bhagat Jayant K Miniature inductor for integrated circuits and devices
EP0756298A2 (fr) * 1995-07-24 1997-01-29 Autosplice Systems, Inc. Dispositif inductif électronique et procédé de fabrication
US5942965A (en) * 1996-09-13 1999-08-24 Murata Manufacturing Co., Ltd. Multilayer substrate
JPH10116746A (ja) * 1996-10-09 1998-05-06 Kokusai Electric Co Ltd 薄膜インダクタ素子の製造方法
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JP2000182851A (ja) * 1998-12-15 2000-06-30 Matsushita Electric Ind Co Ltd インダクタ

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PATENT ABSTRACTS OF JAPAN vol. 2000, no. 09 13 October 2000 (2000-10-13) *

Also Published As

Publication number Publication date
WO2002032198A2 (fr) 2002-04-18
AU2001296724A1 (en) 2002-04-22
TW511419B (en) 2002-11-21
US20020047768A1 (en) 2002-04-25

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