WO2002031877A8 - Procede d"analyse de specimen - Google Patents
Procede d"analyse de specimenInfo
- Publication number
- WO2002031877A8 WO2002031877A8 PCT/JP2001/008836 JP0108836W WO0231877A8 WO 2002031877 A8 WO2002031877 A8 WO 2002031877A8 JP 0108836 W JP0108836 W JP 0108836W WO 0231877 A8 WO0231877 A8 WO 0231877A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- increased
- size
- position coordinates
- analyzing method
- defects
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
- H01J2237/2817—Pattern inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/130,880 US6934920B2 (en) | 2000-10-11 | 2001-10-05 | Specimen analyzing method |
JP2002535167A JPWO2002031877A1 (ja) | 2000-10-11 | 2001-10-05 | 試料分析方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000310321 | 2000-10-11 | ||
JP2000-310321 | 2000-10-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002031877A1 WO2002031877A1 (fr) | 2002-04-18 |
WO2002031877A8 true WO2002031877A8 (fr) | 2002-07-18 |
Family
ID=18790303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/008836 WO2002031877A1 (fr) | 2000-10-11 | 2001-10-05 | Procede d"analyse de specimen |
Country Status (4)
Country | Link |
---|---|
US (1) | US6934920B2 (ja) |
JP (1) | JPWO2002031877A1 (ja) |
TW (1) | TW513779B (ja) |
WO (1) | WO2002031877A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4049723B2 (ja) * | 2003-09-04 | 2008-02-20 | 沖電気工業株式会社 | 窒化物半導体素子の製造方法及び窒化物半導体素子の製造装置 |
US7193698B2 (en) * | 2005-07-18 | 2007-03-20 | Powerchip Semiconductor Corp. | Wafer defect detection methods and systems |
JP6083129B2 (ja) * | 2012-04-27 | 2017-02-22 | 富士電機株式会社 | 半導体装置の製造方法および製造装置 |
JP6964945B2 (ja) * | 2018-01-05 | 2021-11-10 | 株式会社ディスコ | 加工方法 |
JP7157580B2 (ja) * | 2018-07-19 | 2022-10-20 | 東京エレクトロン株式会社 | 基板検査方法及び基板検査装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07221156A (ja) * | 1994-01-31 | 1995-08-18 | Hitachi Ltd | 半導体の不良解析システムおよび半導体検査装置 |
JPH08124977A (ja) * | 1994-10-19 | 1996-05-17 | Hitachi Ltd | 半導体装置不良解析システム |
JP2941308B2 (ja) * | 1989-07-12 | 1999-08-25 | 株式会社日立製作所 | 検査システムおよび電子デバイスの製造方法 |
JPH07201946A (ja) * | 1993-12-28 | 1995-08-04 | Hitachi Ltd | 半導体装置等の製造方法及びその装置並びに検査方法及びその装置 |
JP2813147B2 (ja) * | 1995-02-14 | 1998-10-22 | 三菱電機株式会社 | 微小異物の分析方法、分析装置およびこれらを用いる半導体素子もしくは液晶表示素子の製法 |
US6185325B1 (en) * | 1997-07-02 | 2001-02-06 | Fuji Photo Film Co., Ltd. | Image transforming method and apparatus |
-
2001
- 2001-10-05 US US10/130,880 patent/US6934920B2/en not_active Expired - Lifetime
- 2001-10-05 JP JP2002535167A patent/JPWO2002031877A1/ja active Pending
- 2001-10-05 WO PCT/JP2001/008836 patent/WO2002031877A1/ja active Application Filing
- 2001-10-11 TW TW090125117A patent/TW513779B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPWO2002031877A1 (ja) | 2004-02-26 |
US20030145291A1 (en) | 2003-07-31 |
TW513779B (en) | 2002-12-11 |
WO2002031877A1 (fr) | 2002-04-18 |
US6934920B2 (en) | 2005-08-23 |
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