Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
  • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
  • B01J3/008—Processes carried out under supercritical conditions
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
  • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece

Definitions

• This invention relates to pressure vessels used in process operations requiring extreme cleanliness and operated at elevated pressures and temperatures, and in particular to pressure vessel design and shielded closure mechanisms that facilitate easier and cleaner loading and closing of pressure vessels used in automated wafer treatment processes in a production environment.
• This disclosure relates in particular to pressure vessels used in operations requiring extreme cleanliness and operated at elevated or high pressures up to 10,000 psi (pounds per square inch) or more, and further, to pressure vessel design and isolated lid locking mechanisms that facilitate easier and cleaner loading and locking of pressure vessels used in automated wafer treatment processes in a production environment.
• MEMS Micro Electro Mechanical Systems
• the process agent is carbon dioxide, used in both liquid and supercritical form.
• Other actual and prospective process agents operated in supercritical phase conditions which require much higher temperature and pressure than does carbon dioxide.
• Other semiconductor related applications with strict cleanliness requirements such as photoresist stripping, wafer cleaning, particulate removal, dry resist developing, and material deposition, all suffer from the same pressure vessel deficiencies, which include particle generation upon closing that causes contamination, closure mechanisms that are not suited for quick and automated closing, problems with automatically loading and unloading the vessel, and problems with the integration of the apparatus in a production line.
• the pressure vessel In many laboratory and production setups currently in use, the pressure vessel is loaded by vertical placement through an open top port of the same or larger diameter of the wafers being processed, and is unloaded by reverse action.
• the vessel is typically closed by manually bolting or mechanically clamping the process vessel flanges and its cover flanges together around the perimeter to form a pressure seal.
• This apparatus and methodology is both slow and prone to introducing particulate contamination due to the mechanical interface and constant wearing of mating surfaces. The particulate is generated immediately within the loading and processing environment, and inevitably contaminates the materials being processed to some degree.
• One such example is an autoclave with a quick opening door assembly. It typically consists of a chamber flange, a rotating locking ring and the door flange. The door and vessel are clamped and undamped by the rotation of the locking ring only. As the ring rotates, surfaces of the mating wedges force the chamber flange tight against the gasket providing a leak proof static seal. Due to the contact of the wedges sliding across each other, particles are generated and debris put into motion that eventually contaminate the process beyond acceptable tolerances.
• a further problem with traditional pressure vessels in a production environment is the difficulty in adapting them to the standard wafer handling robots of the semiconductor industry.
• Complex carriage systems are often necessary for automation of the loading and extracting of materials being processed, involving complex transitions between horizontal and vertical transport of the wafers between processing stations.
• Newer industry standards anticipate and provide for cluster tool arrangements, where rotary transport systems move wafers between connected wafer processing machines. It is this need and this environment to which the following disclosure is addressed.
• a pressure chamber with an underside loading port, a vertically movable pedestal arranged directly below the pressure chamber for opening and closing the loading port, the top of the pedestal functioning as the floor of the pressure chamber when the pedestal is raised to a closed position and as a loading platform when the pedestal is lowered to an open position.
• a motor and vertical drive system for moving the pedestal between open and closed positions
• a pedestal locking system consisting of another motor and lateral drive system for wedge locking the pedestal in a sealing relationship with the pressure chamber so as to define a process volume within which to conduct the processes.
• an inlet manifold and an outlet manifold communicating with the process volume within the chamber the manifolds being connectable to a process fluid control source for delivering process fluids under controlled pressure to the process volume and removing byproducts therefrom.
• a heat exchanging platen in the roof of the process volume which is connectible by fluid lines to an external fluid temperature control system, a heat exchanging platen incorporated onto the pedestal and likewise connectible by fluid lines to the external fluid temperature control system, and a thermocouple sensor configured for sensing temperature in the process volume and connectible for communicating with the external fluid temperature control system.
• a horizontal shelf structure vertically positioned below the top of the pedestal and with a center hole through which the pedestal operates, with lateral support for the pedestal being attached thereto.
• a vertically collapsible bellows the upper end thereof being attached by an upper bellows flange around the top of the pedestal and the lower end thereof being attached by a lower bellows flange to the perimeter of the hole in the shelf so as to encircle the pedestal and isolate the lateral support structure and drive and lock mechanisms from the loading and processing environment above.
• FIG. 1 is a side elevation cross section illustrating the principle components of the preferred embodiment with the pedestal and lock blocks in closed and locked positions, respectively.
• FIG. 2 is a side elevation cross section of the preferred embodiment, with the pedestal and lock blocks in open and retracted positions, respectively.
• FIG. 3 is a front elevation of the preferred embodiment, partially cut away to illustrate the pedestal in the open position.
• FIG. 4 is a plan view of the preferred embodiment, illustrating the tie plate bolt heads, and the lock block drive screw motor and gearboxes on the backside of the machine.
• FIG. 5 is a close up side elevation cross section view showing the upper compartment of the preferred embodiment, illustrating the process chamber with process fluid and heating fluid supply lines, with the pedestal and bellows in the mid range position between open and closed.
• FIG. 6 is a plan view cross section through the process chamber of the preferred embodiment, illustrating the vanes and flow channels affecting the fluid flow through the process volume.
• FIG. 7 is a plan view cross section view through the tie plates and pedestal column of the preferred embodiment, illustrating the pedestal guide bars and guide bar holders on each side of the column.
• FIG. 8 is a plan view cross section through the tie plates and lock blocks of the preferred embodiment, illustrating the lock block drive system, LVDT sensor and pneumatic position sensor/interlock.
• FIG. 9 is a side elevation close up cross section view of the lock blocks and base of the pedestal of the preferred embodiment.
• FIG. 10 is a multi view illustration of the side elevation and plan view aspects of the pedestal locking wedge components of the preferred embodiment. DESCRIPTION OF THE PREFERRED EMBODIMENT
• the preferred embodiment described herein is a component of a cluster tool arrangement for the production processing of semiconductor wafers or pressure and temperature sensitive treatment of other small articles. It is an inverted pressure vessel o with an isolated door closure mechanism, and a specially configured process volume for handling a through flow of processing fluids in a closely controlled temperature and pressure cycling environment. It conforms the cluster tool geometry SEMI/MESC (Semiconductor/Modular Equipment Standards Committee) standards. It contemplates a maximum operating pressure in the order of 4500 psi, (pounds per square inch), and in an 5 embodiment with a cavity design size of 200 millimeters diameter and a total process volume of about three quarters of a liter, the structure is required to resist up to about 400,000 pounds of force from within the process volume.
• SEMI/MESC semiconductor/Modular Equipment Standards Committee
• the temperature range of the preferred embodiment is -20 to +150 degrees centigrade. Higher pressures and temperatures may be desired for some processes, and are simply a function of design. No o warranty is expressed or implied in this disclosure as to the actual degree of safety, security or support of any particular specimen of the invention in whole or in part, due to differences in actual production designs, materials and use of the invention.
• the pressure vessel of the invention is assumed to be connected to a suitable 5 dynamic process supply and control system that supplies process fluid under controlled pressure as required by the process, exerts temperature control via heat exchangers in the processing volume, excepts outflow byproducts of the process for recycling or other suitable disposition, and provides the necessary computer control and operator interface to be integrated into the production process.
• the pressure vessel and associated systems 0 are configured with industry standard interlocks and safety features appropriate to the process conditions.
• the preferred embodiment is configured for a cluster tool arrangement as part of an automated production system for processing semiconductor wafers, as it described below.
• the vertically operated pedestal can carry a wafer cassette, a single wafer, or other object being processed into the pressure vessel for processing, and out again for pickup and further transport.
• the lift and lock mechanism for operating the pedestal is fully shielded so as to isolate any particulate matter generated and any debris put into motion by the lift and lock mechanism, from the loading and processing environment.
• an inverted process chamber 10 with an underside loading port is bolted to front tie plates 3 and rear tie plates 4, which in turn are bolted to lower support plate 2.
• This assemblage is supported by frame 1.
• a vertically movable pedestal 50 Within this assemblage is arranged a vertically movable pedestal 50, a columnar structure the upper end of which terminates in a large, circular, flat top or loading platform, the same surface of which functions as the floor to inverted pressure chamber 10 when used to close the underside loading port.
• Pedestal 50 is vertically moveable between an upper closed, and a lower open position relative to process chamber 10. Movement is effected by means of a pedestal drive motor and gearbox 52 mounted in frame 1, which turns a vertically oriented pedestal drive screw 54 in a lift nut 59 in the base of pedestal 50.
• Process chamber 10 is machined and configured to provide a final wafer cavity 8 there within, generally sized to accommodate a single wafer diameter and thickness.
• flow channels 6, divided by flow vanes 7 promote uniform distribution of process fluids into and out of wafer cavity 8, between inlet and outlet manifolds 14 and 18.
• the combination of inlet and outlet flow channels 6 and wafer cavity 8 make up the internal process volume of the pressure chamber.
• pedestal 50 is configured with two opposing flats on its vertical wall, within each of which is machined a vertical channel or groove 55.
• pedestal 50 Lateral support and alignment is provided pedestal 50 throughout its vertical range of motion by opposing bronze pedestal guide bars 56 which closely conform to the cross section of grooves 55, and which are attached to respective adjustable guide bar holders 58 that are in turn mounted on shelf 5.
• the guide bars are lubricated for a sliding interface.
• Shelf 5 divides the region between process chamber 10 and lower support plate 2 into upper and lower compartments, the upper compartment being the region where the loading and unloading of the process chamber occurs, and for which it is important to maintain the highest practical degree of cleanliness to avoid contamination of the process during loading and unloading of the chamber.
• bellows 60 is attached by bellows flanges 62 and 64 to shelf 5 and pedestal 50 so as to isolate pedestal and lock block drive systems from the upper compartment.
• a process fluid inlet line 12 is connected via inlet manifold 14 to the front of chamber 10 so as to provide an inflow path for process fluid into the process volume and wafer cavity 8.
• a process fluid outlet line 16 is connected via outlet manifold 18 to the back side of process chamber 10 so as to provide an outflow path from the process volume and wafer cavity 8 for byproducts of the process.
• the fluid inlet and outlet lines are connected to a suitable process fluid supply source for the controlled supply of process fluids under very high pressures.
• Fluid lines 12 and 16 of the illustrated embodiment are one quarter inch inside diameter, but either or both lines may be larger or smaller, depending on the particular process requirements and the effects of line volume and control valve location with respect to the process volume within the pressure chamber.
• Either or both manifolds 14 and 18 may be modified to incorporate control valves, with their actuators connected to the process control system.
• the preferred embodiment employs a motor and lateral drive mechanism for inserting a wedge structure in one form or another beneath the pedestal when it is in the closed position.
• a pair of lock blocks 90 are interlocked by lock block screws 92 for closure from opposing sides of the base of pedestal 50.
• Lock block screws 92 are supported in screw blocks attached to lower support plate 2 at a height that permits lock blocks 90 to bear and slide on hardened support plates 2A, let into lower support plate 2.
• Lock blocks 90 are configured with hardened bottom plates 91, which bear on and slide over hardened support plates 2A when lock blocks 90 are operated for movement.
• lock blocks 90 are interlocked by screws 92, and are jointly movable between a retracted position clear of the pedestal's vertical motion, to a locking position beneath the base of pedestal 50 when the pedestal is raised up into a closed position against pressure chamber 10.
• Steel hardened locking wedge components 101 and 102 having a two degree angle of ramp or wedge angle, are mounted on the top of the lock block 90 and the base of pedestal 50 respectively, so as to provide a sliding interface with a very high vertical component of force in response to the horizontal closing force applied to lock blocks 90 by the lock block screw motor 98 at low speed/high torque and gear boxes 96.
• the sliding interface between wedge components 101 and 102 has about a three inch horizontal stroke, provided by the range of motion of locking blocks 90 between open and locked positions.
• a suitable lubricant can be applied to all sliding interfaces.
• the resulting vertical range for the two degree slope wedge angle of wedge components 101 and 102 is in the order of 1/8 inch, so pedestal 50 must be lifted on screw 54 by motor and gearbox 52 to within 1/8 inch of full closure with chamber 10 before locking blocks 90 are actuated.
• a smaller slope angle can be used to obtain a greater locking force, the vertical component of motion of the locking mechanism being correspondingly smaller.
• Upper and lower proximity sensors 57 and 58 attached to a vertical rod mounted on shelf 5 adjacent pedestal 50 so as to sense the edge of the pedestal, control the range of pedestal 50 as driven by motor and gearbox 52. Upon sensing pedestal 50 to be at the upper limit, motor and gearbox 52 are stopped and locking blocks 90 can be actuated for sealing pedestal 50 to process chamber 10.
• Lift nut 59 is configured with some vertical play within the base of pedestal 50, to avoid placing the pedestal drive screw in tension when locking blocks 90 are engaged.
• the control mechanism for lock blocks 90 includes an LVDT (linear variable displacement transducer) sensor 91, which is configured to monitor the position of a lock block 90 within its normal range of motion.
• Lock block drive motor 98 is a two speed, brushless D.C. motor.
• Lock blocks 90 are driven at high speed/low torque to a predetermined position just short of where wedge components 101 and 102 come into engagement, as sensed by LVDT sensor 91.
• Motor 98 is then switched to low speed/high torque and driven to the pre-determined final lock position, again as sensed by LVDT sensor 91.
• Pneumatic interlock valve 93 is engaged when locking blocks 90 are fully closed into the locking position, permitting the process to be initiated within the closed and locked pressure chamber.
• a floating seal 51 embedded in the top of pedestal 50 provides a very high pressure sealing capability for the process volume when the pedestal is raised to the closed position and lock blocks 90 are placed in the locking position.
• Floating seals are known in the art for having compliant sealing characteristics suitable to the perimeter sealing problem of high pressure processing chambers.
• heating platen 20 installed in the roof of wafer cavity 8, and a similar heating platen 80 incorporated into pedestal 50.
• Wafer crib 9 on platen 80 provides for receiving wafers delivered by an automated process, lifting and holding the wafer between the two platens when the chamber is closed for processing, and presenting the processed wafer for automated pickup when the process cycle is complete and the pedestal is lowered.
• the necessary thermal energy transfer to and from platens 20 and 80 for the temperature control and cycling according to the desired process is accomplished by the circulation of heating/cooling fluid through respective line sets 22 and 82, which are connected to a suitable temperature control system.
• Process chamber thermocouple 30 is mounted on outlet manifold 18, configured to sense temperature within the process volume of chamber 10, and connects to the process control system.
• the pedestal may be locked in the closed position by a rotate-to-actuate locking lug ring mounted on the lower support plate, that partially rotates so as to slidingly engage its internally extending wedge lugs with a uniformly spaced set of locking wedge lugs extending outward from around the column of the pedestal, instead of the linear slide block mechanism of the preferred embodiment.
• the ring and pedestal wedge lugs have a ramped or slightly sloping interface analogous to the lock block wedge components of the preferred embodiment.
• the rotate to lock mechanism is shielded from the loading and unloading compartment in the same manner as the preferred embodiment, by the shelf and bellows arrangement.
• the pedestal may be of other and various cross sections, including square, channel, or I beam.
• the pedestal may be hollow or have a rigid skirt over a core element, where the skirt may be configured with a flexible rolling wall diaphragm-like structure with a flange that seals to the shelf to perform the isolating function of the bellows of the preferred embodiment.
• Another embodiment may have a vertically operable piston diaphragm, more accurately described here as a pedestal skirt diaphragm, sealing the top of the pedestal to the shelf so as to shield or isolate the lateral supports and the drive mechanisms in the same fashion.
• the shelf embodiment extends to a partial or full enclosure around the mouth or underside port of the pressure chamber, with a door or opening for allowing a transport mechanism to insert and remove articles or wafers being processed from on top of the open pedestal between processing cycles, with a center hole in the bottom of the enclosure through which the pedestal operates, and a pedestal skirt diaphragm sealed to the edge of the center hole to fully contain the loading and unloading environment within the enclosure.
• the lateral support structure for the pedestal can be of various configurations so long as it provides continuous lateral support to the vertically movable pedestal structure.
• Guide bars, channels, and linear bearings are all within the scope of the invention, so long as they are excluded by the shield from exposure to the loading environment of the open pressure chamber along with the vertical driving and lock mechanisms.
• the tie plate framework of the preferred embodiment can be configured for bi-directional or pass through access to the loading platform and wafer crib when the pedestal is down and the pressure vessel open, so as to accommodate a horizontal wafer pass-through conveyor system or robotic placement and removal of wafers from opposite sides.
• the tie plate and bolt system can be replaced with a large closed yoke structure, within which are arranged the inverted pressure chamber and the pedestal and motion systems, so that the yoke provides the structural tie that sustains the closing pressure between the pedestal and the pressure chamber.
• the lift mechanism for the pedestal may be hydraulic, threaded screw, or any other manner of jacking or extension mechanisms sufficiently robust to elevate the pedestal weight to the pre-locking closing height, and designed to tolerate the additional small vertical motion of the locking action.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
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• Organic Chemistry (AREA)
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• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

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Cited By (8)

Citations (12)

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• 2001
  • 2001-02-05 WO PCT/US2001/003796 patent/WO2002011911A1/en not_active Application Discontinuation
  • 2001-02-05 CN CN01813784A patent/CN1446127A/zh active Pending
  • 2001-02-05 AU AU2001234856A patent/AU2001234856A1/en not_active Abandoned
  • 2001-02-05 KR KR10-2003-7001535A patent/KR20030026333A/ko active IP Right Grant
  • 2001-02-05 JP JP2002517234A patent/JP2004506313A/ja active Pending
  • 2001-02-05 EP EP01907022A patent/EP1358021A4/en not_active Withdrawn
  • 2001-02-05 IL IL15409501A patent/IL154095A0/xx unknown

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