AU2001234856A1 - Inverted pressure vessel with shielded closure mechanism - Google Patents

Inverted pressure vessel with shielded closure mechanism

Info

Publication number
AU2001234856A1
AU2001234856A1 AU2001234856A AU3485601A AU2001234856A1 AU 2001234856 A1 AU2001234856 A1 AU 2001234856A1 AU 2001234856 A AU2001234856 A AU 2001234856A AU 3485601 A AU3485601 A AU 3485601A AU 2001234856 A1 AU2001234856 A1 AU 2001234856A1
Authority
AU
Australia
Prior art keywords
pressure vessel
closure mechanism
inverted pressure
shielded closure
shielded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001234856A
Other languages
English (en)
Inventor
Mohan Chandra
Robert Farmer
Heiko Moritz
Jonathan Talbot
James Tseronis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SC Fluids Inc
Original Assignee
SC Fluids Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/632,770 external-priority patent/US6508259B1/en
Application filed by SC Fluids Inc filed Critical SC Fluids Inc
Publication of AU2001234856A1 publication Critical patent/AU2001234856A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/008—Processes carried out under supercritical conditions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2001234856A 2000-08-04 2001-02-05 Inverted pressure vessel with shielded closure mechanism Abandoned AU2001234856A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09632770 2000-08-04
US09/632,770 US6508259B1 (en) 1999-08-05 2000-08-04 Inverted pressure vessel with horizontal through loading
PCT/US2001/003796 WO2002011911A1 (en) 2000-08-04 2001-02-05 Inverted pressure vessel with shielded closure mechanism

Publications (1)

Publication Number Publication Date
AU2001234856A1 true AU2001234856A1 (en) 2002-02-18

Family

ID=24536872

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001234856A Abandoned AU2001234856A1 (en) 2000-08-04 2001-02-05 Inverted pressure vessel with shielded closure mechanism

Country Status (7)

Country Link
EP (1) EP1358021A4 (ko)
JP (1) JP2004506313A (ko)
KR (1) KR20030026333A (ko)
CN (1) CN1446127A (ko)
AU (1) AU2001234856A1 (ko)
IL (1) IL154095A0 (ko)
WO (1) WO2002011911A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1639629B1 (en) * 2003-06-13 2011-04-27 WEN, Sophia Apparatus for thin-layer chemical processing of semiconductor wafers
US7941039B1 (en) 2005-07-18 2011-05-10 Novellus Systems, Inc. Pedestal heat transfer and temperature control
US7960297B1 (en) 2006-12-07 2011-06-14 Novellus Systems, Inc. Load lock design for rapid wafer heating
US8052419B1 (en) 2007-11-08 2011-11-08 Novellus Systems, Inc. Closed loop temperature heat up and control utilizing wafer-to-heater pedestal gap modulation
US8033771B1 (en) 2008-12-11 2011-10-11 Novellus Systems, Inc. Minimum contact area wafer clamping with gas flow for rapid wafer cooling
US8371567B2 (en) 2011-04-13 2013-02-12 Novellus Systems, Inc. Pedestal covers
WO2013103594A1 (en) 2012-01-06 2013-07-11 Novellus Systems, Inc. Adaptive heat transfer methods and systems for uniform heat transfer
US10347547B2 (en) 2016-08-09 2019-07-09 Lam Research Corporation Suppressing interfacial reactions by varying the wafer temperature throughout deposition

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968885A (en) * 1973-06-29 1976-07-13 International Business Machines Corporation Method and apparatus for handling workpieces
DE2940201A1 (de) * 1979-10-04 1981-05-07 Claas Ohg, 4834 Harsewinkel Feldhaecksler mit metalldetektor
US4522788A (en) * 1982-03-05 1985-06-11 Leco Corporation Proximate analyzer
JPS58180631A (ja) * 1982-04-16 1983-10-22 日産自動車株式会社 織機の綜絖枠
US4626509A (en) * 1983-07-11 1986-12-02 Data Packaging Corp. Culture media transfer assembly
JPH0765197B2 (ja) * 1983-11-04 1995-07-12 株式会社日立製作所 真空処理装置
US4827867A (en) * 1985-11-28 1989-05-09 Daikin Industries, Ltd. Resist developing apparatus
JPH01246835A (ja) * 1988-03-29 1989-10-02 Toshiba Corp ウエハ処理装置
US5224504A (en) * 1988-05-25 1993-07-06 Semitool, Inc. Single wafer processor
US4879431A (en) * 1989-03-09 1989-11-07 Biomedical Research And Development Laboratories, Inc. Tubeless cell harvester
US5169408A (en) * 1990-01-26 1992-12-08 Fsi International, Inc. Apparatus for wafer processing with in situ rinse
US5071485A (en) * 1990-09-11 1991-12-10 Fusion Systems Corporation Method for photoresist stripping using reverse flow
JPH0613361A (ja) * 1992-06-26 1994-01-21 Tokyo Electron Ltd 処理装置
KR100304127B1 (ko) * 1992-07-29 2001-11-30 이노마다 시게오 가반식 밀폐 컨테이너를 사용한 전자기판 처리시스템과 그의 장치
JP2548062B2 (ja) * 1992-11-13 1996-10-30 日本エー・エス・エム株式会社 縦型熱処理装置用ロードロックチャンバー
JPH09213772A (ja) * 1996-01-30 1997-08-15 Dainippon Screen Mfg Co Ltd 基板保持装置
JP4246804B2 (ja) * 1997-03-26 2009-04-02 株式会社神戸製鋼所 加熱・加圧処理装置
JPH1194085A (ja) * 1997-09-26 1999-04-09 Kobe Steel Ltd 高圧処理装置における密封チャンバの安全装置
US6067728A (en) * 1998-02-13 2000-05-30 G.T. Equipment Technologies, Inc. Supercritical phase wafer drying/cleaning system
IL147986A0 (en) * 1999-08-05 2002-09-12 S C Fluids Inc Inverted pressure vessel with horizontal throug loading
US6508259B1 (en) * 1999-08-05 2003-01-21 S.C. Fluids, Inc. Inverted pressure vessel with horizontal through loading
AU2001263231A1 (en) * 2000-05-18 2001-11-26 S. C. Fluids, Inc. Supercritical fluid cleaning process for precision surfaces

Also Published As

Publication number Publication date
JP2004506313A (ja) 2004-02-26
CN1446127A (zh) 2003-10-01
EP1358021A4 (en) 2004-03-31
KR20030026333A (ko) 2003-03-31
WO2002011911A1 (en) 2002-02-14
IL154095A0 (en) 2003-07-31
EP1358021A1 (en) 2003-11-05

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