WO2002003183A2 - Kühlvorrichtung für computer - Google Patents
Kühlvorrichtung für computer Download PDFInfo
- Publication number
- WO2002003183A2 WO2002003183A2 PCT/EP2001/007707 EP0107707W WO0203183A2 WO 2002003183 A2 WO2002003183 A2 WO 2002003183A2 EP 0107707 W EP0107707 W EP 0107707W WO 0203183 A2 WO0203183 A2 WO 0203183A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling device
- processor
- cooling
- shells
- outlet opening
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
- H01L23/445—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- a disadvantage of the above-mentioned cooling units is the danger that, in the event of a hose break between the CPU and the cooling unit, the cooling liquid used can cause considerable damage until the computer fails completely.
- the direct heat dissipation on the processor is also very complex, since the cooling liquid places considerable demands on the seal directly on current-carrying components.
- the invention has for its object to provide a cooling device for computers, which is simple and secure.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Silicon Compounds (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/332,462 US20040090746A1 (en) | 2000-07-05 | 2001-07-05 | Cooling device for a computer |
EP01956516A EP1374020A2 (de) | 2000-07-05 | 2001-07-05 | Kühlvorrichtung für computer |
AU2001278473A AU2001278473A1 (en) | 2000-07-05 | 2001-07-05 | Cooling device for a computer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10032050A DE10032050A1 (de) | 2000-07-05 | 2000-07-05 | Kühlvorrichtung für Computer |
DE10032050.3 | 2000-07-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002003183A2 true WO2002003183A2 (de) | 2002-01-10 |
WO2002003183A3 WO2002003183A3 (de) | 2003-10-09 |
Family
ID=7647447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2001/007707 WO2002003183A2 (de) | 2000-07-05 | 2001-07-05 | Kühlvorrichtung für computer |
Country Status (5)
Country | Link |
---|---|
US (1) | US20040090746A1 (de) |
EP (1) | EP1374020A2 (de) |
AU (1) | AU2001278473A1 (de) |
DE (1) | DE10032050A1 (de) |
WO (1) | WO2002003183A2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140083120A1 (en) * | 2012-09-21 | 2014-03-27 | Elizabeth Nowak | Renewable energy-based atmospheric water generator |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5251095A (en) * | 1992-07-31 | 1993-10-05 | International Business Machines Corporation | Low temperature conduction module for a cryogenically-cooled processor |
DE19544085A1 (de) * | 1995-11-27 | 1997-06-19 | Hartmut Pfeffer | Vorrichtung zur Erzeugung einer konstanten Kälteatmosphäre, um optimale Betriebsbedingungen für elektronische Baugruppen und Systeme zu erreichen |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US529705A (en) * | 1894-11-27 | Packing-case | ||
DE3046032A1 (de) * | 1980-12-06 | 1982-07-15 | Brown, Boveri & Cie Ag, 6800 Mannheim | "thermische isolierung" |
US4800422A (en) * | 1987-05-07 | 1989-01-24 | Ncr Corporation | Frostless interface supercooled VLSI system |
US4805420A (en) * | 1987-06-22 | 1989-02-21 | Ncr Corporation | Cryogenic vessel for cooling electronic components |
US4950181A (en) * | 1988-07-28 | 1990-08-21 | Ncr Corporation | Refrigerated plug-in module |
MY115676A (en) * | 1996-08-06 | 2003-08-30 | Advantest Corp | Printed circuit board with electronic devices mounted thereon |
-
2000
- 2000-07-05 DE DE10032050A patent/DE10032050A1/de not_active Withdrawn
-
2001
- 2001-07-05 AU AU2001278473A patent/AU2001278473A1/en not_active Abandoned
- 2001-07-05 WO PCT/EP2001/007707 patent/WO2002003183A2/de not_active Application Discontinuation
- 2001-07-05 EP EP01956516A patent/EP1374020A2/de not_active Withdrawn
- 2001-07-05 US US10/332,462 patent/US20040090746A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5251095A (en) * | 1992-07-31 | 1993-10-05 | International Business Machines Corporation | Low temperature conduction module for a cryogenically-cooled processor |
DE19544085A1 (de) * | 1995-11-27 | 1997-06-19 | Hartmut Pfeffer | Vorrichtung zur Erzeugung einer konstanten Kälteatmosphäre, um optimale Betriebsbedingungen für elektronische Baugruppen und Systeme zu erreichen |
Non-Patent Citations (1)
Title |
---|
"]bertakten, aber richtig" C'T MAGAZIN F]R COMPUTERTECHNIK, Nr. 3, 1998, Seite 124 XP000731093 Hannover, DE * |
Also Published As
Publication number | Publication date |
---|---|
AU2001278473A1 (en) | 2002-01-14 |
EP1374020A2 (de) | 2004-01-02 |
DE10032050A1 (de) | 2002-01-17 |
US20040090746A1 (en) | 2004-05-13 |
WO2002003183A3 (de) | 2003-10-09 |
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