AU2001278473A1 - Cooling device for a computer - Google Patents

Cooling device for a computer

Info

Publication number
AU2001278473A1
AU2001278473A1 AU2001278473A AU7847301A AU2001278473A1 AU 2001278473 A1 AU2001278473 A1 AU 2001278473A1 AU 2001278473 A AU2001278473 A AU 2001278473A AU 7847301 A AU7847301 A AU 7847301A AU 2001278473 A1 AU2001278473 A1 AU 2001278473A1
Authority
AU
Australia
Prior art keywords
computer
cooling device
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001278473A
Inventor
Hannes Reisacher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Porextherm-Dammstoffe GmbH
Original Assignee
Porextherm-Dammstoffe GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Porextherm-Dammstoffe GmbH filed Critical Porextherm-Dammstoffe GmbH
Publication of AU2001278473A1 publication Critical patent/AU2001278473A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H01L23/445—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Silicon Compounds (AREA)
AU2001278473A 2000-07-05 2001-07-05 Cooling device for a computer Abandoned AU2001278473A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10032050A DE10032050A1 (en) 2000-07-05 2000-07-05 Cooling device for computers
DE10032050.3 2000-07-05
PCT/EP2001/007707 WO2002003183A2 (en) 2000-07-05 2001-07-05 Cooling device for a computer

Publications (1)

Publication Number Publication Date
AU2001278473A1 true AU2001278473A1 (en) 2002-01-14

Family

ID=7647447

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001278473A Abandoned AU2001278473A1 (en) 2000-07-05 2001-07-05 Cooling device for a computer

Country Status (5)

Country Link
US (1) US20040090746A1 (en)
EP (1) EP1374020A2 (en)
AU (1) AU2001278473A1 (en)
DE (1) DE10032050A1 (en)
WO (1) WO2002003183A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140083120A1 (en) * 2012-09-21 2014-03-27 Elizabeth Nowak Renewable energy-based atmospheric water generator

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US529705A (en) * 1894-11-27 Packing-case
DE3046032A1 (en) * 1980-12-06 1982-07-15 Brown, Boveri & Cie Ag, 6800 Mannheim "THERMAL INSULATION"
US4800422A (en) * 1987-05-07 1989-01-24 Ncr Corporation Frostless interface supercooled VLSI system
US4805420A (en) * 1987-06-22 1989-02-21 Ncr Corporation Cryogenic vessel for cooling electronic components
US4950181A (en) * 1988-07-28 1990-08-21 Ncr Corporation Refrigerated plug-in module
US5251095A (en) * 1992-07-31 1993-10-05 International Business Machines Corporation Low temperature conduction module for a cryogenically-cooled processor
DE19544085A1 (en) * 1995-11-27 1997-06-19 Hartmut Pfeffer Constant controlled cool atmosphere housing for electronics modules and systems
US6052284A (en) * 1996-08-06 2000-04-18 Advantest Corporation Printed circuit board with electronic devices mounted thereon

Also Published As

Publication number Publication date
WO2002003183A3 (en) 2003-10-09
US20040090746A1 (en) 2004-05-13
WO2002003183A2 (en) 2002-01-10
EP1374020A2 (en) 2004-01-02
DE10032050A1 (en) 2002-01-17

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