WO2001087035A1 - Fertigungslinie für die einseitige und doppelseitige bestückung von leiterplatten - Google Patents
Fertigungslinie für die einseitige und doppelseitige bestückung von leiterplatten Download PDFInfo
- Publication number
- WO2001087035A1 WO2001087035A1 PCT/DE2001/001759 DE0101759W WO0187035A1 WO 2001087035 A1 WO2001087035 A1 WO 2001087035A1 DE 0101759 W DE0101759 W DE 0101759W WO 0187035 A1 WO0187035 A1 WO 0187035A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- production line
- cfl
- sided
- assembly
- printed circuit
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 51
- 238000005476 soldering Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 description 7
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 101100446326 Caenorhabditis elegans fbxl-1 gene Proteins 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
Definitions
- the invention relates to a production line for the one-sided and double-sided assembly of printed circuit boards with components, the production line consisting of two successive sections, each comprising a printer, at least one assembly module and a soldering furnace in the direction of passage of the printed circuit boards.
- a section of such a production line consists of at least one printer, at least one assembly module for the automatic positioning of components on the circuit board running through the line, and a soldering furnace. Since the configuration of the placement modules varies depending on the components to be handled, because e.g. Automatic placement machines that only handle passive components, such as resistors, capacitors, etc., while other automatic placement machines essentially position ICs with high accuracy, the mixed production line generally has to include two or more different placement modules. If different assembly tasks are to be managed with the production line, the production line must have all the assembly modules that are required for these tasks.
- the assembly is populated by a single production line on one side during a first pass, whereupon the single-sided assembly leaving the production line is transported back to the entrance of the production line and then during a second pass through the production line on the other side is populated.
- a typical production line of this type with three different placement modules and the usual reflow oven in the form of a tunnel oven reaches a length of about 20 m.
- two identical production lines are connected in series to form a combined production line, so that the return transport is omitted and the other side is loaded while the assembly is passing through the second production line. Only the first of the two combined production lines that are combined with one another can be used to manufacture a single-sided assembly.
- each of these two production lines has the same equipment with assembly modules, ie doubled by doubling the production lines the number of assembly modules and the total length of the combined production line doubles to around 40 m.
- the invention is therefore based on the object of developing a novel production line which, with high production and product flexibility, is equally suitable for one-sided as well as for double-sided assembly of assemblies in combined operation and with a single pass, the best possible clocking of the assembly modules and so that high performance is possible, the overall length remains within the scope of what is required in the previously customary individual production lines and is particularly cost-effective in terms of construction.
- the two successive sections have only the same number of assembly modules as can be found in the conventional procedure described above in each individual section of the production line, the overall length of the production line consisting of two sections is considerably reduced. Likewise, the cost is reduced.
- the production line according to the invention makes it possible to produce assemblies equipped on one side and on both sides in a single pass, to provide any arrangement of the components on the two sides, provided that only the assembly modules present in the production line permit assembly with these components.
- a particularly advantageous further development according to which a turning station follows the second soldering furnace, facilitates operation with two passes through the production line in order to achieve the greatest possible product flexibility.
- FIG. 1 shows a conventional production line according to the prior art for comparison
- FIG. 2 shows a production line according to the invention with two successive sections, the operation being shown according to a first assembly variant with a single pass;
- Figure 3 shows the production line shown in Figure 2 during operation after a second assembly variant with two passes through the production line.
- 3 3 s 3 3 vQ P 1 ⁇ P ⁇ 3: 3 3 P- 3 3: C ⁇ 3 3 rt 3 3 3 3 0 ⁇ Hl Cfl ⁇ C ⁇ -_ 3 PJ o vQ J ⁇ t ⁇ ⁇ s: rt ⁇ rt ⁇ N> ⁇ rt ⁇ P- * Ü 3 1 P- ⁇ • o cn Cfl 3 Q. -.
- Printed circuit board may comprise the assembled surface elements BE6, BE7 and BE8 by the above beschrie reference to FIG 2 ⁇ surrounded method.
- one surface can only carry components BE6 and the other surface components BE7 and BE8.
- the circuit board 13 to be assembled will pass through the production line 13 twice, as is shown in FIG. 3 is shown.
- one side is populated with components BE6, BE7 and / or BE8, the process sequence corresponding to that described above for one-sided assembly, whereupon the printed circuit board is turned over and in a second pass the other side is loaded in the same way.
- a further turning station 11 which can be optionally switched on and off, is expediently arranged at the end of section 13b, so that in this mode of operation the printed circuit boards are inserted into the magazine in the position turned for the second pass before being transported back.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020027015100A KR100791152B1 (ko) | 2000-05-12 | 2001-05-09 | 프린트 회로 기판의 단면 및 양면 조립을 위한 제조 라인 |
JP2001583114A JP2004507075A (ja) | 2000-05-12 | 2001-05-09 | プリント配線板の片面実装および両面実装用製造ライン |
EP01943042A EP1281305B1 (de) | 2000-05-12 | 2001-05-09 | Fertigungslinie für die einseitige und doppelseitige bestückung von leiterplatten |
DE50110454T DE50110454D1 (de) | 2000-05-12 | 2001-05-09 | Fertigungslinie für die einseitige und doppelseitige bestückung von leiterplatten |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10023358A DE10023358A1 (de) | 2000-05-12 | 2000-05-12 | Fertigungslinie für die einseitige und doppelseitige Bestückung von Leiterplatten |
DE10023358.9 | 2000-05-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001087035A1 true WO2001087035A1 (de) | 2001-11-15 |
Family
ID=7641840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2001/001759 WO2001087035A1 (de) | 2000-05-12 | 2001-05-09 | Fertigungslinie für die einseitige und doppelseitige bestückung von leiterplatten |
Country Status (7)
Country | Link |
---|---|
US (1) | US20030154596A1 (de) |
EP (1) | EP1281305B1 (de) |
JP (1) | JP2004507075A (de) |
KR (1) | KR100791152B1 (de) |
CN (1) | CN1199550C (de) |
DE (2) | DE10023358A1 (de) |
WO (1) | WO2001087035A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005009100A1 (ja) * | 2003-07-22 | 2005-01-27 | Fuji Machine Mfg. Co., Ltd. | 電子回路生産方法および電子回路生産システム |
CN108282993A (zh) * | 2017-12-27 | 2018-07-13 | 昆山遥矽微电子科技有限公司 | 安装印刷电路板的流水线 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6318437B1 (en) * | 1998-07-09 | 2001-11-20 | Samsung Aerospace Industries, Ltd. | Tape feeder for component part mounter |
DE102005045161A1 (de) * | 2005-09-21 | 2007-04-05 | Endress + Hauser Gmbh + Co. Kg | Vorrichtung zum Wenden und Bestücken von Leiterplatten |
DE102006020012B4 (de) * | 2006-04-26 | 2019-01-03 | Behr-Hella Thermocontrol Gmbh | Verfahren zur Erstellung von beidseitig mit Bauteilen bestückten Leiterkarten |
DE102008019102A1 (de) | 2008-04-16 | 2009-10-29 | Siemens Aktiengesellschaft | Anordnung zum Transport von Substraten, Anordnung zum Handhaben von Substraten, Anordnung zum Herstellen elektronischer Baugruppen sowie Verfahren zum Handhaben von Substraten |
JP5780869B2 (ja) * | 2011-07-27 | 2015-09-16 | 富士機械製造株式会社 | 電子部品実装システム |
CN102689071B (zh) * | 2012-06-18 | 2016-07-06 | 日东电子科技(深圳)有限公司 | 回流焊接设备 |
CN106276784B (zh) * | 2015-05-13 | 2017-11-24 | 无锡华润安盛科技有限公司 | 一种Flip Chip生产线 |
CN116193754B (zh) * | 2023-04-26 | 2023-08-22 | 云泰智能科技(天津)有限责任公司 | 一种印刷电路板及其防护件 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5678304A (en) * | 1996-07-24 | 1997-10-21 | Eastman Kodak Company | Method for manufacturing double-sided circuit assemblies |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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FR2634319B1 (fr) * | 1988-07-13 | 1990-09-07 | Europ Composants Electron | Procede de soudure des fils de connexions exterieures sur un composant electronique |
US5170554A (en) * | 1990-09-28 | 1992-12-15 | Hewlett-Packard Company | High mix printed circuit assembly technique |
AU651881B2 (en) * | 1991-03-18 | 1994-08-04 | Fujitsu Limited | System for producing printed-wiring board unit and its producing method |
US5371940A (en) * | 1991-05-24 | 1994-12-13 | Fujitsu Limited | Pallet arranging system |
JPH056212A (ja) * | 1991-06-27 | 1993-01-14 | Mitsubishi Electric Corp | 部品搭載機用データ作成方法 |
JPH06232543A (ja) * | 1993-02-04 | 1994-08-19 | Omron Corp | プリント基板の部品実装方法 |
JP2518539B2 (ja) * | 1993-11-15 | 1996-07-24 | 日本電気株式会社 | 縦型リフロ―半田付装置 |
DE4433565A1 (de) * | 1994-09-20 | 1996-03-21 | Blaupunkt Werke Gmbh | Einrichtung zum automatischen Bestücken der Ober- und Unterseite von Leiterplatten mit SMD-Bauteilen |
JP3702496B2 (ja) * | 1995-07-10 | 2005-10-05 | 三菱電機株式会社 | 数値制御装置を用いた加工方法 |
-
2000
- 2000-05-12 DE DE10023358A patent/DE10023358A1/de not_active Withdrawn
-
2001
- 2001-05-09 US US10/275,545 patent/US20030154596A1/en not_active Abandoned
- 2001-05-09 JP JP2001583114A patent/JP2004507075A/ja not_active Ceased
- 2001-05-09 DE DE50110454T patent/DE50110454D1/de not_active Expired - Fee Related
- 2001-05-09 EP EP01943042A patent/EP1281305B1/de not_active Expired - Lifetime
- 2001-05-09 CN CNB018093019A patent/CN1199550C/zh not_active Expired - Fee Related
- 2001-05-09 WO PCT/DE2001/001759 patent/WO2001087035A1/de active IP Right Grant
- 2001-05-09 KR KR1020027015100A patent/KR100791152B1/ko not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5678304A (en) * | 1996-07-24 | 1997-10-21 | Eastman Kodak Company | Method for manufacturing double-sided circuit assemblies |
Non-Patent Citations (3)
Title |
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"LINE 4 - TYPE III ASSEMBLY", ELECTRONIC PACKAGING AND PRODUCTION, CAHNERS PUBLISHING CO, NEWTON, MASSACHUSETTS, US, vol. 36, no. 2, 1 February 1996 (1996-02-01), pages 29,31, XP000557191, ISSN: 0013-4945 * |
KUHNAPFEL M ET AL: "FLEXIBEL UND EFFIZIENT BESTUCKEN", F & M. FEINWERKTECHNIK MIKROTECHNIK MESSTECHNIK, CARL HANSER GMBH, MUNCHEN, DE, vol. 101, no. 11/12, 1 November 1993 (1993-11-01), pages 433 - 435, XP000411566, ISSN: 0944-1018 * |
SMITHEY H: "BREAK AWAY FIDUCIAL LOCATING MARKS", MOTOROLA TECHNICAL DEVELOPMENTS, MOTOROLA INC. SCHAUMBURG, ILLINOIS, US, vol. 35, June 1998 (1998-06-01), pages 193 - 197, XP000862672 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005009100A1 (ja) * | 2003-07-22 | 2005-01-27 | Fuji Machine Mfg. Co., Ltd. | 電子回路生産方法および電子回路生産システム |
JPWO2005009100A1 (ja) * | 2003-07-22 | 2006-11-02 | 富士機械製造株式会社 | 電子回路生産方法および電子回路生産システム |
JP4745825B2 (ja) * | 2003-07-22 | 2011-08-10 | 富士機械製造株式会社 | 電子回路生産方法および電子回路生産システム |
CN108282993A (zh) * | 2017-12-27 | 2018-07-13 | 昆山遥矽微电子科技有限公司 | 安装印刷电路板的流水线 |
Also Published As
Publication number | Publication date |
---|---|
DE10023358A1 (de) | 2001-11-29 |
CN1199550C (zh) | 2005-04-27 |
JP2004507075A (ja) | 2004-03-04 |
KR100791152B1 (ko) | 2008-01-02 |
US20030154596A1 (en) | 2003-08-21 |
CN1429471A (zh) | 2003-07-09 |
EP1281305A1 (de) | 2003-02-05 |
DE50110454D1 (de) | 2006-08-24 |
EP1281305B1 (de) | 2006-07-12 |
KR20030010619A (ko) | 2003-02-05 |
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