WO2001075801A1 - Dispositif d'inspection d'orifice de brasure - Google Patents

Dispositif d'inspection d'orifice de brasure Download PDF

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Publication number
WO2001075801A1
WO2001075801A1 PCT/JP2000/002040 JP0002040W WO0175801A1 WO 2001075801 A1 WO2001075801 A1 WO 2001075801A1 JP 0002040 W JP0002040 W JP 0002040W WO 0175801 A1 WO0175801 A1 WO 0175801A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder hole
solder
physical quantity
hole
brightness
Prior art date
Application number
PCT/JP2000/002040
Other languages
English (en)
Japanese (ja)
Inventor
Takayuki Haga
Original Assignee
Kokusai Gijutsu Kaihatsu Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Gijutsu Kaihatsu Kabushiki Kaisha filed Critical Kokusai Gijutsu Kaihatsu Kabushiki Kaisha
Priority to PCT/JP2000/002040 priority Critical patent/WO2001075801A1/fr
Publication of WO2001075801A1 publication Critical patent/WO2001075801A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder

Definitions

  • the present invention relates to a solder hole pass / fail determination device, and more particularly to a solder hole pass / fail determination device, and more particularly, to inspect a solder hole defect that is to be an electrode arranged in an array on a substrate.
  • the present invention relates to a device for determining the quality of solder holes.
  • semiconductor devices of a chip size package hereinafter referred to as a CSP in which the external dimensions of the semiconductor device have been reduced to almost the external dimensions of the semiconductor have been developed. Proposed.
  • a semiconductor element is fixed on a substrate having an external dimension slightly larger than the external dimension of the semiconductor element with an adhesive or the like, and an electrode formed on a peripheral part of the semiconductor element and a peripheral part of the substrate are used.
  • the electrodes formed on the printed circuit board are electrically connected to each other with gold wires or the like, electrodes are formed in an array on the bottom surface of the substrate, and the electrodes are formed on the printed circuit board in the same manner as the electrodes, and A spherically formed solder ball is inserted between the two and heated to melt the solder and electrically connect the two.
  • solder holes electrodes for connecting with solder balls on these substrates.
  • connection point with solder is below the semiconductor device, it is not possible to directly observe this soldering situation, and X-ray photography And other devices are required.
  • the present invention has been made in view of the above-mentioned facts, and has as its object to provide an apparatus for determining the quality of a solder hole that acts on various defects in the solder hole.
  • the present invention provides: a photographing means for photographing a substrate having a solder hole formed thereon, and the solder hole based on image data obtained by photographing the substrate by the photographing means.
  • Calculating means for calculating a physical quantity representing the characteristic of the solder hole; comparing the physical quantity representing the characteristic of the solder hole calculated by the calculating means with a reference value serving as a reference for judging the quality of the solder hole; Determining means for determining the quality of the hole.
  • the photographing means photographs the substrate on which the plated solder holes are formed.
  • the calculating means calculates a physical quantity representing a feature of the solder hole based on image data obtained by photographing the substrate by the photographing means. That is, the calculation means calculates a physical quantity representing a feature of the solder hole by labeling based on the image data.
  • labeling refers to treating similar continuous pixels in the image data as a block, and as a result of the labeling, the characteristics (position, height, width, total number of pixels, aspect ratio, etc.) of the block are obtained. In the case of this device, labeling is performed on a plurality of shot solder holes, and when one of the solder holes is labeled, one is provided for each solder hole. A labeling result is obtained.
  • the determining means compares the physical quantity representing the characteristics of the solder hole calculated by the calculating means with a reference value serving as a reference for determining the quality of the solder hole.
  • the quality of the through hole is determined. Note that this reference value may also be obtained by the above-described labeling in image data obtained by previously photographing a regular board.
  • the calculating means may calculate a physical quantity relating to the brightness of the solder hole or a physical quantity relating to the shape of the solder hole as the physical quantity representing the feature of the solder hole.
  • the physical quantity relating to the brightness of the solder hole may be a histogram or an average of the brightness of the solder hole on at least one assumed line assumed on the solder hole.
  • the physical quantities related to the shape of the solder hole include a first width of the solder hole in a predetermined direction, a second width (so-called height) in a direction perpendicular to the predetermined direction, an area, the first width and the second width. And the occupancy (the ratio of the area to the ratio of the first width and the second width to the ratio).
  • the calculating means calculates the physical quantity relating to the brightness of the solder hole as the physical quantity representing the characteristics of the solder hole
  • the determining means obtains a reference value based on the physical quantity relating to the brightness of the solder hole
  • the quality of the solder hole may be determined by comparing the physical quantity representing the characteristic of (1) with the obtained reference value to determine the quality of the solder hole.
  • the average brightness of the solder holes on at least one assumed line assumed on the solder holes includes the average brightness of the entire area of the solder hole. Also, when a plurality of solder holes are formed on the substrate, the average of the average brightness of the solder holes on at least one assumed line of each of the plurality of solder holes of at least one substrate. It is a predetermined percentage (for example, 80%).
  • FIG. 1 is a diagram showing a pass / fail determination device according to the present embodiment.
  • FIG. 2 is a block diagram of the pass / fail determination device.
  • FIGS. 3A to 3C are views showing the appearance of an image obtained by photographing and the structure of a solder hole.
  • 4A to 4C are diagrams illustrating the brightness of a solder hole.
  • FIGS. 5A and 5B are diagrams showing various types of defects in the solder holes.
  • FIG. 6 is a diagram illustrating a method for detecting a defective brightness portion according to a modification.
  • 7A and 7B are diagrams illustrating a method for detecting a defective brightness portion according to another modification.
  • a defect determination device as a solder hole pass / fail determination device includes a light source 10 for illuminating the inspection target 200 and a camera (for example, a camera for photographing the illuminated inspection target 200).
  • a two-dimensional CCD sensor or the like) 12 and a determination device 14 that determines pass / fail from an image signal of the inspection target 200 captured by the camera 12.
  • the belt 13 is moved by the motor 11 driven in accordance with the control of the determination device 14 so as to convey the inspection object arranged on the belt 13.
  • the inspected object for which the judgment result is obtained is marked by a marking device (not shown) on a defective portion or sent to a device for sorting defective and non-defective products.
  • FIG. 2 shows a block diagram of a control system for image processing of the inspection device 14.
  • the judging device 14 is an AMP 16 that amplifies an analog signal of the inspection object 200 photographed by the camera 12 and an AZD conversion that converts the analog signal amplified by the AMP 16 into a digital signal.
  • a shading circuit 20 for performing shading processing based on the digital image signal converted by the A / D converter 18.
  • a lookup table and a data processing circuit 26 are connected to the shading circuit 20.
  • FIG. 3 shows a state of the solder hole of the object 200 to be inspected.
  • FIG. 3A shows the state of the entire substrate
  • FIG. 3B shows the state of an area corresponding to one semiconductor device therein, in which solder holes are formed in an array.
  • FIG. 3C is a diagram showing a cross section of one of the solder holes.
  • the solder hole H is provided in the resist 30 on the base material 40.
  • Figure 4 shows the brightness of the image of the solder hole.
  • Figure 4A shows an example of an image of a single solder hole, and the brightness of the image of the assumed line AB on the solder hole.
  • Figure 4B shows the result.
  • the solder hole is rough on a metal surface, and the image obtained by illuminating the solder hole does not show a constant value as shown in FIG.
  • Fig. 4C shows a histogram of the brightness of the image of the solder hole.If the solder hole is not completely removed, the brightness of the part of the metal surface of the pattern before this plating will change. . For example, a histogram indicated by NG in FIG. 4C is obtained.
  • this difference can be determined by judging that the brightness is within the average value V arv force reference value.
  • Fig. 5 shows various types of defects in the solder hole
  • Fig. 5A shows an example of an image of a solder hole in which partial defect of solder hole, bleeding of resist, adhesion of foreign matter, etc. occurred. .
  • Figure 7 7 shows the solder holes arranged in an array of one semiconductor device.
  • the average value Vavr of the brightness of each solder hole is all added, and the sum is divided by the total number of solder holes n. Is determined, and a solder hole with a brightness of Varv less than / 9 * 100% of the total average value Varv—all is determined to be defective. In such a configuration, only the solder hole connected to the solder hole is defective due to disconnection of the pattern or the like, and the solder hole in this unique state is detected.
  • FIG. 7B shows a substrate on which a plurality of semiconductor devices are arranged (the same as in FIG. 3A).
  • the total average value Varv—all of the solder hole brightness of the one semiconductor device Varv_i c—bd Determine within the board.
  • the average value Varvjc-bd is used to label the image data obtained by binarizing the image data at ⁇ * 100% of this average value Varv_icjDd, and the width X, height ⁇ , and area of each solder hole are obtained.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

Tous les points d'inspection d'un orifice de brasure sont inspectés. En fonction de données d'image collectées par l'imagerie d'une plaque sur laquelle un orifice de brasure est formé par un CCD, le paramètre de forme te le paramètre secondaire sont comparés à des valeurs prédéterminées, de sorte que différentes anomalies soient détectées.
PCT/JP2000/002040 2000-03-30 2000-03-30 Dispositif d'inspection d'orifice de brasure WO2001075801A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/002040 WO2001075801A1 (fr) 2000-03-30 2000-03-30 Dispositif d'inspection d'orifice de brasure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/002040 WO2001075801A1 (fr) 2000-03-30 2000-03-30 Dispositif d'inspection d'orifice de brasure

Publications (1)

Publication Number Publication Date
WO2001075801A1 true WO2001075801A1 (fr) 2001-10-11

Family

ID=11735857

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2000/002040 WO2001075801A1 (fr) 2000-03-30 2000-03-30 Dispositif d'inspection d'orifice de brasure

Country Status (1)

Country Link
WO (1) WO2001075801A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101278046B1 (ko) 2012-03-23 2013-06-27 성균관대학교산학협력단 레이저 드릴링 가공홀 검사방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0560537A (ja) * 1991-09-05 1993-03-09 Matsushita Electric Ind Co Ltd スルーホール検査装置
JPH07128248A (ja) * 1993-11-02 1995-05-19 Nikon Corp 欠陥検査装置
JPH10103933A (ja) * 1996-09-27 1998-04-24 Sanmei Denki Kk 実装基板検査装置
JPH1144524A (ja) * 1997-07-28 1999-02-16 Matsushita Electric Ind Co Ltd 表面実装型パッケージを用いた電子部品実装装置及びその検査方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0560537A (ja) * 1991-09-05 1993-03-09 Matsushita Electric Ind Co Ltd スルーホール検査装置
JPH07128248A (ja) * 1993-11-02 1995-05-19 Nikon Corp 欠陥検査装置
JPH10103933A (ja) * 1996-09-27 1998-04-24 Sanmei Denki Kk 実装基板検査装置
JPH1144524A (ja) * 1997-07-28 1999-02-16 Matsushita Electric Ind Co Ltd 表面実装型パッケージを用いた電子部品実装装置及びその検査方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101278046B1 (ko) 2012-03-23 2013-06-27 성균관대학교산학협력단 레이저 드릴링 가공홀 검사방법

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