WO2001069360A1 - Kühlvorrichtung für elektronische bauelemente - Google Patents
Kühlvorrichtung für elektronische bauelemente Download PDFInfo
- Publication number
- WO2001069360A1 WO2001069360A1 PCT/EP2001/002631 EP0102631W WO0169360A1 WO 2001069360 A1 WO2001069360 A1 WO 2001069360A1 EP 0102631 W EP0102631 W EP 0102631W WO 0169360 A1 WO0169360 A1 WO 0169360A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat transfer
- transfer medium
- heat
- cooling device
- cooling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a cooling device for electronic components, in particular for cooling microprocessors, with at least one passive heat-conducting cooling element.
- passive heat-conducting cooling elements in particular made of aluminum, are arranged on the surfaces of the electronic components and thus brought into active contact with them.
- the cooling elements are attached using adhesive or special brackets.
- An additional active cooling element in the form of a fan is usually attached to the passive cooling elements or integrated into the passive cooling elements.
- the known cooling systems are all based on the principle of heat transfer by evaporation, condensation, convection and radiation or are distinguished by different material combinations and surface structures with different conductivities or thermal resistances.
- a disadvantage of the known cooling devices is that due to the ever more powerful electronic components, especially due to the ever higher clock frequencies of microprocessors, the heat development increases sharply. However, since such electronic components can only work in a certain temperature range and become inoperable if the temperature is too high or experience severe performance losses, ever increasing demands are made on the corresponding cooling devices. With the coolers mentioned according to the prior art, the desired and required cooling can no longer be achieved.
- a generic cooling device with the features of claim 1 is used to achieve this object.
- a cooling device for electronic components has at least one passive heat-conducting cooling element, at least part of the passive cooling element being in contact with at least one heat transfer medium which is in a solid state of aggregation.
- the heat transfer medium is a phase transition material (PCM phase change material) with a heat capacity that is many times higher than that of water.
- the heat transfer medium is designed as a latent heat store, the heat transfer medium storing and storing the amount of heat generated by the load on the electronic component, which can no longer be absorbed and dissipated by the passive cooling element, while maintaining the solid state of the aggregate releases a time of lower load on the electronic component.
- the heat transfer medium is able to absorb temporarily occurring additional quantities of heat and to release them again under normal load, ie with normal heat development of the electronic component.
- This avoids thermal peak loads which, in conventional cooling devices, significantly reduce the performance of the electronic component and especially of microprocessors.
- the cooling device according to the invention thus also ensures an increase in performance of the cooled components. By avoiding harmful heat peaks, the service life and the functionality of the electronic components cooled with the cooling device according to the invention are also increased. Since the phase transition material used as the heat transfer medium also maintains its solid state of aggregation when it absorbs heat, there are advantageously no problems due to expansion of the phase transition material, as is always the case with known materials.
- the heat transfer medium consists of salts or salt mixtures enriched with organic substances and fine powdered metallic substances to improve the conductivity.
- the organic component of the heat transfer medium is usually paraffin.
- Such a heat transfer medium maintains its solid state even when it absorbs heat and can thus be arranged in tablet form and / or as a solid body in and / or on the cooling element. This ensures that the cooling device is inexpensive to manufacture on the one hand and can be kept small on the other.
- the heat transfer medium is adjusted to the required operating temperature. temperatures when cooling the electronic components is individually adjustable. The setting is made by varying the type and amount of the components of the heat transfer medium. In particular, it is also possible to set the amount of heat that the heat transfer medium is to buffer.
- the heat transfer medium is advantageously non-toxic and recyclable.
- At least one active cooling element in particular a fan, is arranged on the passive cooling element. This advantageously ensures that the cooling capacity of the cooling device is increased again.
- the heat transfer medium is arranged in a container made of heat-conducting material, the container being in contact with the passive cooling element.
- the arrangement of the heat transfer medium in a container enables the individual heat transfer elements to be easily exchanged within or on the passive cooling element.
- a heat-conducting film is arranged between a contact surface of the passive cooling element and a corresponding contact surface of the electronic component. This measure ensures that the total cooling capacity with the cooling device is further increased by an optimized heat transfer from the electronic component to the passive cooling element.
- the invention also relates to a processor with a processor socket and at least one cooling device arranged on the processor, the cooling device having at least one passive heat-conducting cooling element and at least part of the passive cooling element with at least one Heat transfer medium, which is in a solid state of aggregation, is in contact.
- the heat transfer medium is a phase transition material (PCM phase change material) with a heat absorption capacity that is many times higher than that of water.
- the heat transfer medium is designed as a latent heat storage device in such a way that the heat transfer medium stores the amount of heat generated by the load on the processor, which can no longer be absorbed and dissipated by the passive cooling element, while maintaining the solid state of the aggregate and at a time when the load on the processor is lower again emits.
- the invention also relates to the use of a heat transfer medium, which is in a solid state of aggregation, for cooling microprocessors, the heat transfer medium being a phase transition material (PCM phase change material) with a heat absorption capacity that is many times higher than that of water, and is designed as a latent heat store ,
- PCM phase change material phase transition material
- the heat transfer medium stores the amount of heat generated by the load on the microprocessor while maintaining the solid aggregate state and releases it again at a time when the load on the microprocessor is lower.
- Figure 1 is a schematic sectional view through a cooling device according to the invention.
- Figure 2 is a schematically illustrated plan view of the invention
- Figure 3 is a schematically illustrated side view of the 1 according to the invention.
- FIG. 1 shows a sectional view of a cooling device 10 for cooling electronic components, in particular for cooling microprocessors.
- the cooling device 10 consists of a passive heat-conducting cooling element 12, the cooling element 12 being constructed from a multiplicity of cooling fins 14.
- the cooling fins 14 are arranged on a base element 16 of the cooling element 12.
- the base element 16 forms a contact surface 18 which is in contact with the electronic component to be cooled.
- the passive cooling element 12 consists of aluminum or an aluminum alloy and is usually formed in one piece. It can be seen that a plurality of heat transfer media 20 are arranged within the cooling element 12 between the cooling fins 14.
- the heat transfer media 20 are in a solid state of aggregation and in heat-conducting contact with the cooling fins 14 and the bottom element 16 or the cooling element 12.
- the heat transfer medium is a phase transition material with a heat absorption capacity that is many times higher than that of water. Since the heat transfer medium is in a solid state of aggregation and also remains when heat is absorbed, it is not necessary to form the heat transfer medium 20 or the cooling element 12 in a sealing manner. A mounting of the individual heat transfer media 20 within the passive cooling element 12 is sufficient.
- the heat transfer medium is also designed as a latent heat storage device, such that the heat transfer medium 20 stores the thermal energy generated by the load on the electronic component, which can no longer be absorbed and dissipated by the passive cooling element 18, while maintaining the solid state of aggregation and at a point in time releases less load on the electronic component again.
- FIG. 2 shows a schematic top view of the cooling device 10 according to FIG. 1. The arrangement of the individual heat transfer media 20 between the individual cooling fins 14 of the cooling element 12 can be seen.
- FIG. 3 shows a side view of the cooling device according to FIG. 1. It can be seen that fastening devices 22 for fastening the cooling device 10 with the electronic component to be cooled are molded onto the cooling element 12 in the region of the base element 16 and laterally thereon. Furthermore, it can be seen that in the exemplary embodiment shown, the heat transfer media 20 are disc-shaped. However, the size and shape of the heat transfer media 20 can be selected as desired. About the size and number of heat transfer media 20, it is among other things. possible to set the required operating temperatures for the respective electronic components to be cooled.
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01913851A EP1198745A1 (de) | 2000-03-16 | 2001-03-08 | Kühlvorrichtung für elektronische bauelemente |
JP2001568171A JP2003527753A (ja) | 2000-03-16 | 2001-03-08 | 電子構成要素のための冷却デバイス |
CA002374008A CA2374008A1 (en) | 2000-03-16 | 2001-03-08 | Cooling device for electronic components |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10012990.0 | 2000-03-16 | ||
DE2000112990 DE10012990A1 (de) | 2000-03-16 | 2000-03-16 | Kühlvorrichtung für elektronische Bauelemente |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001069360A1 true WO2001069360A1 (de) | 2001-09-20 |
Family
ID=7635072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2001/002631 WO2001069360A1 (de) | 2000-03-16 | 2001-03-08 | Kühlvorrichtung für elektronische bauelemente |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1198745A1 (de) |
JP (1) | JP2003527753A (de) |
CN (1) | CN1364251A (de) |
CA (1) | CA2374008A1 (de) |
DE (1) | DE10012990A1 (de) |
TW (1) | TW499749B (de) |
WO (1) | WO2001069360A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109326573A (zh) * | 2017-08-01 | 2019-02-12 | 亚德诺半导体无限责任公司 | 单片相变散热装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7184265B2 (en) | 2003-05-29 | 2007-02-27 | Lg Electronics Inc. | Cooling system for a portable computer |
US7188484B2 (en) * | 2003-06-09 | 2007-03-13 | Lg Electronics Inc. | Heat dissipating structure for mobile device |
CN102548355B (zh) * | 2010-12-31 | 2015-04-29 | 联想(北京)有限公司 | 一种电子设备 |
TWI484089B (zh) * | 2012-03-22 | 2015-05-11 | Univ Nat Cheng Kung | 智慧型太陽能窗、帷幕之模組構造 |
KR102104919B1 (ko) | 2013-02-05 | 2020-04-27 | 삼성전자주식회사 | 반도체 패키지 및 이의 제조방법 |
DE102013204473A1 (de) | 2013-03-14 | 2014-09-18 | Robert Bosch Gmbh | Kühlanordnung für ein Steuergerät |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996028846A1 (en) * | 1995-03-14 | 1996-09-19 | Barr & Stroud Limited | Heat sink |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19805930A1 (de) * | 1997-02-13 | 1998-08-20 | Furukawa Electric Co Ltd | Kühlvorrichtung |
-
2000
- 2000-03-16 DE DE2000112990 patent/DE10012990A1/de not_active Withdrawn
-
2001
- 2001-03-08 CA CA002374008A patent/CA2374008A1/en not_active Abandoned
- 2001-03-08 WO PCT/EP2001/002631 patent/WO2001069360A1/de not_active Application Discontinuation
- 2001-03-08 JP JP2001568171A patent/JP2003527753A/ja not_active Withdrawn
- 2001-03-08 EP EP01913851A patent/EP1198745A1/de not_active Withdrawn
- 2001-03-08 CN CN 01800534 patent/CN1364251A/zh active Pending
- 2001-04-09 TW TW90106088A patent/TW499749B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996028846A1 (en) * | 1995-03-14 | 1996-09-19 | Barr & Stroud Limited | Heat sink |
Non-Patent Citations (2)
Title |
---|
"Phase-change Thermal Pack for Portable Computing Systems", IBM TECHNICAL DISCLOSURE BULLETIN., vol. 38, no. 08, August 1995 (1995-08-01), IBM CORP. NEW YORK., US, pages 627 - 628, XP000534660, ISSN: 0018-8689 * |
FURKAY S. S. & HOFFMAN P. R.: "Clip-on module thermal capacitor", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 27, no. 3, August 1984 (1984-08-01), NEW YORK US, pages 1779, XP002005397 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109326573A (zh) * | 2017-08-01 | 2019-02-12 | 亚德诺半导体无限责任公司 | 单片相变散热装置 |
CN109326573B (zh) * | 2017-08-01 | 2022-08-02 | 亚德诺半导体国际无限责任公司 | 单片相变散热装置 |
Also Published As
Publication number | Publication date |
---|---|
TW499749B (en) | 2002-08-21 |
JP2003527753A (ja) | 2003-09-16 |
EP1198745A1 (de) | 2002-04-24 |
CN1364251A (zh) | 2002-08-14 |
CA2374008A1 (en) | 2001-09-20 |
DE10012990A1 (de) | 2001-10-11 |
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