WO2001065904A1 - Verfahren und vorrichtung zur bestimmung der abhollage von elektrischen bauteilen in einer bestückvorrichtung - Google Patents
Verfahren und vorrichtung zur bestimmung der abhollage von elektrischen bauteilen in einer bestückvorrichtung Download PDFInfo
- Publication number
- WO2001065904A1 WO2001065904A1 PCT/DE2001/000740 DE0100740W WO0165904A1 WO 2001065904 A1 WO2001065904 A1 WO 2001065904A1 DE 0100740 W DE0100740 W DE 0100740W WO 0165904 A1 WO0165904 A1 WO 0165904A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- belt
- pick
- components
- structural features
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Definitions
- the invention relates to em method and an upstream ⁇ for determining the pick-up position of electrical construction ⁇ share a Bestuckvorraum to Bestucken of Substra ⁇ th with the components which m pockets are at least one belt provided, said belt e supply odule a ⁇ is guided that the components require a defined pick-up location to a pick-up point.
- Such feed modules are usually provided with a spiked wheel which engages with its radially protruding pins in the transport hole of the belt and the defined mkelsch ⁇ tten is rotated according to the pitch of the pockets of the belt.
- the pockets have a defined positional relationship to the transport holes. Centering marks are attached to the feed modules at the end of the manufacturing process in the area of the pick-up point.
- the feed modules are attached to a component table in a defined position. Since the centering means can be provided for this only some distance from the pick-up points, there may be deviations in the position of the centering marks.
- a placement head for handling the components is provided with the CCT camera, which is used to determine the exact position of the substrate to be mounted in the placement device. In order to be able to take into account the positional deviations mentioned, it is customary to determine the position of the centering marks on the supply module by means of this circuit board camera after the installation of the supply module, which means that the position of the component to be picked up is also due to the defined positional relationships is determinable. Operating Deviations in Antriebssy ⁇ stem are not completely eliminate.
- the gripper must be moved step by step within the tolerance range mentioned until it finds the component.
- the invention has for its object to accelerate the determination of the fetching of the components ".
- the structural features assigned to the pockets are now independent of the positional relationship to the transport holes and the centering marks.
- the scanning optics have such a large field of view that they already cover the pocket and its surrounding area in the first setting. rather finds.
- the spatially resolving scanning optics transmits measured values to the electrical evaluation unit, which calculates the exact central position of the pockets from the corresponding data.
- the suction gripper can now be safely and immediately aligned with the component to be picked up.
- the belts and the components can have strongly changing optical properties.
- the straps can be made of transparent material. For this reason, it may be necessary to select different structural features depending on the type of belt.
- the development according to claim 2 is particularly suitable for transparent belts, to which the component contrasts sufficiently.
- the components lie with play in the pocket e, so that an exact calibration is not immediately possible.
- the game is small in relation to the dimensions of the component, so that here too the component can be hit with sufficient certainty.
- the exact position of the pockets can be determined using statistical methods when optically measuring the components.
- the development according to claim 5 makes it possible to adjust the illumination of the structural features to different conditions, as is also the case when scanning centering marks on the substrates.
- the lighting makes it possible to make the bags from different
- the device according to claim 6 makes it possible to automatically detect the different structural features of the different types of belts, each full belt, which differs in optical and geometric properties from the others, being assigned its own type.
- the adaptation module according to claim 7 enables an optimal adaptation to the different optical conditions of the belts.
- FIG. 1 shows a side view of a placement head and a feed module with a component belt
- FIG. 2 shows a top view of the feed module according to FIG. 1.
- em ribbon-like belt 1 is provided with since ⁇ compact storage punches 2 and pockets 3 for inserted therein components 4 and m em disc-like flat to ⁇ used drove module 5 which m a defined position in the traversing region of a Bestuckkopfes 6 a Pick and place device is fixed.
- the supply module 5 has em gradually at ⁇ propellable sprocket 7 with pe ⁇ pher projecting transport pins 8 which m is the transport holes 2 of the belt 1 engage without play.
- the positional relationship between the pockets and the transport holes is defined by the relevant standards. However, the permissible tolerances here are almost as large as the side dimension measurements of the smallest components.
- the mounting head has, on its underside facing the belt, a suction gripper 9 and a scanning optic 10 m in the form of a CCT camera, the objective of which is surrounded by illumination 11 which illuminates the field of view of the scanning optic 10.
- the lighting 11 can e.g. consist of a multitude of light-emitting diodes of different wavelengths and different orientations. In adaptation to the different types of belts, it is possible to control an inexpensive selection of the diodes in such a way that the structural features stand out in high contrast and can be reliably recognized.
- the scanning optics 10 is directed to a pick-up point 12 of the components in the feed module 5. It is able to structure features 14, e.g. to recognize the edges of an empty pocket. It is connected to an image evaluation unit 13, which uses this data to calculate the central position of the pocket 3, so that the following component 4 can be reliably grasped by the suction gripper, with all tolerances being eliminated.
- the position of the bag relative to the transport hole can change 3 m over a longer section of the belt.
- the position of the removed components on the suction gripper 9 is increased. Precise measurement of the placement accuracy.
- the sliding change in position of the pockets can thus be reliably detected and taken into account during operation, so that a re-measurement of the belt (1) with the aid of the scanning optics 10 could only be necessary after a loss of data on the mounting device, for example after an interruption.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01915044A EP1260128B1 (de) | 2000-03-01 | 2001-02-28 | Verfahren und vorrichtung zur bestimmung der abhollage von elektrischen bauteilen in einer bestückvorrichtung |
DE50109694T DE50109694D1 (de) | 2000-03-01 | 2001-02-28 | Verfahren und vorrichtung zur bestimmung der abhollage von elektrischen bauteilen in einer bestückvorrichtung |
US11/323,415 US8381395B2 (en) | 2000-03-01 | 2005-12-30 | Method for determining pick-up positions of electronic components |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10009765.0 | 2000-03-01 | ||
DE10009765 | 2000-03-01 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10220535 A-371-Of-International | 2001-02-28 | ||
US11/323,415 Division US8381395B2 (en) | 2000-03-01 | 2005-12-30 | Method for determining pick-up positions of electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001065904A1 true WO2001065904A1 (de) | 2001-09-07 |
Family
ID=7632968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2001/000740 WO2001065904A1 (de) | 2000-03-01 | 2001-02-28 | Verfahren und vorrichtung zur bestimmung der abhollage von elektrischen bauteilen in einer bestückvorrichtung |
Country Status (4)
Country | Link |
---|---|
US (2) | US20030159279A1 (de) |
EP (1) | EP1260128B1 (de) |
DE (1) | DE50109694D1 (de) |
WO (1) | WO2001065904A1 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG185790A1 (en) * | 2010-06-30 | 2013-01-30 | Kla Tencor Corp | Method and arrangement for positioning electronic devices into compartments of an input medium and output medium |
AT513747B1 (de) | 2013-02-28 | 2014-07-15 | Mikroelektronik Ges Mit Beschränkter Haftung Ab | Bestückungsverfahren für Schaltungsträger und Schaltungsträger |
JP6413084B2 (ja) * | 2015-01-06 | 2018-10-31 | パナソニックIpマネジメント株式会社 | 電子部品供給装置 |
KR102362959B1 (ko) | 2016-09-13 | 2022-02-14 | 유니버셜 인스트루먼츠 코퍼레이션 | 피더 시스템, 픽 앤 플레이스 기계, 및 방법 |
WO2018150578A1 (ja) * | 2017-02-20 | 2018-08-23 | 株式会社Fuji | 部品実装機 |
CN110431931B (zh) * | 2017-03-24 | 2021-02-26 | 雅马哈发动机株式会社 | 元件供应装置及具备该装置的元件安装机 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19610126A1 (de) * | 1996-03-14 | 1997-09-18 | Siemens Ag | Einrichtung zur Überprüfung der ordnungsgemässen Verpackung von elektrischen Bauteilen, insbesondere integrierten Schaltkreisen |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4610083A (en) * | 1985-08-26 | 1986-09-09 | Zenith Electronics Corporation | Method and apparatus for electronic component matching |
US4810154A (en) * | 1988-02-23 | 1989-03-07 | Molex Incorporated | Component feeder apparatus and method for vision-controlled robotic placement system |
US5361901A (en) * | 1991-02-12 | 1994-11-08 | Minnesota Mining And Manufacturing Company | Carrier tape |
US5463227A (en) * | 1992-06-24 | 1995-10-31 | Robotic Vision Systems, Inc. | Method for obtaining three-dimensional data from multiple parts or devices in a multi-pocketed tray |
US5648136A (en) * | 1995-07-11 | 1997-07-15 | Minnesota Mining And Manufacturing Co. | Component carrier tape |
JP3358464B2 (ja) * | 1996-10-11 | 2002-12-16 | 松下電器産業株式会社 | 電子部品実装方法 |
US5988394A (en) * | 1996-11-28 | 1999-11-23 | Kabushiki Kaisha Toshiba | Tray for containing parts for storage and transportation |
US5913425A (en) * | 1997-12-08 | 1999-06-22 | Peak International, Inc. | Component carrier having anti-reflective pocket |
-
2001
- 2001-02-28 US US10/220,535 patent/US20030159279A1/en not_active Abandoned
- 2001-02-28 DE DE50109694T patent/DE50109694D1/de not_active Expired - Lifetime
- 2001-02-28 EP EP01915044A patent/EP1260128B1/de not_active Expired - Lifetime
- 2001-02-28 WO PCT/DE2001/000740 patent/WO2001065904A1/de active IP Right Grant
-
2005
- 2005-12-30 US US11/323,415 patent/US8381395B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19610126A1 (de) * | 1996-03-14 | 1997-09-18 | Siemens Ag | Einrichtung zur Überprüfung der ordnungsgemässen Verpackung von elektrischen Bauteilen, insbesondere integrierten Schaltkreisen |
Also Published As
Publication number | Publication date |
---|---|
US20030159279A1 (en) | 2003-08-28 |
US20060133662A1 (en) | 2006-06-22 |
DE50109694D1 (de) | 2006-06-08 |
EP1260128A1 (de) | 2002-11-27 |
US8381395B2 (en) | 2013-02-26 |
EP1260128B1 (de) | 2006-05-03 |
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