US20030159279A1 - Method and device for determining the pick-up position of electrical components in a component in a components placement device - Google Patents

Method and device for determining the pick-up position of electrical components in a component in a components placement device Download PDF

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Publication number
US20030159279A1
US20030159279A1 US10/220,535 US22053503A US2003159279A1 US 20030159279 A1 US20030159279 A1 US 20030159279A1 US 22053503 A US22053503 A US 22053503A US 2003159279 A1 US2003159279 A1 US 2003159279A1
Authority
US
United States
Prior art keywords
belt
component
components
structural features
pockets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/220,535
Other languages
English (en)
Inventor
Thomas Bachthaler
Hans-Horst Grasmueller
Thomas Liebeke
Michael Schwiefert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASMPT GmbH and Co KG
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to SIEMENS AKTIENGESELLSCHAFT reassignment SIEMENS AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SCHWIEFERT, MICHAEL, GRASMUELLER, HANS-HORST, BACHTHALER, THOMAS, LIEBEKE, THOMAS
Publication of US20030159279A1 publication Critical patent/US20030159279A1/en
Priority to US11/323,415 priority Critical patent/US8381395B2/en
Assigned to SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GMBH & CO. KG reassignment SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GMBH & CO. KG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SIEMENS AKTIENGESELLSCHAFT
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Definitions

  • the invention relates to a method and a device for determining the pick-up position of electrical components in a component placement device for populating substrates with the components, which are made ready in pockets of at least one belt, the belt being inserted into a feed module which delivers the components to a pick-up point in a defined pick-up position.
  • Feed modules of this type are usually provided with a pin wheel which, with its radially projecting pins, engages in transport holes in the belt and which is rotated in defined angular steps corresponding to the pitch spacing of the pockets in the belt.
  • the pockets have a defined positional relationship with the transport holes.
  • centering marks Fitted to the feed modules at the end of the production process, in the area of the pick-up point, are centering marks which have a defined positional relationship with the pins of the pin wheel and which are intended to compensate for production tolerances.
  • the feed modules are fixed in a defined position to a component table. Since the centering means for this purpose can be provided only at some distance from the pick-up points, it is possible for positional deviations to occur in the centering marks.
  • a component placement head for handling the components is provided with the CCT camera, which is used to determine the exact position of the substrate to be populated in the component placement device.
  • the components to be placed are being increasingly miniaturized. It is usual to provide the component placement head with a suction gripper, which is set down on the components to be picked up and sucks up the latter at its end. Here, the gripper has to dip into the pocket in order to be placed on the component.
  • the permissible tolerances between the transport hole and the pocket are so great that the suction gripper making the pick-up cannot with certainty be set exactly onto the component to be picked up, and is placed on the edge of the pocket and, as a result, misses the component. In this case, however, this is a systematic error, at least over a relatively long section of the belt.
  • the invention is based on the object of accelerating the determination of the pick-up position of the components.
  • the position-resolving scanning optics transmits the measured values to the electrical evaluation unit, which calculates the accurate center position of the pockets from the appropriate data.
  • the suction gripper can then immediately be aligned reliably on the component to be picked up.
  • the belts and the components can have very variable optical characteristics.
  • the belts can consist of transparent material. For this reason, it may be necessary to select different structural features, depending on the type of belt.
  • the development as claimed in claim 2 is suitable in particular for transparent belts, with which the component has a sufficient contrast.
  • the components lie in the pocket with play, so that exact calibration is not immediately possible, the play is low as compared with the dimensions of the component, so that here, too, the component can be found with sufficient reliability.
  • the precise position of the pockets can be determined with the aid of statistical methods in the case of optical measurement.
  • the development as claimed in claim 5 makes it possible to adjust the illumination of the structural features to different conditions, as is also done when scanning centering marks on the substrates.
  • the illumination makes it possible to illuminate the pockets from different directions at different angles and with different wavelengths, so that the structural features can stand out optimally.
  • the device as claimed in claim 6 makes it possible to register the different structural features of the various belt types automatically, each full belt which differs from the others in terms of its optical and geometric characteristics being assigned to its own type.
  • the adaptation module as claimed in claim 7 permits optimal adaptation to the different optical conditions of the belts.
  • FIG. 1 shows a side view of a component placement head and a feed module in a component belt
  • FIG. 2 shows a plan view of the feed module according to figure 1.
  • a strip-like belt 1 is provided with lateral transport holes 2 and pockets 3 for components 4 laid therein and is inserted into a disk-like flat feed module 5 which is fixed in a defined position in the range of movement of a component placement head 6 of a component placement device.
  • the feed module 5 has a pin wheel 7 which can be driven step by step and has transport pins 8 which stand out peripherally and engage without play in the transport holes 2 in the belt 1 .
  • the positional relationship between the pockets and the transport holes is defined by relevant standards. However, the permissible tolerances here are virtually as great as the lateral dimensions of the smallest components.
  • the component placement head On its underside, facing the belt, the component placement head has a suction gripper 9 and scanning optics 10 in the form of a CCT camera, whose objective is surrounded by an illuminating means 11 which illuminates the field of view of the scanning optics 10 .
  • the illuminating means 11 can, for example, comprise a large number of light-emitting diodes of different wavelengths and different orientations. Matching the various belt types, it is possible to activate a beneficial selection of the diodes in such a way that the structural features stand out with good contrast and can be detected reliably.
  • the scanning optics 10 is aimed at a pick-up point 12 of the components in the feed module 5 . It is capable of detecting structural features 14 , for example the edges of an empty pocket. It is connected to an image evaluation unit 13 , in which the central position of the pocket 3 is calculated by using this data, so that the following component 4 can be gripped reliably by the suction gripper, all the tolerances being eliminated.
  • the position of the pocket 3 in relation to the transport hole can change.
  • the position of the components removed on the suction gripper 9 is measured accurately in order to increase the placement accuracy.
  • the sliding positional change of the pockets can be registered reliably and taken into account during operation in such a way that remeasurement of the belt ( 1 ) with the aid of the scanning optics 10 might only be required following a loss of data on the component placement device, for example following an interruption.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
US10/220,535 2000-03-01 2001-02-28 Method and device for determining the pick-up position of electrical components in a component in a components placement device Abandoned US20030159279A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/323,415 US8381395B2 (en) 2000-03-01 2005-12-30 Method for determining pick-up positions of electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10009765.0 2000-03-01
DE10009765 2000-03-01

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/323,415 Division US8381395B2 (en) 2000-03-01 2005-12-30 Method for determining pick-up positions of electronic components

Publications (1)

Publication Number Publication Date
US20030159279A1 true US20030159279A1 (en) 2003-08-28

Family

ID=7632968

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/220,535 Abandoned US20030159279A1 (en) 2000-03-01 2001-02-28 Method and device for determining the pick-up position of electrical components in a component in a components placement device
US11/323,415 Active 2024-10-21 US8381395B2 (en) 2000-03-01 2005-12-30 Method for determining pick-up positions of electronic components

Family Applications After (1)

Application Number Title Priority Date Filing Date
US11/323,415 Active 2024-10-21 US8381395B2 (en) 2000-03-01 2005-12-30 Method for determining pick-up positions of electronic components

Country Status (4)

Country Link
US (2) US20030159279A1 (de)
EP (1) EP1260128B1 (de)
DE (1) DE50109694D1 (de)
WO (1) WO2001065904A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2807905B1 (de) 2013-02-28 2015-11-18 A.B. Mikroelektronik Gesellschaft mit beschränkter Haftung Bestückungsverfahren für schaltungsträger
WO2018150578A1 (ja) * 2017-02-20 2018-08-23 株式会社Ｆｕｊｉ 部品実装機
WO2018173296A1 (ja) * 2017-03-24 2018-09-27 ヤマハ発動機株式会社 部品供給装置及びこれを備えた部品実装機

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG185790A1 (en) * 2010-06-30 2013-01-30 Kla Tencor Corp Method and arrangement for positioning electronic devices into compartments of an input medium and output medium
JP6413084B2 (ja) * 2015-01-06 2018-10-31 パナソニックＩｐマネジメント株式会社 電子部品供給装置
KR102362959B1 (ko) 2016-09-13 2022-02-14 유니버셜 인스트루먼츠 코퍼레이션 피더 시스템, 픽 앤 플레이스 기계, 및 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4810154A (en) * 1988-02-23 1989-03-07 Molex Incorporated Component feeder apparatus and method for vision-controlled robotic placement system
US5463227A (en) * 1992-06-24 1995-10-31 Robotic Vision Systems, Inc. Method for obtaining three-dimensional data from multiple parts or devices in a multi-pocketed tray
US5988394A (en) * 1996-11-28 1999-11-23 Kabushiki Kaisha Toshiba Tray for containing parts for storage and transportation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4610083A (en) * 1985-08-26 1986-09-09 Zenith Electronics Corporation Method and apparatus for electronic component matching
US5361901A (en) * 1991-02-12 1994-11-08 Minnesota Mining And Manufacturing Company Carrier tape
US5648136A (en) * 1995-07-11 1997-07-15 Minnesota Mining And Manufacturing Co. Component carrier tape
DE19610126C2 (de) * 1996-03-14 1999-03-11 Siemens Ag Einrichtung zur Überprüfung der ordnungsgemässen Verpackung von elektrischen Bauteilen, insbesondere integrierten Schaltkreisen
JP3358464B2 (ja) * 1996-10-11 2002-12-16 松下電器産業株式会社 電子部品実装方法
US5913425A (en) * 1997-12-08 1999-06-22 Peak International, Inc. Component carrier having anti-reflective pocket

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4810154A (en) * 1988-02-23 1989-03-07 Molex Incorporated Component feeder apparatus and method for vision-controlled robotic placement system
US5463227A (en) * 1992-06-24 1995-10-31 Robotic Vision Systems, Inc. Method for obtaining three-dimensional data from multiple parts or devices in a multi-pocketed tray
US5988394A (en) * 1996-11-28 1999-11-23 Kabushiki Kaisha Toshiba Tray for containing parts for storage and transportation

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2807905B1 (de) 2013-02-28 2015-11-18 A.B. Mikroelektronik Gesellschaft mit beschränkter Haftung Bestückungsverfahren für schaltungsträger
US10217675B2 (en) 2013-02-28 2019-02-26 A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier
US10672672B2 (en) 2013-02-28 2020-06-02 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier
US10991632B2 (en) 2013-02-28 2021-04-27 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Assembly process for circuit carrier and circuit carrier
WO2018150578A1 (ja) * 2017-02-20 2018-08-23 株式会社Ｆｕｊｉ 部品実装機
JPWO2018150578A1 (ja) * 2017-02-20 2019-11-07 株式会社Ｆｕｊｉ 部品実装機
WO2018173296A1 (ja) * 2017-03-24 2018-09-27 ヤマハ発動機株式会社 部品供給装置及びこれを備えた部品実装機
JPWO2018173296A1 (ja) * 2017-03-24 2020-01-16 ヤマハ発動機株式会社 部品供給装置及びこれを備えた部品実装機
US11096321B2 (en) 2017-03-24 2021-08-17 Yamaha Hatsudoki Kabushiki Kaisha Component supply device and component mounting machine equipped with same

Also Published As

Publication number Publication date
WO2001065904A1 (de) 2001-09-07
US20060133662A1 (en) 2006-06-22
DE50109694D1 (de) 2006-06-08
EP1260128A1 (de) 2002-11-27
US8381395B2 (en) 2013-02-26
EP1260128B1 (de) 2006-05-03

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Date Code Title Description
AS Assignment

Owner name: SIEMENS AKTIENGESELLSCHAFT, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:BACHTHALER, THOMAS;GRASMUELLER, HANS-HORST;LIEBEKE, THOMAS;AND OTHERS;REEL/FRAME:013681/0068;SIGNING DATES FROM 20020722 TO 20021031

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

AS Assignment

Owner name: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GMBH & CO. KG

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SIEMENS AKTIENGESELLSCHAFT;REEL/FRAME:023044/0828

Effective date: 20090731