WO2001061364A3 - Prise de verification d'un composant semi-conducteur - Google Patents

Prise de verification d'un composant semi-conducteur Download PDF

Info

Publication number
WO2001061364A3
WO2001061364A3 PCT/US2001/004567 US0104567W WO0161364A3 WO 2001061364 A3 WO2001061364 A3 WO 2001061364A3 US 0104567 W US0104567 W US 0104567W WO 0161364 A3 WO0161364 A3 WO 0161364A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor component
test socket
interposing
component test
assembly
Prior art date
Application number
PCT/US2001/004567
Other languages
English (en)
Other versions
WO2001061364A2 (fr
Inventor
Masahito Naito
Takayuki Nagumo
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to EP01912731A priority Critical patent/EP1256003A2/fr
Publication of WO2001061364A2 publication Critical patent/WO2001061364A2/fr
Publication of WO2001061364A3 publication Critical patent/WO2001061364A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)

Abstract

L'invention concerne une prise de vérification d'un composant semi-conducteur utilisée pour connecter des composants semi-conducteurs à un appareil de test de composant semi-conducteur. La prise de vérification est petite, légère et moins coûteuse à la fabrication que les prises de vérification classiques. La prise de vérification comprend un ensemble intercalaire et un corps de cadre qui comprend à son tour un élément de sollicitation destiné à déplacer les premier et second éléments intercalaires de l'ensemble intercalaire d'une position de repos à une position compacte en vue de la connexion amovible d'un composant semi-conducteur à une prise de vérification de composant semi-conducteur.
PCT/US2001/004567 2000-02-14 2001-02-13 Prise de verification d'un composant semi-conducteur WO2001061364A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01912731A EP1256003A2 (fr) 2000-02-14 2001-02-13 Prise de verification d'un composant semi-conducteur

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-34990 2000-02-14
JP2000034990A JP4641079B2 (ja) 2000-02-14 2000-02-14 半導体部品検査用ソケット及び半導体部品検査装置

Publications (2)

Publication Number Publication Date
WO2001061364A2 WO2001061364A2 (fr) 2001-08-23
WO2001061364A3 true WO2001061364A3 (fr) 2002-03-07

Family

ID=18559249

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/004567 WO2001061364A2 (fr) 2000-02-14 2001-02-13 Prise de verification d'un composant semi-conducteur

Country Status (4)

Country Link
EP (1) EP1256003A2 (fr)
JP (1) JP4641079B2 (fr)
KR (1) KR100689161B1 (fr)
WO (1) WO2001061364A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3711283B2 (ja) * 2002-03-06 2005-11-02 株式会社アドバンテスト インサートおよびこれを備えた電子部品ハンドリング装置
JP2005339894A (ja) 2004-05-25 2005-12-08 Three M Innovative Properties Co ボールグリッドアレイ集積回路装置の試験用ソケット
KR100629958B1 (ko) * 2005-01-15 2006-09-28 황동원 반도체용 테스트 및 번인을 위한 비지에이형 소켓
JP2007141670A (ja) 2005-11-18 2007-06-07 Three M Innovative Properties Co ソケット、ソケット基台、ソケットの操作方法及びその試験方法
JP4802059B2 (ja) * 2006-07-27 2011-10-26 株式会社エンプラス 電気部品用ソケット
KR101252449B1 (ko) * 2012-02-01 2013-04-16 주식회사 티에프이 반도체용 테스트 소켓
KR101667523B1 (ko) * 2015-05-07 2016-10-19 신종천 반도체 소자 테스트 장치
TWI777616B (zh) * 2021-06-11 2022-09-11 台灣福雷電子股份有限公司 用於測試具有天線元件之半導體封裝結構的測試治具、測試系統及其測試方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4836798A (en) * 1987-12-21 1989-06-06 Wells Electronics, Inc. Zero insertion socket with normally closed contacts
USRE36217E (en) * 1995-02-06 1999-06-01 Minnesota Mining And Manufacturing Company Top load socket for ball grid array devices
EP0969710A2 (fr) * 1998-06-30 2000-01-05 Enplas Corporation Socle pour un dispositif électrique

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0883656A (ja) * 1994-09-09 1996-03-26 Advantest Corp ボール・グリッド・アレイ半導体測定用ソケット
JP3745060B2 (ja) * 1996-12-09 2006-02-15 日本テキサス・インスツルメンツ株式会社 ソケット
JP3059946B2 (ja) * 1997-05-01 2000-07-04 山一電機株式会社 Ｉｃソケット
JP3755715B2 (ja) * 1998-12-28 2006-03-15 株式会社エンプラス 電気部品用ソケット
JP2904782B1 (ja) * 1998-07-29 1999-06-14 山一電機株式会社 Ｉｃソケット

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4836798A (en) * 1987-12-21 1989-06-06 Wells Electronics, Inc. Zero insertion socket with normally closed contacts
USRE36217E (en) * 1995-02-06 1999-06-01 Minnesota Mining And Manufacturing Company Top load socket for ball grid array devices
EP0969710A2 (fr) * 1998-06-30 2000-01-05 Enplas Corporation Socle pour un dispositif électrique

Also Published As

Publication number Publication date
KR100689161B1 (ko) 2007-03-09
JP2001228204A (ja) 2001-08-24
JP4641079B2 (ja) 2011-03-02
EP1256003A2 (fr) 2002-11-13
WO2001061364A2 (fr) 2001-08-23
KR20020077438A (ko) 2002-10-11

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