WO2001056736A2 - Absorption modifiee par des matieres composites et combinaisons de matieres - Google Patents
Absorption modifiee par des matieres composites et combinaisons de matieres Download PDFInfo
- Publication number
- WO2001056736A2 WO2001056736A2 PCT/US2001/040039 US0140039W WO0156736A2 WO 2001056736 A2 WO2001056736 A2 WO 2001056736A2 US 0140039 W US0140039 W US 0140039W WO 0156736 A2 WO0156736 A2 WO 0156736A2
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- WIPO (PCT)
- Prior art keywords
- reflective
- absoφtive
- energy
- materials
- laser
- Prior art date
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- 238000010521 absorption reaction Methods 0.000 title description 3
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- 239000010949 copper Substances 0.000 claims description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 47
- 229910052802 copper Inorganic materials 0.000 claims description 47
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 34
- 239000002131 composite material Substances 0.000 claims description 34
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- 229910052782 aluminium Inorganic materials 0.000 claims description 15
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- 239000011236 particulate material Substances 0.000 claims description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 239000002250 absorbent Substances 0.000 claims description 10
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
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- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 claims description 3
- -1 CuSiC Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
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- 229910017755 Cu-Sn Inorganic materials 0.000 claims description 2
- 229910017927 Cu—Sn Inorganic materials 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical group [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
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- 239000010931 gold Substances 0.000 claims description 2
- 230000006872 improvement Effects 0.000 claims description 2
- 238000004372 laser cladding Methods 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
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- 230000000274 adsorptive effect Effects 0.000 abstract 1
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- 239000002243 precursor Substances 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 3
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- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
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- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 3
- QIJNJJZPYXGIQM-UHFFFAOYSA-N 1lambda4,2lambda4-dimolybdacyclopropa-1,2,3-triene Chemical compound [Mo]=C=[Mo] QIJNJJZPYXGIQM-UHFFFAOYSA-N 0.000 description 2
- 229910052580 B4C Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 229910039444 MoC Inorganic materials 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 2
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- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910002846 Pt–Sn Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
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- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- WCCJDBZJUYKDBF-UHFFFAOYSA-N copper silicon Chemical compound [Si].[Cu] WCCJDBZJUYKDBF-UHFFFAOYSA-N 0.000 description 1
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- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/25—Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
- C23C24/106—Coating with metal alloys or metal elements only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
- B22F2003/1052—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding assisted by energy absorption enhanced by the coating or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Definitions
- the present invention relates to the fields of metallurgy and direct materials deposition.
- Direct Materials Deposition (DMD) processes allow complex components to be efficiently fabricated in small lot sizes to meet the stringent requirements of the rapidly changing manufacturing environment. This process produces three-dimensional parts directly from a computer aided design (CAD) solid model.
- CAD computer aided design
- U.S. Pat. No. 4,323,756 discusses the production of rapidly solidified bulk articles from metallic feedstock using an energy beam as a heat source to fuse the feedstock onto a substrate. Repeated layers are deposited in order to arrive at a three- dimensional finished product.
- the use of a laser to melt material creates excessive heat in the part, causing distortion and residual stress within the part being made.
- the high energy level of such a laser causes inefficiencies throughout the system.
- the powder is deposited on a target surface, which is exposed to a reactant gas, and then heated using a laser.
- the gas atmosphere and the heated powder material cause a reaction to occur.
- This reaction causes the gas to decompose to a solid and a gas, where the gas adheres to the surface of the powder particles and serves to bond the particles together.
- U.S. Pat. No. 4,332,999 claims the use of a reactive atmosphere in conjunction with the radiant heating of a metallic surface to provide an efficient method of machining.
- This patent discloses use of a beam of radiant energy upon a workpiece whereby the workpiece is heated at the area of incidence with the beam.
- the atmosphere is chemically reactive with the material of the workpiece at the area of incidence.
- the area of incidence is then heated to a reaction temperature that is below the melting point of the workpiece material. Both conditions are chosen so that the chemical reaction therebetween is exothermic, and the reaction occurs at temperatures above the boiling point of workpiece material.
- the gas is preferably a halogen or nonmetallic halide, which reacts with the workpiece material to produce a metal halide.
- the exothermic reaction is used to break down metal and remove material, rather than to cause metals to form parts from exothermic reactions.
- U.S. Pat. No. 5,459,018 claims the use of alternating layers of metal and oxide, such that the oxide has a standard enthalpy of formation higher than that of the oxide obtained by oxidizing the metal.
- an exothermic reaction occurs, converting oxide to metal and vice-versa, resulting in changed optical properties.
- the exothermic reaction in the '018 patent is not used to create a part, but rather to change the state of reflectivity in an optical recording medium.
- Tepper in 'Activated' Aluminum as a Stored Energy Source For Propellants presented at the Nobel Symposium on Chemical Propulsions, Sweden, May 28, 1996) and G. V. Ivanov, M.I. Lerner, and F. Tepper in Intermetallic Alloy Formation from Nanophase Metal Powders Produced by Electro-Exploding Wires describe the production of exothermic powders by the process of electro-explosion of metal wire (EEW) using aluminum.
- EW electro-explosion of metal wire
- the result was an activated aluminum referred to as Alex.
- This activated aluminum contains stored energy that is released when a threshold temperature is reached.
- Other electro-exploded materials, including copper, silver, and zinc, have been produced. The suggested use of such materials is as a fuel in pyrotechnics, explosives, and propellants. This process has not been applied to any direct material deposition processes.
- the present invention provides a method to enhance the energy absorption of reflective materials. This is accomplished by combining the reflective material with a material that is more absorptive of electromagnetic energy at the same wavelength than is the reflective material. Without being bound by theory, it is believed that the energy absorbed by the abso ⁇ tive material is efficiently transmitted to the reflective material by mechanisms such as radiant heat transfer, conduction, or the like.
- the present invention is amenable to use with any material to which energy must be imparted.
- DMD applications are well suited for application of invention methods.
- the invention methods provide a means to enhance energy abso ⁇ tion into a particular reflective material by combining that material with one or more materials that are more abso ⁇ tive. These materials can be a homogeneous mixture of particles of the different materials, a suspension of particles of different materials, particles of one material coated with a second material (i.e., the abso ⁇ tive material), a combination of the coated particles with another material, and the like.
- Invention methods allow for reduced energy requirements, which result in substantial energy savings. Due to the lower energy required to render the material depositable, the residual stress of the resulting item is reduced, as is spatial distortion.
- Certain combinations of materials provide an additional advantage of forming composites that also possess unique properties.
- Several advantages of the composites are that the thermal coefficient of expansion can now be tailored to match that of another material and the thermal conductivity of the reflective material can be largely preserved.
- a further advantage provided through these combinations of materials is to provide a surface that is readily melted by laser such that fully dense structures can be fabricated.
- FIG. 1 is a cross-section of an apparatus for laser-mediated Direct Materials Deposition (DMD).
- DMD Direct Materials Deposition
- FIG. 2 is a schematic showing the difference in distortion between a part 10 formed on a deposition substrate 12 from a composite of reflective and abso ⁇ tive materials, and a part 14 formed on a deposition substrate 12 from conventional processed powders.
- FIG. 3 depicts a cross-section of a microstructure comprising a composite material 26.
- the dispersed particles 28 are evenly distributed throughout the base material 30.
- a method to enhance the energy abso ⁇ tion by a material that is reflective of electromagnetic energy at a selected wavelength comprising combining said reflective material with a material that is more energy absorbent at said selected electromagnetic energy wavelength (i.e., an abso ⁇ tive material) than said reflective material, thereby obtaining an energy enhanced combination.
- a method to reduce the energy abso ⁇ tion by a material that is relatively absorbent of electromagnetic energy at a selected wavelength comprising combining said abso ⁇ tive material with a material that is less energy absorbent at said selected electromagnetic energy wavelength (i.e., reflective material) than said absorbent material, thereby obtaining an energy reduced combination.
- one or both of the types of materials are particulate, as further described hereinbelow.
- any combination of two materials can be employed in the practice of the present invention so long as, when compared to one another, one material is relatively reflective of electromagnetic energy at a selected wavelength (i.e., "reflective material") and one material is relatively abso ⁇ tive of electromagnetic energy at the same wavelength (i.e., "abso ⁇ tive material”). It is presently preferred that the abso ⁇ tive material be able to readily impart the absorbed energy to adjacent particles of the reflective material in a manner that is not substantially hampered by the reflectivity of the reflective material. Energy can be transferred from abso ⁇ tive to reflective materials by, for example, radiant heat transfer, conductive heat transfer, or the like.
- the reflective material is copper, aluminum, silver, gold, platinum, or the like.
- Abso ⁇ tive materials contemplated for use in this aspect of the present invention include carbon (e.g., as graphite, diamond, or the like), tungsten, boron, nickel, silicon, silicon carbide, tin, iron, titanium diboride, and the like, as well as combinations of two or more thereof, when the goal is to enhance the energy absorbance of the reflective material, it is presently preferred that the reflective material be in particulate form when combined with the abso ⁇ tive material.
- the abso ⁇ tive material is aluminum oxide, silicon carbide, tungsten carbide, titanium carbide, titanium diboride, boron nitride, boron carbide, carbon, chromium carbide, tungsten, molybdenum carbide or the like; and the reflective material is aluminum or copper.
- abso ⁇ tive and reflective materials are aluminum oxide/aluminum; silicon carbide/aluminum; tungsten carbide/aluminum; tungsten carbide/copper; boron nitride/copper; boron carbide/copper; carbon/copper; chromium carbide/copper; tungsten/copper; molybdenum carbide/copper, and the like.
- the relative amounts of reflective and abso ⁇ tive materials can be varied over a very broad range depending on a number of factors, including the desired composition of the end product, the desired properties of the combination, the difference in energy abso ⁇ tivity between the reflective and abso ⁇ tive materials, and the like. It is presently contemplated that the combination of reflective and abso ⁇ tive materials will comprise in the range of about 0.1% up to about 99.9% by volume of the reflective material and in the range of about 0.1% up to about 99.9% by volume of the abso ⁇ tive material. As will be understood by those of skill in the art, an almost infinite number of sub-ranges within the foregoing ranges may be used in the practice of the present invention, with due consideration being given to the factors mentioned above.
- combination of reflective and abso ⁇ tive materials when the reflective material is aluminum, combination of reflective and abso ⁇ tive materials will comprise at least about 1% by volume of the reflective material and in the range of about 0.1% up to about 99% by volume of the abso ⁇ tive material.
- combination of reflective and abso ⁇ tive materials when the reflective material is copper, combination of reflective and abso ⁇ tive materials will comprise in the range of 0.1% up to about 90% by volume of the reflective material and in the range of at least about 10% up to about 99.1% by volume of the abso ⁇ tive material.
- invention combinations comprise at least about 5% by volume of reflective material. In still another aspect, invention combinations comprise at least about 15% by volume of abso ⁇ tive material.
- the reflective and abso ⁇ tive materials described herein are employed as feedstock materials in a laser-assisted deposition process such as DMD, laser cladding, laser spray, plasma spray, or the like.
- a laser-assisted deposition process such as DMD, laser cladding, laser spray, plasma spray, or the like.
- Three dimensional structures can be manufactured by employing invention combinations in a laser-assisted deposition process.
- the laser-assisted deposition process is employed for creation of a three dimensional structure on a substrate.
- the laser- assisted deposition process is DMD.
- the DMD process comprises passing the combination of reflective and abso ⁇ tive materials through a laser under conditions sufficient to convert substantially all of said first and second materials into a depositable form, and depositing, in a layerwise manner, said combination on said substrate, thereby forming a three- dimensional structure thereon.
- layerwise manner means that a layer of the "feedstock materials" (i.e., the reflective and/or abso ⁇ tive materials as used in a laser-assisted deposition process) is created with each iteration of the process.
- the layer will vary in thickness according to how much feedstock material is converted into depositable form with each iteration of the process.
- the thickness of the layer deposited with each pass of the laser can vary from about 10 microns up to about 10 millimeters.
- a combination of feedstock materials is employed such that the three dimensional structure under construction is sufficiently absorbing of the energy being imparted at the selected laser wavelength so that the surface layer (i.e., the previously deposited layer) of the article is rendered molten during deposition of the subsequent layer.
- the layer being deposited is more thoroughly bound to the surface of the workpiece than if the materials were being deposited on a "cold" piece.
- the abso ⁇ tive material absorbs energy imparted initially to the abso ⁇ tive material
- the abso ⁇ tive material is not molten upon being deposited (i.e., upon impact with the substrate) yet prior to impact with the substrate, it may have had sufficient energy imparted to it to render it molten.
- the abso ⁇ tive material has transferred some of its energy to the reflective material, thereby increasing the energy level of the reflective material while at the same time causing the abso ⁇ tive material to lose energy, sometimes to the point where the abso ⁇ tive material resolidifies prior to impact with the substrate.
- Feedstock materials contemplated for use in the practice of the present invention include a wide variety of elemental and molecular materials (or precursors thereof) in a number of forms, including, solid, liquid, powder, gel, suspension, solution, aerosol, fine mist, and the like. Accordingly, in one embodiment of the present invention, feedstock material is in a finely divided particulate form. In another embodiment of the present invention, feedstock material is provided in a substantially liquid form.
- the feedstock may be supplied with one or more carrier systems.
- powdered feedstock may be used as a homogeneous mixture of reflective and abso ⁇ tive particles which is fluidized in a gas stream for delivery to the deposition area.
- reflective and abso ⁇ tive materials include Cu-diamond, Cu-W, Cu-graphite, Cu-Ti-diboride, Ni-Ti-diboride, Ni-Cu, Fe-Ni-Cu, CuSiC, AlSiC, and the like.
- the homogenous mixture of reflective and abso ⁇ tive materials may further comprises a vehicle (i.e., a solvent, a diluent, or the like) that is compatible with the intended use of the combination (i.e., DMD, or the like).
- a vehicle i.e., a solvent, a diluent, or the like
- the combination comprises a suspension of the reflective and abso ⁇ tive materials.
- a suitable vehicle may be employed that is compatible with the intended use of the combination (i.e., DMD, or the like).
- a carrier gas is used to transport particulate materials to the location where they are to be deposited.
- the particulate materials may be mixed in a single feed unit or transported to the deposition location where they are then mixed during the deposition process.
- the particles are passed through a laser beam that causes them to be heated such that they become depositable. It is important that some of the particles and the surface onto which the particles are to be deposited are partially absorbing at the electromagnetic energy wavelength used for the deposition process. This is particularly true if the structure required from the deposit is to be fully dense (i.e., contiguous and substantially void- free). This requirement is not nearly as critical if a porous structure is desired.
- Feedstock materials can be provided in the form of powder particles composed of different materials that are mixed to create a homogenous mixture of the powder materials.
- the powder can be provided in the form of one material coated with a second material. Additional mixing of the coated particles with uncoated particles can also be used to tailor the particle mixture properties.
- the use of coated particles with conventional processing has been shown to be advantageous to achieve better properties in the composite structure.
- the high thermal conductivity typically associated with the highly reflective material can be largely preserved.
- altering the combination used to create the composite will alter the thermal coefficient of expansion of the deposited structure.
- An example of this would be in a tooling application when a high thermal conductivity material is initially deposited and then is covered by a surface layer of tool steel. As such a tool is thermally cycled it is important that the tool steel and the highly thermally conductive material expand and contract at approximately the same rate to avoid delamination.
- powder feedstock material contemplated for use in the practice of the present invention comprises particles in the range of about 5 ⁇ m up to about 400 ⁇ m. In a presently preferred embodiment, feedstock particle sizes are in the range of about 20 ⁇ m up to about 150 ⁇ m.
- the term “depositable form” refers to form whereby the material is suitable for deposition upon and adherence to a substrate or underlying layer of deposited feedstock.
- the depositable form of a feedstock material may vary according to the feedstock material used, the number of feedstocks applied, the substrate material, and the like. Accordingly, in one embodiment of the present invention, the depositable form of feedstock material will be a heated feedstock. The heating will occur due to energy being imparted by the laser beam(s) through which the feedstock passes immediately prior to and during its deposition on the substrate.
- the feedstock will have sufficient energy imparted thereto so that it is softened (e.g., when feedstocks such as glass, and the like are employed). In an even more preferred embodiment, the feedstock will have sufficient energy imparted thereto so that it is heated above the latent heat of fusion for the particular feedstock material employed. In an especially preferred embodiment, the feedstock will have sufficient energy imparted thereto by the laser beam(s) so that it is rendered molten prior to impact with the substrate.
- a depositable feedstock may have any one of a number of forms, depending on the composition of the feedstock. Such forms include liquid, gel, slurry, mush, and the like as well as combinations thereof. For example, the abso ⁇ tive material may take on one form and the reflective material another, yet the combination will be depositable.
- Feedstock material may also be provided in the form of feedstock precursors. Accordingly, in another embodiment of the present invention, the electromagnetic energy heats one or more feedstock material precursors resulting in a chemical conversion of the feedstock material precursor to a depositable form.
- Electromagnetic energy may be from a number of sources. Because the present invention is particularly well suited for laser-assisted deposition processes, in one embodiment, the source of electromagnetic energy is a laser. It is further contemplated that the combination of reflective and abso ⁇ tive materials will be contacted with a laser under conditions sufficient to convert substantially all of the reflective material into depositable form. In certain aspects of the invention, it may be desirable to also convert a portion of the abso ⁇ tive material into depositable form. In a further embodiment of the present invention, reflective and abso ⁇ tive materials are alloyed or rendered into a composite material as a result of the contact with the laser, and are both thereby converted into a depositable form. Alloys to be formed include any one or more of Cu-Sn, Al-Sn, Ag-Sn, Au-Sn, Pt-Sn, or the like.
- Equation (I) where w 0 is the laser beam radius at the focal point of the beam, v p is the feedstock particle velocity and ⁇ is the angle of trajectory of the feedstock particle with respect to the laser beam axis.
- the energy imparted by the laser beam to the particle is derived by taking the ratio of the area of the particle to the area of the laser beam and then multiplying this quantity by the laser power and the time of flight of the particle through the beam, as given by equation (II) as follows: P ⁇ r p t f
- Equation I indicates that the energy absorbed by a feedstock particle is directly proportional to the time of flight (t f ) of the particle through the laser beam. Accordingly, by adjusting parameters to maximize the in-laser t f of feedstock particles, the energy imparted to the feedstock particles is enhanced. Equation I also demonstrates that in-laser t f can be increased by a number of means including one or more of reducing particle velocity (v p ), decreasing the angle of incidence ( ⁇ ) of the particle to the laser, increasing the radius of the laser beam at the focal point, and the like.
- a function of invention methods is to provide a means to efficiently render depositable the materials (i.e., feedstock) being applied to a substrate while only providing sufficient peripheral heating of the substrate to facilitate adhesion without a significant level of surface modification.
- materials i.e., feedstock
- this approach several advantages will be realized. For example, residual stress will be minimized, and thus, a broader range of materials can be deposited onto dissimilar materials.
- Another added benefit of the present invention is a result of the fact that the more energy abso ⁇ tive material is rendered molten more quickly than the reflective material at a given wavelength of electromagnetic energy.
- the abso ⁇ tive material upon exposure of the abso ⁇ tive material to sufficient energy to render it molten, the abso ⁇ tive material can coat particles of the as yet solid reflective material, thereby enhancing the wettability between the particles of the reflective material.
- a method to enhance the wettability, at a selected wavelength of electromagnetic energy, of a reflective particulate material that is reflective of electromagnetic energy at said selected wavelength comprising combining said reflective particulate material with an abso ⁇ tive material that is more energy absorbent at said selected electromagnetic energy wavelength than said reflective material, thereby obtaining a combination wherein said reflective material has enhanced the wettability at said selected wavelength of electromagnetic energy when compared to particles of said reflective particulate material that have not been combined with said abso ⁇ tive material.
- the reflective material is Al, and the relatively less reflective (i.e., more abso ⁇ tive) material is one or more of nickel, iron, copper or titanium. In another aspect, the reflective material is Cu and the more abso ⁇ tive material is one or more of nickel, iron or titanium.
- the materials combinations of the present invention are useful when they are to be exposed to electromagnetic radiation of a wavelength typically used in DMD applications, in another embodiment of the present invention, there is provided in a DMD process, the improvement comprising combining a particulate feedstock material that is reflective of electromagnetic energy at a selected wavelength with one or more feedstock material(s) that is more energy absorbent at said selected electromagnetic energy wavelength than said reflective material. Combinations of reflective and abso ⁇ tive materials described herein are all useful in the practice of this embodiment of the present invention.
- One simple method to increase the abso ⁇ tion of the normally highly reflective material is to simply apply a coating that enhances abso ⁇ tion of the powdered materials at the laser wavelength. This method works well to increase the abso ⁇ tion of the powder particles; however, if the coating is vaporized during the heating process then the changing reflectivity is short-lived. This method works well to apply melted powders to a surface, however, a sufficient volume of abso ⁇ tive material must be used to insure that the deposited surface is also abso ⁇ tive. Otherwise, the surface quickly becomes reflective and resistant to further laser processing. If the materials used to form the coated particles form a composite material in the deposited structure, then the properties of the deposited material may be altered to provide several advantages.
- the thermal conductivity of a highly thermally conductive material can be largely preserved and tailored by changing the composition.
- the thermal coefficient of expansion can be altered as a function of composition.
- a copper-tungsten composite can be deposited onto a tool steel surface to provide a means of removing heat from the tool quickly.
- the expansion of the composite can be closely matched to that of the tool steel and the thermal conductivity of the copper-tungsten composite can be close to that of the copper by itself. This is quite different than if an actual alloy is formed.
- a second method that can be used to enhance the abso ⁇ tion of highly reflective materials would be to mix these materials with other materials that are more absorbing at the laser wavelength. If the material which is much more absorbing at the laser wavelength, is dissolved, thus forming an alloy with the more highly reflective material, then the desirable properties of the highly reflective material may be altered.
- a positive aspect to this approach is that the alloy material deposited onto the substrate will remain absorbing at the laser wavelength.
- a third alternative is available.
- desirable material properties such as thermal conductivity can be degraded significantly.
- a coating or abso ⁇ tive material, whose abso ⁇ tion is significant at the laser wavelength is selected such that the material with the higher abso ⁇ tion does not vaporize or go into solution, but instead precipitates upon solidification to form a composite of two single phase materials; then when the abso ⁇ tive material is laser processed together with the more highly reflective material, a unique mixture of materials can be obtained.
- this combination of materials can be used to create a composite material.
- Materials may be selected based on such criteria as melting temperature, vaporization temperature, solubility between the materials, and the like.
- the material properties of the highly reflective material can be degraded when it is used to form a composite material
- material combinations available to form composites that preserve the desirable properties of the reflective material.
- Several combinations of material systems that provide this advantage include: copper-tungsten, copper-graphite, copper-silicon carbide, aluminum-silicon carbide, and the like.
- Some combinations of materials can actually enhance the properties of the highly reflective material when used as composites while at the same time providing an increase in the absorbed laser energy.
- One such combination of these materials includes copper combined with synthetic diamond particles.
- the composite material actually has a higher thermal conductivity than the copper by itself.
- This particular metal matrix composite can, in fact, have a thermal conductivity that is 50% greater than that of silver.
- the base material 30 e.g., copper
- the particles of the second material 28 e.g., diamond
- One of the noteworthy aspects of this invention is the use of various material combinations to produce composite structures that can be fabricated using laser processing. Although this is not an absolute requirement, it is presently preferred that the combination of materials used to form a composite be selected so as to conserve the desirable properties of the material that may not otherwise be readily processed by lasers (i.e., the more reflective material).
- a tool steel is to be deposited onto a copper material with the copper used to form cooling passages, the difference in thermal expansion between these two materials can present a significant problem as the tool is thermally cycled. If such a tool is used for injection molding of plastic components, then the tool can actually be cycled several million times. In this situation, the differences and thermal expansion between the tool steel and the copper can actually cause the mold surface of the tool to pull away from the copper.
- a composite structure also allows the thermal coefficient of expansion to be altered to match that of the tool steel. This is an added advantage that the composite structures provide.
- Figure 2 demonstrates the type of wa ⁇ ing that can occur when materials with dissimilar coefficients of thermal expansion (i.e., materials 14 and 12) are bonded, versus bonding invention composites 10 with a substrate 12' having a similar coefficient of thermal expansion.
- Example 1 Demonstration of the superior properties of aluminum coated with nickel.
- Nickel coated aluminum particles were placed in a powder feed unit and delivered to the deposition surface in a carrier gas stream. The deposition process was carried out inside of a controlled atmosphere box. When the nickel coated aluminum particles were heated with the laser they immediately formed a uniform layer much more characteristic of other metals that are not limited by their surface oxide layers. These aluminum particles were easily processed using the laser deposition process.
- the particles were exposed to a NdNAG laser and deposited onto a stainless steel substrate to form a l inch cube.
- the nickel coated particles were readily melted as they passed through the laser beam.
- a three dimensional structure was formed. Once these particles formed a couple of layers on the surface of the stainless steel substrate, the surface became highly reflective and the resulting structure was very porous.
- less energy can be used to melt nickel-coated copper particles than uncoated copper particles, yet the properties of the finished item are more like copper, than nickel.
- nickel coated copper particles were mixed with a tungsten powder and the combination then formed a usable material for direct deposition.
- Tungsten was added to the mixture in an amount of from about 12-15% by volume, although lower volume percentages of tungsten may be employed.
- Tungsten is approximately 40% absorbing at the selected NdNAG laser wavelength (1.064 ⁇ m), and thus provides a sufficient change in the abso ⁇ tion of the deposited layer to allow a fully dense structure to be achieved.
- metallographic cross-sections show that there are tungsten precipitates within the solid structure, thereby demonstrating the ability to achieve composite materials using invention methods.
- Copper coated tungsten particles (approximately 25 volume percent tungsten) were tested to determine if particles of relatively abso ⁇ tive tungsten could be coated with more reflective material and still allow structures of sufficient structural integrity to be fabricated. Deposits formed using this material show a more uniform distribution of tungsten particles within the copper matrix than if mixed but uncoated materials are used. Metallographic cross-sections show that this structure is also fully dense.
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Abstract
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AU2001247961A AU2001247961A1 (en) | 2000-02-04 | 2001-02-05 | Modified absorption through unique composite materials and material combinations |
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US49797400A | 2000-02-04 | 2000-02-04 | |
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US7732002B2 (en) | 2001-10-19 | 2010-06-08 | Cabot Corporation | Method for the fabrication of conductive electronic features |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1993019019A1 (fr) * | 1992-03-20 | 1993-09-30 | Board Of Regents, The University Of Texas System | Production par frittage a basse temperature de pieces resistant aux hautes temperatures |
EP0714725A1 (fr) * | 1989-09-05 | 1996-06-05 | The Board Of Regents, The University Of Texas System | Ensemble comprenant plusieurs matériaux, manipulation permettant le frittage par rayonnement sélectif |
WO1998052709A2 (fr) * | 1997-05-23 | 1998-11-26 | Atz-Evus Applikations- Und Technikzentrum Für Energieverfahrens-, Umwelt- Und Strömungstechnik | Procede et poudre pour la production de modeles fonctionnels metalliques par frittage au laser |
-
2001
- 2001-02-05 AU AU2001247961A patent/AU2001247961A1/en not_active Abandoned
- 2001-02-05 WO PCT/US2001/040039 patent/WO2001056736A2/fr active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0714725A1 (fr) * | 1989-09-05 | 1996-06-05 | The Board Of Regents, The University Of Texas System | Ensemble comprenant plusieurs matériaux, manipulation permettant le frittage par rayonnement sélectif |
WO1993019019A1 (fr) * | 1992-03-20 | 1993-09-30 | Board Of Regents, The University Of Texas System | Production par frittage a basse temperature de pieces resistant aux hautes temperatures |
WO1998052709A2 (fr) * | 1997-05-23 | 1998-11-26 | Atz-Evus Applikations- Und Technikzentrum Für Energieverfahrens-, Umwelt- Und Strömungstechnik | Procede et poudre pour la production de modeles fonctionnels metalliques par frittage au laser |
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CN105986266B (zh) * | 2015-12-26 | 2018-06-01 | 包头市三隆稀有金属材料有限责任公司 | 钨阴极激光多层熔覆修复方法 |
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CN105522153A (zh) * | 2016-02-05 | 2016-04-27 | 东南大学 | 一种电磁场辅助激光增材制造的装置 |
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CN111699061A (zh) * | 2018-03-01 | 2020-09-22 | 三菱综合材料株式会社 | 激光吸收率优异的铜合金粉末 |
WO2020099662A1 (fr) * | 2018-11-15 | 2020-05-22 | Katholieke Universiteit Leuven | Poudre de cuivre, d'or ou d'argent destinée à la fabrication additive sur lit de poudre et procédé de fabrication d'une telle poudre |
WO2020254108A1 (fr) * | 2019-06-19 | 2020-12-24 | Infinite Flex GmbH | Poudre pour le frittage laser et utilisation |
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CN113853260B (zh) * | 2019-06-19 | 2023-08-08 | 德怡科技有限公司 | 用于激光烧结的粉末及应用 |
CN110682209A (zh) * | 2019-09-09 | 2020-01-14 | 长春理工大学 | 一种激光原位辅助单晶金刚石典型晶面的研磨方法 |
CN110682209B (zh) * | 2019-09-09 | 2022-03-29 | 长春理工大学 | 一种激光原位辅助单晶金刚石典型晶面的研磨方法 |
CN111992708A (zh) * | 2020-08-30 | 2020-11-27 | 中南大学 | 一种制备高性能金刚石/铜复合材料的方法 |
CN111992708B (zh) * | 2020-08-30 | 2021-10-22 | 中南大学 | 一种制备高性能金刚石/铜复合材料的方法 |
CN113634745A (zh) * | 2021-08-06 | 2021-11-12 | 金华职业技术学院 | 一种化学镀法制备NiCu双层合金粉末的方法及其应用 |
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WO2001056736A3 (fr) | 2002-03-14 |
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