WO2001023141A1 - Tampon de polissage - Google Patents

Tampon de polissage Download PDF

Info

Publication number
WO2001023141A1
WO2001023141A1 PCT/US2000/026652 US0026652W WO0123141A1 WO 2001023141 A1 WO2001023141 A1 WO 2001023141A1 US 0026652 W US0026652 W US 0026652W WO 0123141 A1 WO0123141 A1 WO 0123141A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
layer
window
opening
fluid
Prior art date
Application number
PCT/US2000/026652
Other languages
English (en)
Other versions
WO2001023141A9 (fr
Inventor
Peter W. Freeman
Stanley E. Eppert, Jr.
Alan H. Saikin
Marco A. Acevedo
Original Assignee
Rodel Holdings, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rodel Holdings, Inc. filed Critical Rodel Holdings, Inc.
Priority to EP00968455A priority Critical patent/EP1224060B1/fr
Priority to DE60011798T priority patent/DE60011798T2/de
Priority to JP2001526332A priority patent/JP2003510826A/ja
Publication of WO2001023141A1 publication Critical patent/WO2001023141A1/fr
Publication of WO2001023141A9 publication Critical patent/WO2001023141A9/fr

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/205Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08Circular back-plates for carrying flexible material

Definitions

  • the invention relates to a polishing pad having a transparent window through which an optical beam is transmitted for an optical apparatus to detect the status of a workpiece during a polishing operation.
  • U.S. Patent 5,893,796 discloses a polishing pad for use with a polishing fluid, the polishing pad having, a polishing layer and a window in an opening through the polishing layer.
  • the window transmits an optical beam for detection of the presence or absence of a thickness of material being removed from a semiconductor wafer by a CMP polishing operation.
  • One of the problems to be faced is to prevent polishing fluid from leaking beyond the polishing layer and, thereby, cause optical interference with the optical beam being transmitted by the window.
  • an adhesive seal is imbedded in the opening between the window and the fluid impermeable layer. However, the seal can be defective by having a leakage path due to a small void or gap in the adhesive seal.
  • the polishing pad is thin and, thereby, is easily bent, which tends to develop a crack or separation of the adhesive from the sides of the opening due to bending during routine handling of the polishing pad, or due to exertion of polishing pressure during use of the polishing pad.
  • the invention resides in a polishing pad for use with a polishing fluid, wherein the polishing pad has, a polishing layer, a window in an opening through the polishing layer, and a fluid impermeable layer spanning across the polishing layer and the window and the opening to provide an uninterrupted continuous barrier to leakage of polishing fluid, the fluid impermeable layer having thereon an adhesive that forms bond seals with the polishing layer and the window.
  • An advantage is that the fluid impermeable layer 40, being uninterrupted, avoids a tendency to produce leakage paths due to bending during routine handling, or due to exertion of polishing pressure during use of the polishing pad, or due to small voids or gaps m an adhesive.
  • a further advantage is that the bond seals minimizes wetting by the polishing fluid of the interface between the adhesive 41 and each of the polishing layer 10, the window 30 and the fluid impermeable layer 40.
  • Fig. 1 is a top plan view of a polishing pad having a transparent window
  • Fig. 2 is an enlarged cross-sectional view through a portion of a polishing pad having a transparent window and an unsuccessful seal
  • Fig. 3 is an enlarged cross-sectional view of a portion of the polishing pad disclosed in Fig. 1, further disclosing a transparent window and an uninterrupted seal according to the invention.
  • an unsuccessful, polishing pad is a two layer pad that includes an upper polishing layer (10) of IC1000 material and a lower backing layer (20) of Suba IV material, both of which materials are made by Rodel, Inc.
  • a transparent window (30) is made from a piece of optical transmissive polymeric material which is installed m an opening (16) in the polishing layer (10) of the polishing pad.
  • An opening (18) in the lower layer (20) is aligned with and is smaller than the opening (16), thereby forming a ledge (26) that served as a seat for the window (30) .
  • a seal was attempted between the window (30) and the ledge (26) , which would prevent polishing fluid, in the form of slurry and/or de-ionized water, from leaking past the window (30) and causing interference with an optical beam from optical equipment.
  • a seal was attempted to be established between the window (30) and the ledge (26) by an adhesive film (32) configured with a cutout (34) which matched the opening (18) in the lower layer (20), and the window (30) was sealed by the adhesive seal overlying the ledge (26) on the lower layer (20).
  • leakage could still occur if the adhesive seal was defective with small voids or gaps in the adhesive, or became damaged as could occur by bending the polishing pad and by exertion of polishing pressure during routine handling and use of the polishing pad.
  • the invention provides a polishing pad having a polishing layer (10) , and a window (30) in an opening (16) through the polishing layer (10), which are covered by an underlying, continuous, optically transmissive, fluid impermeable layer (40) having adhesive (41) that forms bond seals with the polishing layer (10) and the window (30) .
  • the bond seals resist wetting by the polishing fluid of an interface between the adhesive (41) and each of, the polishing layer (10) and the window (30) and the fluid impermeable layer (40).
  • polishing pad (10) comprises, a lower backing layer (20) , together with, a polishing layer (10) and a window (30) in an opening (16) through the polishing layer (10), which are covered by, and bond sealed to adhesive (41) on both, opposite sides of an underlying, fluid impermeable layer
  • the adhesive (41) on the both sides forms bond seals with the lower backing layer (40), the polishing layer (10) and the window (30).
  • the backing layer (20) has a top face
  • the bond seals resist wetting by the polishing fluid of an interface between the adhesive (41) and each of, the polishing layer (10), the window (30), the fluid impermeable layer (40) and the backing layer (20).
  • the polishing layer (10) and the backing layer (20) are adhered together by the fluid impermeable layer (40) which includes adhesive (41).
  • the polishing layer (10) is a layer of IC1000 material, and the backing layer 20 is a layer of Suba IV material, both of which materials are made by Rodel, Inc., of Newark, Delaware.
  • the polishing layer (10) has a top polishing face (12) and a bottom face (14) .
  • the polishing layer (10) and the backing layer (20) are substantially opaque.
  • a transparent window (30) is disposed in an opening (16) in the polishing layer (10) .
  • the transparent window (30) is made of an optically transmissive, or light-transmissive, material to permit an optical beam from a known optical equipment or apparatus to pass through the polishing pad while the polishing pad is being used for polishing a workpiece (not shown) .
  • An optically transmissive material is known from U.S. Patent 5,893,796.
  • the opening (16) extends through the thickness of the polishing layer (10) from the polishing face (12) to the bottom face (14), and the transparent window (30) lies in the opening (16) within this thickness.
  • the opening (16) is axially aligned above an opening (18) extending through the thickness of the backing layer (20) from the top face (22) to the bottom face (24) .
  • the opening (18) is smaller in circumference than the circumference of the opening (16) .
  • the backing layer (20) around a periphery of the opening (18) forms a circumferential ledge (26) that serves as a seat for the transparent window (30) and the fluid impermeable layer (40) .
  • the fluid impermeable layer (40) is uninterrupted as it spans an area between the openings (16) and (18) beneath the transparent window (30).
  • uninterrupted it is meant that the fluid impermeable layer (40) is continuous without an aperture or passageway through which polishing fluid could flow through the layer (40) from the opening (16) to the opening (18) .
  • the fluid impermeable layer (40) comprises a flexible, thin film of optically transmissive hydrophobic polymeric material thar. is used in minimized thickness to maximize its optical transparency, such as, polyethyleneteraphthalate, which is coated with a thin layer of the adhesive (41) on its opposite major surfaces.
  • the adhesive (41) is a pressure sensitive adhesive that is hydrophobic, and that is used in minimized thickness to maximize its optical transparency, for example, a synthetic rubber based adhesive known as Rodel, Inc., of Newark, Delaware, and known as 3M442 commercially available from 3M Company, Minneapolis, Minnesota, USA, and further, for example, an acrylic based adhesive known as Rodel PSA V, Adchem 2019, commercially available from Rodel, Inc. of Newark, Delaware, and further for example, a metal-free acrylic adhesive known as, Rodel PSA VII, Adhesive Research Development 8049-28, commercially available from Rodel, Inc.
  • a synthetic rubber based adhesive known as Rodel, Inc., of Newark, Delaware, and known as 3M442 commercially available from 3M Company, Minneapolis, Minnesota, USA
  • an acrylic based adhesive known as Rodel PSA V, Adchem 2019, commercially available from Rodel, Inc. of Newark, Delaware
  • a metal-free acrylic adhesive known as, Rodel PSA VII
  • the fluid impermeable layer (40) is fabricated as a film with opposite sides having adhesive (41) permanently adhered to the film, and the adhesive (41) on each of the opposite sides being covered and protected by a peel away covering film, not shown.
  • the peel away covering film is removed to expose the adhesive (41) on the fluid impermeable layer (40) for application in contact with the bottom face (14) of the polishing layer (10) and the entire bottom surface of the transparent window (30) .
  • Pressure is applied to thereby adhere the adhesive (41) to the polishing layer (10) and the window (30) with a water repellant, hydrophobic bond seal.
  • the adhesive (41) adheres to the bottom face (14), and circumscribes around a periphery of the cutout (16) , and also adheres to the entire bottom surface of the transparent window (30) .
  • the adhesive (41) on the bottom of the fluid impermeable layer (40) is exposed by removal of the peel away covering film, to adhere the polishing pad to a platen of a known polishing machine, not shown, or to adhere the polishing pad to a backing layer (20), in turn, mounted to a platen of a known polishing machine.
  • the invention provides a polishing pad having a polishing layer (10), and a window (30) in an opening (16) through the polishing layer (10), which are covered by, and bond sealed to, an underlying, fluid impermeable layer (40) having adhesive (41) on both sides.
  • Polishing fluid such as slurry or de-ionized water, is delivered to the polishing face (12) .
  • the fluid impermeable layer (40) that is adhesively bond sealed to the undersurfaces of the polishing layer (10) and the transparent window (30) , serves as an uninterrupted continuous, fluid impermeable barrier to polishing fluid that leaks into the opening (16) around the transparent window (30) or that leaks beneath the polishing layer (10) .
  • any polishing fluid which leaks through such a gap will be contained against an uninterrupted continuous, fluid impermeable barrier provided by the fluid impermeable layer (40) that covers and spans across the opening (16) and the back face (14) of the polishing layer (10) and the back side of the window (30) .
  • the uninterrupted fluid impermeable layer (40) eliminates reliance upon a previously used seal imbedded in the opening (16) between the window (30) and the polishing layer (10) .

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention concerne un tampon de polissage conçu pour être utilisé avec un fluide de polissage, comportant une couche de polissage (10), une fenêtre (30) pratiquée dans la couche de polissage, et une couche étanche aux fluides (40) s'étendant au travers de la couche de polissage, de la fenêtre, et de l'ouverture, afin de former une barrière continue contre les fuites de fluide de polissage, la couche étanche aux fluides présentant à sa surface un adhésif formant des joints de liaison avec la couche de polissage et la fenêtre.
PCT/US2000/026652 1999-09-29 2000-09-28 Tampon de polissage WO2001023141A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP00968455A EP1224060B1 (fr) 1999-09-29 2000-09-28 Tampon de polissage
DE60011798T DE60011798T2 (de) 1999-09-29 2000-09-28 Schleifkissen
JP2001526332A JP2003510826A (ja) 1999-09-29 2000-09-28 研磨パッド

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15661499P 1999-09-29 1999-09-29
US60/156,614 1999-09-29

Publications (2)

Publication Number Publication Date
WO2001023141A1 true WO2001023141A1 (fr) 2001-04-05
WO2001023141A9 WO2001023141A9 (fr) 2002-11-14

Family

ID=22560299

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/026652 WO2001023141A1 (fr) 1999-09-29 2000-09-28 Tampon de polissage

Country Status (6)

Country Link
US (1) US6358130B1 (fr)
EP (1) EP1224060B1 (fr)
JP (1) JP2003510826A (fr)
DE (1) DE60011798T2 (fr)
TW (1) TW542767B (fr)
WO (1) WO2001023141A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6676483B1 (en) 2003-02-03 2004-01-13 Rodel Holdings, Inc. Anti-scattering layer for polishing pad windows
US6840843B2 (en) 2001-03-01 2005-01-11 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
US7874894B2 (en) 2006-05-17 2011-01-25 Toyo Tire & Rubber Co., Ltd. Polishing pad
US8398794B2 (en) 2006-04-19 2013-03-19 Toyo Tire & Rubber Co., Ltd. Method for manufacturing polishing pad
CN108701600A (zh) * 2016-02-26 2018-10-23 应用材料公司 在薄型抛光垫中的窗
US11161218B2 (en) 2016-02-26 2021-11-02 Applied Materials, Inc. Window in thin polishing pad

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6832950B2 (en) 2002-10-28 2004-12-21 Applied Materials, Inc. Polishing pad with window
US6716085B2 (en) 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
US6179709B1 (en) * 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
US6213845B1 (en) * 1999-04-26 2001-04-10 Micron Technology, Inc. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
US6524164B1 (en) * 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
JP4131632B2 (ja) * 2001-06-15 2008-08-13 株式会社荏原製作所 ポリッシング装置及び研磨パッド
WO2002102547A1 (fr) * 2001-06-15 2002-12-27 Rodel Holdings, Inc. Ponceuse a fenetre
JP4570286B2 (ja) 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
US6722249B2 (en) * 2001-11-06 2004-04-20 Rodel Holdings, Inc Method of fabricating a polishing pad having an optical window
US7001242B2 (en) * 2002-02-06 2006-02-21 Applied Materials, Inc. Method and apparatus of eddy current monitoring for chemical mechanical polishing
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US20040171339A1 (en) * 2002-10-28 2004-09-02 Cabot Microelectronics Corporation Microporous polishing pads
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7008295B2 (en) 2003-02-04 2006-03-07 Applied Materials Inc. Substrate monitoring during chemical mechanical polishing
EP1594656B1 (fr) * 2003-02-18 2007-09-12 Parker-Hannifin Corporation Article de polissage pour polissage mecanique electrochimique
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
JP4526778B2 (ja) * 2003-04-07 2010-08-18 ニッタ・ハース株式会社 研磨パッドおよび研磨パッドの製造方法
KR100532440B1 (ko) * 2003-06-05 2005-11-30 삼성전자주식회사 윈도로의 유체의 침투를 막는 실링 장벽부를 가지는 화학기계적 연마 장비에 사용되는 연마 패드
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7264536B2 (en) * 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7132033B2 (en) 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
JP2005347532A (ja) * 2004-06-03 2005-12-15 Tokyo Seimitsu Co Ltd 化学機械研磨装置及び化学機械研磨方法
US7018581B2 (en) * 2004-06-10 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad with reduced stress window
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
JP4726108B2 (ja) * 2005-01-06 2011-07-20 東洋ゴム工業株式会社 研磨パッド及び半導体デバイスの製造方法
KR101107044B1 (ko) 2004-12-10 2012-01-25 도요 고무 고교 가부시키가이샤 연마 패드 및 연마 패드의 제조 방법
US7261625B2 (en) * 2005-02-07 2007-08-28 Inoac Corporation Polishing pad
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於cmp之特製拋光墊及其製造方法及其用途
US7226339B2 (en) * 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
EP1983558A4 (fr) * 2006-02-06 2011-08-10 Toray Industries Patin abrasif et dispositif d'abrasion
US20070197132A1 (en) * 2006-02-15 2007-08-23 Applied Materials, Inc. Dechuck using subpad with recess
JP4859109B2 (ja) * 2006-03-27 2012-01-25 東洋ゴム工業株式会社 研磨パッドの製造方法
JP4971028B2 (ja) 2007-05-16 2012-07-11 東洋ゴム工業株式会社 研磨パッドの製造方法
US20080287047A1 (en) * 2007-05-18 2008-11-20 Sang Fang Chemical Industry Co., Ltd. Polishing pad, use thereof and method for making the same
JP4943233B2 (ja) 2007-05-31 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
US8562389B2 (en) * 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
US20090305610A1 (en) * 2008-06-06 2009-12-10 Applied Materials, Inc. Multiple window pad assembly
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
KR20110120893A (ko) * 2009-01-16 2011-11-04 어플라이드 머티어리얼스, 인코포레이티드 윈도우 지지부를 가지는 폴리싱 패드 및 시스템
TWI410299B (zh) * 2009-08-24 2013-10-01 Bestac Advanced Material Co Ltd 研磨墊與其應用及其製造方法
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US8393940B2 (en) * 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
WO2012068428A2 (fr) * 2010-11-18 2012-05-24 Cabot Microelectronics Corporation Tampon à polir comprenant une région transmissive
JP5893479B2 (ja) * 2011-04-21 2016-03-23 東洋ゴム工業株式会社 積層研磨パッド
JP5732354B2 (ja) 2011-09-01 2015-06-10 東洋ゴム工業株式会社 研磨パッド
US8961266B2 (en) * 2013-03-15 2015-02-24 Applied Materials, Inc. Polishing pad with secondary window seal
US9868185B2 (en) * 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
KR101904322B1 (ko) * 2017-01-23 2018-10-04 에스케이씨 주식회사 연마패드 및 이의 제조방법
JP7026943B2 (ja) * 2018-05-08 2022-03-01 丸石産業株式会社 研磨パッド及び該研磨パッドによる研磨方法
JP7348860B2 (ja) * 2020-02-26 2023-09-21 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0663265A1 (fr) * 1993-12-22 1995-07-19 International Business Machines Corporation Technique et appareil de surveillance in situ pour la détection de la fin d'une opération chimique/méchanique de surfaçage

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
JPH09277162A (ja) * 1996-04-12 1997-10-28 Nikon Corp 半導体研磨装置
US6102775A (en) * 1997-04-18 2000-08-15 Nikon Corporation Film inspection method
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6077783A (en) * 1998-06-30 2000-06-20 Lsi Logic Corporation Method and apparatus for detecting a polishing endpoint based upon heat conducted through a semiconductor wafer
US6190234B1 (en) * 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
US6213845B1 (en) * 1999-04-26 2001-04-10 Micron Technology, Inc. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
US6524164B1 (en) * 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0663265A1 (fr) * 1993-12-22 1995-07-19 International Business Machines Corporation Technique et appareil de surveillance in situ pour la détection de la fin d'une opération chimique/méchanique de surfaçage

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6840843B2 (en) 2001-03-01 2005-01-11 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
US6676483B1 (en) 2003-02-03 2004-01-13 Rodel Holdings, Inc. Anti-scattering layer for polishing pad windows
US8398794B2 (en) 2006-04-19 2013-03-19 Toyo Tire & Rubber Co., Ltd. Method for manufacturing polishing pad
US9050707B2 (en) 2006-04-19 2015-06-09 Toyo Tire & Rubber Co., Ltd. Method for manufacturing polishing pad
US7874894B2 (en) 2006-05-17 2011-01-25 Toyo Tire & Rubber Co., Ltd. Polishing pad
CN108701600A (zh) * 2016-02-26 2018-10-23 应用材料公司 在薄型抛光垫中的窗
EP3420579A4 (fr) * 2016-02-26 2019-08-14 Applied Materials, Inc. Fenêtre d'un tampon de polissage mince
US11161218B2 (en) 2016-02-26 2021-11-02 Applied Materials, Inc. Window in thin polishing pad
CN108701600B (zh) * 2016-02-26 2023-03-14 应用材料公司 在薄型抛光垫中的窗
US11826875B2 (en) 2016-02-26 2023-11-28 Applied Materials, Inc. Window in thin polishing pad

Also Published As

Publication number Publication date
US6358130B1 (en) 2002-03-19
WO2001023141A9 (fr) 2002-11-14
JP2003510826A (ja) 2003-03-18
EP1224060A1 (fr) 2002-07-24
EP1224060B1 (fr) 2004-06-23
DE60011798D1 (de) 2004-07-29
TW542767B (en) 2003-07-21
DE60011798T2 (de) 2005-11-10

Similar Documents

Publication Publication Date Title
EP1224060B1 (fr) Tampon de polissage
US7101275B2 (en) Resilient polishing pad for chemical mechanical polishing
KR100267597B1 (ko) 워크피스리테이닝기구및그의생산방법
US7264536B2 (en) Polishing pad with window
US20030171070A1 (en) Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
US11826875B2 (en) Window in thin polishing pad
US8287330B1 (en) Reducing polishing pad deformation
US20020193059A1 (en) Stacked polishing pad having sealed edge
JP2003188124A (ja) 研磨布
KR100707959B1 (ko) 연마 패드
US7160181B2 (en) Polishing pad of CMP equipment for polishing a semiconductor wafer
KR20010102103A (ko) 연마 패드와 이를 성형하는 방법
JP2003163191A (ja) 機械化学的研磨装置用の研磨パッド
KR102664256B1 (ko) 얇은 연마 패드 내의 윈도우
JP2019508272A5 (fr)

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): JP KR SG

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
ENP Entry into the national phase

Ref country code: JP

Ref document number: 2001 526332

Kind code of ref document: A

Format of ref document f/p: F

WWE Wipo information: entry into national phase

Ref document number: 1020027004067

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2000968455

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020027004067

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2000968455

Country of ref document: EP

AK Designated states

Kind code of ref document: C2

Designated state(s): JP KR SG

AL Designated countries for regional patents

Kind code of ref document: C2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

WWG Wipo information: grant in national office

Ref document number: 2000968455

Country of ref document: EP