Classifications

• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C13/00—Fibre or filament compositions
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
  • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
  • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
  • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
  • H01C17/06593—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the temporary binder
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/018—Dielectrics
  • H01G4/06—Solid dielectrics
  • H01G4/08—Inorganic dielectrics
  • H01G4/12—Ceramic dielectrics
  • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/018—Dielectrics
  • H01G4/06—Solid dielectrics
  • H01G4/08—Inorganic dielectrics
  • H01G4/12—Ceramic dielectrics
  • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
  • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
  • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/018—Dielectrics
  • H01G4/06—Solid dielectrics
  • H01G4/08—Inorganic dielectrics
  • H01G4/12—Ceramic dielectrics
  • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
  • H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/28—Applying non-metallic protective coatings
  • H05K3/285—Permanent coating compositions
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
  • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
  • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
  • H10W70/69—Insulating materials thereof
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
  • Y02T10/00—Road transport of goods or passengers
  • Y02T10/60—Other road transportation technologies with climate change mitigation effect
  • Y02T10/70—Energy storage systems for electromobility, e.g. batteries
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
  • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Definitions

• the invention relates to a paste for screen printing of fresh electrical structures on ceramic carrier substrates with the features specified in the preamble of independent claim 1.
• Such pastes are used in thick-film technology to produce electrical components on ceramic carrier substrates, such as resistors, capacitor layers and insulating glass layers between conductor track structures, as well as cover or protective layers, which isolate an electronic circuit applied to the ceramic carrier substrate from the outside.
• the composition of the known thick-film pastes is described, for example, in “Herbert Reichl; Hybrid integration: technology and Design of thick-film circuits; Hüthig Verlag, Heidelberg, 1988, pages 37 to 63 ".
• the thick-film pastes are screen-printed onto a ceramic substrate.
• the known pastes consist of a mixture of small solid particles with a high softening point or high sintering temperature and an inorganic binder, for example a glass with a low sintering temperature which are dispersed in a vaporizable organic binder typically have a diameter of approximately 0.1 to 3 ⁇ m.
• the dispersions have the consistency of a paste and have a rheology which makes the paste suitable for screen printing.
• the organic binders contain various additives such as solvents and rheological agents, which increase the paste's printability. For the printing of resistors, metal oxides are also added to the paste, which determine the conductivity of the resistance elements.
• the printed structures are fired in a sintering process, with the organic components completely evaporating or pyrolyzing from the paste.
• a temperature below the sintering temperature of the solid particles but above the sintering temperature of the inorganic binder the latter is softened and flows around the non-sintering solid particles.
• the electrical structures completed after cooling have a different thermal expansion behavior than the carrier substrate. In the event of temperature fluctuations, cracks often occur in the resistance structures, which adversely affects the electrical properties. In extreme cases, the resistance is completely eliminated. Cracks in a printed cover layer or insulation layer lead to an adverse penetration of pollutants or a short circuit of the conductor tracks.
• the tensile strength of the printed structures is advantageously increased by a factor of ten and the risk of cracking or breaking of the structures is reduced.
• the probability of a failure of the circuit generated on the carrier substrate can hereby be significantly reduced, which is particularly important in cases in which the carrier
• the substrate with the printed structures is exposed in operation to very strong temperature changes or strong accelerating forces, as is the case, for example, in automotive electronics.
• the fracture toughness and strength of the structures is increased by fibers, which form the high-sintering solid content of the screen printing paste.
• the fibers embedded in the fired structures (resistors or insulating layers) increase the strength of the structures formed.
• the fibers are made of a material that does not sinter at the sintering temperature of the inorganic binder.
• ceramic fibers or fibers made of HT glass with a high softening point or high sintering temperature are suitable.
• the length of the fibers is advantageously at least five times the value of their diameter.
• the fiber-containing paste has good printability in the screen printing process, so that the structures can be applied to the carrier substrate using the known screen printing technique.
• the pastes used for the screen printing of electrical structures on a carrier substrate comprise at least the following components: a) inorganic fiber particles with a high sintering temperature, b) inorganic binder,
• the inorganic fiber particles contained in the paste have a sintering temperature that is significantly above the sintering temperature of the inorganic binder and do not sinter during the firing process.
• Materials that can be used here are fibers made of ceramic solids or HT glasses with a high softening point.
• the fibers can be produced from BaTi0 3 , CaTi0 3 , SrTi0 3 , PbTi0 3 , CaZr0 3 , BaZr0 3 , CaSn0 3 , BaSn0 3 , a metal carbide or a metal nitride, zirconium dioxide or silicon dioxide.
• Quartz glass, borosilicate glass, aluminum silicate glass, silica glass and other glasses can be used as HT glasses.
• the fibers are made from Al 2 0 3 ceramic. Such fibers are commercially available, for example, for use in cutting tools.
• the fiber diameter should be between 3 and 10 micrometers, the length of the fibers between 15 and 100 micrometers.
• the length of the fibers should exceed the diameter by a factor of 5. Good results have been achieved with fibers whose length is five to ten times the diameter.
• the fill factor of the fibers in the screen printing paste should be around 2 to 10 percent by volume. If necessary, the paste can contain further high-sintering, non-fibrous ceramic particles or particles made of HT glass with different geometries.
• Known glasses are used as inorganic binders, the sintering temperature of which is clearly below the sintering temperature of the fibers and which are subject to viscous phase sintering when the printed structures are fired.
• the particle size is between 0.5 and 20 micrometers. Amorphous vitrifiable or amorphous crystallizable are possible
• Glasses as are typically used as an inorganic binder in thick-film pastes.
• the organic binders include the print carrier and various additives, such as plasticizers, for example glycerol, and solvents, for example ethyl cellulose or terpineol.
• plasticizers for example glycerol
• solvents for example ethyl cellulose or terpineol.
• Polymeric binders for thick-film pastes known in the prior art are suitable.
• a screen with a web width and an opening diameter of approximately 20 to 120 micrometers is used for screen printing the paste. Of course, printing stencils can also be used.
• a ceramic substrate, for example made of A1 2 0 3 ceramic, or a multilayer substrate is used as the substrate.
• conductive agents are added to the above-mentioned paste.
• lead ruthenate Pb 2 Ru 2 0 6 can be used for this.
• other additives can also be used, such as admixtures of ruthenium dioxide or iridium oxide / platinum and palladium oxide / silver.
• the structures are printed on the ceramic carrier substrate in a thickness of 5 to 50 micrometers, dried and then fired in a sintering furnace. Evaporate or pyrolyze the organic components from the paste at temperatures of 400 to 600 ° C. At temperatures between 750 and 1000 ° C, the inorganic binder begins to soften and sinter, which means that the non-sintering fiber particles with a softening point well above 1000 ° C arrange themselves more closely.
• various electrical structures can be printed on the carrier substrate.
• cover layers can be applied to the top of the ceramic carrier substrate.
• insulating layers can be printed on conductor tracks, which are then covered with further conductor tracks.
• Resistor elements can be printed on using special additives, such as the additives mentioned above. It is also possible to use special paste additives to add capacitor layers on the carrier substrate with the to print the paste presented here.
• the volume fraction of the fibers in the fired structures is between 6 and 20% after cooling.
• the fibers contained in the fired structures form an inner framework, which increases the strength of the structures.

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• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Ceramic Engineering (AREA)
• Power Engineering (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Inorganic Chemistry (AREA)
• Geochemistry & Mineralogy (AREA)
• Materials Engineering (AREA)
• Organic Chemistry (AREA)
• General Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Life Sciences & Earth Sciences (AREA)
• Parts Printed On Printed Circuit Boards (AREA)
• Compositions Of Oxide Ceramics (AREA)
• Non-Adjustable Resistors (AREA)
• Conductive Materials (AREA)

Priority Applications (4)

Applications Claiming Priority (2)

Publications (1)

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Citations (2)

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• 1999
  • 1999-07-29 DE DE19935677A patent/DE19935677B4/de not_active Expired - Fee Related
• 2000
  • 2000-07-01 WO PCT/DE2000/002151 patent/WO2001009060A1/de not_active Ceased
  • 2000-07-01 DE DE50002256T patent/DE50002256D1/de not_active Expired - Lifetime
  • 2000-07-01 US US09/806,387 patent/US6667094B1/en not_active Expired - Fee Related
  • 2000-07-01 EP EP00952884A patent/EP1129050B1/de not_active Expired - Lifetime
  • 2000-07-01 JP JP2001514266A patent/JP4843171B2/ja not_active Expired - Fee Related

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Non-Patent Citations (2)

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