WO2000079574A1 - Dispositif a etage et systeme d'exposition - Google Patents

Dispositif a etage et systeme d'exposition Download PDF

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Publication number
WO2000079574A1
WO2000079574A1 PCT/JP1999/003253 JP9903253W WO0079574A1 WO 2000079574 A1 WO2000079574 A1 WO 2000079574A1 JP 9903253 W JP9903253 W JP 9903253W WO 0079574 A1 WO0079574 A1 WO 0079574A1
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WO
WIPO (PCT)
Prior art keywords
stage
mask
surface plate
stage device
substrate
Prior art date
Application number
PCT/JP1999/003253
Other languages
English (en)
Japanese (ja)
Inventor
Kazuya Ono
Hiroaki Narushima
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to AU41677/99A priority Critical patent/AU4167799A/en
Priority to PCT/JP1999/003253 priority patent/WO2000079574A1/fr
Publication of WO2000079574A1 publication Critical patent/WO2000079574A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/01—Frames, beds, pillars or like members; Arrangement of ways
    • B23Q1/015—Frames, beds, pillars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members

Definitions

  • the present invention relates to a stage device in which a movable body moves within a plane on a surface plate, and to an exposure device that performs an exposure process using a mask and a substrate that are precisely moved and positioned by the stage device.
  • various exposure devices stepspers, scanning steppers, etc.
  • transfer mask drawing devices mask pattern position coordinate measurement devices, or other positioning devices used for VLSI pattern transfer hold the target and are orthogonal.
  • a stage device that moves precisely in two axes (X and Y axes) is used.
  • FIG. 5 is an external perspective view showing an example of this type of stage device.
  • the stage device 1 includes a substantially rectangular parallelepiped surface plate 2, an X stage 3 that moves in the X direction along the surface of the surface plate 2, and a Y stage 4 that moves in the Y direction.
  • the Y stage 4 is arranged so as to extend along the X direction, and the Y guide 5 provided at the edge of the surface plate 2 so as to extend in the Y direction is used as a guide to drive the Y stage linear motor. Driven by 6 overnight.
  • the X stage 3 is fitted on the Y stage 4 and driven by the X drive linear motor 7 with the Y stage 4 as a guide.
  • air pads 8 and 9 constituting an air guide mechanism are provided, respectively. Therefore, the X stage 3 and the Y stage 4 levitate and travel without contact with the surface plate 2 with a small gap, and no frictional force acts between the X stage 3 and the Y stage 4.
  • a movable table 10 for holding a substrate such as a glass substrate or a wafer is provided on the top of the X stage 3.
  • the movable table 10 can freely move in a two-dimensional direction along the surface of the surface plate 2 by moving the X stage 3 and the Y stage 4 in the X direction and the Y direction, respectively.
  • long mirrors 11 and 12 are respectively installed at the edges on the movable table 10 in a direction perpendicular to the movable table 10.
  • Laser light is emitted from a laser interferometer (not shown) to the long mirrors 11 and 12, and the laser interference between the long mirrors 11 and 12 is made based on the interference between the reflected light and the incident light.
  • the distance between the movable table 10 and the position on the XY plane of the movable table 10 is detected with high resolution and high accuracy.
  • Stone has low rigidity and low strength compared to metals (especially iron-based materials) and ceramics. For this reason, increasing the rigidity and strength of stones equivalent to that of metals and ceramics will inevitably increase weight.
  • stone materials have a low degree of freedom in processing, so when they are actually used, they are almost always installed in the state of stone blocks.
  • the surface plate 2 could not adopt a rib structure like an animal to reduce its weight, and could not avoid the problem of weight increase.
  • the surface plate 2 is formed of an organic material and its surface is plated with nickel and phosphorus, or the surface plate 2 is formed of an aluminum-based material and the surface is anodized. Thus, measures were taken to prevent oxidation of the surface and increase the hardness.
  • air may be interrupted while the movable table 10 is moving. At this time, there is a possibility that the movable table 10 and the surface plate 2 come into contact with each other and the surface plate 2 is damaged. Also, when the operating table 10 moves in a state where small dust or the like exists between the movable table 10 and the surface plate 2, the surface plate 2 may be damaged. At this time, in both cases using the above metal material, if the surface of the surface plate 2 is scratched, the surface of the metal material rises. When the X stage and the Y stage 4 move along the surface of the surface plate 2 in this state, swelling occurs between the swelling of the surface plate 2 and the air pads 8 and 9.
  • the control performance of the movable table 10 may be significantly reduced due to a loss of the motion accuracy of the air guide mechanism or a change in the dynamic characteristics of the air guide mechanism. If the air pads 8 and 9 continue to be used for a long time in this state, the air pads 8 and 9 may be gradually damaged, leading to fatal injury. And had such difficulties in terms of long-term stability. In addition, there is a limit to the size of the plating and alumite treatment performed on the surface plate 2, so that it can be used in exposure equipment. It could not be applied to large large shapes.
  • the conventional stage apparatus and exposure apparatus as described above have the following problems. Since the surface of the stone has micropores called pores, there is a problem that it is difficult to maintain high-precision planar traveling characteristics required for the movable table 10.
  • ceramics have the property that it is impossible to produce a single substance having a large volume, and that it is difficult to form a complex shape. For this reason, examples in which the surface plate 2 was entirely made of ceramics were limited to small devices such as stage devices having only one axis or stage devices having extremely small strokes. Furthermore, even if large ceramics can be manufactured in the future, ceramics will ultimately be very expensive considering the cost of manufacturing equipment and the poor mass productivity represented by yield. There is a problem that the price cannot be applied to the product. In addition, demand for larger wafers and glass plates is expected to increase in the future in order to increase the number of IC chips and LCD panels manufactured from a single wafer or glass plate. In that case, Naturally, the size of the exposure equipment will also increase, and with this, it is expected that the demand for developing a surface plate for large air guides will increase in the future.
  • the present invention has been made in view of the above points, and is a stage capable of maintaining performance for a long period of time even if the size is increased, and achieving a reduction in weight and cost. It is an object of the present invention to provide an apparatus and an exposure apparatus provided with the stage apparatus. Disclosure of the invention
  • the present invention employs the following configuration corresponding to FIGS. 1 to 4 showing the embodiment.
  • the stage device of the present invention is a stage device (18) having a movable body (25) that moves the surface (3 la) of the surface plate (24) in a non-contact manner, and the surface plate (24) is made of stone. It has a main body (30) and a surface (31) in which a surface (31a) is coated with a coating material. Therefore, the stage device of the present invention
  • the exposure apparatus of the present invention is an exposure apparatus for exposing a pattern of a mask (M) held on a mask stage (16) to a substrate (W) held on a substrate stage (18).
  • a stage device (18) according to claim 1 is installed as at least one of the mask stage (16) and the substrate stage (18). It is. Therefore, in the exposure apparatus of the present invention, the stage apparatus (18) provided in at least one of the mask stage (16) and the substrate stage (18) is used for masking. The pattern of the mask (M) held on the substrate stage (16) can be exposed on the substrate (W) held on the substrate stage (18).
  • FIG. 1 is a view showing an embodiment of the present invention, and is an external perspective view of a substrate stage in which a ceramic portion is formed on a surface plate main body.
  • FIG. 2 is a schematic configuration diagram of an exposure apparatus including the substrate stage.
  • FIG. 3 is an explanatory view for explaining the procedure for spraying ceramics on the surface plate body of the substrate stage.
  • (A) shows the relative movement of the nozzle in the + Y direction along the surface of the surface plate body.
  • FIG. 7B is an explanatory diagram when the platen body is moved relative to the nozzle in the + X direction.
  • FIG. 4 is a view showing another embodiment of the present invention, and is an external perspective view in which four ceramic parts are formed on a surface plate main body so as to be separated from each other.
  • FIG. 5 is an external perspective view showing an example of a stage device according to the related art. BEST MODE FOR CARRYING OUT THE INVENTION
  • the substrate is a wafer for manufacturing semiconductor devices
  • the exposing device is a scanning type exposure device that scans and exposes the pattern of the mask on the wafer by synchronously moving the mask and the wafer.
  • Description will be made using an example in which the exposure apparatus is installed on a substrate stage that holds a wafer.
  • the same components as those in FIG. 5 shown as a conventional example are denoted by the same reference numerals, and description thereof will be omitted.
  • FIG. 2 is a schematic configuration diagram of the exposure apparatus 13.
  • the exposure apparatus 13 projects and transfers a pattern (for example, a semiconductor element pattern) formed on a mask (reticle) M onto a substantially circular wafer (substrate) W coated with a photosensitive agent. It is roughly composed of a light source 14, an illumination optical system 15, a projection optical system 16, a mask stage (reticle stage) 17, and a substrate stage (stage device) 18.
  • a light source 14 an illumination optical system
  • a projection optical system 16 a mask stage (reticle stage) 17
  • substrate stage device substrate stage
  • the light source 14 emits a beam B as exposure light, and is composed of an ultra-high pressure mercury lamp or the like.
  • the beam B emitted from the light source 14 is reflected by the reflection mirror 19 and enters the illumination optical system 15.
  • the illumination optical system 15 includes a shirt 19 that opens and closes the optical path of the beam B, a reflection mirror 20 and 21, a wavelength selection filter 42, and an optical integrator for uniformizing the beam B. (Fly eye lens, etc.) 23, relay lenses 44, 45, variable field stop 46, and condenser optical system 47 composed of a plurality of optical elements.
  • the beam B incident in response to the opening operation of the shutter 19 passes the wavelengths (g-line and i-line) required for exposure in the wavelength selection filter 42, and the illuminance is reduced by the optical integrator 43. It is made uniform.
  • the beam B having uniform illuminance passes through the relay lenses 4 4 and 4 5, is then condensed by the condenser optical system 4 7, and is illuminated on the mask M defined by the aperture of the variable field stop 4 6. For example, a slit-shaped illumination area extending in the non-scanning direction is illuminated in a superimposed manner.
  • a mask M is held and fixed to the mask stage 17 via a mask holder 48, and a through hole 17a is formed so that the beam B transmitted through the mask M can pass therethrough.
  • the mask stage 17 is provided on a base 49 so as to be movable along a plane (XY plane) orthogonal to the plane of FIG.
  • a movable mirror 50 is provided on the mask holder 48. The position of the mask stage 17 (and thus the position of the mask M) reflects the laser light emitted from the laser interferometer 51 on the movable mirror 50, enters the laser interferometer 51, and reflects the light. It is measured based on the interference between light and incident light.
  • the measured position information is used for controlling the position of the mask M and the speed of the mask M during scanning exposure via the mask stage driving motor 52.
  • the projection optical system 16 has a plurality of optical elements, and forms an image of a pattern existing in the illumination area of the mask M on the wafer W. Then, the resist applied on the wafer W is exposed to light, and a pattern image is transferred onto the wafer W.
  • the substrate stage 18 holds and fixes the wafer W via the substrate holder 53, and is movable in directions orthogonal to each other (three-dimensional directions of ⁇ , ⁇ , ⁇ ).
  • a movable mirror 54 is provided on the substrate stage 18.
  • the position of the substrate stage 18 (and thus the position of the wafer W) is determined by the laser interferometer (position measurement device).
  • the laser light emitted from 55 is reflected by the moving mirror 54, enters the laser interferometer 55, and is measured based on the interference between the reflected light and the incident light.
  • the measured position information is used for controlling the position of the wafer W and the speed of the wafer W during scanning exposure via the substrate stage driving motor 56.
  • the index mark FM provided outside the exposure area on the substrate stage 18 and the wafer transferred to the exposure area of the wafer W are separated from the projection optical system 16.
  • An alignment optical system 57 for observing marks (not shown) is provided.
  • a mask alignment microscope MAM for observing the mark provided on the mask M and the second mark formed on the index mark FM is disposed above the mask stage 17. .
  • the substrate stage 18 is positioned so that Next, by observing the first mark of the index mark FM by the alignment optical system 57 in this state, the distance between the detection center of the alignment optical system 57 and the center of the projected image by the projection optical system 16 is obtained. Baseline volume can be measured.
  • FIG. 1 is an external perspective view of the substrate stage 18.
  • Substrate stage 18 includes base 22, anti-vibration device (not shown), surface plate 24, movable plate (movable body) 25, X guide 26, X-drive linear motor 27, Y Guide 28 and Y-drive linear motor — mainly composed of evening 29 and 29 (in this figure, for convenience, The substrate holder, moving mirror, etc. are omitted).
  • the anti-vibration and anti-vibration device has a pneumatic damper and a piezo damper, etc., which damps and removes the vibration applied to the surface plate 24, between the base 22 and the surface plate 24. Are located.
  • the surface plate 24 includes a surface plate main body (main body portion) 30 and a ceramic portion (surface portion) 31 coated on the entire upper surface of the surface plate main body 30 as a coating material.
  • the platen body 30 has a substantially rectangular parallelepiped shape, and is formed of a sufficiently rigid stone material such as Indian Black having a linear expansion coefficient substantially equal to that of a steel material.
  • the ceramic part 31 is formed by spraying alumina-based ceramics (gray alumina, alumina titania, etc.) onto the main body 30 of the platen, and the movable plate 25 moves along the surface 3 la. ing.
  • silicon nitride, tungsten byte, titania, chromium oxide (chromia), and the like can be applied as the ceramic material used for the thermal spraying.
  • the X guide 26 freely moves in the X direction by driving the linear motor 27 for X drive.
  • the Y guide 28 has a long shape extending in the Y direction along the surface 31 a of the ceramic portion 31, and is formed integrally with the X guide 26.
  • Guide 26 moves in the X direction.
  • the movable plate 25 has the substrate holder 53 (not shown in FIG. 1) for holding the wafer W, and drives the Y guides 28 and 29 by driving the linear motors 29 and 29 for Y drive. It is a guide and moves freely in the Y direction.
  • plates 32, 32 for integrally supporting these are provided so as to face the ceramic portion 31.
  • An air pad air bearing
  • the movable plate 25 is provided with a plate 33 integrally with the movable plate 25 with the Y-drive linear motors 29 and 29 and the Y guide 28 interposed therebetween.
  • the same ceramic material as that of the ceramic portion 31 is coated on the surface of the movable plate 25 facing the surface 31 a of the ceramic portion 31, that is, the bottom surface of the plate 33.
  • the plate 33 was formed by coating the above ceramic material on a plate body composed of metal material, carbon fiber, etc. Things. An air pad (not shown) is also provided on the bottom surface of the plate 33 so as to face the surface 31a of the ceramic portion 31.
  • An air pad (not shown) is also provided on the bottom surface of the plate 33 so as to face the surface 31a of the ceramic portion 31.
  • a procedure for manufacturing the surface plate 24 in the substrate stage 18 having the above configuration will be described. First, as shown in FIG. 3 (a), the platen body 30 is placed along the XY plane, and a nozzle 36 for spraying alumina-based ceramics by plasma spraying or the like is connected to the platen body 30. The nozzle 36 is moved in the + Y direction along the surface of the platen body 30 so as to face the surface of the platen 30. As a result, ceramics corresponding to the width of the nozzle 36 is sprayed on the platen body 30 in a strip shape.
  • the platen body 30 is moved in the + X direction relative to the nozzle 36 in a distance slightly shorter than the width of the nozzle 36, and the nozzle 36 is fixed. Move relative to panel body 30 in the Y direction.
  • a surface plate 24 having a ceramic layer having a thickness of approximately 100 to 80 O / zm, for example, approximately 200 m, formed on the surface of the surface plate body 30. Is obtained.
  • the surface of the surface plate 24 is ground and lapped to complete the surface plate 24 having a smooth ceramic portion 31 (ceramic layer) having a thickness of about 10. If the nozzle 36 and the platen body 30 move relative to each other in the above direction, only the nozzle 36 or the platen body 30 may move.
  • the surface plate 24 is attached to the base 22 and the anti-vibration device, movable plate 25, X guide 26, linear motor for X drive 27, Y guide 28 and Y drive By incorporating Linear Motors 29, 29, a substrate stage 18 can be obtained.
  • the plate 33 is also manufactured by spraying a ceramic material on the bottom surface in the same manner as the surface plate body 30 and then grinding and wrapping the ceramic material.
  • a ceramic part 31 coated (sprayed) with a ceramic material is provided on the upper surface of a surface plate main body 30 formed of a stone material.
  • the ceramic material does not rise when the surface 31a is scratched, there is no rubbing between the ceramic material and the air guide mechanism, and therefore, the air guide mechanism such as a non-contact bearing is not damaged.
  • the wear resistance can be improved, and the high plane accuracy is maintained, so that the flat traveling characteristics of the movable plate 25 can be maintained for a long period of time.
  • ceramics is a non-magnetic material, it is preferable to use a magnetic bearing as the non-contact bearing because it does not adversely affect the magnetic bearing.
  • the ceramic material is sprayed on the surface of the platen body 30 and coated, it is compared with a case where the entire platen is formed of ceramics. Therefore, even if the surface plate body 30 becomes large, the ceramic layer can be easily formed, and the manufacturing cost can be reduced.
  • the plate 33 is also manufactured by coating the bottom surface of the plate body with a ceramic material, so that the plate 33 is compared with a case where the whole is formed of a ceramic material. Weight reduction and cost reduction can be realized. Also, in this case, by reducing the weight of the plate 33, it becomes possible to reduce the thrust of the drive system such as the substrate stage drive motor 56 for driving the movable plate 25, thereby suppressing the amount of heat generated. At the same time, the cost of the drive train itself can be reduced.
  • the ceramic portion 31 is formed over the entire upper surface of the platen body 30.
  • the present invention is not limited to this, and the movable plate 25 and the plate 33 move. If the area is coated with a ceramic material.
  • the movable range of the movable plate 25 and the plate 33 during scanning exposure for exposing the pattern of the mask M on the wafer W, and the movable plate 25 when exchanging the wafer W Based on the moving range of the plate 33 and the moving range of the movable plate 25 and the plate 33 when measuring the above-mentioned baseline amount, these moving ranges or slightly larger than these moving ranges. Then, a ceramic material may be coated on the platen body 30.
  • the area for coating the ceramic material need not be one, and a number of areas corresponding to the number of air pads may be set.
  • the ceramic part 31 may be formed so as to at least cover the range in which each air pad 35 moves. In this case, since the range of the ceramic part 31 is the minimum required, it is possible to contribute to a reduction in the number of manufacturing steps and a further reduction in price. It should be noted that the number of ceramic portions 31 and air pads 35 is not limited to four as shown in FIG. 4, and it goes without saying that there may be three or more.
  • the surface plate body 30 is coated with a ceramic material.
  • a structure in which a ceramic plate is attached to the upper surface of the surface plate body 30 with an adhesive may be used. The same effects as above can be obtained.
  • the adhesive layer causes a slight slip, thereby increasing the damping effect, and is particularly effective for torsional resonance of the surface plate 24 and the like.
  • the platen body 30 is made of a stone material, but may be made of a metal material ⁇ carbon fiber or the like.
  • a material is used as a metal material, the material is excellent in workability, so that a hollow portion or a rib structure can be easily formed, and both light weight and high rigidity can be achieved.
  • the ceramics part 31 is formed with high specific rigidity on the surface plate body 30 made of an animal, the strength is increased as compared with the case of an object alone, and the amount of torsional deformation and bending deformation can be reduced. Also occurs.
  • the platen body 30 is formed of a stone having a linear expansion coefficient equivalent to that of a steel material.
  • a wire equivalent to the ceramic part 31 may be used. It may be formed of a stone material having an expansion coefficient. In this case, even if a thermal change occurs, no compressive or tensile force due to the thermal change acts between the platen body 30 and the ceramic portion 31, causing distortion as the platen 24. Can be prevented. Therefore, in the exposure apparatus 13 of the present embodiment, the imaging characteristics can be maintained with high accuracy without the projection image being adversely affected by the distortion of the surface plate 24.
  • the thickness of the ceramics layer is merely an example, and does not limit the stage device of the present invention.
  • the surface of the surface plate 24 is formed of a ceramic material.
  • the present invention is not limited to this.
  • another material such as crystallized glass having the same performance as the ceramic material is used. It may be a configuration. When crystallized glass is used, effects such as a small shrinkage ratio during production and a furnace temperature lower than that of ceramics can be obtained.
  • stage apparatus of the present invention is applied to the substrate stage 18 of the exposure apparatus 13 .
  • stage apparatus of the present invention can be applied to the mask stage 17 holding the mask M.
  • the present invention is also applicable to precision measuring devices such as a transfer mask drawing device and a mask pattern position coordinate measuring device.
  • a surface grinder is used as a means of grinding and lapping the ceramic part 3 1 sprayed on the surface plate body 30 .
  • a so-called partial polishing machine for polishing is also possible to use.
  • a magnet unit having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil are opposed to each other, and the stage is driven by electromagnetic force
  • the plane mode may be used.
  • one of the magnet unit and the armature unit may be connected to the stages 17 and 18, and the other of the magnet unit and the armature unit may be provided on the surface plate body 30.
  • a plurality of substrate stages 18 (or mask stages 17) that move on the ceramic parts 31 and 34 of the platen body 30 may be provided.
  • a plurality of stages can be independently controlled when the above-mentioned plane motor is used as the driving device. For this reason, for example, while the wafer W on the first substrate stage 18 is being exposed, the alignment operation of the wafer W on the second substrate stage 18 ' Throughput can be improved.
  • the substrate not only a semiconductor wafer for a semiconductor device, but also a glass plate for a liquid crystal display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle (synthetic quartz, Silicon wafer) is applied.
  • the exposure apparatus 13 is not only a step-and-scan type scanning projection exposure apparatus (scanning stepper) for exposing a pattern of the mask M by synchronously moving the mask M and the wafer W,
  • the present invention can also be applied to a step-and-repeat type exposure apparatus (stepper) that exposes the pattern of the mask M while the mask M and the wafer W are stationary and sequentially moves the wafer W in steps.
  • Exposure equipment The 13 types can be widely applied to an exposure apparatus for manufacturing a semiconductor or a liquid crystal display device, an exposure apparatus for manufacturing a thin-film magnetic head, an image sensor (CCD) or a mask M, and the like.
  • emission lines g-line (433 ⁇ m), i-line (365 nm)
  • F 2 laser 157 nm
  • X-ray and electron gun can be used.
  • a high frequency such as a YAG laser or a semiconductor laser can be used.
  • the magnification of the projection optical system 16 may be not only the same magnification system but also any of a reduction system and an enlargement system. Also, as the projection optical system 16, when a far ultraviolet ray such as an excimer laser is used, a material that transmits the far ultraviolet ray such as quartz or fluorite is used as a glass material. System optical system. Further, the present invention can be applied to a proximity exposure apparatus that exposes the pattern of the mask M by bringing the mask M into close contact with the wafer W without using the projection optical system 16.
  • each of the stages 16 and 17 may be of a type that moves along a guide, or may be a guideless type that does not have a guide.
  • the reaction force generated by the movement of the substrate stage 18 may be mechanically released to the floor (ground) using a frame member.
  • the reaction force generated by the movement of the mask stage 17 may be mechanically released to the floor (ground) using a frame member.
  • Each of the illumination optical system 15 and the projection optical system 16 composed of a plurality of optical elements is incorporated into the main body of the exposure apparatus to perform optical adjustment, and a mask stage 17 and a substrate stage 1 composed of many mechanical parts are provided.
  • the exposure apparatus 13 of the present embodiment is manufactured by attaching 8 to the surface plate main body 30 on which ceramics are sprayed, connecting wiring and piping, and further performing overall adjustment (electrical adjustment, operation confirmation, etc.). can do. It is desirable that the exposure apparatus 13 be manufactured in a clean room in which temperature, cleanliness, and the like are controlled.
  • Devices such as semiconductor devices and liquid crystal display devices are A step of performing a performance design, a step of manufacturing a mask M based on this design step, a step of manufacturing a wafer W, a glass substrate, and the like. It is manufactured through a step of exposing a glass substrate, a step of assembling each device, and an inspection step.
  • the present invention relates to a stage device in which a movable body moves within a plane on a surface plate, and to an exposure device that performs an exposure process using a mask and a substrate that are precisely moved and positioned by the stage device.
  • a surface plate has the main-body part which consists of a stone material, and the surface part with which the coating material was coated on the surface, the function which bears rigidity and the function which does not generate a rub between a movable body Can be separated. Therefore, it is possible to appropriately select a material having characteristics according to each function, and it is possible to solve problems such as weight increase, cost increase, rigidity shortage, etc. which occurred when using a single material, Versatility can be improved.
  • the coating material can block the pores existing in the main body, there is no rubbing between the air guide mechanism and the abrasion resistance without damaging the air guide mechanism such as non-contact bearings.
  • the planar running characteristics of the movable body can be maintained for a long period of time.
  • the coating material is a ceramic material and does not rise even if the surface is scratched, there is no rubbing between the air guide mechanism and the air guide mechanism for a long time without damage.
  • the performance can be maintained over a long period of time, and since ceramics is a non-magnetic material, when a magnetic bearing is used for the air pad mechanism, the effect is obtained that the magnetic bearing is not adversely affected.
  • the ceramic material has almost zero water absorption as a material, it is possible to prevent a change in flatness due to swelling due to a change in humidity.
  • a ceramic layer can be formed easily and at low cost even on a large surface plate. Is also obtained. And at least movable By coating the area where the body moves with the coating material, the area of the surface portion can be minimized, and the effect of reducing the number of manufacturing steps and further reducing the price can be obtained. If a position measuring device that measures the position of the movable body is provided, the relative position between the movable body and the surface plate can be measured even when the movable body moves on the surface of the surface plate. By arranging a non-contact bearing between the surface plate and the movable body, the movable body can be moved without contact with the surface plate and with high-precision plane running characteristics.
  • the exposure apparatus can perform the exposure operation and the alignment operation in parallel, and can improve the throughput of the exposure apparatus.
  • the coating material can be coated in a minimum necessary range, which can contribute to a reduction in the number of manufacturing steps and a further reduction in cost.
  • the exposure apparatus of the present invention since the above-described stage device is installed as at least one of the mask stage and the substrate stage, cost reduction and weight reduction can be realized, and over a long period of time. As a result, the stage performance such as the plane running characteristics can be maintained, and thus the imaging characteristics can be maintained with high accuracy.
  • the moving range of the stage can be covered by coating the area where the movable body moves, eliminating the need to coat the unnecessary area with the coating material.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

L'invention concerne un dispositif d'étage (18) comprenant un corps (30) formé d'une pierre et une unité de surface (31) dont la surface (31a) est recouverte d'un revêtement. On prévoit une fonction chargée de la rigidité et une fonction ne générant pas d'abrasion d'un corps mobile (25) qui peuvent être indépendantes, permettant ainsi une sélection adéquate de matières aux caractéristiques adaptées à chaque fonction de manière à éliminer les désavantages dont peut faire preuve une seule matière, tels qu'un poids excessif, un coût élevé et une moindre rigidité
PCT/JP1999/003253 1999-06-18 1999-06-18 Dispositif a etage et systeme d'exposition WO2000079574A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU41677/99A AU4167799A (en) 1999-06-18 1999-06-18 Stage device and exposure system
PCT/JP1999/003253 WO2000079574A1 (fr) 1999-06-18 1999-06-18 Dispositif a etage et systeme d'exposition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1999/003253 WO2000079574A1 (fr) 1999-06-18 1999-06-18 Dispositif a etage et systeme d'exposition

Publications (1)

Publication Number Publication Date
WO2000079574A1 true WO2000079574A1 (fr) 2000-12-28

Family

ID=14235994

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1999/003253 WO2000079574A1 (fr) 1999-06-18 1999-06-18 Dispositif a etage et systeme d'exposition

Country Status (2)

Country Link
AU (1) AU4167799A (fr)
WO (1) WO2000079574A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009117803A (ja) * 2007-10-17 2009-05-28 Canon Inc 駆動装置及び露光装置、デバイスの製造方法
JP2009210295A (ja) * 2008-02-29 2009-09-17 Canon Inc 位置決め装置、露光装置及びデバイス製造方法
JP2018170412A (ja) * 2017-03-30 2018-11-01 ピー・ヂー・ダブリュー株式会社 スライダ装置およびその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59129633A (ja) * 1983-01-08 1984-07-26 Canon Inc ステージ装置
JPS62172577U (fr) * 1986-04-18 1987-11-02
JPH023381U (fr) * 1988-06-09 1990-01-10
JPH0471475B2 (fr) * 1986-01-21 1992-11-13 Canon Kk
JPH08229759A (ja) * 1995-02-24 1996-09-10 Canon Inc 位置決め装置並びにデバイス製造装置及び方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59129633A (ja) * 1983-01-08 1984-07-26 Canon Inc ステージ装置
JPH0471475B2 (fr) * 1986-01-21 1992-11-13 Canon Kk
JPS62172577U (fr) * 1986-04-18 1987-11-02
JPH023381U (fr) * 1988-06-09 1990-01-10
JPH08229759A (ja) * 1995-02-24 1996-09-10 Canon Inc 位置決め装置並びにデバイス製造装置及び方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009117803A (ja) * 2007-10-17 2009-05-28 Canon Inc 駆動装置及び露光装置、デバイスの製造方法
JP2009210295A (ja) * 2008-02-29 2009-09-17 Canon Inc 位置決め装置、露光装置及びデバイス製造方法
JP2018170412A (ja) * 2017-03-30 2018-11-01 ピー・ヂー・ダブリュー株式会社 スライダ装置およびその製造方法

Also Published As

Publication number Publication date
AU4167799A (en) 2001-01-09

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