WO2000074023A1 - Structure de connexions electriques et ecran plat - Google Patents

Structure de connexions electriques et ecran plat Download PDF

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Publication number
WO2000074023A1
WO2000074023A1 PCT/JP2000/003518 JP0003518W WO0074023A1 WO 2000074023 A1 WO2000074023 A1 WO 2000074023A1 JP 0003518 W JP0003518 W JP 0003518W WO 0074023 A1 WO0074023 A1 WO 0074023A1
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WO
WIPO (PCT)
Prior art keywords
conductive
gap
display device
electrical connection
connection structure
Prior art date
Application number
PCT/JP2000/003518
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English (en)
Japanese (ja)
Other versions
WO2000074023A8 (fr
Inventor
Toshihiko Satou
Original Assignee
Citizen Watch Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co., Ltd. filed Critical Citizen Watch Co., Ltd.
Publication of WO2000074023A1 publication Critical patent/WO2000074023A1/fr
Publication of WO2000074023A8 publication Critical patent/WO2000074023A8/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape

Definitions

  • the present invention relates to an anisotropic conductive adhesive for connecting two opposing conductive layers, for example, in a flat panel display device having a pair of substrates, for electrically connecting the opposing conductive layers between the substrates. It relates to a connection structure for connection.
  • anisotropic conductive sealing material As an adhesive material for establishing electrical continuity between two conductive layers, an anisotropic conductive sealing material having conductivity in one direction has been conventionally known.
  • This anisotropic conductive sealing material is an adhesive in which non-conductive particles and conductive particles are mixed in an adhesive, and which is conductive by the conductive particles in the pressing direction.
  • This anisotropic conductive adhesive is used, for example, as a sealant between a pair of substrates of a typical liquid crystal display device as a flat display device.
  • a liquid crystal display device liquid crystal is sealed between a pair of substrates, and a predetermined display signal is applied to electrodes formed on each of the opposing surfaces of each substrate to drive the liquid crystal between the substrates, thereby producing a desired liquid crystal display.
  • a liquid crystal display device There is a demand for such a liquid crystal display device to be thinner and smaller, and it is necessary to make wiring routing outside the substrate as simple as possible. Therefore, it is necessary to connect an electrode formed on the surface of one substrate to a lead terminal formed on the other electrode. In order to connect the electrodes on one substrate to the terminals on the other substrate when forming the gap for liquid crystal sealing between the substrates by sealing the peripheral portions of the two substrates, Such an anisotropic conductive adhesive is used.
  • FIG. 6 shows a seal and electrical connection structure between substrates in a conventional liquid crystal display device.
  • a first electrode 12 and a second electrode 22 such as ITO (indium tin oxide) are formed, respectively.
  • an extraction terminal (not shown) for connecting the second electrode 22 to an external drive circuit, and the first electrode 12 of the first substrate 10 are connected to the second substrate 20.
  • External drive circuit A lead terminal 24 for connection is formed.
  • the first substrate 10 and the second substrate 20 were sealed by the anisotropic conductive adhesive 40 near the periphery of the first substrate 10 and simultaneously pulled out to the periphery of the first substrate 10.
  • the first electrode 12 is connected to a lead terminal 24 on the second substrate 20.
  • a liquid crystal 14 is sealed in a gap formed between the pair of substrates by bonding the peripheral portions of the substrates.
  • the anisotropic conductive adhesive 40 two kinds of particles are mixed in the adhesive 46, and one of the particles is formed by coating the surface of a non-conductive bead with a conductive material.
  • the conductive particles 44 are deformable as shown in FIG.
  • the other particle is a non-conductive particle 42 smaller than the particle size of the conductive particle 44 and may be deformed, but is generally made harder than the conductive particle.
  • the bonding of the substrates is performed, for example, by disposing a paste-like anisotropic conductive adhesive 40 on one substrate by screen printing or the like. This is done by positioning another substrate and heating it while applying pressure between both substrates.
  • the anisotropic conductive adhesive 40 When the anisotropic conductive adhesive 40 is cured by, for example, heating while pressing the first and second substrates 10 and 20 in this manner, the adhesive 46 is extruded from the gap between the substrates, and the conductive material remaining in the gap is removed.
  • the adhesive 46 is cured in a state where the conductive particles 44 are in contact with the conductive layers on the upper and lower substrate surfaces, the conductive layers are separated by a distance corresponding to the particle size of the conductive particles 44, and the conductive layers are electrically connected. It will be in a state of being connected.
  • the non-conductive particles 42 are mixed to increase the dispersibility of the conductive particles 44 in the adhesive 46, but function as spacers when external pressure or the like is further applied between the substrates. Thus, it is possible to prevent the conductive particles 44 from being excessively deformed and causing a connection failure between the conductive layers.
  • the conductive particles 44 allow conduction between the conductive layers of the substrate.
  • the first and second substrates 10 and 20 have undulations as shown in FIG. 7 and are not completely flat. Further, the thickness of the conductive layer formed on each substrate also varies. Further, the flatness of the substrate and the degree of variation in the film thickness vary depending on the type of the display device. Therefore, when two substrates are bonded together In this case, it is difficult to completely match all the gaps of the actual bonding portion with the bonding set gap Gp.
  • the conductive particles 44 particles having one kind of particle diameter that has optimal characteristics with respect to the adhesion setting gap Gp are used. Therefore, at the position where the gap Gp is as set, the upper and lower conductive layers are connected by the conductive particles 44a, but at the position of the gap variation lower limit Gmin, the conductive particles 44b are shown in FIG. As shown in the figure, the particles are too crushed, resulting in poor conduction to the upper and lower conductive layers. For example, the conductive material coating the beads becomes thinner due to extreme pressure, causing a problem that the contact resistance increases. In addition, at the position of the gap variation upper limit Gmax, as shown in FIG. 7 as the conductive particles 44c, the particles are hardly deformed and poor contact occurs with the upper and lower conductive layers.
  • the conventional anisotropic conductive adhesive 40 has a problem in that the variation in the gap between the bonding surfaces cannot be absorbed and poor connection between the upper and lower conductive layers occurs.
  • An object of the present invention is to provide a connection configuration that enables reliable connection between substrates by absorbing variations in the gap between the substrates.
  • the present invention provides an electrical connection structure in which two conductive layers opposed to each other with a predetermined gap therebetween are electrically connected by an anisotropic conductive adhesive interposed therebetween. Is characterized in that a plurality of types of conductive particles having different particle diameters corresponding to variations in the adhesion setting gap between the conductive layers are mixed.
  • Another feature of the present invention is an electrical connection structure in which two conductive layers opposed to each other with a predetermined gap are electrically connected by an anisotropic conductive adhesive interposed therebetween.
  • the conductive adhesive material among the dispersion with respect to the adhesion set gap between the conductive layers, the conductive particles having the first particle size having connectivity within an appropriate range with respect to the variation upper limit gap, and the adhesive set gap between the conductive layers.
  • Still another feature of the present invention is that, in the electrical connection configuration, non-conductive particles are further mixed in the anisotropic conductive adhesive.
  • the opposing conductive layers are, for example, electrodes, wirings, terminals, etc. formed on a substrate or the like, and these conductive layers are opposingly arranged with an anisotropic conductive adhesive therebetween and are electrically connected.
  • the gap between the opposing terminals on the bonding surface varies, reliable conduction between the terminals can be achieved by the presence of at least two types of conductive particles.
  • the flat panel display device includes first and second substrates each having a conductive layer formed on a surface thereof, wherein the first and second substrates are anisotropically conductively bonded therebetween.
  • the conductive layers on the first substrate and the conductive layer on the second substrate are electrically arranged by the anisotropic conductive adhesive so that the conductive layers face each other with a predetermined gap therebetween.
  • the anisotropic conductive adhesive is characterized in that a plurality of types of conductive particles having different particle diameters corresponding to variations in the adhesion setting gap between the conductive layers are mixed.
  • Another feature of the present invention is a flat panel display device including first and second substrates each having a conductive layer formed on a surface thereof, wherein the first and second substrates have an anisotropic conductive adhesive therebetween.
  • the conductive layer on the first substrate and the conductive layer on the second substrate are electrically connected by the anisotropic conductive adhesive so that the conductive layers face each other with a predetermined gap therebetween.
  • conductive particles having a first particle size having connectivity within an appropriate range with respect to a variation upper limit gap, among variations in the adhesion setting gap between the conductive layers are mixed: conductive particles having connectivity within an appropriate range with respect to the variation lower limit gap and having a second particle size different from the first particle size. That is.
  • Still another feature of the present invention is that, in the flat display device, non-conductive particles are further mixed in the anisotropic conductive adhesive.
  • a flat display device is, for example, a liquid crystal display device in which liquid crystal is sandwiched between a pair of opposing substrates.
  • the conductive layer formed on the opposing surface side of the opposing substrates includes, for example, electrodes, wiring, Terminals.
  • the conductive layer is connected between the substrates due to the presence of the conductive particles of the first particle size in the upper limit range of the variation. Is done.
  • the conductive layers are electrically connected due to the presence of the conductive particles having the second particle size.
  • Another feature of the present invention is that, in the electrical connection structure or the flat display device, the first particle size of the conductive particles is larger than the variation upper limit gap. Another feature is that, in the electrical connection structure or the flat display device described above, the second particle size of the conductive particles is larger than the minimum clearance.
  • a particle size of the non-conductive particles is substantially equal to the second particle size of the conductive particles.
  • the conductive particles have flexibility.
  • particles having a large particle diameter are more variably with respect to the gap between the conductive layers in setting the adhesion. That is, they are arranged at large gap positions.
  • the anisotropic conductive adhesive is, for example, a seal material for sealing a liquid crystal material between substrates.
  • the anisotropic conductive adhesive is, for example, an adhesive for connecting an integrated circuit to a substrate.
  • the anisotropic conductive adhesive in a structure in which conductive layers facing each other are sandwiched with an anisotropic conductive adhesive therebetween, the anisotropic conductive adhesive has a gap variation that may occur between the conductive layers. Taking into account the upper and lower limits, conductive particles of multiple types (at least two types) are mixed into the adhesive and used.
  • FIG. 1 is a conceptual diagram showing the anisotropic conductive adhesive of the present invention.
  • FIG. 2 is a diagram showing a planar structure of the liquid crystal display device according to the embodiment of the present invention.
  • FIG. 3 is a diagram showing a cross-sectional structure of the liquid crystal display device according to the embodiment of the present invention at a position along the line AA in FIG.
  • FIG. 4 is a diagram showing functions of two types of conductive particles in the anisotropic conductive adhesive of the present invention.
  • FIG. 5 is a diagram showing an electrical connection structure between terminals according to the embodiment of the present invention.
  • FIG. 6 is a diagram showing a cross-sectional configuration of a liquid crystal display device using a conventional anisotropic conductive adhesive.
  • FIG. 7 is a diagram for explaining a problem when a conventional anisotropic conductive adhesive is used.
  • a plurality of anisotropic conductive adhesives for connecting a conductive layer on one substrate to a conductive layer on the other particle size at least two kinds of particle size r!, r 2 (r> r 2) conductive particles children 3 2, 3 4 and mixed using.
  • the particle size ⁇ of the first conductive particles 32 is a particle whose conduction characteristics with the conductive layer fall within an appropriate range within a range from the set value Gp to the variation upper limit Gmax with respect to the set gap Gp between the conductive layers.
  • the diameter (for example, if the particles 32 are flexible, the particle size is slightly larger than the upper limit Gmax).
  • the particle size r 2 of the second conductive particles 34 is within the range from the set value G p to the variation lower limit value G min, and the connection characteristics with the conductive layer are set. Is set within a proper range (for example, if the particles 34 are flexible, the particle size is slightly larger than the lower limit Gmin).
  • Non-conductive particles 42 are further mixed in the adhesive 36, and the particles 42 are used to improve the dispersibility of the conductive particles in the adhesive 36. For this reason, at least, equal to or less particle size r 3 of the sphere-shaped and the particle diameter r 2 of the second conductive particle 3 4, particles of cylindrical shape or filler shape is used.
  • the material of the non-conductive particles any non-conductive organic materials such as plastics, and inorganic materials such as glass and metal oxides can be used, and have sufficient strength and a certain degree of rigidity. I just want to. Note that when setting a large particle diameter r 3 than the set value G p, may have some degree of elasticity.
  • the conductive particles 32 and 34 for example, a non-conductive material similar to the non-conductive particles is used as the core material, and a conductive material such as metal is formed on the surface of the core material having a size corresponding to the target particle size.
  • a conductive material such as metal is formed on the surface of the core material having a size corresponding to the target particle size.
  • These are spherical, cylindrical, or filler-shaped particles formed by coating a conductive material.
  • the whole particles may be formed only from a conductive material.
  • the conductive particles only need to have sufficient strength and a certain degree of rigidity. Incidentally, it is preferable to certain elasticity or flexibility have in the case of larger particle size r 2 than the set value G p.
  • the adhesive 36 a material having good dispersibility of non-conductive particles and conductive particles and having good adhesive strength is preferable, and a material generally used as an adhesive, for example, a glass paste And the like, and an organic adhesive material such as an epoxy resin or a polyester resin can be used.
  • the mixing ratio of the two types of conductive particles having a particle size of rr 2 to the adhesive 36 is, for example, preferably equal to 0.1% by weight to 0.6% by weight, respectively.
  • the present invention is not limited to this, and may be set as appropriate (total mixing ratio of two types of conductive particles: 0.2% by weight to 1.2% by weight).
  • the mixing ratio of the non-conductive particles having a particle size of r 3 to the adhesive 36 is, for example, 0.5% by weight to 1.5% by weight.
  • the mixing ratio is not limited to these values, but, for example, the conductive particles must be mixed in an amount that is at least the minimum required to reliably connect one conductive layer to the other conductive layer. There is.
  • FIG. 2 is a plan configuration of a liquid crystal display device according to the present invention using the anisotropic conductive adhesive 30 as a substrate sealing material
  • FIG. 3 is an example of a cross-sectional configuration along line AA in FIG. Is shown.
  • the first and second substrates 10 and 20 are insulating substrates made of glass or the like, and a first electrode 12 made of ITO or the like is formed on the first substrate 10.
  • a second electrode 22 made of ITO or the like is formed in the central region on the second substrate 20 disposed to face the first electrode, and a first electrode lead terminal 24 made of a conductive layer, such as ITO, is formed around the substrate.
  • a second electrode lead terminal is formed. For example, a part of the plurality of lead terminals shown in FIG. 2 is the first electrode lead terminal 24.
  • the first substrate 10 and the second substrate 20 are attached near the periphery of the first substrate 10 using an anisotropic conductive adhesive 30 as a sealing material with a predetermined gap therebetween so that the liquid crystal 14 can be sealed between the substrates.
  • an anisotropic conductive adhesive 30 as a sealing material with a predetermined gap therebetween so that the liquid crystal 14 can be sealed between the substrates.
  • the first electrode 12 on the first substrate is drawn out to the peripheral edge of the substrate, and the corresponding first electrode facing the peripheral edge of the first substrate 10 with the anisotropic conductive adhesive 30 interposed therebetween.
  • the first electrode lead terminal 24 of the second substrate 20 is electrically connected to the first electrode lead terminal 24 by the anisotropic conductive adhesive 30.
  • liquid crystal 14 is sealed in the gap between the liquid crystal cells formed between the substrates. In the gap, together with the liquid crystal 14, non-conductive particles 16 having two kinds of particle diameters are mixed as a spacer in the cell.
  • non-conductive particles 42 and conductive particles 32 and 34 having two types of particle diameters n and r 2 are mixed in the adhesive 36.
  • the adhesive setting gap Gp of the sealing portion is set to 6 m in the above liquid crystal display device
  • the actual gap has a variation of about ⁇ 0.2 m ( ⁇ 3%) of the installation value.
  • the variation upper limit Gmax for the set value Gp is 6.2 / m
  • the variation lower limit Gmin is about 5.8 jum. Therefore, when bonding such an adhesive gap, for example, the first conductive particles 32 having a particle size 7 of about 7 m (about 1.167 times Gp) are used, and the second conductive particles 34 are used. Used have a particle size r 2 of about 6.5 m (about 1.083 times Gp).
  • the particle size r 3 is about 6.5 ⁇ 111 Use the first one.
  • the particle size i (1) Due to the presence of the conductive particles 32, the first electrode 12 and the lead terminal 24 thereof are reliably connected. Further, the adhesion position is Paratsuki lower limit Gmin, the presence of the second electrically conductive particles 3 4 having a particle size of r 2, the first electrode 1 2 and its lead terminals 2 4 are securely connected. Furthermore, at the position where the bonding gap is equal to the set value Gp, the first electrode 12 and its lead-out terminal 24 are securely connected by both the first conductive particles 32 and the second conductive particles 34. Is done.
  • the first particle size that provides good conduction characteristics in the adhesion setting gap Gp and the gap particle size upper limit Gmax are good. It is sufficient to use conductive particles having a second particle size that provides good conduction characteristics and a third particle size that provides good conduction characteristics with respect to the gap variation lower limit Gmin. Further, in the above example, the particle size of each of the conductive particles 32, 34 and the non-conductive particles 42 is set to be larger than the adhesion setting gap G p, and as shown in FIG. , 34 and the non-conductive particles 42 are present in the gap between the bonding portions in a slightly crushed state.
  • the conductive layers (electrodes 12 and terminals 24) sandwiching the anisotropic conductive adhesive 30 and the substrates 10 and 20 often have flexibility, respectively, and these particles 32, 34, It is possible that 42 is present in the gap between the bonded portions without deformation.
  • the liquid crystal display device is manufactured through, for example, the following steps. First, necessary elements, electrodes, liquid crystal alignment layers, etc. are formed on the first and second substrates, respectively. Next, a sealant for sealing liquid crystal on the first substrate 10 is used. An anisotropic conductive adhesive 30 is disposed by a screen printing method or the like in order to obtain conduction of the electrodes between the upper and lower substrates (see FIG. 2). On the second substrate 20, a spacer 16 for the cell portion is sprayed in a region to be a liquid crystal cell portion. Thereafter, the first substrate 10 is superimposed on the second substrate 20 and heated while applying pressure from the outside of both substrates to cure the anisotropic conductive adhesive 30.
  • this pressurizing and heating step for example, first, 120 ° C. to 160 ° C. is applied while applying a pressure of 0.2 kg / cm 2 kg / cm between the first and second substrates. Bake in a heating atmosphere of C, stop applying pressure, and then heat in the same heating atmosphere. to continue.
  • the adhesive 36 is extruded from the bonding gap, and the particles 32, 34, and 42 also move, but the conductive particles 32, 34 and the non-conductive particles 42 remain, and in this state, the adhesive 36 hardens. For this reason, the two substrates are bonded with an interval separated by a distance corresponding to the particle size of the conductive particles. Interval.
  • the method of bonding between the substrates using the anisotropic conductive adhesive 30 is not limited to such pressure baking.
  • the adhesive 36 when an ultraviolet curable resin is used as the adhesive 36, the superposed first and second substrates are pressed from the outside of the substrate and irradiated with a violet ray K to cure the adhesive 36. .
  • the above contents are black and white display devices, but other color display devices, reflective display devices, TN (twisted nematic) liquid crystal display devices, STN (super twisted nematic) liquid crystal display devices, ferroelectric liquid crystal display devices, and polymers
  • TN twisted nematic liquid crystal display devices
  • STN super twisted nematic liquid crystal display devices
  • ferroelectric liquid crystal display devices and polymers
  • the present invention can be applied to all liquid crystal display devices and the like, and the same effects can be obtained.
  • the anisotropic conductive adhesive 30 of the present invention is used for bonding between substrates of a liquid crystal display device or the like.
  • the adhesive material can be used for all purposes of connecting conductive layers arranged opposite to each other.
  • FIG. 5 when mounting the IC 50 on the substrate 60, the IC terminals 52 formed on the lower surface side of the IC and the electrode terminals 62 on the substrate surface are connected. It is necessary to use the anisotropic conductive adhesive of the present invention for bonding the terminals, and the same effect as described above can be obtained. Due to the undulation of IC 50 and mounting board 60, I The surface of the C terminal 52 and the bonding surface of the electrode terminal 62 are not necessarily flat, and the mounting gap may vary during mounting.
  • an anisotropic conductive adhesive 30 in which at least two types of conductive particles 32 and 34 are mixed together with the non-conductive particles 42 in the adhesive 36 is used.
  • the adhesive setting gap between the terminals is Gp
  • the conductive particles 32 a particle diameter that provides connectivity within an appropriate range with respect to the gap variation upper limit Gmax is used, and the conductive particles 34 are used.
  • the anisotropic conductive adhesive of the present invention By using the anisotropic conductive adhesive of the present invention also in the connection between the IC terminal 52 and the terminal 62 on the mounting board, the terminals are securely connected and the contact resistance between the terminals is increased. Can be prevented.
  • a liquid crystal driving IC may be mounted on the second substrate 20 and the IC terminal may be connected to the lead terminal on the substrate. If this anisotropic conductive adhesive 30 is used for bonding, the lead terminal and the liquid crystal driving IC can be securely connected.
  • the anisotropic conductive adhesive 30 can also be used for connecting a flexible printed board (FPC) to another board. Unlike a glass substrate or the like, an FPC substrate is flexible and its bonding surface often does not become flat. However, if the anisotropic conductive adhesive 30 of the present invention is used, the variation in the bonding gap is absorbed. Electrical connection between the conductive layer of the FPC substrate and the conductive layer of another substrate can be made more reliably.
  • FPC flexible printed board
  • the electrical connection structure of the present invention can be used for a liquid crystal display device and the like.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

On forme sur les faces opposées de deux substrats (10, 20) des couches conductrices constituant chacune une électrode et des bornes. Lorsqu'on colle l'un à l'autre les substrats à l'aide d'un matériau adhésif conducteur anisotrope, l'électrode (12) du premier substrat (10) et une première borne (24) du deuxième substrat sont reliées électriquement mais séparées par un intervalle prédéfini. Le matériau adhésif conducteur anisotrope comprend, mélangées à un adhésif (36), des particules non conductrices, des particules conductrices (32) d'une taille de grains η1 permettant à la persistance de se maintenir dans une plage correcte par rapport à la limite supérieure Gmax des variations de l'intervalle Gp de fixation de la liaison, et des particules conductrices (34) d'une taille de grains η2 permettant à la persistance de se maintenir dans une plage correcte par rapport à la limite inférieure Gmin des variations de l'intervalle Gp de fixation de la liaison, ce qui assure positivement une conduction électrique en dépit des variations de l'intervalle entre les substrats à coller ensemble.
PCT/JP2000/003518 1999-05-31 2000-05-31 Structure de connexions electriques et ecran plat WO2000074023A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11/152365 1999-05-31
JP15236599 1999-05-31

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WO2000074023A8 WO2000074023A8 (fr) 2001-03-01

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EP1666959A1 (fr) * 2004-12-02 2006-06-07 Sony Corporation Connection électrique dans une cellule à cristaux liquides utilisant des particules conductrices à déformation élastique
WO2006080839A2 (fr) * 2005-01-25 2006-08-03 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Dispositif electronique comprenant un composant electronique et des elements d'encapsulation
JP2013110404A (ja) * 2011-10-26 2013-06-06 Hitachi Chemical Co Ltd 回路部品及びその製造方法
JP2015130426A (ja) * 2014-01-08 2015-07-16 デクセリアルズ株式会社 接続方法、及び接合体

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CN101561591B (zh) * 2008-04-17 2012-02-29 北京京东方光电科技有限公司 封框胶涂覆固化方法、封框胶和液晶面板
CN102243399A (zh) * 2011-07-11 2011-11-16 深圳市华星光电技术有限公司 液晶显示器框胶制造方法及液晶显示器
CN105741917B (zh) * 2016-03-11 2019-03-08 联想(北京)有限公司 一种导电胶膜及电子设备
CN108822760B (zh) * 2018-05-30 2021-02-02 业成科技（成都）有限公司 异方性导电胶以及利用异方性导电胶接合的基板结构

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DE10232636A1 (de) * 2002-07-18 2004-02-12 Delo Industrieklebstoffe Gmbh & Co. Kg Verfahren und Klebstoff zur Flip-Chip-Kontaktierung
EP1666959A1 (fr) * 2004-12-02 2006-06-07 Sony Corporation Connection électrique dans une cellule à cristaux liquides utilisant des particules conductrices à déformation élastique
WO2006080839A2 (fr) * 2005-01-25 2006-08-03 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Dispositif electronique comprenant un composant electronique et des elements d'encapsulation
WO2006080839A3 (fr) * 2005-01-25 2006-12-28 Tno Dispositif electronique comprenant un composant electronique et des elements d'encapsulation
JP2013110404A (ja) * 2011-10-26 2013-06-06 Hitachi Chemical Co Ltd 回路部品及びその製造方法
JP2015130426A (ja) * 2014-01-08 2015-07-16 デクセリアルズ株式会社 接続方法、及び接合体

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