WO2000072351A1 - Method of producing gas discharge panel - Google Patents

Abstract

A method of producing a gas discharge panel capable of an efficient exhausting in the exhaust process. In a vacuum pumping process, with an open/close valve (53f) opened to a suitable degree while heating (baking) a heating furnace (51) to a temperature (exhaust baking temperature) lower than the softening temperature of a sealant layer, a turbo-molecular pump (53b) and a rotary pump (53c) are actuated to evacuate an envelope (40) until a vacuum is created, whereupon a discharge gas is introduced from a gas introducing system (52) into the envelope (40) until a predetermined pressure (for example, 0.05 MPa) is produced therein. Thereafter, the discharge gas introduction from the gas introducing system (52) is stopped, and the discharge gas in the envelope is sucked out through a suction exhaust system (53), thereby re-establishing a vacuum state in the envelope (40).

Description

 Akira Itoda Manufacturing method of gas discharge panel

 The present invention relates to a method for manufacturing a gas discharge panel such as a plasma display panel used for displaying images on a computer monitor and a television. Background art

 Hereinafter, a conventional plasma display panel will be described with reference to the drawings. FIG. 8 is a cross-sectional view schematically showing an AC-type (AC-type) plasma display panel (hereinafter, referred to as “PDP”).

 In FIG. 8, reference numeral 110 denotes a front glass substrate, and discharge electrodes 111 are formed on the front glass substrate 110. Further, the discharge electrode 111 is covered with a dielectric glass layer 112 and a dielectric protective layer 113 made of magnesium oxide (Mg〇) (see, for example, Japanese Patent Application Laid-Open No. 5-349291).

 Reference numeral 120 denotes a rear glass substrate. On the rear glass substrate 120, an address electrode 121, a visible light reflecting layer 122, a partition wall 123, and a phosphor layer 124 that cover the address electrode 122 are provided. 130 is a discharge space for filling a discharge gas. In the phosphor layer, three color phosphor layers of red, green, and blue are sequentially arranged for color display. Each of the above-mentioned phosphor layers 124 emits and emits light by ultraviolet rays having a short wavelength (eg, a wavelength of 147 nm) generated by discharge.

 The following materials are generally used as the phosphor constituting the phosphor layer 124.

"Blue phosphor" B a Mg A 1 ₁₀ O ₁₇ : Eu

"Green phosphor" _{Z n 2 S i 0 4:} Mn or _{B a A 1 12 O 19:} Mn

"Red phosphor" Y ₂ O _3: E u or _{(Y x Gd 1-x)} BO 3: E u

 Each color phosphor can be produced as follows.

Blue phosphor _{(B aMg A 1 1 ()} 0 17: E u) , first, carbonate Bariumu (B a C_〇 ₃₎ Magnesium carbonate (Mg CO ₃ ) and aluminum oxide (a—Al ₂ 〇 ₃ ) are blended so that the atomic ratio of Ba, Mg, and A 1 is 1: 1: 1: 10.

Then added a predetermined amount of europium oxide (E u ₂ 0 ₃₎ with respect to the mixture. Then, mixed with an appropriate amount of a flux _{(A 1 F 2. B a} C 1 2) with a ball mill, 1 400 ° C~ 1 650 ° C for a predetermined time (e.g., 0.5 hours), a reducing atmosphere (H ₂ walking is obtained by firing in N _2).

Red phosphor _{(Y 2 0 3: E u} ) , the hydroxide as the raw material I Tsu preparative potassium Υ ₂ (ΟΗ) ₃ and the boron acid (H ₃ B0 ₃₎ and Upsilon, so that the atomic ratio of 1: 1 of Β To mix. Then adding a predetermined amount of europium oxide with respect to the mixture (E u ₂ 0 _3), was mixed with ball mill together with a suitable amount of flux, 1 200 ° C~ 1 450 ° C for a predetermined time in the air (e.g. 1 hour) Obtained by firing.

Green phosphor _{(Z n 2 S i O 4} : Mn) is as a raw material of zinc oxide (Z n 0), so that the oxide silicofluoride-containing (S i 0 ₂₎ Z n, the atomic ratio of 2: 1 of S i To mix. Next, a predetermined amount of manganese oxide (Mn ₂ O ₃ ) is added to the mixture, mixed with a pole mill, and calcined in air at 1200 to 1350 ° C for a predetermined time (for example, 0.5 hour). can get. The phosphor particles having the predetermined particle size distribution can be obtained by pulverizing and sieving the phosphor particles produced by the above method.

 Hereinafter, a conventional PDP manufacturing method will be described.

 First, a discharge electrode is formed on a front glass substrate, a dielectric layer made of dielectric glass is formed so as to cover the discharge electrode, and a protective layer made of MgO is formed on the dielectric layer. Next, an address electrode is formed on the back glass substrate, and a visible light reflecting layer made of a dielectric glass and a glass partition are formed thereon at a predetermined pitch.

 The phosphor layers are formed by disposing the phosphor pastes of the respective colors including the red phosphor, the green phosphor, and the blue phosphor prepared as described above in the spaces sandwiched by these partition walls. After the formation, the phosphor layer is fired at about 500 ° C to remove resin components and the like in the paste (a phosphor firing step).

After firing the phosphor, apply a glass frit for sealing to the front glass substrate around the back glass substrate, and calcine at about 350 ° C to remove resin components etc. in the glass frit (sealing glass) Calcination process). Thereafter, a front glass substrate on which a discharge electrode, a dielectric glass layer, and a protective layer are sequentially formed, and the rear glass substrate are arranged so as to be opposed to each other so that the display electrode and the address electrode are orthogonal to each other with a partition wall interposed therebetween. Baking is performed to a degree, and the surroundings are sealed with sealing glass (sealing process).

 After that, the inside of the panel is evacuated while heating to a predetermined temperature (about 350 ° C) (evacuation step), and after completion, discharge gas is introduced at a predetermined pressure.

 In the conventional method of manufacturing a plasma display panel as described above, there is a problem that the light emission characteristics gradually deteriorate in an aging process for stabilizing the light emission characteristics and discharge characteristics after panel production and during normal operation. .

 This is because the impurities (gas components having a composition different from that of the discharge gas such as water vapor, oxygen, nitrogen, and carbon dioxide) in the internal space are not sufficiently cleaned in the evacuation process and remain in the internal space. Because it is.

Disclosure of the invention

 The present invention has been made in view of the above problems, and has as its object to provide a method of manufacturing a gas discharge panel that can efficiently exhaust gas in an exhaust process required for a panel manufacturing process.

 In order to achieve such an object, an envelope is formed by arranging a second substrate so as to face a partition-side surface of a first substrate having a main surface on which a partition separating light-emitting cells is formed, thereby forming an envelope. A forming step, a sealing step of sealing the outer peripheral portions of both substrates in the envelope with a sealing material, an exhausting step of exhausting gas inside the envelope, A method for manufacturing a gas discharge panel comprising: a filling step of filling a discharge gas, wherein the exhausting step comprises: a sub-step of evacuating the inside of the envelope; and It is characterized by including a sub-step of filling with a cleaning gas containing a gas that does not become an impurity as a substantial component, and thereafter, a sub-step of evacuating the inside of the envelope.

An envelope forming step of forming an envelope by disposing a second substrate on the partition-side surface of the first substrate having a main surface on which a partition for separating the light emitting cells is formed; A sealing step for sealing the outer peripheral portions of both substrates in the enclosure with a sealing material A method for manufacturing a gas discharge panel, comprising: an exhausting step of exhausting gas inside the envelope; and an enclosing step of enclosing a discharge gas inside the envelope, wherein the exhausting step comprises: A sub-step of evacuating the interior of the envelope, and then evacuating the interior of the envelope while circulating a cleaning gas substantially containing a gas that does not become an impurity in the discharge gas through the interior of the envelope. It is characterized by including sub-steps. In addition, “substantially” means that “the main component of the cleaning gas does not become an impurity with respect to the discharge gas”. Therefore, this does not mean that “the gas contained as an impurity (usually extremely low concentration) in the main component gas from the beginning” is not excluded.

 According to these manufacturing methods, not only the inside of the envelope is simply evacuated as in the related art, but also the rinsing gas is exhausted after being filled or circulated as described above. Compared with the manufacturing method, it is possible to quickly (shortly) reduce the impurity gas concentration in the envelope to a low concentration.

 In the above manufacturing method, the sealing step may include heating the entire envelope or the sealing portion at a temperature equal to or higher than the softening point or the melting point of the sealing material, and setting the pressure inside the envelope to be lower than the external pressure. If the sealing is performed by lowering the sealing material, the sealing material is cured and sealed in a state where both substrates are uniformly pressed from the outside by the pressure difference between the inside and outside, so that the top of the partition The sealing is performed in a state where there is almost no gap between the substrate and the opposing substrate. Conventionally, the outer peripheral part is simply clamped with a clip or the like without providing a pressure difference between the inner and outer parts of the envelope.Therefore, the center part of the envelope is not pressed, so the top of the partition and the substrate facing it Were easily or completely sealed apart.

 Therefore, according to such a manufacturing method, it is possible to easily manufacture a PDP which is less likely to generate vibration during PDP driving and has good display quality.

 Further, in the above-mentioned manufacturing method, if the sealing step is performed in a state where the inside of the envelope is filled with a dry gas, thermal degradation of the phosphor can be suppressed. BRIEF DESCRIPTION OF THE FIGURES

 FIG. 1 is a perspective view showing a configuration of an AC plasma display panel (PDP) common to the embodiments according to the present invention.

FIG. 2 is a configuration diagram of a display device in which a circuit block is mounted on the PDP. FIG. 3 is a diagram schematically showing a sealing / exhausting device 50 used in the sealing step of the present embodiment, where (a) is a top cutaway view, and (b) is an A in FIG. FIG. 4 is a vertical sectional view including a line A ′.

 FIG. 4 is a diagram showing a temperature and pressure profile at the time of sealing (Example).

Figure 5: Temperature and pressure profiles in the evacuation process and the encapsulation process (Example)

 Figure 6: Temperature and pressure profiles during sealing and during evacuation and encapsulation processes (Example).

 FIG. 7 is a view schematically showing a sealing / exhausting device 70 used in a sealing step according to another embodiment of the present invention.

 FIG. 8 is a perspective view showing a configuration of a PDP common to the embodiments according to the conventional example. BEST MODE FOR CARRYING OUT THE INVENTION

 Hereinafter, a method for manufacturing a plasma display panel according to the present invention will be specifically described with reference to the drawings.

 [Overall configuration and manufacturing method of PDP]

 FIG. 1 is a perspective view showing an AC surface discharge type PDP according to an embodiment, and FIG. 2 is a configuration diagram of a display device in which a circuit block is mounted on the PDP.

 This PDP generates a discharge in the discharge space by applying a pulsed voltage to each electrode, and transmits visible light of each color generated on the rear panel side from the main surface of the front panel due to the discharge. is there.

 The PDP has a front glass substrate 11 on which a plurality of discharge electrodes 12 (scanning electrodes 12 a and sustain electrodes 12 b), a dielectric layer 13, and a protective layer 14 are disposed. Panel 10 and rear panel 20 having a plurality of address electrodes 22 and dielectric layers 23 on rear glass substrate 21 are composed of electrodes 12 a, 12 b and address electrodes 22. Are arranged in parallel with each other at an interval in a state where they face each other.

The central part of the PDP is an area for displaying an image. Here, the gap between the front panel 10 and the rear panel 20 is divided into a plurality of stripe-shaped partition walls 24. 0 is formed, and the discharge space 30 is filled with a discharge gas. In the discharge space 30, a plurality of fluorescent light A body layer 25 is provided. The phosphor layer 25 is repeatedly arranged in the order of red, green and blue.

 The discharge electrode 12 and the address electrode 22 are both striped, and the discharge electrode 12 is arranged in a direction orthogonal to the partition wall 24 and the address electrode 22 is arranged in parallel with the partition wall 24. .

 The panel structure is such that cells emitting red, green, and blue colors are formed where the discharge electrode 12 and the address electrode 22 intersect.

 The dielectric layer 13 is a layer made of a dielectric material disposed over the entire surface of the front glass substrate 11 on which the discharge electrodes 12 are disposed, and is generally made of a lead-based low-melting glass. Although it is used as a material, it may be formed of bismuth-based low-melting glass or a laminate of lead-based low-melting glass and bismuth-based low-melting glass.

The protective layer 14 is a thin layer made of magnesium oxide (Mg〇) and covers the entire surface of the dielectric layer 13. The dielectric layer 23 is mixed with TiO ₂ particles so as to also serve as a visible light reflecting layer. The partition wall 24 is made of a glass material, and protrudes from the surface of the dielectric layer 23 of the back panel 20.

 On the other hand, on the outer peripheral portion of the PDP, the front panel 10 and the rear panel 20 are sealed with a sealing material.

 The top of the partition wall 24 and the front panel 10 are almost in contact with each other or are joined by a joining material.

 An example of a method for producing such a PDP will be described below.

 Fabrication of the front panel;

 A discharge electrode 12 is formed on a front glass substrate 11, a dielectric layer 13 is formed so as to cover the discharge electrode 12, and a vacuum evaporation method, an electron beam evaporation method, Alternatively, it is manufactured by forming a protective layer 14 made of magnesium oxide (Mg〇) by a CVD method.

The discharge electrode 12 can be formed by applying a paste for a silver electrode by screen printing and then firing. In addition, ITO (Lee indium 'Tin' Okisai de) and after forming the transparent electrode in S n 0 _2, or to form a silver electrode as described above thereon, C at the Photo lithographic one method r- A Cu—Cr electrode may be formed. The dielectric layer 1 3, the glass material (the composition of the lead-based, for example, lead oxide [P b O] 70 wt%. Boron oxide [B ₂ 0 _3] 1 5 wt%. Silicon oxide [S I_〇 ₂ ] 15% by weight) is applied by screen printing and baked.

 Fabrication of rear panel:

 An address electrode 22 is formed on the rear glass substrate 21 by using a screen printing method in the same manner as the discharge electrode 12.

Next, a dielectric layer 23 by applying and baking by a screen printing method of a glass material T i 〇 ₂ particles are mixed.

 Next, the partition 24 is formed. The partition walls 24 can be formed by applying a glass paste for partition walls repeatedly by a screen printing method, followed by baking. Alternatively, the partition wall 24 can also be formed by applying a method of applying a glass paste for the partition wall to the entire surface of the rear glass substrate 21 and then shaving off a portion where the partition wall is not formed by a sand-plasting method. .

 Then, the phosphor layer 25 is formed in the groove between the partition walls 24. The phosphor layer 25 is generally formed by applying and burning a phosphor paste containing phosphor particles of each color by a screen printing method, and continuously ejects a phosphor ink from a nozzle. However, it can also be formed by applying by a method of scanning along the groove, and baking to remove the solvent and binder contained in the phosphor ink after the application. In this phosphor ink, phosphor particles of each color are dispersed in a mixture of a binder, a solvent, a dispersant, and the like, and are adjusted to an appropriate viscosity.

 Specific examples of the phosphor particles include:

Blue _{phosphor: B aMgA 1 1 () O} 17: E u 2+

Green phosphor: B a A 1 ₁₂ 〇 ₁₉ : Mn or Zn ₂ S i 〇 ₄ : Mn

Red phosphor: (Y _X G (1 preparative _x) B_〇 _3: E u ³⁺ or YB0 _3: E u ³⁺

 Can be mentioned.

In the present embodiment, the height of the partition walls is set to 0.06 to 0.15 mm and the pitch of the partition walls is set to 0.13 to 0.36 mm in accordance with a 40-inch class VGA or high-definition television. Sealing process · Evacuation process · Discharge gas filling process:

 Next, the front panel 10 and the rear panel 20 thus manufactured are sealed. In this sealing step, the front panel 10 and the rear panel 20 are overlapped with each other with a sealing material interposed therebetween in the outer peripheral portion to form an envelope, and sealing is performed with the sealing material. At this time, if necessary, a bonding material may be applied to the top of the partition wall 24 of the rear panel 20.

 As a sealing material, a material that is softened by externally applying energy such as heat, ordinarily a low-melting glass is used, and the sealing material is heated to be softened and then cured. To wear.

 Then, when performing the sealing step, by forming a pressure difference between the inside and the outside of the envelope, both panels 10 and 20 are uniformly pressed from the outside. Thereby, sealing is performed in a state where the top of the partition wall 24 and the front panel 10 are entirely in contact with or close to each other.

 After the sealing process is completed, the internal space is evacuated to a high vacuum (for example, 1.3 X 10— “MPa) in order to drive out the impurity gas and the like adsorbed inside the envelope. Vacuum exhaust process).

 Thereafter, a discharge gas (for example, He-Xe system, Ne-Xe system, or Ar-Xe system inert gas) is sealed at a predetermined pressure inside the envelope (discharge gas filling process). In this way, a PDP is produced.

 In this embodiment, the content of Xe in the discharge gas is set to about 5% by volume, and the filling pressure is set in the range of 0.067 to 0.11 MPa.

 When driving and displaying a PDP, a circuit block is mounted as shown in Fig. 2 to drive.

 Hereinafter, the sealing step, the evacuation step, and the discharge gas filling step will be described in detail for each of Embodiments 1 to 4.

 <First Embodiment>

FIGS. 3A and 3B are diagrams schematically showing the sealing / exhausting device 50 used in the sealing step of the present embodiment, wherein FIG. 3A is a top cutaway view, and FIG. FIG. 4 is a vertical sectional view including a line A ′. The sealing / exhaust device 50 includes a heating furnace 51 for housing and heating an envelope 40 on which the front panel 10 and the rear panel 20 are superimposed, and an outside of the heating furnace 51. The system consists of a gas introduction system 52 and a suction / exhaust system 53 provided.

 The heating furnace 51 can be heated by a heater 54, and the internal temperature can be controlled to a desired set temperature.

 Using this sealing / exhausting device 50, a sealing process is performed as follows.

 As shown in FIG. 3, the rear panel 20 is provided with ventilation holes 21a and 21b on the outer peripheral portion outside the display area in advance. The air hole 21 a is formed at the upper right of the rear panel 20, and the air hole 21 b is formed at the lower left of the rear panel 20.

 A paste containing a sealing material is applied to the outer peripheral portion of one or both of the facing surfaces of the front panel 10 and the rear panel 20 and fired to form a sealing material layer 41. Here, a low-melting glass having a softening temperature lower than that of the material of the partition wall 24 and the dielectric layer 23 is used as the sealing material. Needless to say, the sealing material is not limited to this low-melting glass, but a metal or the like can also be used. In this case, the sealing temperature is a temperature at which the metal is melted, that is, a temperature equal to or higher than the melting point.

 Specific examples of the low-melting glass paste include a mixture of 80 parts of a low-melting glass frit (softening point: 370 ° C), 5 parts of an ethylcellulose binder, and 15 parts of isoamyl acetate. By applying this with a dispenser, the sealing material layer 41 can be formed.

 Between the partition walls located at both ends and the sealing material layer 41, a separating material 42 for dividing the space formed therebetween into two is provided. The same material as the sealing material layer 41 and the partition wall can be used for the separation material 42. Due to the presence of the separating material, gas is efficiently introduced and discharged in the discharge space formed between the partition walls. Note that the separation member 42 need not be provided.

 Next, the front panel 10 and the rear panel 20 are overlapped while being positioned to form an envelope 40. Then, the outer peripheral portion of the envelope 40 is tightened and fixed with a clip (not shown) so that the aligned front panel 10 and rear panel 20 do not shift.

The envelope 40 is set in the heating furnace 51. And the vents of the enclosure 40 2 1a is connected to the gas introduction system 52 via the connection pipe 55. On the other hand, a suction / exhaust system 53 is connected to the ventilation hole 21 b of the envelope 40 via a connection pipe 56.

 The connection pipe 55 and the connection pipe 56 are glass tubes fixed to the lower surface of the rear panel 20 via adhesives 55a and 56a. For the adhesives 55a and 56a, for example, the same material as the material of the sealing material layer 41 is used, and a paste containing a low-melting glass is applied and dried with a dispenser, and clicked. And temporarily fix them together. As a result, as the sealing material layer 41 is softened and hardened and the envelope 40 is sealed, the adhesive materials 55 a and 56 a are also softened and hardened, thereby forming the connection pipe 5. The connection and airtight sealing between the air holes 21a and the air holes 21b of the rear panel 20 and the connection pipe 56 and the connection pipe 56 are automatically performed.

 The gas introduction system 52 includes a gas cylinder 52 a filled with a discharge gas and a piping system 52 b connecting the gas cylinder 52 a to the connection pipe 55. An on-off valve 52c for adjusting the gas introduction amount is provided in the middle of the piping system 52b. The connection pipe 55 and the piping system 52b are connected to each other in a state where airtightness is secured by a check or the like. The suction / exhaust system 53 includes a manifold 53a, a turbo molecular pump 53b, an outlet pump 53c, and a connection connecting the connection pipe 56 and the manifold 53a. A pipe system 53d and a piping system 53e connecting the manifold 53a and the turbo-molecular pump 53b. An opening / closing valve 53 f for adjusting the suction amount of the turbo molecular pump is provided in the middle of the piping system 53 e. The connecting pipe 56 and the piping system 53d are connected to each other in a state where airtightness is secured by a check or the like. In the present embodiment, the front panel 10 is set so as to be on the upper side, and the rear panel 20 is set so as to be on the lower side. However, it may be set upside down. If both panels 10 and 20 are fixed so as not to be displaced, the envelope 40 may be set up in the heating furnace.

Then, the inside of the heating furnace 51 is heated to a sealing temperature slightly higher than the softening temperature of the sealing material (for example, 450 ° C.), kept at the sealing temperature for a predetermined time, and then again. The temperature between the panels 10 and 20 is sealed by lowering the temperature below the softening point, but sealing is performed while exhausting the inside of the envelope 40 with the turbo molecular pump 53b. When the turbo molecular pump 53b is operated, the rotary pump 53c is simultaneously operated and the turbo molecular pump 53b is operated. -Bo molecular pump 5 Reduce back pressure in 3b. The sealing conditions are determined by the compatibility between the glass substrate material and the sealing material. When low-melting glass is used, the temperature is about 450 ° C. for about 10 to 20 minutes.

It is desirable that the evacuation be started after the inside of the heating furnace 51 reaches the softening temperature of the sealing material. Until the temperature reaches the softening temperature of the sealing material, the outer periphery between the panels 10 and 20 is not very airtight. However, after the sealing material softens, the outer periphery between the panels 10 and 20 is hermetically sealed, and the adhesive layer 26 is also softened so that the piping member 26 and the vent hole 2 are softened. since also the connecting portion between the 1 a is hermetically sealed, since the pressure is reduced in the evacuated from within the envelope 4 0 high vacuum (1. 3 3 X 1 0- 4 MP a degree (about several T orr)) It is.

 By exhausting air from the internal space of the envelope 40 in this manner, the panels 10-20 are uniformly pressed from the outside. In the suction and exhaust system 53, the sealing material is pressed and shrunk by the difference between the pressure in the envelope 40 and the pressure in the heating furnace, and the two front and rear panels are separated. Sufficient suction and exhaust (for example, about 0.08 MPa) is enough, as long as it is close enough to allow the front panel and partition to come into contact.

 When both panels 10 and 20 are uniformly pressed from the outside, as shown in Fig. 3, the top of the partition wall on the rear panel 20 and the front panel 10 are in close contact with each other as a whole. . When the temperature is lowered in this state, the temperature of the sealing material becomes lower than the softening temperature and the sealing material is hardened, whereby the envelope 40 is sealed. Therefore, in the envelope 40 after the sealing, the top of the partition wall and the front panel 10 are kept in close contact with each other as a whole.

 In the sealing step, the temperature is not increased at a stretch to a sealing temperature slightly higher than the softening temperature of the sealing material, but at a temperature lower than the sealing temperature for a certain time, for example, about 350 ° C. Burning the binder material by heating for about 30 minutes is effective in suppressing deterioration of the phosphor.

After the sealing of the envelope 40 is completed in this manner, the process proceeds to the next evacuation step. In the evacuation process, the temperature in the heating furnace 51 is set to a temperature lower than the softening point of the sealing material layer (exhaust temperature). While heating (baking) at the heating temperature (baking temperature), the turbo molecular pump 53 b and the rotary pump 53 c are operated while the opening / closing valve 53 f is appropriately opened, and the inside of the envelope 40 is heated. The gas is suctioned to a vacuum state, and then a discharge gas is introduced from the gas introduction system 52 into the envelope 40 at a predetermined pressure (for example, 0.05 MPa). It is more desirable to maintain the pressure for the specified time (5 to 10 minutes) after charging the discharge gas. This is because it takes time to reach the equilibrium pressure because the conductance between the partitions in the envelope 40 is small.

 By performing the evacuation process while heating to the evacuation baking temperature as described above, the impurities adsorbed on the inner wall surface of the envelope 40 become gaseous and fill the discharge space. It is preferable because impurities can be expelled out of the envelope more easily. Generally, the vacuum evacuation is performed while heating to the exhaust baking temperature as described above. However, it is possible to simply evacuate.

 The exhaust baking temperature is, of course, lower than the softening point of the sealing material (or lower than the melting point of the metal when a metal is used as the sealing material). Here, the temperature is set to a temperature (for example, about 350 ° C.) at which the adsorbed water adsorbed on the inner wall surface of the envelope 40 is effectively desorbed.

 The evacuation process can be started after the temperature of the envelope 40 has been cooled down to about room temperature.However, the process should be started when the sealing temperature in the sealing process is cooled to the exhaust baking temperature. If this is done, a heating period for heating to the exhaust baking temperature again after cooling can be omitted, which is desirable in further shortening the manufacturing process.

 Then, the introduction of the discharge gas from the gas introduction system 52 is stopped, the discharge gas in the envelope is sucked and discharged from the suction / exhaust system 53, and the inside of the envelope 40 is again brought into a vacuum state. Such a process of evacuation, discharge gas introduction, and evacuation is usually sufficient even once, but if repeated, the impurity gas in the envelope 40 can be made lower in concentration.

As described above, the gas introduced into the envelope 40 is not limited to the discharge gas, and may be any gas that does not become an impurity with respect to the discharge gas. The definition of an impurity is not clear, but refers to a gas that causes a reduction in brightness. In addition, it is more preferable that the gas be a dry gas, since the deterioration of the characteristics of the phosphor can be suppressed. Where dry gas and Is a gas whose vapor partial pressure is lower than that of ordinary gas, for example, a gas whose vapor partial pressure (dew point) is less than 0.027 MPa (22 ° C).

Once the vacuum was applied, pressure is introduced into the envelope 4 inside 0, if ^{1. 3 3 x 1 0- 4} MP a extent from (the number T orr) within the pressure enclosure 4 0 does not destroy Good, preferably below atmospheric pressure.

 Next, in the filling step, a discharge gas is supplied to the internal space of the envelope 40 by the gas introduction system 52 so as to have a predetermined filling pressure (for example, 0.067 MPa). Then, the ventilation holes 21 a and 21 b are sealed by melting (chip-off) the root portions of the connection pipe 55 and the connection pipe 56 with a wrench or heater.

 [Effects of the manufacturing method of the present embodiment]

 When the outer periphery is tightened with a clip or the like without providing a pressure difference between the inside and outside of the envelope 40 as in the conventional case, the central part of the envelope 40 is not pressed, so that the top of the bulkhead on the rear panel 20 is not pressed. While the front panel 10 is easily or completely sealed away from the front panel 10, as described above, the envelope 40 is separated by the pressure difference between the inside and the outside. The sealing material layer 41 is hardened and sealed in a state where the sealing material layer 41 is uniformly pressed from the outside, so that the sealing is performed in a state where there is almost no gap between the top of the partition wall and the front panel 10.

 Therefore, according to the manufacturing method of the present embodiment, it is possible to easily manufacture a PDP with less vibration during PDP driving and good display quality.

 In order to obtain such an effect, at least at the time when the softened sealing material layer 41 is hardened, the suction / exhaust system is operated so that a pressure difference between the inside and outside of the envelope 40 is generated. Although necessary, it is not necessary to operate the suction and exhaust system 53 continuously from the beginning to the end of the sealing process. For example, even if the operation of the suction / discharge system 53 is started after the sealing material layer 41 is softened, the effect due to the internal / external pressure difference between the panels 10 and 20 can be sufficiently obtained.

 In addition, the above-described evacuation step makes it possible to quickly (shortly) remove the impurity gas concentration in the envelope 40 to a low concentration.

This is due to 1) the effect of diluting the impurity gas by filling a large amount of discharge gas, 2) the effect of discharging the residual impurity gas out of the envelope 40 by viscous flow during gas filling and re-evacuation, 3) Discharge gas molecules that have become hot due to heating during exhaust baking collide with the inner wall surface of the envelope 40, such as the phosphor and the protective layer, to release the adsorbed gas. Conceivable. For the third reason, it can be said that it is desirable to use a preheated discharge gas (cleaning gas) to be introduced into the envelope during the exhaust process.

After the inside of the envelope 40 is evacuated while maintaining the exhaust baking temperature, the residual gas in the discharge space surrounded by the partition walls in the envelope 40 is not sufficiently removed. For example, the height of the partition wall in the envelope 40 is 120 μm, the pitch is 200, the diameter of the processing hole for exhaust is about 2 mm, the inner diameter of the connecting pipe 57 is about 2 mm, and the connection Assuming that the length of the pipe 57 is about 9 Omm, exhausting at an exhaust baking temperature of 350 ° C results in a pressure in the manifold 53 a of 1.3 X 1 The pressure in the envelope 40 is about one to two orders of magnitude higher than 0— ^u to ^1.3 × 10— ^lfl MPa.

 Of course, if the baking time is lengthened, the amount of impurity gas such as water, carbon dioxide, nitrogen, and oxygen adsorbed on the inner wall of the envelope 40 is reduced, but the manufacturing cost is increased.

 In the above-described evacuation step, the discharge gas is sealed, and then the evacuation is performed again. However, the impurity gas can be removed more quickly as follows.

 In other words, the discharge gas is introduced into the envelope 40 by the gas introduction system 52, and at the same time, the interior of the envelope 40 is exhausted by the suction / exhaust system 53. Is indicated by a thick arrow.) By doing so, the flow of the discharge gas is generated in the envelope 40, so that the impurity gas can be discharged more efficiently. In particular, the exhaust port is provided at the center of the envelope 40. Excellent discharge efficiency of impurity gas in the discharge space located relatively far from the (venting hole 2 lb).

 In this case, there is no need to evacuate the envelope once before the filling step of filling the discharge gas, and it is possible to fill the envelope as it is. Example 1>

 Next, an example in which each manufacturing process is performed based on the above embodiment to produce a PDP according to the example will be specifically described.

FIG. 4 is a diagram showing a temperature and pressure profile at the time of sealing, and FIG. FIG. 4 is a diagram showing temperature and pressure profiles in a gas process and an encapsulation process. In this example, a PDP was produced according to each profile. In each figure, a dotted line indicates the temperature of the envelope 40, and a solid line indicates a pressure change in the manifold 53a of the suction / exhaust system connected to the envelope 40.

 First, in the sealing process, the temperature is raised to the sealing temperature of 450 ° C over 2 to 3 hours, and this temperature is maintained for about 20 minutes. At the same time, when the temperature reaches 450 ° C, the pressure in the manifold 53 a is reduced to about 0.05 MPa, the operation of the suction and exhaust system is stopped, and this is maintained.

 Then, while maintaining the reduced pressure, the temperature is lowered to room temperature over 2 to 3 hours.

 At this stage, the front panel and the rear panel have been completely sealed.

Next, go to 5, further pressure of the suction exhaust continue to Ma two hold 53 in a a is 1. 3 x 1 0- ¹¹ ~; after becoming I about 3 X 1 0- ^lfl MP a. Start heating and heat to exhaust baking temperature (350 ° C) over 2 to 3 hours. Then, when the exhaust baking temperature is reached, suction exhaust is started again, and the gas flowing into the manifold at the time of heating and heating is exhausted. When the suction and exhaust are restarted, the pressure in the manifold 53a has risen as indicated by reference numeral 60 in FIG. 5 due to degassing from the inner wall of the connection pipe 56 and the inner wall of the envelope 40. It will start to decrease by restarting.

When the pressure in the manifold 53a reaches about 1.3 X 10— to 1.3 x 10 ^{1 ()} Μ Ρa, the operation of the suction / exhaust system 53 is stopped, The introduction system 52 is operated to fill the envelope 40 with the discharge gas at about 0.05 MPa, and the pressure is maintained for about 5 to 10 minutes.

Thereafter, while cooled, the gas in the envelope 40 to resume suction ^{exhaust, 1. 3 x 1 0 n ~} 1. 3 X 1 0- 1 () after becoming about MP a, the gas introduction system 52 With this, the discharge gas is filled into the envelope 40 at about 0.067 MPa.

In the conventional evacuation process, it takes about 2 hours to reduce the pressure in the envelope to ^1.3 x ^10— ”to ^1.3 x ^10—1ϋMPa . In the evacuation step, the pressure can be reduced to the pressure more quickly than in the past in about one hour. Here, if the driving force of the pump system of the suction / exhaust system is increased to suction the inside of the envelope more strongly, it is considered that the pressure can be reduced to a low pressure in a short time. However, in this case, the phosphor in the envelope is detached from the phosphor layer and the like, which leads to deterioration of the panel characteristics. The suction force is relatively weakened by intervening to make the inside of the envelope sucked. For this reason, conventionally, in the vacuum evacuation process, it usually takes a relatively long time to reduce the pressure in the envelope to a desired internal pressure.

 The PDP fabricated as described above had less lifting of the outer peripheral portion, and the discharge characteristics were more uniform than those of the conventional method using only a clip or the like. In addition, the noise level from the outer periphery was also reduced by several dB to 10 dB. In addition, the discharge starting voltage was reduced by about 5 to 10 V, the discharge current was increased by several percent to 10%, and the efficiency was improved by several percent to about 10%.

 <Example 2>

 Next, an example in which each manufacturing process is performed based on the above embodiment to produce a PDP according to another example will be specifically described.

 FIG. 6 is a diagram showing a temperature and pressure profile at the time of sealing, and a temperature and pressure profile in an evacuation step and an enclosing step. In the present example, a PDP was produced according to each of these profiles. In each figure, the dotted line indicates the temperature of the envelope 40, and the solid line indicates the pressure change in the manifold of the suction / exhaust system connected to the envelope 40.

 First, in the sealing step, the temperature is raised to a sealing temperature of 450 ° C. over 2 to 3 hours, and this temperature is maintained for about 20 minutes. At the same time, when the temperature reaches 450 ° C, the pressure of the manifold 53a is reduced to about 0.05MPa, the operation of the suction / exhaust system is stopped, and this is maintained.

 Then, the temperature is lowered to the exhaust baking temperature (350 ° C.) over about 30 minutes while maintaining the reduced pressure state.

At this stage, the front panel and the rear panel have been completely sealed, but if the temperature is monitored and the pressure inside the manifold 53a is monitored, a sealing defect can be identified. In addition, it is possible to deal with the occurrence of sealing failure at an early stage Help below.

 Next, after the temperature is reduced to the exhaust baking temperature, the suction and exhaust are continued and manifold

1.3 x 1 pressure within 53 a. ¹ ~ :! 3 x 10—Suction and exhaust to about ^1D MF a. Next, the operation of the suction / exhaust system 53 is stopped, the gas introduction system 52 is operated, and the envelope 40 is filled with the discharge gas at about 0.05 MPa, and the pressure is maintained for about 5 to 10 minutes.

Thereafter, while cooled, the gas in the envelope 40 to resume suction exhaust, 1. 3 x 1 0- ~ 1. Once in about 3 X ¹ 0- 1β ΜΡ a, discharged by the gas introduction system 52 Fill the envelope 40 with gas at about 0.067 MPa.

In the conventional evacuation process, the pressure inside the envelope is reduced from 1.3 x 10— ”to 1.3 x 10—1 ^(It takes about 2 hours to reduce the pressure to 1 MPa. However, in the evacuation step of the above embodiment, the pressure can be reduced to the pressure in about one hour.

 The PDP fabricated as described above had less lifting of the outer peripheral portion, and the discharge characteristics were more uniform than those of the conventional method using only a clip or the like. In addition, the noise level from the outer periphery was also reduced by several dB to 10 dB. Also, the discharge starting voltage was reduced by about 5 to 10 V, the discharge current was increased by several percent to 10%, and the efficiency was improved by several percent to about 10%.

 Compared with Example 1, in the manufacturing method according to Example 2, the time from the sealing of the envelope 40 to the cooling and the heating time from room temperature for exhaust baking to the exhaust baking temperature were reduced. There is an effect that can be. Also, the degree of deterioration of the phosphor was about several percent, which was smaller than that of Example 1 and was slightly better.

 Embodiment 2>

 This embodiment is the same as the embodiment except that the method in the evacuation step is different from that in the above embodiment.

 FIG. 7 is a diagram schematically showing the sealing / exhausting device 70 used in the sealing step of the present embodiment, and is a diagram corresponding to FIG. 3 (b).

The sealing / exhaust device 70 is provided outside the heating furnace 71 and a heating furnace 71 for housing and heating the envelope 40 in which the front panel 10 and the rear panel 20 are overlapped. Gas introduction and suction / exhaust system 72 The rear panel 20 is provided with a connecting pipe 73 so that the ventilation hole 21a communicates with the internal space, and the getter pipe 74 is provided with an adhesive 7 3a so that the ventilation hole 21b communicates with the internal space. And is temporarily fixed via the adhesive 74a in the same manner as described above.

 The connection tube 73 is a glass tube whose contact end with the rear panel 20 is open, and the getter tube 74 is a glass tube whose other end of contact with the rear panel 20 is sealed. The getter tube 74 has a getter storage space 74b in which a gas is stored at the outlet of the vent hole 21b of the rear panel 20.

 The gas introduction / suction / exhaust system 72 includes a manifold 72 a, a turbo molecular pump 72 b, a rotary pump 72 c, a gas cylinder 72 d filled with discharge gas, and the connection pipe 73. And a manifold 7 2 f for connecting the manifold 72 a to the turbo molecular pump 72 b and the gas cylinder 72 d. . The branch piping system 7 2 f is a single piping system 7 2 f 1 extending from the manifold 7 2 a.The two piping systems 7 2 f 2 and the piping system 7 2 are connected via the path selection valve 72 g. f3 is connected to the turbo molecular pump 72b and the gas cylinder 72d, respectively. In the middle of the piping system 7 2 f 2 and the piping system 7 2 f 3, an opening and closing valve for adjusting the suction amount by the turbo molecular pump 72 h, an opening and closing valve for adjusting the flow rate of the discharge gas 72 i Is provided. Then, the connection pipe 73 and the piping system 72 e are connected to each other in a state where airtightness is ensured by a chuck or the like. When the turbo molecular pump 72b is operated, the path selection valve 72g selects the piping system 72f2, and when the discharge gas is introduced into the envelope 40 from the gas cylinder 72d, the piping system 72 7 Select 2f3.

 Then, the inside of the heating furnace 71 was heated by the heater 75, and the temperature was raised to a sealing temperature (for example, 450 ° C.) slightly higher than the softening temperature of the sealing material, and was maintained at the sealing temperature for a predetermined time. Thereafter, the temperature between the panels 10 and 20 is sealed by lowering the temperature again to the softening point temperature or lower, but the sealing is performed while exhausting the inside of the envelope 40 with the turbo molecular pump 72b. The sealing conditions are determined by the compatibility between the glass substrate material and the sealing material. When low-melting glass is used, the temperature is about 450 ° C. for about 10 to 20 minutes.

It is desirable that the evacuation be started after the inside of the heating furnace 71 reaches the softening temperature of the sealing material. Until the softening temperature of the sealing material is reached, the airtightness of the outer periphery between both panels 10 and 20 Because there is not much air, the inside of the envelope 40 cannot be evacuated to a high degree of vacuum even if it is evacuated, but after the sealing material softens, the outer periphery between the panels 10 The part is hermetically sealed, and the adhesive layer 41 is also softened, so that the connection between the connection pipe 72 and the vent hole 21a is also hermetically sealed. (1. 3 3 X 1 0- 4 degree MP a (number T 0 rr about)) der from being reduced to Ru.

 By exhausting air from the inner space of the envelope 40 in this manner, the panels 10 and 20 are uniformly pressed from the outside. In the suction and exhaust, the sealing material is compressed and shrunk by the difference between the pressure in the envelope 40 and the pressure in the heating furnace, and the two front panels and the rear panel approach to each other to close the front panel and the partition wall. However, it is sufficient that only a small amount of gas comes into contact with the gas, so that a slight suction and exhaust (for example, about 0.08 MPa) is sufficient.

 When the two panels 10 and 20 are uniformly pressed from the outside, the top of the partition on the rear panel 20 and the front panel 10 are in close contact with each other as described above. Then, when the temperature is lowered in this state, the temperature of the sealing material becomes lower than the softening temperature and the sealing material is hardened, whereby the envelope 40 is sealed. Therefore, in the envelope 40 after the sealing, the top of the partition wall and the front panel 10 are kept in close contact with each other.

 Next, after cooling to about room temperature, the end portion 74c of the getter tube 74 attached to the envelope 40 is broken, and the particulate getter 76 is placed in the inner space of the envelope 40. Insert the amount corresponding to the size, seal off the end 74c and store the getter 76 in the getter storage space 74b. As the getter 76 to be charged, a getter that activates the surface by heating and irreversibly chemically adsorbs the impurity gas can be used. In this case, it is desirable that the material be activated at the evacuation baking temperature in the subsequent evacuation step.

 Next, the inside of the envelope 40 is evacuated again, and then the heating furnace 71 is heated (baked) at a temperature lower than the softening point of the sealing material layer (exhaust baking temperature). You.

The exhaust baking temperature is, of course, a temperature lower than the softening point of the sealing material (or lower than the melting point of the metal when a metal is used for the sealing material). And this Here, the temperature is set to a temperature (for example, about 350 ° C.) at which the getter 76 is activated and the adsorbed water adsorbed on the inner wall surface of the envelope 40 is effectively desorbed.

 When the temperature reaches the activation temperature of the getter 76 while the temperature rises to the exhaust baking temperature, impurity gas such as water, carbon dioxide, nitrogen, oxygen, etc. is adsorbed on the particle surface of the getter 76, so that the inside of the particle hole of the getter 76 increases more and more. It is taken in. This is because as a result of the impurity gas being taken into the getter 76, a pressure gradient (gas concentration gradient) is generated between the inner space of the envelope 40 and the storage space 74b in which the getter 76 is stored.

 Next, with the exhaust baking temperature maintained, the on-off valve 72 h is appropriately opened, and the turbo molecular pump 72 b and the rotary pump 72 c are operated to further suction the inside of the envelope 40. The piping 72 f 3 is selected by the selection valve 72 g, the opening and closing valve 72 i is opened, and the discharge gas is introduced into the envelope 40 at a predetermined pressure (for example, 0.05 MPa). It is more desirable that the pressure be maintained for a predetermined time (5 to 10 minutes) after filling the discharge gas. This is because the conductance between the partitions in the envelope 40 is small, and it takes time to reach the equilibrium pressure.

 Then, the introduction of the discharge gas is stopped, the discharge gas in the envelope is sucked and discharged, and the inside of the envelope 40 is again brought into a vacuum state.

 Such processes of vacuum evacuation, discharge gas introduction, and vacuum evacuation are usually sufficient even once, but if repeated, the impurity gas in the envelope 40 can be made lower in concentration.

 As described above, the gas introduced into the envelope 40 is not limited to the discharge gas, and may be any gas that does not become an impurity with respect to the discharge gas. In addition, this gas is more preferable if it is a dry gas because the deterioration of the characteristics of the phosphor can be suppressed.

Once the vacuum was applied, the gas pressure introduced into the envelope 40 is 1. about 33 x 1 0- ⁴ MP a (number T orr) may be within pressure at which the envelope 40 does not break, the large It is desirable to be lower than the atmospheric pressure.

Next, in the filling step, a discharge gas is supplied to the internal space of the envelope 40 so as to have a predetermined filling pressure (for example, 0.067 MPa). Then, the ventilation holes 21a and 21b are sealed by melting and cutting off (tip-off) the root portions of the connection pipe 73 and the getter pipe 74 with a wrench or heater. [Effects of the manufacturing method of the present embodiment]

 When the outer periphery is tightened with a clip or the like without providing a pressure difference between the inside and outside of the envelope 40 as in the conventional case, the central part of the envelope 40 is not pressed, so that the top of the bulkhead on the rear panel 20 is not pressed. While the front panel 10 is easily or completely sealed away from the front panel 10, as described above, the envelope 40 is separated by the pressure difference between the inside and the outside. The sealing material layer 41 is hardened and sealed in a state where the sealing material layer 41 is uniformly pressed from the outside, so that the sealing is performed in a state where there is almost no gap between the top of the partition wall and the front panel 10.

 Therefore, according to the manufacturing method of the present embodiment, it is possible to easily manufacture a PDP with less vibration during PDP driving and good display quality.

 In order to obtain such an effect, at least at the time when the softened sealing material layer 41 is hardened, the suction / exhaust system is operated so that a pressure difference between the inside and outside of the envelope 40 is generated. Although necessary, it is not necessary to aspirate continuously from the beginning to the end of the sealing process. For example, even if the suction operation is started after the sealing material layer 41 is softened, the effect due to the difference between the inside and outside pressures of both panels 10 and 20 can be sufficiently obtained.

 In addition, the above-described evacuation step makes it possible to quickly (shortly) remove the impurity gas concentration in the envelope 40 to a low concentration.

 This is due to 1) the effect of diluting the impurity gas by filling a large amount of discharge gas, 2) the effect that the residual impurity gas is discharged out of the envelope 40 by viscous flow during gas filling and re-evacuation, and 3) the exhaust. This is considered to be due to the effect of releasing the adsorbed gas by colliding the discharge gas molecules heated to a high temperature during the baking with the inner wall surface of the envelope 40 such as the phosphor and the protective layer. For the third reason, it can be said that it is desirable to use a preheated discharge gas (cleaning gas) to be introduced into the envelope during the exhaust process.

Further, in the present embodiment, since the step of raising the temperature to the exhaust baking temperature includes the step of removing the impurity gas in the envelope 40 by the getter, the vacuum exhaust “discharge gas filling” is performed. compared with the manufacturing method of the first embodiment only step of evacuation, more quickly and _c rather example 3 capable of removing impurity gases from the envelope 4 inside 0 to lower concentrations> Next, an example in which each manufacturing process is performed based on the second embodiment to produce a PDP according to the example will be specifically described.

 In this example, PDPs were produced according to the profiles shown in FIGS. The getter 76 is sealed and once cooled down to room temperature, it is stored in the getter tube 74, and the getter is made of vanadium, titanium and iron alloy particles with an activation temperature of 280 ° C. Was.

In the conventional evacuation process, it takes about 2 hours to reduce the pressure in the envelope from 1.3 x 10— ”to 1.3 x 10—1 ⁽¹ MPa). In the evacuation process of the example, the pressure can be reduced to the pressure in about one hour.

 The PDP fabricated as described above had less lifting of the outer peripheral portion, and the discharge characteristics were more uniform than those of the conventional method using only a clip or the like. In addition, the noise level from the outer periphery was also reduced by several dB to 10 dB. In addition, the discharge starting voltage was reduced by about 5 to 10 V, the discharge current was increased by several percent to 10%, and the efficiency was improved by several percent to about 10%.

 Compared with Example 1, in the manufacturing method according to Example 3, deterioration of the characteristics after the aging step (the aging step is a step for stabilizing the panel characteristics after the discharge gas sealing step). It was a little less and the efficiency was a few percent better.

 Embodiment 3>

 This embodiment is the same as that of the first embodiment except that the method in the sealing step is different from that in the first embodiment.

First, the inside of the heating furnace 51 is heated to a sealing temperature slightly higher than the softening temperature of the sealing material (for example, 450 ° C.), kept at the sealing temperature for a predetermined time, and then softened again. By sealing the gap between the panels 10 and 20 by lowering the temperature below the point temperature, when the temperature is raised to the sealing temperature, the gas introduction system is activated to introduce dry gas into the envelope 40. Then raise the temperature. Here, a dried gas of the discharge gas filled in the gas cylinder 52a is used as a dry gas. In addition, dry air, dry nitrogen gas, dry argon gas, dry neon gas (dry rare gas in general) and the like can be used. When heated to the sealing temperature, the sealing material is softened, so that the outer peripheral portion of the envelope 40 becomes airtight, so that the internal pressure in the envelope 40 increases. Monitor this, Stop the introduction of the discharge gas.

 Note that the flow rate of the drying gas is such that when the sealing material is softened and hermetically sealed, even if the drying gas flows into the envelope 40, a sharp pressure rise occurs and the It will of course be limited to the extent that the constituent glass substrates are not damaged.

 As described above, since the drying gas is circulated in the envelope 40 until the temperature reaches the sealing temperature, the outer peripheral portion of the envelope 40 becomes airtight due to softening of the sealing material. At this stage, the envelope 40 is filled with dry gas. Then, the sealing temperature is held for a predetermined time while the drying gas is being filled. The sealing conditions are determined by the compatibility between the glass substrate material and the sealing material. When low-melting glass is used, the temperature is about 450 ° C. for about 10 to 20 minutes.

 By sealing in a state where the dry gas is filled in the internal space in this way, thermal degradation of the phosphor is prevented.

 Further, the sealing temperature is maintained for a predetermined time in a state where the drying gas is filled, and at the same time, the sealing is performed while exhausting the inside of the envelope 40 by the turbo molecular pump 53b. When operating the turbo molecular pump 53b, the rotary pump 53c is simultaneously operated to reduce the back pressure in the turbo molecular pump 53b.

It is desirable that the evacuation be started after the inside of the heating furnace 51 reaches the softening temperature of the sealing material. Until the temperature reaches the softening temperature of the sealing material, the outer periphery between the panels 10 and 20 is not very airtight. However, after the sealing material softens, the outer periphery between the panels 10 and 20 is hermetically sealed, and the adhesive layer 56 a is also softened to form the connection pipe 56 and the vent hole. since the connection portion between the 2 1 b is also hermetically sealed, it is reduced to the envelope 4 0 when the exhaust from the internal high have vacuum (1. 3 3 X 1 0- 4 MP a degree (number T orr) about) This is because that.

By exhausting air from the internal space of the envelope 40 in this manner, the panels 10-20 are uniformly pressed from the outside. In the suction and exhaust, the sealing material is compressed and shrunk by the difference between the pressure in the envelope 40 and the pressure in the heating furnace, and the two front panels and the rear panel approach to each other to close the front panel and the partition wall. However, it is sufficient that only slight suction and exhaust (for example, about 0.08 MFa) occur. When both panels 10.2 0 are uniformly pressed from the outside, as shown in Fig. 3, the top of the partition wall on the back panel 20 and the front panel 10 are in close contact with each other as a whole. . When the temperature is lowered in this state, the temperature of the sealing material becomes lower than the softening temperature and the sealing material is hardened, whereby the envelope 40 is sealed. Therefore, in the envelope 40 after the sealing, the top of the partition wall and the front panel 10 are kept in close contact with each other as a whole.

 In the sealing step, the temperature is not increased at a stretch to a sealing temperature slightly higher than the softening temperature of the sealing material, but at a temperature lower than the sealing temperature for a certain time, for example, about 350 ° C. Burning the binder material by heating for about 30 minutes is effective in suppressing deterioration of the phosphor.

 Thereafter, the PDP is completed through the same evacuation process, sealing process, and encapsulation process as in the first embodiment.

 Example 4>

 Next, an example in which each manufacturing process is performed based on the above embodiment to produce a PDP according to the example will be specifically described.

 In this example, PDPs were produced according to the profiles shown in FIGS.

 First, in the sealing step, the temperature is raised to a sealing temperature of 450 ° C. over 2 to 3 hours, and this temperature is maintained for about 20 minutes. At the same time, the dry gas is made to flow through the envelope 40 by operating the gas introduction system until the sealing temperature is reached.

 Next, when the sealing temperature reaches 450 ° C., the pressure of the manifold is stopped from operating the gas introduction system, and the pressure is reduced to about 0.05 MPa and maintained.

 Then, while maintaining the reduced pressure, the temperature is lowered to room temperature over 2 to 3 hours.

At this stage, the front panel and the rear panel have been completely sealed, but if the temperature is reduced and the pressure inside the manifold is monitored, sealing defects can be identified and poor sealing can be achieved. Outbreaks can be dealt with earlier in the manufacturing process, helping to reduce costs. The pressure in the manifold decreases gradually when sealing is performed normally, but otherwise decreases at a relatively fast rate due to gas leaking into the furnace. Next, go to 5, further pressure is 1. 3 x 1 0- ¹¹ ~ suction exhaust continue to Ma two hold 53 in a ^{a; 1. 3 X 1 0- 1 (} ) becomes about MP a After that, start heating and heat to exhaust baking temperature (350 ° C) over 2 to 3 hours. Then, when the exhaust baking temperature is reached, the suction and exhaust is started again. Exhaust gas flowing into the manifold during heating. When resuming suction and exhaust, the pressure in the manifold 53a has risen as indicated by reference numeral 60 in FIG. 5 due to degassing from the inner wall of the connection pipe and the inner wall of the envelope 40. It turns to decrease.

Then, when the pressure in the manifold 53a reaches about 1.3 x ^{10 1} to 1.3 x 10—10 ΜΡa, the operation of the suction / exhaust system 53 is stopped and the gas introduction system is stopped. Activate 52 and fill the envelope 40 with about 0.05 MPa of discharge gas, and maintain this pressure for about 5 to 10 minutes.

Thereafter, while cooling, the gas in the envelope 40 was sucked and evacuated again, and after the pressure became about 1.3 xl O—ul. 3 X 10—1 ⁽⁾ MPa, the gas was discharged by the gas introduction system 52. Fill the envelope 40 with gas at about 0.067 MPa.

In conventional vacuum evacuation step, to vacuum until the pressure within the envelope 1. 3 x 1 0- "~1. 3 x 1 0- 1Q MP a is takes about 2 hours, the above-described embodiment In the evacuation step, the pressure can be reduced to the pressure in about one hour.

 The PDP fabricated as described above had little lifting at the outer periphery and had more uniform discharge characteristics than the conventional method using only a clip or the like. In addition, the noise level from the outer periphery was also reduced by several dB to 10 dB. In addition, the discharge starting voltage was reduced by about 5 to 10 V, the discharge current was increased by several percent to 10%, and the efficiency was improved by several percent to about 10%.

 In addition, the light emission intensity (luminance of the PDP) of the PDP sealed after the flow of the dry gas as described above and the PDP sealed in the presence of the air without the flow of the dry gas as in the related art. The y-value of the chromaticity coordinates) was compared and evaluated by irradiating the panel with a Xe excimer lamp (wavelength: 173 nm). The emission intensity of the blue phosphor was improved by about 10%. . If the dry gas was non-reactive, a uniform improvement effect was observed, but dry air was particularly excellent.

Example 5> Next, an example in which each manufacturing process is performed based on the above embodiment to produce a PDP according to another example will be specifically described.

 In this example, a PDP was produced according to the profile shown in FIG.

 First, in the sealing process, the temperature is raised to the sealing temperature of 450 ° C over 2 to 3 hours, and this temperature is maintained for about 20 minutes. At the same time, the dry gas is circulated through the envelope 40 by operating the gas introduction system until the sealing temperature is reached.

 Next, when the sealing temperature reaches 450 ° C, the pressure of the manifold is stopped from operating the gas introduction system, and the pressure is reduced to about 0.05 MPa and maintained.

 While maintaining the reduced pressure, the temperature is lowered to the exhaust baking temperature (350 ° C) in about 30 minutes over 2 to 3 hours.

At this stage, the front panel and the rear panel have been completely sealed, but if the temperature is reduced and the pressure inside the manifold is monitored, sealing defects can be identified and poor sealing can be achieved. Outbreaks can be dealt with earlier in the manufacturing process, helping to reduce costs. The pressure inside the manifold gradually decreases when sealing is performed normally, but otherwise decreases at a relatively high rate because gas leaks into the furnace. Next, after the temperature is lowered to the exhaust ^baking temperature, suction and exhaust are continued to ^reduce the pressure in the ^{manifold to 1.3} x ^10— "to ^1.3 x 10— ^{lfl MPa} . Next, the operation of the suction / exhaust system 53 is stopped, and the gas introduction system 52 is operated to fill the envelope 40 with the discharge gas at about 0.05 MPa, and the pressure is increased for about 5 to 10 minutes. maintain.

Thereafter, while cooled, the gas in the envelope 40 to resume suction ^{exhaust, 1. 3 x 1 0 "11} - after it becomes about ^{1. 3 X 1 0- 1Q MP a} , a gas introduction system discharge The gas is filled into the envelope 40 at about 0.067 MPa.

In the conventional evacuation process, it takes about 2 hours to reduce the pressure in the envelope to 1.3 X 1 — ¹¹ to 1.3 X ¹⁰ MPa. In the process, the pressure can be reduced to the pressure in about one hour.

The PDP fabricated as described above had little lifting at the outer periphery and had more uniform discharge characteristics than the conventional method using only a clip or the like. In addition, the noise level from the outer periphery was also reduced by several dB to 10 dB. In addition, The pressure was also reduced by about 5 to 10 V, the discharge current was increased by several percent to about 10%, and the efficiency was improved by several percent to about 10%.

 Compared with Example 4, in the manufacturing method according to Example 5, the time from the sealing of the envelope 40 to the cooling and the heating time from the room temperature for the exhaust baking to the exhaust baking temperature. There is an effect that it can be shortened. In addition, the degree of deterioration of the phosphor was about several%, which was smaller than that of Example 4, and was slightly superior.

 Embodiment 4>

 This embodiment is the same as the second embodiment except that the technique in the sealing step is different from that in the second embodiment.

 First, the inside of the heating furnace 71 is heated to a sealing temperature slightly higher than the softening temperature of the sealing material (for example, 450 ° C.), kept at the sealing temperature for a predetermined time, and then softened again. By sealing the gap between the panels 10 and 20 by lowering the temperature below the point temperature, when the temperature is raised to the sealing temperature, the gas introduction system is activated to introduce dry gas into the envelope 40. Then raise the temperature. Here, a dried gas of the discharge gas filled in the gas cylinder 72 d is used as a dry gas. In addition, dry air, dry nitrogen gas, dry argon gas, dry neon gas (dry rare gas in general) and the like can be used. When heated to the sealing temperature, the sealing material softens and the outer peripheral portion of the envelope 40 becomes airtight, so that the internal pressure in the envelope 40 increases. This is monitored and the introduction of discharge gas is stopped.

 Note that the flow rate of the drying gas is such that when the sealing material is softened and hermetically sealed, even if the drying gas flows into the envelope 40, a sharp pressure rise occurs and the It will of course be limited to the extent that the constituent glass substrates are not damaged.

 As described above, since the drying gas is circulated in the envelope 40 until the sealing temperature is reached, the outer peripheral portion of the envelope 40 is hermetically sealed by the softening of the sealing material. At the next stage, the envelope 40 is filled with dry gas. Then, the sealing temperature is held for a predetermined time while the drying gas is being filled. The sealing conditions are determined by the compatibility between the glass substrate material and the sealing material. When low-melting-point glass is used, the temperature is about 450 ° C. for about 10 to 20 minutes.

By sealing in a state where the dry gas is filled in the internal space, the fluorescent light Thermal degradation of the body is prevented.

 Further, the sealing temperature is maintained for a predetermined time in a state where the drying gas is filled, and at the same time, the sealing is performed while exhausting the inside of the envelope 40 by the turbo molecular pump 72b. When the turbo molecular pump 72b is operated, the rotary pump 72c is simultaneously operated to lower the back pressure in the turbo molecular pump 72b.

It is desirable that the evacuation be started after the inside of the heating furnace 71 reaches the softening temperature of the sealing material. Until the temperature reaches the softening temperature of the sealing material, the outer periphery between the panels 10 and 20 is not very airtight. However, after the sealing material has softened, the outer periphery between the panels 10 and 20 is hermetically sealed, and the adhesive layer 73 a is also softened so that the connection pipe 73 and the vent hole are formed. since the connection portion between the 2 1 a is also hermetically sealed, it is reduced to the envelope 4 0 when the exhaust from the internal high have vacuum (1. 3 3 X 1 0- 4 MP a degree (number T orr) about) This is because that.

 By exhausting air from the inner space of the envelope 40 in this manner, the panels 10 and 20 are uniformly pressed from the outside. In the suction and exhaust, the sealing material is compressed and shrunk by the difference between the pressure in the envelope 40 and the pressure in the heating furnace, and the two front and rear panels come close to each other and come into contact with the front panel. Sufficient suction and exhaust (for example, about 0.08 MPa) is enough, as long as it is sufficient to make contact with the partition wall.

 When both panels 10 and 20 are uniformly pressed from the outside, as shown in Fig. 3, the top of the partition wall on the rear panel 20 and the front panel 10 are in close contact with each other as a whole. . When the temperature is lowered in this state, the temperature of the sealing material becomes lower than the softening temperature and the sealing material is hardened, whereby the envelope 40 is sealed. Therefore, in the envelope 0 after the sealing, the top of the partition wall and the front panel 10 are kept in close contact with each other.

 In the sealing step, the temperature is not increased at a stretch to a sealing temperature slightly higher than the softening temperature of the sealing material, but at a temperature lower than the sealing temperature for a certain time, for example, about 350 ° C. Burning the binder material by heating for about 30 minutes is effective in suppressing deterioration of the phosphor.

After this, the vacuum evacuation process, sealing process, and encapsulation process DP is completed.

 Example 6>

 Next, an example in which each manufacturing process is performed based on the above embodiment to produce a PDP according to the example will be specifically described.

 In this example, a PDP was produced according to the same temperature and pressure profile as in Example 4. The getter 76 is sealed and once cooled down to room temperature, is stored in a getter tube 74, and vanadium, titanium, and iron-based alloy particles having an activation temperature of 280 ° C are used as the getter. .

 In the conventional evacuation process, it takes about two hours to reduce the pressure in the envelope to 1.3 × 10— ”to 1.3 × 10 MPa. In the process, the pressure can be reduced to the pressure in about one hour.

 The PDP fabricated as described above had less lifting of the outer peripheral portion, and the discharge characteristics were more uniform than those of the conventional method using only a clip or the like. In addition, the noise level from the outer periphery was also reduced by several dB to 10 dB. In addition, the discharge starting voltage was reduced by about 5 to 10 V, the discharge current was increased by several percent to 10%, and the efficiency was improved by several percent to about 10%.

 In addition, the emission intensity (luminance, chromaticity) of the PDP sealed after the flow of the dry gas as described above and the PDP sealed in the presence of the air without the flow of the dry gas as in the past. The y-value of the coordinates) was compared and evaluated by irradiating the panel with a Xe excimer lamp (wavelength: 1733 nm). In particular, the emission intensity of the blue phosphor was improved by about 10%. If the dry gas was non-reactive, a uniform improvement effect was observed, but dry air was particularly excellent.

In the above embodiments, the sealing step and the evacuation step are performed by the same apparatus. However, the present invention is not limited to this, and the sealing step and the evacuation step may be performed by separate apparatuses. Also, in the sealing process, instead of heating the entire envelope, a heat source such as a laser beam may be selectively irradiated to the sealed portion to selectively heat and seal the portion. it can. In this case, since the phosphor is not directly heated, even if the dry gas is not introduced into the discharge space, thermal degradation of the phosphor due to the sealing step is not likely to occur. As described above, according to the present invention, if necessary, the partition wall for separating the light emitting cells is formed on the main surface. An envelope forming step of forming an envelope by disposing a second substrate on the partition-side surface of the first substrate formed in the above, and sealing the outer peripheral portions of both substrates in the envelope. A method for manufacturing a gas discharge panel, comprising: a sealing step of sealing with a material; an exhausting step of exhausting gas inside the envelope; and an enclosing step of enclosing a discharge gas inside the envelope. The evacuation step includes a sub-step of evacuating the inside of the envelope, and thereafter, filling the inside of the envelope with a cleaning gas containing a gas that does not become an impurity with respect to the discharge gas as a substantial component. And a sub-step of evacuating the inside of the envelope after that.

An envelope forming step of forming an envelope by disposing a second substrate on the partition-side surface of the first substrate having a main surface on which a partition for separating the light emitting cells is formed; A sealing step of sealing the outer peripheral portions of both substrates in the envelope with a sealing material, an exhausting step of exhausting gas inside the envelope, and filling a discharge gas inside the envelope. A method of manufacturing a gas discharge panel comprising: an enclosing step, wherein the evacuation step includes a sub-step of evacuating the inside of the envelope, and thereafter, a gas that does not become an impurity with respect to the discharge gas inside the envelope. It is characterized by including a sub-step of exhausting the inside of the envelope while allowing the cleaning gas as a substantial component to flow ₍ according to these manufacturing methods, simply exhausting the inside of the envelope as in the conventional method). Not just above The exhaust gas is exhausted after the cleaning gas is filled or distributed as shown in the figure above, so that the impurity gas concentration in the envelope can be quickly (shortly) reduced to a low concentration compared to the conventional manufacturing method. This effect is more effective as the definition of the gas discharge panel is higher, because the higher the definition, the longer it generally takes to reduce the concentration of the impurity gas. Because.

 When exhausting after filling with the cleaning gas, it is preferable to exhaust after a while rather than exhausting immediately after filling.

Here, the sealing step includes heating the entire envelope at a temperature equal to or higher than the softening point or the melting point of the sealing material with a sealing material interposed between the first substrate and the second substrate. The sealing can be performed by lowering the internal pressure of the device than the external pressure and then cooling it. Note that a lead alloy can also be used as the sealing material. As a result, the sealing material is hardened and sealed in a state in which the two substrates are uniformly pressed from the outside by the pressure difference between the inside and the outside, so that the gap between the top of the partition wall and the substrate opposed thereto is formed. Sealing is performed in a state where there is almost no.

 Here, between the sealing step and the exhausting step, a step of storing the getter in a container communicating with the inside of the envelope may be provided.

 As a result, the impurity gas can be more quickly removed from the envelope.

 Here, the evacuation step may be performed while heating the entire envelope at a temperature equal to or lower than the softening point or the melting point of the sealing material. When the getter is used as described above, it is desirable that the activation temperature be within the range of the heating temperature in the evacuation step.

 This makes it possible to remove impurities from the envelope to the outside more quickly.

 Here, the cooling in the sealing step can be heating and cooling at a temperature equal to or lower than the softening point or the melting point.

 As a result, it is possible to quickly move to the next evacuation step without performing the process of once cooling to around room temperature and then reheating to the exhaust baking temperature.

 Here, in the sealing step, the sealing material is interposed between the first substrate and the second substrate, and while the dry gas is circulated inside the envelope, the entire envelope is softened at a softening point of the sealing material. Or the sub-step of heating to a temperature above the melting point, heating at a temperature above the softening point or melting point of the sealing material, reducing the internal pressure of the envelope to a value lower than the external pressure, and then cooling. A sub-step of sealing.

 Thus, the sealing step is performed in a state where the inside of the envelope is filled with the dry gas, so that the thermal degradation of the phosphor can be suppressed.

Here, the sealing step is to heat the sealing portion of the envelope at a temperature equal to or higher than the softening point or the melting point of the sealing material with a sealing material interposed between the first substrate and the second substrate, By reducing the pressure inside the envelope below the external pressure and then cooling It can be sealed.

 Here, it is most desirable to use a discharge gas as the cleaning gas.

 This is because there is no possibility that the cleaning gas becomes an impurity gas with respect to the discharge gas sealed in the sealing step performed after the evacuation step.

 Here, a rare gas can be used as the discharge gas.

 Here, the rare gas may include at least one of helium, neon, argon, and xenon.

 Here, it is assumed that the light emitting cell is formed by an electrode group arranged side by side on the first substrate and an electrode group arranged side by side on the second substrate spaced apart from each other at a predetermined distance. be able to.

Industrial applicability

 INDUSTRIAL APPLICABILITY The method for manufacturing a gas discharge panel according to the present invention can be used for manufacturing a PDP or the like used as an image display such as a television or a computer monitor.

Claims

The scope of the claims

 1. an envelope forming step of forming an envelope by disposing a second substrate on the partition-side surface of the first substrate on which a partition wall for separating the light emitting cells is formed on the main surface; A sealing step of sealing the outer peripheral portions of both substrates of the container with a sealing material, an exhausting step of exhausting gas inside the envelope, and enclosing a discharge gas inside the envelope. And a method for manufacturing a gas discharge panel comprising:

 The evacuation step includes a sub-step of evacuating the inside of the envelope, and thereafter, a sub-step of filling the inside of the envelope with a cleaning gas having a gas that does not become an impurity in the discharge gas as a substantial component. , Followed by a sub-step to evacuate the interior of the envelope

 A method for manufacturing a gas discharge panel, comprising:

2. An envelope forming step of forming an envelope by arranging a second substrate on the partition-side surface of the first substrate having a main surface on which a partition for separating the light emitting cells is formed; A sealing step of sealing the outer peripheral portions of both substrates of the container with a sealing material, an exhausting step of exhausting a gas inside the envelope, and an encapsulation for filling a discharge gas inside the envelope. A method for manufacturing a gas discharge panel comprising:

 The evacuation step includes a sub-step of evacuating the inside of the envelope, and then enclosing the inside of the envelope while flowing a cleaning gas containing a gas that does not become an impurity to the discharge gas as a substantial component. Includes sub-step to evacuate interior of vessel

 A method for manufacturing a gas discharge panel, comprising:

3. In the sealing step, a sealing material is interposed between the first substrate and the second substrate, and the entire envelope is heated at a temperature equal to or higher than the softening point or melting point of the sealing material. 2. The method for manufacturing a gas discharge panel according to claim 1, wherein the internal pressure is made lower than the external pressure, and then the sealing is performed by cooling.

4. The sealing step includes surrounding a sealing material between the first substrate and the second substrate. The entire vessel is heated at a temperature higher than the softening point or melting point of the sealing material, the pressure inside the envelope is made lower than the external pressure, and then the vessel is cooled and then sealed. 3. The method for manufacturing a gas discharge panel according to claim 2.

5. Between the sealing step and the exhausting step, a step of storing a getter in a container communicating with the inside of the envelope is provided.

 2. The method for manufacturing a gas discharge panel according to claim 1, wherein:

6. Between the sealing step and the exhausting step, a step of storing a getter in a container communicating with the inside of the envelope is provided.

 3. The method for manufacturing a gas discharge panel according to claim 2, wherein:

7. A step is provided between the sealing step and the evacuation step for storing the getter in a container communicating with the inside of the envelope.

 4. The method for manufacturing a gas discharge panel according to claim 3, wherein:

8. Between the sealing step and the exhausting step, a step of storing the getter in a container communicating with the inside of the envelope is provided.

 5. The method for manufacturing a gas discharge panel according to claim 4, wherein:

9. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

 2. The method for manufacturing a gas discharge panel according to claim 1, wherein:

10. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

 3. The method for manufacturing a gas discharge panel according to claim 2, wherein:

1 1. In the evacuation step, the entire envelope is heated to a temperature below the softening point or melting point of the sealing material. Perform while heating

 4. The method for manufacturing a gas discharge panel according to claim 3, wherein:

1 2. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

 5. The method for manufacturing a gas discharge panel according to claim 4, wherein:

1 3. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

 6. The method for manufacturing a gas discharge panel according to claim 5, wherein:

1 4. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

 7. The method for manufacturing a gas discharge panel according to claim 6, wherein:

1 5. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

 8. The method for manufacturing a gas discharge panel according to claim 7, wherein:

1 6. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

 9. The method for manufacturing a gas discharge panel according to claim 8, wherein:

1 7. The cooling in the sealing step is heating and cooling at a temperature below the softening point or melting point.

 4. The method for manufacturing a gas discharge panel according to claim 3, wherein:

1 8. Cooling in the sealing step is heating and cooling at a temperature below the softening point or melting point. 5. The method for manufacturing a gas discharge panel according to claim 4, wherein:

19. Cooling in the sealing step is heating cooling at a temperature lower than the softening point or the melting point.

 The method for manufacturing a gas discharge panel according to claim 11, wherein

20. The cooling in the sealing step is heating cooling at a temperature lower than the softening point or the melting point.

 13. The method for manufacturing a gas discharge panel according to claim 12, wherein:

21. In the sealing step, the sealing material is interposed between the first substrate and the second substrate, and a dry gas is allowed to flow through the inside of the envelope. Or a sub-step of heating to a temperature higher than the melting point, heating at a temperature higher than the softening point or melting point of the sealing material, reducing the pressure inside the envelope below the external pressure, and then cooling. Sub-step of sealing with

 2. The method for manufacturing a gas discharge panel according to claim 1, wherein:

22. In the sealing step, the sealing material is interposed between the first substrate and the second substrate, and a dry gas is allowed to flow through the inside of the envelope. Or a sub-step of heating to a temperature higher than the melting point, heating at a temperature higher than the softening point or melting point of the sealing material, reducing the pressure inside the envelope below the external pressure, and then cooling. Substeps to be sealed by

 3. The method for manufacturing a gas discharge panel according to claim 2, wherein:

23. Between the sealing step and the exhausting step, a step of storing a getter in a container communicating with the inside of the envelope is provided.

 21. The method for manufacturing a gas discharge panel according to claim 21, wherein:

2 4. A container communicating with the inside of the envelope between the sealing step and the exhausting step Equipped with a step for storing the inside

 The method for producing a gas discharge panel according to claim 22, characterized in that:

25. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

 21. The method for manufacturing a gas discharge panel according to claim 21, wherein:

26. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

 The method for producing a gas discharge panel according to claim 22, characterized in that:

27. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

 24. The method for manufacturing a gas discharge panel according to claim 23, wherein:

28. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

 25. The method for manufacturing a gas discharge panel according to claim 24, wherein:

29. Cooling in the sealing step is heating cooling at a temperature lower than the softening point or the melting point.

 21. The method for manufacturing a gas discharge panel according to claim 21, wherein:

30. The cooling in the sealing step is heating and cooling at a temperature lower than the softening point or the melting point.

 The method for producing a gas discharge panel according to claim 22, characterized in that:

31. The cooling in the sealing step is heating cooling at a temperature below the softening point or melting point. 26. The method for manufacturing a gas discharge panel according to claim 25, wherein:

3 2. The cooling in the sealing step is heating and cooling at a temperature below the softening point or melting point.

 27. The method for manufacturing a gas discharge panel according to claim 26, wherein:

33. In the sealing step, a sealing material is interposed between the first substrate and the second substrate, and the sealing portion of the envelope is heated at a temperature equal to or higher than the softening point or the melting point of the sealing material. Sealing by lowering the pressure inside the envelope than the outside pressure and then cooling

 2. The method for manufacturing a gas discharge panel according to claim 1, wherein:

34. In the sealing step, a sealing material is interposed between the first substrate and the second substrate, and the sealing portion of the envelope is heated at a temperature equal to or higher than the softening point or the melting point of the sealing material. Sealing by lowering the pressure inside the envelope than the outside pressure and then cooling

 3. The method for manufacturing a gas discharge panel according to claim 2, wherein:

35. Between the sealing step and the evacuation step, a step of storing a getter in a container communicating with the inside of the envelope is provided.

 34. The method for manufacturing a gas discharge panel according to claim 33, wherein:

36. Between the sealing step and the exhausting step, a step of storing a getter in a container communicating with the inside of the envelope is provided.

 35. The method for manufacturing a gas discharge panel according to claim 34, wherein:

37. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

34. The method for manufacturing a gas discharge panel according to claim 33, wherein:

38. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

 35. The method for manufacturing a gas discharge panel according to claim 34, wherein:

39. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

 36. The method for manufacturing a gas discharge panel according to claim 35, wherein:

40. The evacuation step is performed while heating the entire envelope at a temperature lower than the softening point or melting point of the sealing material.

 37. The method for manufacturing a gas discharge panel according to claim 36, wherein:

4 1. Use discharge gas for the cleaning gas

 The method for manufacturing a gas discharge panel according to any one of claims 1 to 40, characterized in that:

4 2. The discharge gas consists of rare gas

 The method for producing a gas discharge panel according to claim 41, characterized by that:

4 3. The rare gas contains at least one of helium, neon, argon and xenon

 The method for producing a gas discharge panel according to claim 42, wherein the method is characterized in that:

44. The light emitting cell is formed by an electrode group arranged side by side on the first substrate and an electrode group arranged side by side on the second substrate, which are separated from each other at a fixed distance. The method for manufacturing a gas discharge panel according to any one of claims 1 to 40, wherein

45. The light emitting cell is formed by an electrode group arranged side by side on the first substrate and an electrode group arranged side by side on the second substrate, spaced apart from each other at a certain distance. The method for producing a gas discharge panel according to claim 41, characterized by that:

46. The light emitting cell is formed by an electrode group arranged side by side on a first substrate and an electrode group arranged side by side on a second substrate, which are separated from each other at a certain distance. The method for producing a gas discharge panel according to claim 42, wherein the method is characterized in that:

47. The light emitting cell is formed in such a manner that the electrode group arranged side by side on the first substrate and the electrode group arranged side by side on the second substrate cross each other at a predetermined distance. 43. The method for manufacturing a gas discharge panel according to claim 43, wherein