JP3553902B2 - Method and apparatus for manufacturing plasma display panel - Google Patents

Description

【００６４】
パネルＮｏ．１〜４は、本実施の形態に基づいて作製した実施例に係るＰＤＰであって、蛍光体焼成工程、フリット仮焼工程、封着工程で流す乾燥空気の水蒸気分圧を、０〜１２Ｔｏｒｒの範囲内でいろいろな値に変化させたものである。また、パネルＮｏ．５は、比較例に係るＰＤＰであって、蛍光体焼成工程、フリット仮焼工程、封着工程を、未乾燥の空気（水蒸気分圧２０Ｔｏｒｒ）中で行ったものである。
【００６５】
これらの各ＰＤＰにおいて、蛍光体層の膜厚は３０μｍとし、放電ガスはＮｅ（９５％）−Ｘｅ（５％）を５００Ｔｏｒｒで封入した。
〈発光特性試験〉
試験方法及び結果：
これらの各ＰＤＰについて、発光特性として、色補正なしで白バランスでのパネル輝度及び色温度（青色セル，赤色セル，緑色セルを同じ電力で発光させたときのパネル輝度及び色温度）、青色セル及び緑色セルを同じ電力で発光させたときの発光スペクトルのピーク強度比を測定した。
【００６６】
これらの測定結果は、表１に示す通りである。
なお、作製した各ＰＤＰを分解し、背面パネル基板にクリプトンエキシマランプを用いて真空紫外線（中心波長１４６ｎｍ）を照射し、青色，緑色，赤色の全色を発光させたときの色温度、並びに、青色及び緑色を発光させたときの発光スペクトルのピーク強度比を測定したところ、作製した前面パネル基板に色フィルタなどを設けていないため、上記点灯による結果と同等の結果が得られた。
【００６７】
更に、パネルから青色蛍光体を取り出し、ＴＤＳ分析法（昇温脱離ガス質量分析法）で、青色蛍光体１ｇ当りから脱離するＨ_２Ｏガス分子数を測定した。また、Ｘ線回折によって青色蛍光体結晶のａ軸長及びｃ軸長も測定した。
ＴＤＳ分析では、日本真空技術（株）製の赤外線加熱型昇温脱離ガス質量分析装置を用いて次のように測定した。
【００６８】
Ｔａ製皿に詰めた蛍光体資料を予備排気室で１０^−４Ｐａオーダまで排気した後、測定室へ挿入し、１０^−７Ｐａオーダまで排気した。その後、赤外線ヒータを用いて、室温から１１００℃まで、昇温速度１０℃／ｍｉｎで昇温しながら、蛍光体から脱離するＨ_２Ｏ分子（質量数１８）の分子数を、測定間隔１５秒のスキャンモードで測定した。図７（ａ），（ｂ），（ｃ）は、パネルＮｏ．２，４，５から取り出した青色蛍光体について測定した結果を示すチャートである。
【００６９】
図７のチャートにおいて、青色蛍光体から脱離するＨ_２Ｏ分子数のピークは、１００〜２００℃付近と４００〜６００℃付近で見られる。
１００〜２００℃付近のピークは物理吸着ガスが脱離したもの、４００〜６００℃付近のピークは化学吸着ガスが脱離したものによると考えられる。
表１には、２００℃以上の領域で現れる脱離Ｈ_２Ｏの分子数のピーク値、即ち、４００〜６００℃付近の脱離Ｈ_２Ｏの分子数のピーク値、及び青色蛍光体結晶のａ軸長に対するｃ軸長の比の測定結果も示されている。
【００７０】
考察：
表１の測定結果において、実施例（パネルＮｏ．１〜４）と、比較例（パネルＮｏ．５）とについて、発光特性を比較すると、実施例は比較例より発光特性が優れている（パネル輝度が高く、色温度が高い。）。
パネルＮｏ．１〜４について発光特性を比較すると、パネルＮｏ．１，２，３，４の順で発光特性が向上している。
【００７１】
この結果から、蛍光体焼成工程、フリット仮焼工程、封着工程における水蒸気分圧が低いほど、発光特性（パネル輝度、色温度）が優れていることがわかる。
このように水蒸気分圧を低減すると発光特性が向上するのは、青色蛍光体層（ＢａＭｇＡｌ_１０Ｏ_１７：Ｅｕ）の熱劣化が防止され、色度座標ｙの値が小さくなるためと考えられる。
【００７２】
また、本実施例の青色蛍光体では、昇温脱離ガス質量分析における２００℃以上の領域で現れる脱離Ｈ_２Ｏの分子数のピーク値が１×１０^１６個／ｇ以下であり、ａ軸長に対するｃ軸長の比が４．０２１８以下であるのに対して、比較例の青色蛍光体では、上記各値より大きい値を示している。
［実施の形態２］
本実施形態のＰＤＰは、図１に示す実施の形態１のＰＤＰと同様の構成である。
【００７３】
また、ＰＤＰの製造方法についても上記実施の形態１と同様であるが、背面ガラス基板２１の外周部における通気口の開設位置や、封着ガラスフリットを塗布する形態などに違いがある。即ち、ＰＤＰの製造工程の中でも、封着工程においては、蛍光体焼成工程やフリット仮焼工程と比べて、加熱時に前面板上の保護層、蛍光体層、封着用ガラスなどから発生する水蒸気を含むガスが、隔壁で仕切られた狭い内部空間に閉じ込められることによって、蛍光体層が熱劣化をより大きく受けやすいことを考慮し、本実施形態では、封着工程において、内部空間に導入された乾燥空気が、隔壁間の空間を安定して流れるように工夫を施し、隔壁間の空間に発生するガスを効率よく排出して、蛍光体層の熱劣化を防止する効果を高めるようにしている。
【００７４】
図８〜図１６は、背面ガラス基板２１の外周部における通気口の開設位置や、封着ガラスフリットを塗布する形態の具体例を示す図である。なお、背面パネル基板２０には、画像表示領域全体にわたってストライプ状の隔壁２４が設けられているが、図８〜図１６においては、両サイドの数本の隔壁２４だけを表示しており、中央部の隔壁２４は図示を省略している。
【００７５】
これらの図に示すように、背面ガラス基板２１の外周部において、枠状の封着ガラス領域６０（封着ガラス層１５が配される領域）が設定されている。この封着ガラス領域６０は、最も外側に配列された隔壁２４に沿って延びる一対の縦封着領域６１と、隔壁２４の幅方向に延びる一対の横封着領域６２とからなる。
そして、封着時において、隔壁２４間の各間隙６５を乾燥空気が流れる。
【００７６】
以下、各図に示した例の特徴について説明する。
図８〜図１２に示す例では、封着ガラス領域６０の内側における対角位置に通気口２１ａ及び通気口２１ｂが開設されており、封着時において、上記図４のように通気口２１ａから導入される乾燥空気は、隔壁端部２４ａと横封着領域６２との間の間隙６３ａを通過し、隔壁２４間の各間隙６５に分配されこれを流れた後に、隔壁端部２４ｂと横封着領域６２との間の間隙６３ｂを通過して、通気口２１ｂから排出される。
【００７７】
図８に示す例では、横封着領域６２と隔壁端部２４ａとの間隙６３ａ及び横封着領域６２と隔壁端部２４ｂとの間隙６３ｂが、縦封着領域６１とそれに隣接する隔壁２４との間隙６４ａ及び間隙６４ｂよりも広く設定されている（間隙６３ａの最小幅をＤ１及び間隙６３ｂの最小幅をＤ２、間隙６４ａ最小幅をｄ１、間隙６４ｂの最小幅をｄ２とするとＤ１，Ｄ２＞ｄ１，ｄ２に設定されている）。
【００７８】
この構成によって、通気口２１ａから導入される乾燥空気が隔壁２４間の間隙６５を流通するときのガス流通抵抗が、間隙６４ａ及び間隙６４ｂを流通するときのガス流通抵抗と比べて小さくなるので、乾燥空気が間隙６３ａ及び６３ｂに広がりやすく、乾燥空気は、安定して各間隙６５に分配されこれを流通する。
従って、各間隙６５内に発生するガスは、効率良く排出されるため、封着工程における蛍光体層の熱劣化を防止する効果が高められる。
【００７９】
そして、間隙６３ａの最小幅Ｄ１及び間隙６３ｂの最小幅Ｄ２を、間隙６４ａの最小幅ｄ１及び間隙６４ｂの最小幅ｄ２と比べて、２倍あるいは３倍と大きくすればするほど、隔壁２４間の間隙６５を流通するときのガス流通抵抗が小さくなり、乾燥空気がより安定に各間隙６５を流れるので、効果も大きくなる。
、図９に示す例では縦封着領域６１は、それに隣接する隔壁２４と、中央部において接触しており、間隙６４ａの最小幅ｄ１及び間隙６４ｂの最小幅ｄ２は０である。この場合、間隙６４ａ及び間隙６４ｂには乾燥空気が流れないので、乾燥空気が更に安定して各間隙６５に分配される。
【００８０】
図１０〜図１６に示す例では、封着ガラス領域６０の内周に沿って、流止隔壁７０が設けられている。この流止隔壁７０は、縦封着領域６１に沿った縦隔壁７１と横封着領域６２に沿った横隔壁７２とからなる枠状であって、通気口２１ａ，２１ｂはこの流止隔壁７０の内側に隣接している（但し、図１２に示す例では、縦隔壁７１はなく、横隔壁７２だけ設けられている。）。
【００８１】
このような流止隔壁７０は、隔壁２４と同様の形状及び材料で形成されたものであって、隔壁２４を形成するときに流止隔壁７０も一緒に形成することができる。
この流止隔壁７０は、封着ガラス領域６０に配設される封着ガラスが、加熱されて軟化したときに、パネル中央の表示領域に流れ込むのを防止する。
【００８２】
図１０に示す例では、上記図８の場合と同様、横隔壁７２と隔壁端部２４ａとの間隙６３ａ及び横隔壁７２と隔壁端部２４ｂとの間隙６３ｂが、縦隔壁７１とそれに隣接する隔壁２４との間隙６４ａ及び間隙６４ｂよりも広く設定されており（Ｄ１，Ｄ２＞ｄ１，ｄ２）、図８の場合と同様の効果を奏する。
図１１に示す例では、更に、縦隔壁７１とそれに隣接する隔壁２４との間隙６４ａ及び間隙６４ｂを仕切る仕切隔壁７３ａ及び仕切隔壁７３ｂが設けられている。この仕切隔壁７３ａ及び７３ｂによって、縦隔壁７１とそれに隣接する隔壁２４とが、中央部において仕切られているため、図９の場合と同様に、間隙６４ａの最小幅ｄ１及び間隙６４ｂの最小幅ｄ２は０である。よって、図９の場合と同様の効果を奏する。
【００８３】
図１２に示す例では、図９の場合と同様に、縦封着領域６１は、それに隣接する隔壁２４と、中央部において接触しており、間隙６４ａの最小幅ｄ１及び間隙６４ｂの最小幅ｄ２は０であるので、図９の場合と同様の効果を奏する。
図１３に示す例では、流止隔壁７０内側における通気口２１ａ、２１ｂの位置が、対角位置ではなく、縦隔壁７１の中央付近に隣接して設けられていると共に、間隙６４ａ及び間隙６４ｂの端部において当該間隙を仕切る仕切隔壁７３ａ及び仕切隔壁７３ｂが設けられている。この場合、乾燥空気は、図１１の場合と同様に流通し、図１１の場合と同様の効果を奏する。
【００８４】
図１４に示す例は、図１１の例と略同様であるが、ガス入口となる通気口２１ａ及びガス出口になる通気口２１ｂが、２ヶ所づつに形成されていると共に、ストライプ状に並設されている複数の隔壁２４の中で、真ん中に位置する中央隔壁２７は横隔壁７２につながるよう延設されている。この場合、中央隔壁２７で分割された２つの領域ごとに、乾燥空気が別々に流通することになるが、間隙６３ａ及び間隙６３ｂが、間隙６４ａ及び間隙６４ｂよりも広く設定されているので、図１１の場合と同様の効果を奏する。また、この図１４の例では、２つの領域ごとに乾燥空気の流通量を調整することも可能である。
【００８５】
（本実施形態の変形例）
なお、本実施の形態において、封着工程で内部空間に流す乾燥空気は、水蒸気分圧を１５Ｔｏｒｒ以下（または露点温度が２０℃以下）とするのが好ましい点や、封着工程で流すガスは、乾燥空気に限られず、蛍光体層と反応を起こさない窒素等の不活性ガスであって水蒸気分圧の低いものを流しても、同様の効果が得られる点などについては、実施の形態１で説明した通りである。
【００８６】
また、本実施形態においては、背面パネル基板側に隔壁が設けられる場合について説明したが、前面パネル基板側に隔壁が設けられる場合においても、同様に実施することができ、同様の効果を奏する。
（実施例２）
【００８７】
【表２】

【００８８】
パネルＮｏ．６のＰＤＰは、本実施の形態における図１０の例に基づいて作製したＰＤＰであって、封着工程で流す乾燥空気の水蒸気分圧は２Ｔｏｒｒ（露点温度−１０℃）とした。
パネルＮｏ．７のＰＤＰは、背面パネル基板２０が、図１５に示すように、横隔壁７２と隔壁端部２４ａとの間隙６３ａ及び横隔壁７２と隔壁端部２４ｂとの間隙６３ｂが、縦隔壁７１とそれに隣接する隔壁２４との間隙６４ａ及び間隙６４ｂよりも狭く設定されている（Ｄ１，Ｄ２＜ｄ１，ｄ２）が、それ以外は図１０に示す例と同様である。このパネルＮｏ．７は、パネルＮｏ．６と同様の条件で封着を行うことによって作製したＰＤＰである。
【００８９】
パネルＮｏ．８のＰＤＰは、図１６に示すように、背面パネル基板２０に通気口２１ａが１カ所だけ設けられている。このパネルＮｏ．８は、比較例に係るものであって、封着工程において、前面パネル基板１０と背面パネル基板２０とを重ね合わせた後に内部空間に乾燥空気を流すことなく加熱昇温して封着したものである。
【００９０】
これらのパネルＮｏ．６〜８のＰＤＰにおいて、封着工程以外の製造過程は同じ条件とした。また、パネル構成も、通気口と流れ止め用隔壁以外は同じ構成とし、蛍光体膜厚は３０μｍとし、放電ガスはＮｅ（９５％）−Ｘｅ（５％）を５００Ｔｏｒｒで封入した。
〈発光特性試験〉
試験方法及び結果：
これらの各ＰＤＰについて、発光特性として、色補正なしで白バランスでのパネル輝度及び色温度、青色セル及び緑色セルを同じ電力で発光させたときの発光スペクトルのピーク強度比を測定した。
【００９１】
これらの測定結果は、表２に示す通りである。
また、作製した各ＰＤＰを分解し、背面パネル基板にクリプトンエキシマランプを用いて真空紫外線を照射し、全色を発光させたときの色温度、並びに、青色及び緑色を発光させたときの発光スペクトルのピーク強度比を測定したところ、上記点灯による結果と同等の結果が得られた。
【００９２】
更に、パネルから青色蛍光体を取り出し、ＴＤＳ分析法で青色蛍光体１ｇ当りから２００℃以上で脱離するＨ_２Ｏガス分子数を測定した。また、Ｘ線回折により、青色蛍光体結晶のａ軸長に対するｃ軸長の比も測定した。表２には、これらの結果も示されている。
考察：
表２の測定結果において、パネルＮｏ．６が最も良好な発光特性を示している。
【００９３】
パネルＮｏ．６の発光特性がパネルＮｏ．７の発光特性よりも良かったのは、パネルＮｏ．６では封着工程で、隔壁間の空間を乾燥空気が安定に流れ、内部で発生したガスを効率良く排出できたのに対し、パネルＮｏ．７は、通気口２１ａから導入された乾燥空気のほとんどが、間隙６３ａ及び間隙６３ｂを通って通気口２１ｂから排出され、隔壁間の間隙６５にはあまり流れなかったため、間隙６５に発生したガスを効率良く排出できなかったことが理由と考えられる。
【００９４】
また、パネルＮｏ．８の発光特性が悪いのは、乾燥ガスが間隙６５に流れないため、間隙６５に発生したガスが排出されないためと考えられる。
なお、本実施例では、図１０に基づくＰＤＰについて述べたが、図１０〜図１６のいずれに基づくＰＤＰにおいても、ほぼ同等に良好な発光特性が得られた。
［実施の形態３］
本実施形態のＰＤＰは、図１に示す実施の形態１のＰＤＰと同様の構成である。
【００９５】
また、ＰＤＰの製造方法においても上記実施の形態１と同様であるが、封着工程において、前面パネル基板１０と背面パネル基板２０とを封着する際に、内部空間が大気圧より低い圧力になるよう調整しつつ乾燥空気を流しながら、加熱を行う。
即ち、前面パネル基板１０及び背面パネル基板２０の少なくとも一方に封着用ガラスフリットを塗布して封着ガラス層を形成して、仮焼する。仮焼した後、両基板１０，２０を重ね合わせ、重ね合わせた両基板１０，２０を、上記図４に示す封着用加熱装置５０の加熱炉５１内に入れ、ガラス管２６ａ・２６ｂに配管５２ａ・５２ｂを連結し、配管５２ｂから真空ポンプ５４で排気することにより内部空間を減圧状態にしながら、ガス供給源５３からの乾燥空気を配管５２ａを通して一定の流量で送り込む。このとき、内部空間が大気圧より低い所定圧力に維持されるように、調整バルブ５５ａ，５５ｂを調整する。
【００９６】
このように内部空間に減圧状態で乾燥空気を流しながら、両パネル基板１０・２０を加熱昇温し、封着温度（ピーク温度４５０℃）で３０分間加熱することによって、封着ガラス層１５を軟化させて両パネル基板１０・２０を封着する。
そして、付着したパネル基板の内部空間を真空排気しながらパネルを焼成する（３５０℃で３時間）。その後、上記組成の放電ガスを所定の圧力で封入することによってＰＤＰが作製される。
【００９７】
（本実施の形態における効果）
本実施形態の封着工程においては、実施の形態１と同様、内部空間に乾燥ガスを流しながら封着を行うので、上記したように蛍光体が水蒸気と接触することによる熱劣化が抑えられる。
内部空間に流通している乾燥空気の水蒸気分圧については、実施の形態１と同様、１５Ｔｏｒｒ以下とすることが望ましく、さらに水蒸気分圧を、１０Ｔｏｒｒ以下、５Ｔｏｒｒ以下、１Ｔｏｒｒ、０．１Ｔｏｒｒ以下と低く設定するほど蛍光体の熱劣化を抑えることができ、乾燥空気の露点温度としては、これを２０℃以下とするのが好ましく、０℃以下、−２０℃以下、−４０℃以下とするのがより好ましい。
【００９８】
更に、本実施の形態では、内部空間を大気圧より低い圧力に保ちつつ封着を行うので、内部空間で発生した水蒸気が、実施の形態１と比べて、より効率よく外部へ排出される。また、内部空間を大気圧以下に維持しながら乾燥空気を導入しているので、封着時に内部空間が膨らむことなく、前面パネル基板１０と背面パネル基板２０とを密着性よく封着できる。
【００９９】
封着時における内部空間の圧力を低く設定するほど、水蒸気分圧を低くしやすく、密着性よく封着できる点で好ましい。この点で、内部空間の圧力は、５００Ｔｏｒｒ以下に設定することが好ましく、３００Ｔｏｒｒ以下に設定することがより好ましい。
一方、乾燥空気を流す場合、あまり圧力を低くし過ぎると、雰囲気ガスの酸素分圧が低くなる。そのため、ＰＤＰで多用されているＢａＭｇＡｌ_１０Ｏ_１７：Ｅｕ、Ｚｎ_２ＳｉＯ_４：ＭｎやＹ_２Ｏ_３：Ｅｕ等の酸化物系の蛍光体は、無酸素の雰囲気中で加熱すると、酸素欠陥等の欠陥が形成され、発光効率が低下起こりやすくなる。従って、この点から見ると、圧力を３００Ｔｏｒｒ以上に設定することが好ましいということが言える。
【０１００】
（本実施形態の変形例）
なお、本実施の形態では、封着工程において、内部空間に雰囲気ガスとして乾燥空気を流したが、蛍光体層と反応を起こさない酸素、窒素等の不活性ガスであって水蒸気分圧の低いものを流しても、同様の効果が得られる。ただし、酸素を含む雰囲気ガスを流す方が、輝度劣化が抑えられる点で好ましい。
【０１０１】
また、本実施の形態では、封着用ガラスが軟化していない低温時から、内部空間を減圧状態にしたが、この場合、前面パネル基板１０と背面パネル基板２０との隙間から、加熱炉５１内のガスが内部空間に流入することもあり得るので、加熱炉５１内にも乾燥空気を充填したり流すようにすることが好ましい。
また、封着工程において、加熱炉５１内のガスが内部空間に流入しないようにするため、封着用ガラスが軟化していない低温時には、内部空間から乾燥ガスを強制的に排出せずに、大気圧近くに保っておき、ある程度に温度が上昇してから強制的に排出して内部空間を大気圧より低くするようにしてもよい。この場合、排気を開始する温度は、封着用ガラスが軟化し始める温度以上とすることが望ましい。この点から、排気を開始する温度は、３００℃以上とすることが好ましく、より好ましくは３５０℃以上、更に４００℃以上とすることが好ましい。
【０１０２】
また、本実施形態では、封着工程を、内部空間を減圧状態にしつつ乾燥空気を流しながら行うことについて説明したが、蛍光体焼成工程、仮焼工程についても、減圧状態で乾燥空気を流した雰囲気中で行うことも可能であって、同様の効果を奏する。
また、本実施形態においても、上記実施の形態２で説明したようなパネル構造を適用すればより効果的である。
（実施例３）
【０１０３】
【表３】

【０１０４】
表３に、本実施の形態及び実施形態１に基づいて作製した実施例に係るＰＤＰ、及び比較例に係るＰＤＰについて、作製条件を示す。
パネルＮｏ．１１〜２１のＰＤＰは、本実施形態に基づくＰＤＰであって、封着工程でパネル内部に流す乾燥ガスの水蒸気分圧、パネル内部空間のガス圧、パネル内部空間を大気圧以下にし始める温度、および乾燥ガスの種類を変化させたものである。
【０１０５】
パネルＮｏ．２２のＰＤＰは、実施の形態１に基づくＰＤＰであって、封着工程において、内部空間に乾燥空気を導入したが、強制的に排気を行わなかったものである。
パネルＮｏ．２３のＰＤＰは、比較例に係るＰＤＰであって、封着工程において内部空間に乾燥ガスを導入することなく従来通りの方法で行ったものである。
【０１０６】
これらの各ＰＤＰにおいて、蛍光体層の膜厚は３０μｍとし、放電ガスはＮｅ（９５％）−Ｘｅ（５％）を５００Ｔｏｒｒで封入した。
〈発光特性試験〉
試験方法及び結果
これらの各ＰＤＰについて、発光特性として、青色発光の相対発光強度、青色発光の色度座標ｙの値、青色発光のピーク波長、白色表示（色補正なし）の色温度、青色セル及び緑色セルを同じ電力で発光させたときの発光スペクトルのピーク強度比を測定した。
【０１０７】
青色発光強度、青色発光の色度座標ｙの値、白色表示（色補正なし）の色温度については、実施の形態１で説明した方法で測定した。青色発光のピーク波長については、青色セルのみを点灯させ、その発光スペクトルを測定することによって求めた。 これらの測定結果は、表３に示す通りである。
なお、表３に示す青色発光の相対発光強度は、発光強度測定値を、比較例に係るパネルＮｏ．２３についての発光強度測定値を基準値１００としたときの相対値で表わしたものである。
【０１０８】
また、作製した各ＰＤＰを分解し、背面パネル基板にクリプトンエキシマランプを用いて真空紫外線を照射し、青色発光時の色度座標ｙ、全色を発光させたときの色温度、並びに、青色及び緑色を発光させたときの発光スペクトルのピーク強度比を測定したところ、上記点灯による結果と同等の結果が得られた。
更に、パネルから青色蛍光体を取り出し、ＴＤＳ分析法で青色蛍光体１ｇ当りから２００℃以上で脱離するＨ_２Ｏガス分子数を測定した。また、Ｘ線回折により、青色蛍光体結晶のａ軸長に対するｃ軸長の比も測定した。表３には、これらの結果も示されている。
【０１０９】
考察：
実施例（パネルＮｏ．１１〜２１）と、比較例（パネルＮｏ．２３）とで、発光特性を比較すると、実施例は比較例より発光特性が優れている（青色発光の発光強度が高く、白色表示の色温度が高い。）。
パネルＮｏ．１４及びパネルＮｏ．２２の発光特性を比べると、同等の値を示している。これは、内部空間に流れる乾燥空気の水蒸気分圧が同等であるなら、内部空間が大気圧状態であっても、減圧状態であっても同等の効果（発光特性）が得られることを示している。
【０１１０】
但し、パネルＮｏ．２２の中で、隔壁と前面パネル基板との間に隙間が見られたものもあった。これは、パネルＮｏ．２２においては、封着中に導入する乾燥ガスで内部空間が多少膨らんだためと考えられる。
パネルＮｏ．１１〜１４の発光特性を比較すると、Ｎｏ．１１〜１４の順で青色発光強度が高く、また青色発光の色度座標ｙも小さくなっていることがわかる。これより、乾燥空気の水蒸気分圧が低いほど、青色発光強度が高くなり、青色発光の色度座標ｙも小さくなることがわかる。これは、青色蛍光体の熱劣化が、水蒸気分圧を低減することによって防止されたためと考えられる。
【０１１１】
パネルＮｏ．１４〜１６の発光特性を比較すると、青色発光の色度座標ｙについては同等であって、青色発光の色度座標ｙが内部空間の圧力に影響されないことを示している。一方、青色発光の相対発光強度については、パネルＮｏ．１４〜１６の順で低下している。これは、雰囲気ガスの酸素分圧が低くなると、蛍光体に酸素欠陥等の欠陥が発生し、青色発光の発光強度が低下することを示している。
【０１１２】
パネルＮｏ．１４及びパネルＮｏ．２０，２１の発光特性を比べると、青色発光の色度座標ｙについては同等であって、青色発光の色度座標ｙが内部空間に流す乾燥ガスの種類に影響されないことを示している。一方、青色発光の相対発光強度については、パネルＮｏ．２０，２１では、パネルＮｏ．１４と比べて低くなっている。これは、乾燥ガスとして窒素やＮｅ（９５％）−Ｘｅ（５％）のような酸素が含まれないガスを用いた場合、蛍光体に酸素欠陥等の欠陥が発生し、発光強度が低下することを示している。
【０１１３】
パネルＮｏ．１４及びパネルＮｏ．１７〜１９の発光特性を比べると、パネルＮｏ．１７、１８、１４、１９の順で、青色発光強度が向上し、色度座標ｙも小さくなっている。これは、内部空間を真空排気して大気圧より低くし始める温度が高いほど、青色発光強度が高く、色度座標ｙも小さくなることを示しており、内部空間の排気開始温度を高くすることで、パネル周囲の雰囲気ガスがパネル内部空間に流入することを防げたためと考えられる。
【０１１４】
また、表３に示した各パネルＮｏ．における青色発光の色度座標ｙと青色発光のピーク波長との関係を見ると、青色発光の色度座標ｙの値が小さいほど、青色発光のピーク波長は短いことがわかる。これは、青色発光の色度座標ｙ値が小さいことと、青色発光のピーク波長が短いこととが同等であることを示している。
［実施の形態４］
本実施形態のＰＤＰは、図１に示す実施の形態１のＰＤＰと同様の構成である。
【０１１５】
本実施形態のＰＤＰの製造方法においては、前面パネル基板１０と背面パネル基板２０とを封着する封着工程までは、従来と同様の方法で行うが（即ち、封着工程では、前面パネル基板１０と背面パネル基板２０とを重ね合わせた後に内部空間に乾燥空気を流すことなく加熱昇温する。）、排気工程において、真空排気を開始する前に、乾燥ガスを内部空間に流しながら加熱する処理を行う点が異なっており、これによって、封着工程までに熱劣化した青色蛍光体層の発光特性を回復させることができる。
【０１１６】
以下、本実施の形態における排気工程について、詳述説明する。
本実施の形態の排気工程では、図４に示す封着用加熱装置と同じものを用いるので、図４を参照しながら説明する。
背面パネル基板２０の通気口２１ａ、２１ｂには、予めガラス管２６ａ・２６ｂが取り付けられている。ガラス管２６ａ・２６ｂに配管５２ａ・５２ｂを連結し、配管５２ｂから真空ポンプ５４で排気することによって内部空間を一旦真空にした後、真空ポンプ５４は使わずに配管５２ａから一定の流量で乾燥空気を送り込む。これによって、両パネル基板１０・２０間の内部空間に乾燥空気が流通し、配管５２ｂから排出される。
【０１１７】
このように内部空間に乾燥空気を流しながら、両パネル基板１０・２０を所定の温度になるまで加熱昇温する。
その後、乾燥空気の供給を停止し、今度は、真空ポンプ５４を用いて排気を行いながら、所定の排気温度に保つことによって、パネル基板１０・２０の内部に吸着されているガスを排出する。
【０１１８】
このように排気工程が終了した後、放電ガスを封入することによってＰＤＰが作製される。
（本実施形態の効果について）
本実施形態の排気工程によれば、排気工程における蛍光体層の熱劣化を防止する効果がある。
【０１１９】
また、ＰＤＰの製造工程の中で、蛍光体を塗布し蛍光体層を形成した後でこれを焼成する蛍光体焼成工程、封着用ガラスフリットを塗布した後でこれを仮焼する仮焼工程、並びに前面パネル基板と背面パネル基板を重ね合わせて封着する封着工程において、蛍光体層（特に青色蛍光体）に熱劣化が生じやすいが、仮に排気工程を行う前の封着工程などで蛍光体層が熱劣化して発光特性が低下していたとしても、蛍光体層の発光特性を回復させることが可能である。
【０１２０】
この理由は、次のように考えられる。
封着工程によって封着されたパネル基板を加熱昇温すると、内部空間にはガス（特に水蒸気）が放出される。例えば、封着されたパネル基板を大気中に放置しておくと内部にも水分等が吸着されるので、これを加熱すると水蒸気などが放出されることになる。ここで、本実施形態の排気工程によれば、真空排気を開始する前に、内部空間に乾燥空気を流通させながらパネル基板を加熱昇温させるという乾燥ガス処理で水蒸気等が放出され効率よくパネル外部に排出される。従って、乾燥ガス処理を行わず単純に真空排気を行う従来の排気工程と比べて、熱劣化は少なくなる。
【０１２１】
また、乾燥ガス処理によるガス排出作用によって、蛍光体層が熱劣化する時とは逆の反応が起こってガスが排出され、発光特性が回復されると考えられる。
このように本実施形態では、一旦熱劣化した青色蛍光体の発光特性を、最後の熱プロセスとなる排気工程で回復させることができるため、実用的効果も大きい。
【０１２２】
本排気工程における青色蛍光体の発光特性を回復させる効果をより高めるために、以下のように条件を設定することが好ましい。
排気工程におけるピーク温度（即ち、乾燥ガスを流しながら加熱するときの温度及び真空排気を行うときの温度の温度の中で高い方の温度）は、高く設定する程、青色蛍光体の発光特性回復効果は大きくなる。
【０１２３】
十分な発光特性の回復効果を得るために、ピーク温度（乾燥ガス処理時の温度及び排気温度に中で高い方の温度）は３００℃以上に設定することが好ましく、更に、３６０℃、３８０℃、４００℃とより高く設定するのが好ましい。但し、封着用ガラスが軟化して流れ出すほど温度を高くしないようにする必要がある。
また、乾燥ガス処理において加熱昇温する温度は、真空排気を行うときの排気温度よりも高く設定する方が好ましい。これは、真空排気時の排気温度が乾燥ガス処理における加熱温度より高いと、真空排気時において基板から内部空間に放出されるガス（特に水蒸気）によって効果が低減するのに対して、乾燥ガス処理時の加熱温度の方を高くすると、真空排気時において内部空間に放出されるガスが少なくなるためと考えられる。
【０１２４】
乾燥ガス処理において流通させる乾燥ガスの水蒸気分圧は、低く設定するほど好ましい。即ち、青色蛍光体の発光特性が回復する効果は、乾燥ガスの水蒸気分圧が低いほど向上するが、従来の真空排気工程と比較して顕著な効果が現れるのは、水蒸気分圧が１５Ｔｏｒｒ以下の範囲である。
熱劣化した青色蛍光体の発光特性を回復できることは、以下の実験からもわかる。
【０１２５】
図１７及び図１８は、青色蛍光体（ＢａＭｇＡｌ_１０Ｏ_１７：Ｅｕ）を一旦熱劣化させた後、空気中で再焼成して発光特性を回復させる効果の水蒸気分圧依存性を示す特性図であって、以下のように測定したものである。
先ず、青色蛍光体（色度座標ｙ値は、０．０５２）を、水蒸気分圧３０Ｔｏｒｒの空気中で焼成（ピーク温度４５０℃で２０分）することによって熱劣化させた。この熱劣化した青色蛍光体は、色度座標ｙ値は０．０９２、相対発光強度（全く未焼成の青色蛍光体の発光強度を１００としたときの発光強度の指標）は８５であった。
【０１２６】
そして、この熱劣化した青色蛍光体を、水蒸気分圧の値をいろいろに変えた空気中で所定のピーク温度で再焼成した後、相対発光強度並びに色度座標ｙ値を測定した。なお、再焼成時に、ピーク温度は３５０℃および４５０℃に設定し、ピーク温度維持時間は３０分とした。
図１７は、再焼成時における空気中の水蒸気分圧と測定した相対発光強度との関係を示し、図１８は、再焼成時における空気中の水蒸気分圧と測定した色度座標ｙ値との関係を示している。
【０１２７】
図１７，１８の特性図から、再焼成の温度が３５０℃，４５０℃のいずれの場合でも、再焼成時における空気中の水蒸気分圧が０〜３０Ｔｏｒｒの範囲において、青色相対発光強度は高く、青色色度座標ｙ値は小さくなっていることがわかる。これは、青色蛍光体が、水蒸気が多く含まれる雰囲気で焼成することによって熱劣化し発光特性が低下しても、より水蒸気分圧の低い雰囲気中で再焼成することによって、発光特性が回復すること、即ち、青色蛍光体の熱劣化が可逆的反応であることを示している。
【０１２８】
また、図１７，１８の特性図から、再焼成時における空気中の水蒸気分圧が低いほど、そして再焼成温度が高いほど、発光特性の回復効果が大きいこともわかる。
なお詳しい説明は省略するが、この他に、ピーク温度で維持する時間を変えて同様の測定を行った。その結果、ピーク温度で維持する時間が長いほど、発光特性の回復効果は大きいことがわかった。
【０１２９】
（本実施形態の変形例）
本実施形態の排気工程では、乾燥ガス処理を行うのに乾燥空気を用いたが、窒素やアルゴン等の不活性ガスを用いても同様に実施でき、同様の効果が得られる。
また、本実施形態の排気工程では、真空排気を開始する前に、乾燥空気を流通させながらパネル基板を加熱昇温させる乾燥ガス処理を行ったが、乾燥ガス処理を行わず単純に真空排気を行う場合でも、排気温度を従来の一般的な排気温度よりも高めの排気温度（３６０℃以上）に設定することによって、蛍光体層の発光特性をある程度回復することはできる。そして、この場合も、排気温度を高く設定する程、大きい発光特性回復効果が得られる。
【０１３０】
但し、乾燥ガス処理を行う方が、蛍光体層の発光特性回復効果は大きい。これは、内部空間が狭いために、乾燥ガス処理を行わないと、真空排気時に放出される水蒸気がパネル外部へ十分に排気されにくいためと考えられる。
また、本実施形態においても、上記実施の形態２で説明したようなパネル構造を適用すれば、乾燥ガス処理時においてより大きなガス排出効果が期待できる。
【０１３１】
（実施例４）
【０１３２】
【表４】

【０１３３】
パネルＮｏ．２１〜２９は、本実施の形態に基づいて、乾燥ガス処理を行った後、真空排気して作製した実施例のＰＤＰであって、乾燥ガス処理時の加熱温度および排気温度とを、いろいろな温度に変えて作製した。乾燥ガス処理では、乾燥空気を流しながら所定の加熱温度で３０分間維持し、真空排気時には、所定の排気温度で２時間維持した。
【０１３４】
パネルＮｏ．３０〜３２は、上記変形例に基づいて、乾燥ガス処理は行わず、３６０℃以上の排気温度で真空排気して作製した実施例のＰＤＰである。
パネルＮｏ．３３は、従来と同様に、乾燥ガス処理を行うことなく３５０℃で加熱しながら２時間真空排気して作製した比較例に係るＰＤＰである。
これらの各ＰＤＰにおいて、パネル構成は同じとし、蛍光体層の膜厚は３０μｍとし、放電ガスはＮｅ（９５％）−Ｘｅ（５％）を５００Ｔｏｒｒで封入した。
【０１３５】
〈発光特性試験〉
これらの各ＰＤＰについて、発光特性として、青色発光の相対発光強度、青色発光の色度座標ｙ値を測定した。
試験結果と考察：
これらの測定結果は、表４に示す通りである。なお、発光強度は、比較例のパネルＮｏ．３３の発光強度を１００とし、相対発光強度で示している。
【０１３６】
パネルＮｏ．２１〜２８は、いずれもパネルＮｏ．３３と比べて、発光強度が高く青色発光の色度座標ｙ値が小さい。これは、本実施の形態の排気工程を用いてＰＤＰを製造することによって、従来よりＰＤＰの発光特性が向上することを示している。
パネルＮｏ．２１〜２４の間で発光特性を比べると、パネルＮｏ．２１，２２，２３，２４の順で発光特性が向上している（相対発光強度が高くなり、色度座標ｙ値が小さくなっている）。これは、乾燥ガス処理時における加熱温度を高く設定する程、青色蛍光体層の発光特性回復効果が向上することを示している。
【０１３７】
また、パネルＮｏ．２４，２５，２６の間で発光特性を比較すると、パネルＮｏ．２６，２５，２４の順で発光特性が向上している。これは、乾燥ガス処理時における加熱温度を、真空排気時の排気温度よりも高く設定する方が、青色蛍光体層の発光特性回復効果が向上することを示している。
また、パネルＮｏ．２４，２７〜２９の間で発光特性を比べると、パネルＮｏ．２７，２８，２４，２９の順で発光特性が向上している。これは、乾燥ガス処理時の水蒸気分圧を小さく設定するほど、青色蛍光体層の発光特性回復効果が向上することを示している。
【０１３８】
また、パネルＮｏ．３０〜３２は、パネルＮｏ．３３と比べて、いずれも発光強度が高く青色発光の色度座標ｙ値が小さい。これは、上記変形例の排気工程を用いてＰＤＰを製造することによっても、従来よりＰＤＰの発光特性が向上することを示している。
ただし、パネルＮｏ．３０〜３２は、パネルＮｏ．２１等と比べると発光特性は劣っている。これは、乾燥ガス処理を行う方が、青色蛍光体層の発光特性の回復効果が大きいことを示している。
【０１３９】
［実施の形態５］
本実施形態のＰＤＰは、図１に示す実施の形態１のＰＤＰと同様の構成である。
ＰＤＰの製造方法においても、仮焼工程までは上記実施の形態１と同様であるが、前面パネル基板１０と背面パネル基板２０とを封着する際に、前面パネル基板１０と背面パネル基板２０の対向面を開放した状態で予備加熱し、加熱された状態で重ね合わせて封着する点が異なっている。
【０１４０】
本実施形態のＰＤＰは、青色セルのみを点灯させたときの発光色の色度座標ｙが０．０８以下、発光スペクトルのピーク波長が４５５ｎｍ以下であって、色補正なしの白バランスで色温度を７０００Ｋ以上とすることができる。更に製造条件によっては青色発光の色度座標ｙを０．０６以下とすることにより、色補正なしの白バランスで色温度を１１０００Ｋ程度とすることも可能となる。
【０１４１】
以下、本実施形態における封着工程について詳細に説明する。
図１９は、封着工程に用いる封着装置の構成を模式的に示す図である。
この封着装置８０は、前面パネル基板１０及び背面パネル基板２０を加熱する加熱炉８１に、加熱炉８１内ヘ導入する雰囲気ガスの導入量を調整するガス導入弁８２、加熱炉８１から排出するガスの排出量を調整するガス排出弁８３等が取り付けられて構成されている。
【０１４２】
加熱炉８１内は、ヒータ（不図示）によって高温に加熱できるようになっている。また、加熱炉８１内には、前面パネル基板及び背面パネル基板が加熱される雰囲気を形成する雰囲気ガス（例えば乾燥空気）を、ガス導入弁８２から導入することができ、ガス排出弁８３から真空ポンプ（不図示）で排気して加熱炉８１内を高真空にできるようにもなっている。そして、このガス導入弁８２及びガス排出弁８３で加熱炉８１内の真空度を調整することができる。
なお、雰囲気ガス供給源から加熱炉８１への間には、雰囲気ガスを低温（マイナス数十度）に冷却して水分を凝結させることによって除去するガス乾燥器（不図示）が設けられており、このガス乾燥器を経由することによって、雰囲気ガス中の水蒸気量（水蒸気分圧）が低減される。
【０１４３】
加熱炉８１の中には、前面パネル基板１０と背面パネル基板２０を重ね合わせて載置する載置台８４が設けられ、この載置台８４の上部には、背面パネル基板２０を平行移動させる移動ピン８５が設置されている。また載置台８４の上方には、背面パネル基板２０を下方に押圧するための押圧機構８６が設置されている。
【０１４４】
図２０は、加熱炉８１の内部の構成を示す斜視図である。
図１９，２０において、背面パネル基板２０は、隔壁の長手方向が図面横方向に沿うように配置されている。
図１９，２０に示すように、隔壁の長手方向（図面横方向）において、背面パネル基板２０は、前面パネル基板１０よりも若干長く設定されており、背面パネル基板２０の両端部が前面パネル基板１０の両端部より外方にはみ出している。なお、このはみ出し部分には、アドレス電極２２を駆動回路に接続するための引出し線が配設されている。そして、移動ピン８５及び押圧機構８６は、載置台８４上に載置される背面パネル基板２０のはみ出し部分を、背面パネル基板２０の４角付近において上下から挟みこむように配置されている。
【０１４５】
４つの移動ピン８５は、ピン上端が載置台８４の上面から上方に突き出ており、載置台８４の内部に設けられたピン昇降機構（不図示）によって同時に昇降できるようになっている。
４つの押圧機構８６の各々は、加熱炉８１の上部に固着されている円筒状の支持部８６ａと、支持部８６ａの内側を上下移動可能な状態で支持されているスライド棒８６ｂと、支持部８６ａの内部にあってスライド棒８６ｂを下方に付勢するバネ８６ｃとから構成され、バネ８６ｃの付勢力によりスライド棒８６ｂの下端が背面パネル基板２０を押圧するようになっている。
【０１４６】
図２１は、この封着装置を用いて予備加熱工程及び封着工程を行う際の動作を示す図である。
本図を参照しながら、仮焼・予備加熱・封着工程について説明する。
仮焼工程：
予め、前面パネル基板１０の対向面（背面パネル基板２０と対向する面）の外周部、あるいは背面パネル基板２０の対向面（前面パネル基板１０と対向する面）の外周部、あるいは前面パネル基板１０及び背面パネル基板２０両方の対向面の外周部に、封着用ガラス（ガラスフリット）からなるペーストを塗布し、３５０℃程度で１０〜３０分間、仮焼成することによって封着ガラス層１５を形成しておく（なお、図では、封着ガラス層１５は前面パネル基板１０の対向面に形成されている。）。
【０１４７】
予備加熱工程：
そして、前面パネル基板１０及び背面パネル基板２０を位置合わせして重ね合わせた状態で、載置台８４上の定位置に載置し、押圧機構８６をセットして背面パネル基板２０を押える（図２１（ａ）参照）。
次に、加熱炉８１内に雰囲気ガス（乾燥空気）を流通させながら（もしくはガス排出弁８３からの真空排気を併用しながら）、以下の操作を行う。
【０１４８】
移動ピン８５を上昇させ、背面パネル基板２０を上方に押し上げて平行移動させる（図２１（ｂ）参照）。これによって前面パネル基板１０及び背面パネル基板２０の対向面の間隙が広がり、背面パネル基板２０の蛍光体層２５が配された面は、加熱炉８１内の広い空間に開放されることになる。
この状態で加熱炉８１内を加熱昇温することによってパネル基板１０，２０からガスを放出する。そして、所定の温度（例えば４００℃）に達したら、予備加熱工程を終える。
【０１４９】
封着工程：
続いて、移動ピン８５を降下させて、背面パネル基板２０を前面パネル基板１０に再度重ね合わせる。このとき、背面パネル基板２０は、もとのように位置合わせした状態で重ね合わせられる（図２１（ｃ）参照）。
そして、加熱炉８１内が、封着ガラス層１５の軟化点より高い所定の封着温度（４５０℃前後）に達したら、１０〜２０分間その封着温度に維持する。このとき、軟化した封着用ガラスによって、前面パネル基板１０と背面パネル基板２０の外周部が封止される。この間、押圧機構８６によって背面パネル基板２０は前面パネル基板１０に押えつけられているので、安定した封着が行える。
【０１５０】
そして、封着が完了したら、押圧機構８６を解除して、封着された基板を取り出す。
このように封着工程を行った後、排気工程を行う。
本実施形態では、図１９，２０に示すように、背面パネル基板２０外周部に通気口２１ａが１つだけ設けられており、当該通気口２１ａに取り付けられたガラス管２６に真空ポンプ（不図示）を連結して排気を行う。そして、この排気工程の後、ガラス管２６から内部空間に放電ガスを封入し、通気口２１ａを封止してガラス管２６を切り取ることによって、ＰＤＰが作製される。
【０１５１】
（本実施形態の製造方法の効果について）
本実施形態の製造方法は、従来の製造方法と比べて、以下のような効果を奏する。
実施の形態１で説明したように、従来の一般的な製造方法では、封着工程において、放出ガスが狭い内部空間内に閉じ込められるため、内部空間に臨んでいる蛍光体層２５がガスの影響（特に保護層１４から放出される水蒸気の影響）で熱劣化しやすい。そして、蛍光体層（特に青色蛍光体層）が熱劣化すると発光強度が低下する。
【０１５２】
これに対して、本実施形態の製造方法によれば、予備加熱によって前面パネル基板１０及び背面パネル基板２０に吸着されている水蒸気などのガスが放出されるが、このとき両パネル基板１０・２０間に広い間隙が形成されているため、発生するガスが内部空間に閉じ込められることはない。そして、予備加熱後、両パネル基板１０・２０が加熱された状態で封着されるため、予備加熱の後で両パネル基板１０・２０に水分などが吸着することもない。よって、封着時に両パネル基板１０・２０から発生するガスは少なくなり、蛍光体層２５の熱劣化が防止されることになる。
【０１５３】
更に、本実施の形態では、予備加熱工程から封着工程までを、乾燥空気が流通する雰囲気で行っているので、雰囲気ガス中の水蒸気によって蛍光体層２５の熱劣化が生じることもない。
また、上記のように封着装置８０を用いることにより、予備加熱工程と封着工程を、同じ加熱炉８１内で連続して行うことができるので、これらの工程を迅速に且つ少ない消費エネルギーで行うことができる。
【０１５４】
また、上記のように封着装置８０を用いて、最初に前面パネル基板１０と背面パネル基板２０を位置合わせして載置すれば、位置合せされた状態で封着がなされる。
（予備加熱で昇温させる温度、並びに前面パネル基板と背面パネル基板とを重ね合わせるタイミングについての考察）
封着時に基板から発生するガス（保護層１４から放出される水蒸気）によって蛍光体層２５が熱劣化するのを防止する観点から、できるだけ高い温度まで加熱した後に重ね合わせる方がよいと言える。
【０１５５】
この点について更に詳細に調べるために、以下の実験を行った。
前面パネル基板１０と同様にＭｇＯ層が形成されたガラス基板を、一定の昇温速度で徐々に加熱昇温しながら、昇温脱離ガス質量分析計を用いて、ＭｇＯ層から放出される水蒸気量を経時的に測定した。
図２２は、その測定結果であって、７００℃までの各加熱温度における放出水蒸気量が示されている。
【０１５６】
図２２のグラフでは、２００℃〜３００℃付近に第１のピークが見られ、４５０℃〜５００℃付近で第２のピークが見られる。
図２２の結果から、保護層１４を加熱昇温していくと、第１のピークに相当する２００℃〜３００℃付近で水蒸気がかなり放出され、更に保護層１４を加熱昇温していくと、第２のピークに相当する４５０℃〜５００℃付近でも水蒸気がかなり放出されることが推測される。
【０１５７】
従って、封着工程における加熱昇温時に、保護層１４から放出される水蒸気が内部空間に閉じ込められるのを避けるためには、少なくとも２００℃程度の温度まで、好ましくは３００℃〜４００℃程度まで、前面パネル基板１０と背面パネル基板２０とを離した状態で加熱昇温するべきであると考えられる。
また、前面パネル基板１０と背面パネル基板２０とを離した状態で、４５０℃程度以上の高い温度まで昇温させてから重ね合わせれば、重ね合わせた後においてパネルからガスが放出されるのはほぼ完全に抑えられると考えられる。そして、この場合、封着時に蛍光体が熱劣化をほとんど受けない状態で封着でき、ＰＤＰ完成後においても、パネル内に吸着されている水蒸気が放電中に徐々に放出される可能性も極めて少なくなるので、パネル完成後の経時変化等を抑えることもできる。
【０１５８】
ただし、蛍光体層やＭｇＯ保護層を形成するときの焼成温度は一般的に５２０℃程度であるので、この温度を越えることは好ましくない。従って、４５０℃〜５２０℃程度の高温度に昇温させてから重ね合わせるのが更に好ましいということが言える。
一方、前面パネル基板と背面パネル基板が離された状態で、封着用ガラスの軟化点以上に加熱すると封着用ガラスが本来の位置から流れ出し、安定に封止できなくなる可能性がある。
【０１５９】
よって、発生するガスによる蛍光体層の劣化を防止することと、安定に封止することとを両立する観点に立つと、次の（１），（２），（３）のように考察することができる。
（１）前面パネル基板と背面パネル基板を離した状態で、用いる封着用ガラスの軟化点以下のできるだけ高い温度まで加熱昇温した後、重ね合わせて、封着するのがよいと考察できる。
【０１６０】
従って、例えば従来から一般的に使用されている軟化点が４００℃程度の封着用ガラスを用いる場合、封止の安定を保ちつつ、ガスによる蛍光体への影響をできるだけ少なくするために、前面パネル基板と背面パネル基板を離した状態で４００℃近くまで加熱昇温して、その後、前面パネル基板と背面パネル基板を重ね合わせて、更に軟化点以上に加熱して封着するのがよいと考えられる。
【０１６１】
（２）ここで、もっと軟化点の高い封着用ガラスを用いるようにすれば、それだけ高い温度まで前面パネル基板と背面パネル基板を離した状態で加熱昇温しても安定した封着ができることになる。従って、このように高軟化点の封着用ガラスを用いて、その軟化点近くまで加熱昇温し、その後、前面パネル基板と背面パネル基板を重ね合わせて、更に軟化点以上に加熱して封着すれば、封止の安定を保ちつつ、ガスによる蛍光体への影響を更に少なくすることができる。
【０１６２】
（３）一方、前面パネル基板あるいは背面パネル基板において、外周部に形成した封着ガラス層が軟化しても流れないような工夫をすれば、前面パネル基板と背面パネル基板を離した状態で封着用ガラスの軟化点以上の高温度まで加熱しても、安定した封止をすることができる。例えば、前面パネル基板あるいは背面パネル基板の外周部において、封着用ガラスを塗布する領域と表示領域との間に流れ止め用の隔壁を形成しておけば、封着用ガラスが軟化したときに表示領域に流れ出るのを防止することができる。
【０１６３】
従って、このような封着用ガラス流出防止の工夫をした上で、前面パネル基板と背面パネル基板を離した状態で封着用ガラスの軟化点以上の高温度まで加熱昇温し、前面パネル基板と背面パネル基板を重ね合わせて封着すれば、封止の安定を保ちつつ、ガスによる蛍光体への影響を更に少なくすることができる。
即ち、この場合、前面パネル基板と背面パネル基板を重ね合わせた後に加熱昇温しなくても封着できるので、重ね合わせ後におけるパネルからのガス放出をほぼ完全に抑えられる。よって、蛍光体が熱劣化をほとんど受けない状態で封着が可能となる。
【０１６４】
（雰囲気ガス及び圧力についての考察）
封着時に加熱炉８１内を流通させる雰囲気ガスとしては、酸素を含有しないガスよりも、空気のように酸素を含有するガスを用いることが望ましい。これは、実施の形態１で説明したように、ＰＤＰで多用されている酸化物系の蛍光体は、無酸素の雰囲気中で加熱すると発光効率が低下する傾向があるためである。
【０１６５】
また、雰囲気ガスとして外気を常圧で送り込んでもある程度の効果を奏するが、蛍光体層の劣化を防止する効果を高めるために、加熱炉８１内に乾燥空気をはじめとする乾燥ガスを流通させたり、加熱炉８１内を真空排気しながら行うことが望ましい。
乾燥ガスを流通させるのが好ましいのは、雰囲気ガスに含まれている水蒸気によって蛍光体層の熱劣化が引起こされることがないためである。また、加熱炉８１内を真空排気するのが望ましいのは、加熱に伴ってパネル基板１０・２０から放出されるガス（水蒸気等）が効率よく排出されるためである。
【０１６６】
雰囲気ガスとして乾燥ガスを流通させる場合、その水蒸気分圧が低いほど青色蛍光体層の熱劣化が抑えられる（実施形態１で説明した図５，６の実験結果参照）。十分な効果を得るために、水蒸気分圧は、１５Ｔｏｒｒ以下に設定するのが望ましく、更に、１０Ｔｏｒｒ、５Ｔｏｒｒ、１Ｔｏｒｒ、０．１Ｔｏｒｒと低く設定するほどより効果が期待できる。
【０１６７】
（封着用ガラスの塗布について）
ＰＤＰの封着時において、一方の基板にのみ（一般的には背面基板側のみ）に封着用ガラスを塗布して、両基板を重ね合わせて封着するのが一般的である。
ところで、本実施の形態では、封着装置８０内で、押圧機構８６によって背面パネル基板２０を前面パネル基板１０に押圧するようにしているので、クランプで締め付けるように強い圧力で押さえつけることは難しい。
【０１６８】
そのため、背面ガラス基板側だけに封着ガラス層を形成して封着すると、封着用ガラスと前面ガラス板との塗れ性が悪い場合、封着用ガラスによる封着が完全になされないこともあり得るが、前面ガラス基板と背面ガラス基板の両方に封着ガラス層を形成しておけば、封着後に前面ガラス基板と背面ガラス基板が完全に接着されるので、歩留まり良くＰＤＰを製造することができる。
【０１６９】
なお、このように前面ガラス基板と背面ガラス基板の両方に封着ガラス層を形成して封着する方法は、本実施の形態の場合に限らず、一般的なＰＤＰ製造の封着工程において、歩留まりよく封着を行うのに有効である。
（本実施形態の変形例）
なお、上記封着装置８０においては、加熱前に前面パネル基板１０と背面パネル基板２０とを重ね合わせて位置合わせした後、移動ピン８５で背面パネル基板２０を押し上げることによって背面パネル基板２０を前面パネル基板１０から引き離すようにしたが、背面パネル基板２０を前面パネル基板１０から引き離す方法はこれに限らない。
【０１７０】
例えば、図２３に示す例では、前面パネル基板１０の外周の外側に填まるような枠体８７を、上下にスライド駆動する吊下げ棒８８で加熱炉の上方から吊下げており、背面パネル基板２０のはみ出し部分を枠体８７上に載せて背面パネル基板２０を上下に平行移動することができるようになっている。即ち、枠体８７を上方に引き上げることによって背面パネル基板２０を前面パネル基板１０から引き離し、枠体８７を下方に下げることによって、背面パネル基板２０を前面パネル基板１０に重ね合わせることができる。
【０１７１】
また、上記封着装置８０では、押圧機構８６で背面パネル基板２０を前面パネル基板１０に押圧するようにしたが、図２３に示す例では、押圧機構８６を設ける代わりに背面パネル基板２０上に重り８９を載せてある。この場合、枠体８７を下に降ろしたときに、重り８９にかかる重力で背面パネル基板２０が前面パネル基板１０に押えつけられる。
【０１７２】
図２４は、別の変形例における封着工程の動作を示す図である。
この図２４の例では、封着工程において、背面パネル基板２０を部分的に接近させた状態で回転させることによって、前面パネル基板１０から引き離したり、重ね合わせたりするようになっている。
即ち、載置台８４の上部には、図２０の場合と同様に、背面パネル基板２０の４角付近に合計４つのピン８５ａ・８５ｂが設けられているが、一方側（図２４で左側）にある１対のピン８５ａは、その先端で、背面パネル基板２０の一定位置を支持しており（例えば、ピン８５ａの先端部を球面状に形成すると共に、背面パネル基板２０にも球面状の凹みを形成して填め込むようにする。）、他方側（図２４で右側）にある１対のピン８５ｂは、上下に駆動できるようになっている。
【０１７３】
この場合、図２４（ａ）に示すように、前面パネル基板１０と背面パネル基板２０を重ね合わせた状態で載置台８４に載置し、図２４（ｂ）に示すように、一対のピン８５ｂを上方に動かすことによって、一対のピン８５ａの先端を中心にして背面パネル基板２０を回転させ、前面パネル基板１０から引き離すことができる。また、図２４（ｃ）に示すように、一対のピン８５ｂを下方に動かすことによって、背面パネル基板２０を同じ経路で逆方向に回転させ、前面パネル基板１０に位置合わせされた状態で重ね合わせることもできる。
【０１７４】
なお、図２４（ｂ）の状態では、一対のピン８５ａ側で、前面パネル基板１０と背面パネル基板２０とが接触状態にあるが、背面パネル基板２０の蛍光体層が配設された対向面は開放されているので、ガスが発生しても内部空間に閉じこめられることはない。
（実施例５）
【０１７５】
【表５】

【０１７６】
パネルＮｏ．４１〜５０のＰＤＰは、本実施の形態に基づいて、前面パネル基板と背面パネル基板を加熱するときの雰囲気ガス、圧力、重ね合わせるときの温度やタイミングをいろいろ変えて封着工程を行い、作製した実施例である。
仮焼成は、いずれも３５０℃で行った。
雰囲気ガスとして、パネルＮｏ．４１〜４６，４８，４９，５０では、水蒸気分圧を０〜１２Ｔｏｒｒの範囲内でいろいろな値に設定した乾燥空気を用いた。また、パネルＮｏ．４７では、真空排気しながら加熱を行った。
【０１７７】
パネルＮｏ．４３〜４７においては、封着工程で、パネル基板を室温から加熱昇温して４００℃（封着用ガラスの軟化点より低い温度）に達したときに、両パネル基板を重ね合わせた。そして、更に加熱昇温して封着温度４５０℃（封着用ガラスの軟化点以上の温度）に達したら、１０分間以上保持し、その後、排気温度３５０℃に降温し、この排気温度に維持しながら排気工程を行った。
【０１７８】
これに対して、パネルＮｏ．４１，４２では、封着工程において、少し低めの温度２５０℃，３５０℃で、両パネル基板を重ね合わせた。
また、パネルＮｏ．４８では、封着工程において、封着温度４５０℃まで昇温した後に、両パネル基板を重ね合わせ、パネルＮｏ．４９では、封着工程において、封着温度（ピーク温度）５００℃まで昇温した後に、両パネル基板を重ね合わせた。
【０１７９】
また、パネルＮｏ．５０では、封着工程において、ピーク温度４８０℃まで昇温した後、封着温度４５０℃まで降温してから両パネル基板を重ね合わせて封着した。
パネルＮｏ．５１のＰＤＰは、本実施の形態５の図２４に示す変形例に基づいて、封着温度（ピーク温度）４５０℃まで昇温した後に、両パネル基板を重ね合わせて封着したものである。
【０１８０】
パネルＮｏ．５２のＰＤＰは、先ず、室温で前面パネル基板と背面パネル基板を重ね合わせておき、大気圧の乾燥空気中で４５０℃まで加熱昇温して封着することによって作製した比較例である。
なお、上記パネルＮｏ．４１〜５２のＰＤＰにおいて、蛍光体膜厚は３０μｍ、放電ガスはＮｅ（９５％）−Ｘｅ（５％）、その封入圧力は５００Ｔｏｒｒとし、パネル構成が同一となるようにした。
【０１８１】
〈発光特性試験〉
試験方法及び結果：
上記パネルＮｏ．４１〜５２の各ＰＤＰについて、発光特性として、青色セルのみを点灯させたときの発光強度と色度座標ｙと発光スペクトルのピーク波長、及び色補正なしで白バランスでのパネル輝度及び色温度、青色セル及び緑色セルを同じ電力で発光させたときの発光スペクトルのピーク強度比を測定した。
【０１８２】
更に、作製した各ＰＤＰを分解し、背面パネル基板の青色蛍光体層にクリプトンエキシマランプを用いて真空紫外線（中心波長１４６ｎｍ）を照射し、発光光の色度座標ｙを測定した。
これらの測定結果は、表５に示す通りである。なお、表５に示す青色セルの発光強度は、パネルＮｏ．５２（比較例）の発光強度を１００とした相対発光強度である。
【０１８３】
また、作製した各ＰＤＰを分解し、背面パネル基板にクリプトンエキシマランプを用いて真空紫外線を照射し、全色発光時の色温度、並びに、青色及び緑色を発光させたときの発光スペクトルのピーク強度比を測定したところ、上記点灯による結果と同等の結果が得られた。
また図２５は、パネルＮｏ．４５，５０，５２のＰＤＰについて、青色セルのみを点灯させたときの発光スペクトルである。
【０１８４】
なお、表５には示していないが、赤色セル及び緑色セルの発光色の色度座標ｘ、ｙについては、パネルＮｏ．４１〜５３のいずれも略同じ値であり、赤色が（０．６３６，０．３５０）、緑色が（０．２５１，０．６９２）であった。比較例のＰＤＰでは、青色セル発光色の色度座標が（０．１７０，０．０９０）、発光スペクトルのピーク波長が４５８ｎｍであった。
【０１８５】
更に、パネルから青色蛍光体を取り出し、ＴＤＳ分析法で青色蛍光体１ｇ当りから２００℃以上で脱離するＨ_２Ｏガス分子数を測定した。また、Ｘ線回折により、青色蛍光体結晶のａ軸長に対するｃ軸長の比も測定した。表５には、これらの結果も示されている。
考察：
パネルＮｏ．４１〜５１と、パネルＮｏ．５２とについて発光特性を比較すると、パネルＮｏ．４１〜５１のいずれにおいても、パネルＮｏ．５２より発光特性が優れている（相対発光強度が高く、色度座標ｙが小さい）。これは、上記実施例の封着方法によれば、比較例の封着方法と比べて、両パネル基板を重ね合わせた後に内部空間に放出されるガスが少なくなるからと考えられる。
【０１８６】
パネルＮｏ．５２のＰＤＰでは、青色発光の色度座標ｙが０．０８８であって、この場合、色補正なしで白バランスでの色温度は５８００Ｋであるのに対して、パネルＮｏ．４１〜５１では、青色発光の色度座標ｙが０．０８以下で、色補正なしで白バランスでの色温度は６５００Ｋ以上である。特に、パネルＮｏ．４８，４９，５０，５１のように青色の色度座標ｙが低いＰＤＰでは、色補正なしで白バランスで１１０００Ｋ程度の高い色温度が実現されている。
【０１８７】
図２６は、実施例と比較例のＰＤＰについて、青色付近の色再現域をＣＩＥ色度図上に示したものである。
図中の領域（ａ）は青色発光の色度座標ｙが０．０９（発光スペクトルのピーク波長が４５８ｎｍ）程度の場合（パネルＮｏ．５２相当）について、領域（ｂ）は青色発光の色度座標ｙが０．０８（発光スペクトルのピーク波長が４５５ｎｍ）程度の場合（パネルＮｏ．４１相当）について、領域（ｃ）は青色発光の色度座標ｙが０．０５２（発光スペクトルのピーク波長が４４８ｎｍ）程度の場合（パネルＮｏ．５０相当）について、青色付近における色再現域を示している。
【０１８８】
本図から、青色付近における色再現域が、（ａ）と比べて、（ｂ）では広くなり、（ｃ）では更に広くなっていることがわかる。これは、青色セル発光の色度座標ｙが小さくなる（発光スペクトルのピーク波長が短くなる）に従って、青色付近における色再現域の広いＰＤＰを実現できることを示している。
次に、パネルＮｏ．４１，４２，４５，４８（いずれも乾燥空気の水蒸気分圧は２Ｔｏｒｒ）の間で発光特性を比較すると、パネルＮｏ．４１，４２，４５，４８の順で発光特性が向上している（相対発光強度が高く、色度座標ｙが小さくなっている）。この結果から、前面パネル基板１０と背面パネル基板２０とを重ね合わせるときの温度を高く設定するほど、ＰＤＰの発光特性が向上することがわかる。
【０１８９】
これは、前面パネル基板１０と背面パネル基板２０を離した状態で高い温度まで予備加熱する程、各パネル基板から放出されるガスを十分に排気できるため、両パネル基板を重ね合わせた後に内部空間に放出されるガスが少なくなるからと考えられる。
また、パネルＮｏ．４３，４４，４５，４６（封着工程での温度プロファイルが同じ）の間で発光特性を比較すると、パネルＮｏ．４３，４４，４５，４６の順で発光特性が向上している（色度座標ｙが小さい）。この結果から、雰囲気ガス中の水蒸気分圧が低いほど発光特性が向上することがわかる。
【０１９０】
また、パネルＮｏ．４６及びパネルＮｏ．４７（封着工程での温度プロファイルが同じ）について発光特性を比較すると、パネルＮｏ．４６の方がＰＤＰの発光特性が若干優れている。
これは、パネルＮｏ．４６では酸素が含まれる雰囲気ガス中で予備加熱されているのに対して、パネルＮｏ．４７では無酸素雰囲気中で予備加熱されているので、酸化物である蛍光体の酸素が一部が抜けて酸素欠陥が形成されたためと考えられる。
【０１９１】
また、パネルＮｏ．４８及びパネルＮｏ．５１について発光特性を比較すると、発光特性はほとんど同じであることがわかる。これは予備加熱する際に、前面パネル基板１０と背面パネル基板２０の対向面を完全に引き離して開放した場合と、一部を接触させた状態で開放した場合とで、ＰＤＰの発光特性にほとんど差がないことを示している。
【０１９２】
また、表５に示した各パネルＮｏ．において、青色蛍光体層を真空紫外線で励起したときに放出される光の色度座標ｙと、青色セルのみを点灯させたときの色度座標ｙとは、ほぼ同じ値を示している。
また、表５に示した各パネルＮｏ．における青色発光の色度座標ｙと青色発光のピーク波長との関係を見ると、青色発光の色度座標ｙの値が小さいほど、青色発光のピーク波長は短いことがわかる。これは、青色発光の色度座標ｙ値が小さいことと青色発光のピーク波長が短いこととが同等の意味を持つことを示している。
［実施の形態６］
本実施形態のＰＤＰは、図１に示す実施の形態１のＰＤＰと同様の構成である。
【０１９３】
またＰＤＰの製造方法については、上記実施の形態５とほぼ同様であるが、前面パネル基板１０および背面パネル基板２０の少なくとも一方に封着用ガラスを塗布した後、封着装置８０の加熱炉８１内で、仮焼工程・封着工程・排気工程を、連続して行う点が異なっている。
以下、本実施形態における仮焼・封着・排気工程について以下に詳細に説明する。
【０１９４】
本実施形態の仮焼工程・封着工程・排気工程は、上記実施形態５の図１８，１９に示す封着装置を用いて行う。但し本実施形態では、図２７に示すように、背面パネル基板２０の通気口２１ａに取り付けられているガラス管２６には、加熱炉８１の外部から挿設された配管９０が接続されている。
図２７は、この封着装置を用いて仮焼工程から排気工程までを行う際の動作を示す図である。
【０１９５】
本図を参照しながら、仮焼・予備加熱・封着・排気工程について説明する。
仮焼工程：
予め、前面パネル基板１０の対向面（背面パネル基板２０と対向する面）の外周部、あるいは背面パネル基板２０の対向面（前面パネル基板１０と対向する面）の外周部、あるいは前面パネル基板１０及び背面パネル基板２０両方の対向面の外周部に、封着用ガラスペーストを塗布することによって封着ガラス層１５を形成しておく（なお、図では、封着ガラス層１５は前面パネル基板１０の対向面に形成されている。）。
【０１９６】
そして、前面パネル基板１０及び背面パネル基板２０を位置合わせして重ね合わせた状態で、載置台８４上の定位置に載置し、押圧機構８６をセットして背面パネル基板２０を押える（図２７（ａ）参照）。
次に、加熱炉８１内に雰囲気ガス（乾燥空気）を流通させながら（もしくはガス排出弁８３からの真空排気を併用しながら）、以下の操作を行う。
【０１９７】
移動ピン８５を上昇させ、背面パネル基板２０を上方に押し上げて平行移動させる（図２７（ｂ）参照）。これによって前面パネル基板１０及び背面パネル基板２０の対向面の間隙が広がり、背面パネル基板２０の蛍光体層２５が配された面は、加熱炉８１内の広い空間に開放されることになる。
この状態で加熱炉８１内を仮焼温度（３５０℃程度）まで加熱昇温し、この仮焼温度で１０〜３０分間程度保持することによって仮焼する。
【０１９８】
予備加熱工程：
パネル基板１０，２０を更に加熱昇温して、パネル基板１０，２０に吸着されているガスを放出させる。そして、所定の温度（例えば４００℃）に達したら、予備加熱工程を終える。
封着工程：
続いて、移動ピン８５を降下させて、背面パネル基板２０を前面パネル基板１０に再度重ね合わせる。このとき、背面パネル基板２０は、もとのように位置合わせした状態で重ね合わせられる（図２７（ｃ）参照）。
【０１９９】
そして、加熱炉８１内の温度が、封着ガラス層１５の軟化点より高い封着温度（４５０℃前後）に達したら、１０〜２０分間その封着温度に維持する。このとき、軟化した封着用ガラスによって、前面パネル基板１０と背面パネル基板２０の外周部が封止される。この間、押圧機構８６によって背面パネル基板２０は前面パネル基板１０に押えつけられているので、安定した封着が行える。
【０２００】
排気工程：
加熱炉８１内を封着用ガラスの軟化点より低い排気温度に下げ、その排気温度に維持して焼成しながら（例えば、３５０℃程度で１時間）、封着した両パネル基板の内部空間を高真空（８×１０^−７Ｔｏｒｒ）に排気することによって、内部空間のガス抜きを行う。この排気工程は、配管９０に真空ポンプ（不図示）を連結して行う。
【０２０１】
そして、この排気工程の後、内部空間を真空に保ったままパネル基板を室温まで冷却し、ガラス管２６から内部空間に放電ガスを封入し、通気口２１ａを封止してガラス管２６切り取ることによって、ＰＤＰが作製される。
（本実施形態の封着方法の効果について）
従来は、仮焼工程、封着工程、排気工程は、加熱炉を用いて別々に行われ、工程と工程では基板が室温まで冷却されていたため、後の工程で加熱昇温するのに、長い時間が必要で消費エネルギーも多くなるが、本実施の形態では、仮焼工程、予備加熱工程、封着工程、排気工程を、室温まで降温することなく、同じ封着装置の中で連続して行っているので、これら一連の工程を速く行い且つ加熱のためのエネルギー消費も低くすることができる。
【０２０２】
更に、本実施形態では、加熱炉８１内を封着工程を行う封着温度まで昇温させる途中で、仮焼工程、予備加熱工程を行っているので、仮焼工程から封着工程までをより迅速に且つ低い消費エネルギーで行うことができ、更に、封着工程の後、封着された基板を室温まで降温させる途中で排気工程を行っているので、封着工程から排気工程までをより迅速に且つ低い消費エネルギーで行うことができる。
【０２０３】
更に、本実施形態の封着方法によれば、従来の封着方法と比べて、以下に説明するように、上記実施の形態５と同様の効果を奏する。
通常、前面パネル基板や背面パネル基板には、水蒸気などのガスが吸着されているが、これらの基板を加熱昇温すると、吸着されているガスが放出される。
従来の一般的な製造方法では、仮焼工程の後、封着工程では、前面パネル基板と背面パネル基板とを室温で重ね合わせてから加熱昇温して封着するので、この封着工程時に、前面パネル基板と背面パネル基板に吸着されているガスが放出される。仮焼工程において、基板に吸着されているガスがある程度抜けても、その後、封着工程開始時まで大気中で室温にすることによって再びガスが吸着されるので、封着工程においてガスの放出は生じる。ここで、放出されたガスが狭い内部空間内に閉じ込められるため、特に保護層１４から放出される水蒸気の影響で蛍光体層が熱劣化し、その発光強度が低下しやすい。
【０２０４】
これに対して、本実施形態の製造方法によれば、封着工程や予備加熱工程によって前面パネル基板１０及び背面パネル基板２０に吸着されている水蒸気などのガスが放出されるが、このとき両パネル基板１０・２０間に広い間隙が形成されているため、発生するガスが内部空間に閉じ込められることはない。そして、予備加熱後、両パネル基板１０・２０が加熱された状態で封着されるため、予備加熱の後で両パネル基板１０・２０に水分などが吸着することもない。よって、封着時に両パネル基板１０・２０から発生するガスは少なくなり、蛍光体層２５の熱劣化が防止されることになる。
【０２０５】
また、上記のように封着装置８０を用いることにより、最初に前面パネル基板１０と背面パネル基板２０を位置合わせしておけば、位置合せされた状態で封着がなされる。
更に、本実施の形態では、予備加熱工程から封着工程までを、乾燥空気が流通する雰囲気で行っているので、雰囲気ガス中の水蒸気によって蛍光体層２５の熱劣化が生じることもない。
【０２０６】
なお、予備加熱で昇温させる温度、前面パネル基板と背面パネル基板とを重ね合わせるタイミングの好ましい条件、並びに、雰囲気ガスの種類、圧力、水蒸気分圧の好ましい条件については、上記実施の形態５で説明した通りである。
（本実施形態の変形例）
なお、本実施の形態では、上述したように仮焼工程−予備加熱工程−封着工程−排気工程を、同じ装置の中で連続的に行ったが、予備加熱工程を省略することもでき、その場合でも同様の効果がある程度得られる。また、仮焼工程−封着工程だけを同じ装置の中で連続的に行ったり、封着工程−排気工程だけを同じ装置の中で連続的に行うことによっても、ある程度の効果を得ることはできる。
【０２０７】
また、本実施形態において、封着工程の後に、加熱炉８１内を封着用ガラスの軟化点より低い排気温度（３５０℃）に下げてから排気工程を行ったが、封着工程における封着温度と同程度の高い温度のまま排気工程を行うようにすれば、短時間で十分に排気することが可能である。但し、この場合、封着用ガラス流出防止に対する工夫（例えば、図１０〜１６に示した流止隔壁）を施すことが必要と考えられる。
【０２０８】
また、本実施の形態では、封着に際して、前面パネル基板１０と背面パネル基板２０の対向面を開放した状態で、仮焼工程・予備加熱工程を行ったが、上記実施の形態３のように、前面パネル基板１０と背面パネル基板２０を位置合わせして重ね合わせて、そのまま内部空間を減圧にしつつ乾燥空気を流しながら加熱昇温して封着を行う場合でも、以下のようにして、仮焼工程−封着工程−排気工程を同じ装置の中で連続的に行うことは可能である。
【０２０９】
即ち、図４の封着用加熱装置５０を用い、前面パネル基板１０及び背面パネル基板２０の少なくとも一方の対向面に、封着用ガラスを塗布し、封着ガラス層１５を形成し、仮焼は行わずに位置合わせしながら重ね合わせ、加熱炉５１の中に入れる。
そして、背面パネル基板２０の通気口２１ａに付けられたガラス管２６ａに配管５２ａを連結し、配管５２ａから真空ポンプ（不図示）で排気する。それと共に、背面パネル基板２０の通気口２１ｂに付けられたガラス管２６ｂに配管５２ｂを連結し、乾燥空気を送り込むことによって、両パネル基板１０・２０間の内部空間を、減圧にしつつ乾燥空気が流れる状態にする。
【０２１０】
そして、両パネル基板１０・２０間の内部空間をこの状態に保ちながら、加熱炉５１の内部を、仮焼温度まで昇温して仮焼する（３５０℃、１０〜３０分保持）。
このとき、単に前面パネル基板１０と背面パネル基板とを重ね合わせた状態でパネルを加熱昇温するだけでは、封着ガラス層に酸素が供給されにくいので仮焼が十分にできないが、上記のようにパネル内部に乾燥空気を流しながら加熱すれば、十分に仮焼を行うことが可能である。
【０２１１】
次に、更に、封着ガラスの軟化点以上の封着温度まで加熱昇温して保持する（例えば、ピーク温度が４５０℃、３０分保持）ことによって封着を行う。
そして、加熱炉５１内を封着用ガラスの軟化点より低い排気温度に下げ、その排気温度に維持しながら、封着した両パネル基板の内部空間から高真空で排気を行うことによって、内部空間からガス抜きを行い、排気工程の後、パネル基板を室温まで冷却し、ガラス管２６から内部空間に放電ガスを封入し、通気口２１ａを封止してガラス管２６を切り取ることによって、ＰＤＰを作製する。
【０２１２】
この変形例の場合も、本実施の形態と同様に、仮焼工程、封着工程、排気工程を、同じ封着装置の中で、室温まで降温することなく連続的に行っているので、これら一連の工程を速く行い且つ加熱のためのエネルギー消費も低くすることができる。
なお、この変形例において、加熱炉５１内で、仮焼工程−封着工程だけ、或は封着工程−排気工程だけを連続して行うことも可能である。
（実施例６）
【０２１３】
【表６】

【０２１４】
パネルＮｏ．６１〜６９は本実施形態に基づいて作製した実施例にかかるＰＤＰであって、前面パネル基板と背面パネル基板を加熱するときの雰囲気ガス、圧力、重ね合わせるときの温度やタイミングをいろいろ変えて封着工程を行った。
図２８は、パネルＮｏ．６３〜６７のＰＤＰを製造する際に、仮焼工程−封着工程−排気工程で用いた温度プロファイルである。
【０２１５】
雰囲気ガスとして、パネルＮｏ．６１〜６６，６８，６９では、水蒸気分圧を０〜１２Ｔｏｒｒの範囲内でいろいろな値に設定した乾燥空気を用い、パネルＮｏ．７０では未乾燥の空気を用いた。また、パネルＮｏ．６７では、真空排気しながら加熱を行った。
パネルＮｏ．６３〜６７では、パネル基板を室温から加熱昇温して、３５０℃に達したら３５０℃で１０分間保持して仮焼を行い、更に加熱昇温して４００℃（封着用ガラスの軟化点より低い温度）に達したときに、両パネル基板を重ね合わせた。そして、更に加熱昇温して封着温度４５０℃（封着用ガラスの軟化点以上の温度）に達したら、１０分間以上保持し、その後、炉内を３５０℃まで下降させ、３５０℃に維持しながら排気工程を行った。
【０２１６】
これに対して、パネルＮｏ．６１，６２の封着工程では、少し低めの温度２５０℃並びに３５０℃で、両パネル基板を重ね合わせた。
また、パネルＮｏ．６８の封着工程では、封着温度４５０℃まで昇温した後に、両パネル基板を重ね合わせ、パネルＮｏ．６９の封着工程では、ピーク温度４８０℃まで昇温した後、封着温度４５０℃まで降温してから両パネル基板を重ね合わせて封着した。
【０２１７】
パネルＮｏ．７０は比較例にかかるＰＤＰであって、従来の封着工程通り、仮焼の後、室温で前面パネル基板と背面パネル基板を重ね合わせて、大気圧の空気中で封着温度４５０℃まで加熱昇温して封着し、一旦室温まで降温させた。そして、再び加熱炉で排気温度３５０℃まで加熱し、この排気温度３５０℃に維持しながら排気工程を行った。
【０２１８】
なお、上記パネルＮｏ．６１〜７０において、蛍光体層の膜厚は３０μｍ、放電ガスはＮｅ（９５％）−Ｘｅ（５％）、その封入圧力は５００Ｔｏｒｒとし、パネル構成が同一となるようにした。
〈発光特性試験〉
試験方法及び結果：
上記パネルＮｏ．６１〜７０の各ＰＤＰについて、発光特性として、青色セルのみを点灯させたときの発光強度と色度座標ｙと発光スペクトルのピーク波長、及び色補正なしで白バランスでの色温度、青色セル及び緑色セルを同じ電力で発光させたときの発光スペクトルのピーク強度比を測定した。
【０２１９】
これらの測定結果は、表６に示す通りである。なお、表６に示す青色セルの発光強度は、パネルＮｏ．７０の発光強度を１００とした相対発光強度である。
また、作製した各ＰＤＰを分解し、背面パネル基板にクリプトンエキシマランプを用いて真空紫外線を照射し、青色発光の色度座標ｙ、全色発光時の色温度、並びに、青色及び緑色を発光させたときの発光スペクトルのピーク強度比を測定したところ、上記点灯による結果と同等の結果が得られた。
【０２２０】
更に、パネルから青色蛍光体を取り出し、ＴＤＳ分析法で青色蛍光体１ｇ当りから２００℃以上で脱離するＨ_２Ｏガス分子数を測定した。また、Ｘ線回折により、青色蛍光体結晶のａ軸長に対するｃ軸長の比も測定した。表６には、これらの結果も示されている。
考察：
パネルＮｏ．６１〜６９と、パネルＮｏ．７０とについて発光特性を比較すると、パネルＮｏ．６１〜６９のいずれにおいても、パネルＮｏ．７０より発光特性が優れている（相対発光強度が高く、色度座標ｙが小さい）。これは、パネルＮｏ．６１〜６９で用いた封着方法によれば、パネルＮｏ．７０で用いた封着方法と比べて、両パネル基板を重ね合わせた後に内部空間に放出されるガスが少なくなるからと考えられる。
【０２２１】
パネルＮｏ．７０のＰＤＰでは、青色発光の色度座標ｙが０．０９０であって、色温度補正なしの白バランスでの色温度は５８００Ｋであるのに対して、パネルＮｏ．６１〜６９では、青色発光の色度座標ｙが０．０８以下で、色温度補正なしの白バランスでの色温度は６５００Ｋ以上である。特に、パネルＮｏ．６８，６９のように青色の色度座標ｙが低いＰＤＰでは、色補正なしの白バランスで１１０００Ｋ程度の高い色温度が実現されている。
【０２２２】
次に、パネルＮｏ．６１，６２，６５，６８，６９（いずれも乾燥空気の水蒸気分圧は２Ｔｏｒｒ）の間で発光特性を比較すると、パネルＮｏ．６１，６２，６５，６８，６９の順で発光特性が向上（相対発光強度が高く、色度座標ｙが小さく）している。この結果から、前面パネル基板１０と背面パネル基板２０とを重ね合わせるときの温度を高く設定するほど、発光特性が向上することがわかる。
【０２２３】
また、パネルＮｏ．６３，６４，６５，６６（封着工程での温度プロファイルが同じ）の間で発光特性を比較すると、パネルＮｏ．６３，６４，６５，６６の順で発光特性が向上している（色度座標ｙが小さい）。この結果から、雰囲気ガス中の水蒸気分圧が低いほど発光特性が向上することがわかる。
また、パネルＮｏ．６６及びパネルＮｏ．６７（封着工程での温度プロファイルが同じ）について発光特性を比較すると、パネルＮｏ．６６の方が発光特性が若干優れている。
【０２２４】
これは、パネルＮｏ．６６では酸素が含まれる雰囲気ガス中で加熱されているのに対して、パネルＮｏ．６７では無酸素雰囲気中で加熱されており、無酸素雰囲気で蛍光体層を加熱すると、酸化物である蛍光体の酸素が一部が抜けて酸素欠陥が形成されるためと考えられる。
（その他の事項）
以上の実施の形態１〜６においては、面放電型のＰＤＰを製造する場合について説明したが、本発明は、対向放電型のＰＤＰを製造する場合にも適用することができる。
【０２２５】
また、蛍光体層を形成する蛍光体の組成としては、上で示したもの以外に、一般的にＰＤＰの蛍光体層に使用されているものを用いても、同様に実施することができる。
また、上記実施の形態１〜６に示したように、蛍光体層を形成した後に、封着用ガラスを塗布するのが一般的であるが、この順序を入れ換えて行うことも可能と考えられる。
【０２２６】
【発明の効果】
以上のように、本発明のＰＤＰの製造方法によれば、配設された蛍光体が加熱される工程（蛍光体焼成工程、封着材仮焼工程、封着工程、排気工程など）を、乾燥ガス雰囲気中、もしくは減圧で乾燥ガスが流れる雰囲気中で行うことによって、青色セルのみを点灯させたときの発光色の色度座標ｙ（ＣＩＥ表色系）または青色蛍光体層を真空紫外線で励起したときに放出される光の色度座標ｙが、０．０８以下となるような発光色度が優れたＰＤＰを製造することができる。
【０２２７】
このようなＰＤＰは、白バランスにおける色温度を７０００Ｋ以上とすることができ、更に８０００Ｋ以上，９０００Ｋ以上，１００００Ｋ以上とすることも可能である。また、青色蛍光体層の発光色度が向上すれば、色再現性も向上される。
また、上記のように青色蛍光体層の発光色度が優れたＰＤＰは、前面基板及び背面基板を対向面が開放された状態で仮焼する方法、前面基板及び背面基板を内部空間に乾燥ガスを流しながら封着する方法、あるいは、前面基板及び背面基板を、対向面が開放された状態で予備加熱した後、両基板を重ね合わせて封着する方法を用いることによっても製造することができる。
【０２２８】
また、前面パネル基板と背面パネル基板を重ね合わせた状態で封着材を封着温度に保って封着する封着工程を行った後、室温まで降下させることなく、封着された両基板間の内部空間の気体を排気する排気工程を開始すること、或は、封着材が配設された基板を仮焼温度に保って仮焼する封着材仮焼工程の後、当該基板を室温まで降下させることなく封着工程を開始することによっても製造でき、この場合、加熱に要する時間及び消費エネルギーを低減することもできる。
【図面の簡単な説明】
【図１】実施の形態１に係る交流面放電型ＰＤＰを示す要部斜視図である。
【図２】上記ＰＤＰに駆動回路を接続したＰＤＰ表示装置を示す図である。
【図３】実施の形態１で用いるベルト式加熱装置の構成を示す図である。
【図４】実施の形態１で用いる封着用加熱装置の構成を示す図である。
【図５】水蒸気分圧を変えた空気中で青色蛍光体を焼成したときの相対発光強度測定結果である。
【図６】水蒸気分圧を変えた空気中で青色蛍光体を焼成したときの色度座標ｙの測定結果である。
【図７】青色蛍光体から脱離するＨ_２Ｏ分子数を測定した測定結果の一例である。
【図８】実施の形態２における背面ガラス基板の具体例を示す図である。
【図９】実施の形態２における背面ガラス基板の具体例を示す図である。
【図１０】実施の形態２における背面ガラス基板の具体例を示す図である。
【図１１】実施の形態２における背面ガラス基板の具体例を示す図である。
【図１２】実施の形態２における背面ガラス基板の具体例を示す図である。
【図１３】実施の形態２における背面ガラス基板の具体例を示す図である。
【図１４】実施の形態２における背面ガラス基板の具体例を示す図である。
【図１５】実施の形態２における背面ガラス基板の具体例を示す図である。
【図１６】実施の形態２における背面ガラス基板の具体例を示す図である。
【図１７】青色蛍光体を一旦熱劣化させた後、空気中で再焼成して発光特性を回復させる効果の水蒸気分圧依存性を示す特性図である。
【図１８】青色蛍光体を一旦熱劣化させた後、空気中で再焼成して発光特性を回復させる効果の水蒸気分圧依存性を示す特性図である。
【図１９】実施の形態５で封着工程に用いる封着装置の構成を示す図である。
【図２０】上記封着装置における加熱炉の内部の構成を示す斜視図である。
【図２１】上記封着装置を用いて予備加熱工程及び封着工程を行う際の動作を示す図である。
【図２２】実施の形態５に係る実験で、ＭｇＯ層から放出される水蒸気量を経時的に測定した結果を示す図である。
【図２３】実施の形態５にかかる封着装置の一変形例を示す図である。
【図２４】実施の形態５にかかる封着装置の別の変形例の動作を示す図である。
【図２５】実施例５ＰＤＰについて、青色セルのみを点灯させたときの発光スペクトルである。
【図２６】実施例５と比較例のＰＤＰについて、青色付近の色再現域をＣＩＥ色度図上に示したものである。
【図２７】実施の形態６において、封着装置を用いて仮焼工程から排気工程までを行う際の動作を示す図である。
【図２８】実施例６で、ＰＤＰを製造する際に、仮焼工程−封着工程−排気工程で用いた温度プロファイルである。
【図２９】一般的な交流型（ＡＣ型）ＰＤＰの一例を示す概略断面図である。
【符号の説明】
１０ 前面パネル基板
１１ 前面ガラス基板
１２ａ，１２ｂ 表示電極
１３ 誘電体層
１４ 保護層
１５ 封着ガラス層
２０ 背面パネル基板
２１ 背面ガラス基板
２１ａ，２１ｂ 通気口
２２ アドレス電極
２３ 誘電体層
２４ 隔壁
２５ 蛍光体層
２６ ガラス管
３０ 放電空間
４０ 加熱装置
４１ 加熱炉
４２ 搬送ベルト
４３ ガス導入パイプ
５０ 封着用加熱装置
５１ 加熱炉
５３ ガス供給源
５４ 真空ポンプ
６０ 封着ガラス領域
７０ 流止隔壁
８０ 封着装置[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method and an apparatus for manufacturing a plasma display panel used for a display of a color television receiver or the like.
[0002]
[Prior art]
2. Description of the Related Art In recent years, in a display device used for a computer, a television, or the like, a plasma display panel (hereinafter, referred to as a PDP) has attracted attention as a device capable of realizing a large, thin, and lightweight device, and has a high definition. Demands for PDPs are also increasing.
[0003]
FIG. 29 is a schematic sectional view showing an example of a general AC type (AC type) PDP. In the figure, a display electrode 102 is formed on a front glass substrate 101, and the display electrode 102 is covered with a dielectric glass layer 103 and a dielectric protection layer 104 made of magnesium oxide (MgO) (for example, see Japanese Patent Application Laid-Open No. H05-260, 1993). -342991).
[0004]
On the back glass substrate 105, an address electrode 106 and a partition 107 are provided, and phosphor layers 110 to 112 of each color (red, green, blue) are provided in a gap between the partition 107.
The front glass substrate 101 is provided on the partition wall 107 of the rear glass substrate 105, and a discharge gas is sealed between the two substrates 101 and 105 to form a discharge space 109.
[0005]
In this PDP, in the discharge space 109, vacuum ultraviolet rays (mainly at a wavelength of 147 nm) are generated with the discharge, and the color phosphor layers 110 to 112 are excited to emit light, whereby color display is performed.
The PDP can be manufactured as follows.
A display electrode 102 is formed by applying and firing a silver paste on the front glass substrate 101, and a dielectric glass paste is applied and fired to form a dielectric glass layer 103, and a protective layer 104 is formed thereon.
[0006]
A silver paste is applied and baked on the rear glass substrate 105 to form the address electrodes 106, and a glass paste is applied at a predetermined pitch and baked to form the partition 107. The phosphor layers 110 to 112 are formed by applying a phosphor paste for each color between the partition walls 107 and baking the paste at about 500 ° C. to remove resin components and the like in the paste.
[0007]
After firing the phosphor, a glass frit for sealing is applied around the rear glass substrate 105, and calcined at about 350 ° C. to remove resin components and the like in the formed sealing glass layer (frit calcining step). .
Thereafter, the front glass substrate 101 and the rear glass substrate 105 are stacked so that the display electrodes 102 and the address electrodes 106 face each other at right angles. Then, this is heated to a temperature (about 450 ° C.) higher than the softening temperature of the sealing glass to seal (sealing step).
[0008]
Then, while heating the sealed panel to about 350 ° C., the panel is evacuated from an internal space formed between the two substrates (a space formed between the front plate and the back plate and facing the phosphor) (an evacuation step). After the evacuation, a discharge gas is introduced at a predetermined pressure (normally 300 to 500 Torr).
[0009]
[Problems to be solved by the invention]
In the PDP manufactured in this manner, there is a problem how to improve the light emission characteristics including the improvement of the luminance.
For this purpose, for example, the emission characteristics of the phosphor itself have been improved. However, it is desired that the PDP be further excellent in emission characteristics.
[0010]
In addition, PDPs are being mass-produced using the above-described manufacturing method. However, at present, PDPs are considerably higher in manufacturing cost than CRTs, and thus it is desired to reduce them.
There are various possible ways to reduce the cost of manufacturing a PDP. For example, energy consumption and labor (work time) required in several steps requiring heating as described above are considered. In view of the fact that is large, it is desired to reduce these as one solution.
[0011]
The first object of the present invention is to provide a PDP which operates with high luminous efficiency and has good color reproducibility. In manufacturing a PDP, a calcination step, a sealing step, and an exhaust step are performed in a short working time. A second object is to reduce the manufacturing cost by providing a method that can be performed with low energy consumption.
[0012]
[Means for Solving the Problems]
The first object of the present invention is to make the color temperature of the luminescent color when all the cells are turned on under the same power condition in a PDP be 7000K or more, preferably 8000K or more, 9000K or more and 10,000K or more. Can be achieved.
In order to increase the color temperature in the white balance as described above, it is important to improve the emission chromaticity of the blue phosphor layer, and the chromaticity coordinate y () of the emission color when only the blue cell is turned on. (CIE color system) or the blue phosphor layer is excited so that the chromaticity coordinate y of the light emitted when excited by vacuum ultraviolet rays is 0.08 or less, preferably 0.07 or less, and 0.06 or less. Just fine. Alternatively, the peak wavelength in the emission spectrum when only the blue cell is turned on may be 455 nm or less, preferably 453 nm or less, or 451 nm or less.
[0013]
Further, if the emission chromaticity of the blue phosphor layer is improved as described above, the color reproducibility is also improved.
As described above, a PDP having an excellent emission chromaticity of the blue phosphor layer is obtained by heating the provided phosphor in the process of manufacturing the PDP (the phosphor firing step, the sealing material calcining step). , Sealing step, evacuation step, etc.) in a dry gas atmosphere or in an atmosphere in which a dry gas flows under reduced pressure.
[0014]
That is, the present inventors have found that in the conventional method of manufacturing a PDP, in the step of heating the phosphor layer, the blue phosphor is thermally degraded and its emission intensity and emission chromaticity are reduced. By using the method, this thermal deterioration can be prevented.
Here, the “dry gas” is a gas having a smaller partial pressure of water vapor than usual, and it is preferable to use air that has been subjected to a drying treatment (dry air).
[0015]
The partial pressure of water vapor in the atmosphere of the drying gas is preferably 15 Torr or less, more preferably 10 Torr or less, 5 Torr or less, 1 Torr or less, and 0.5 Torr or less. It can be said that the dew point temperature of the drying gas is preferably 20 ° C. or lower, more preferably 10 ° C. or lower, 0 ° C. or lower, −20 ° C. or lower, and −40 ° C. or lower.
[0016]
Further, as described above, the PDP having excellent emission chromaticity of the blue phosphor layer is prepared by calcining the front substrate and the rear substrate in a state where the opposing surfaces are opened, and drying the front substrate and the rear substrate in the internal space by drying gas. Or a method in which the front substrate and the rear substrate are preheated in a state where the opposing surfaces are open, and then the two substrates are overlapped and sealed. .
[0017]
In addition, after performing a sealing step of keeping the sealing material at the sealing temperature in a state in which the front panel substrate and the rear panel substrate are overlapped, without lowering to room temperature, After starting the evacuation step of exhausting the gas in the internal space of the sealing material, or maintaining the substrate on which the sealing material is provided at a calcination temperature, the substrate is cooled to room temperature. By starting the sealing step without lowering to the second object, the first object and the second object can be achieved.
[0018]
That is, in the actual manufacturing process, each of these steps is performed using a heating furnace. However, conventionally, generally, a sealing material calcining step, a sealing step, and an exhausting step are separately performed. Since the substrate was cooled down to room temperature, heating and raising the temperature again in a later step consumes a longer time and more energy, but on the other hand, as described above, If the temperature is lowered without lowering the temperature of the substrate to room temperature, the time required for heating and energy consumption can be reduced.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
[Embodiment 1]
FIG. 1 is a perspective view of a main part of an AC surface discharge type PDP according to an embodiment, and FIG. 1 partially shows a display area in a central portion of the PDP.
This PDP includes a front panel substrate 10 in which display electrodes 12 (scanning electrodes 12 a and sustain electrodes 12 b), a dielectric layer 13 and a protective layer 14 are arranged on a front glass substrate 11, and an address electrode on a rear glass substrate 21. The rear panel substrate 20 on which the dielectric layer 23 is disposed is arranged in parallel with each other with the display electrodes 12a and 12b and the address electrode 22 facing each other at an interval. The gap between the front panel substrate 10 and the rear panel substrate 20 is partitioned by a stripe-shaped partition wall 24 to form a discharge space 30, and the discharge space 30 is filled with a discharge gas.
[0020]
In the discharge space 30, a phosphor layer 25 is provided on the back panel substrate 20 side. Note that the phosphor layers 25 are repeatedly arranged in the order of red, green, and blue.
The display electrode 12 and the address electrode 22 are both stripe-shaped, and the display electrode 12 is arranged in a direction orthogonal to the partition wall 24, and the address electrode 22 is arranged in parallel with the partition wall 24. Then, a panel configuration is formed in which cells emitting red, green, and blue colors are formed where the display electrodes 12 and the address electrodes 22 intersect.
[0021]
When driving the PDP, a drive circuit (not shown) applies an address discharge pulse to the scan electrode 12a and the address electrode 22, thereby accumulating wall charges in the cell to emit light. The display operation is performed by repeating the operation of applying the sustain discharge pulse to the display electrode pairs 12a and 12b to perform the sustain discharge in the cell in which the wall charges are accumulated.
[0022]
The address electrode 22 is a metal electrode (for example, a silver electrode or a Cr—Cu—Cr electrode). The display electrode 12 is made of ITO, SnO ₂ An electrode configuration in which a thin bus electrode (silver electrode, Cr—Cu—Cr electrode) is laminated on a wide transparent electrode made of a conductive metal oxide such as ZnO, ZnO, etc. However, it is preferable to secure a large discharge area in the cell, but a silver electrode can be used similarly to the address electrode 22.
[0023]
The dielectric layer 13 is a layer made of a dielectric material disposed over the entire surface of the front glass substrate 11 on which the display electrodes 12 are disposed, and is generally made of a lead-based low-melting glass. However, it may be formed of bismuth-based low-melting glass or a laminate of lead-based low-melting glass and bismuth-based low-melting glass.
The protective layer 14 is a thin layer made of magnesium oxide (MgO) and covers the entire surface of the dielectric layer 13.
[0024]
The dielectric layer 23 is the same as the dielectric layer 13, but is made of TiO.sub.2 so that it also functions as a visible light reflecting layer. ₂ The particles are mixed.
The partition 24 is made of a glass material, and protrudes from the surface of the dielectric layer 23 of the back panel substrate 20.
Here, as a phosphor material constituting the phosphor layer 25,
Blue phosphor: BaMgAl ₁₀ O ₁₇ : Eu
Green phosphor: Zn ₂ SiO ₄ : Mn
Red phosphor: Y ₂ O ₃ : Eu
Shall be used.
[0025]
The compositions of these phosphor materials are basically the same as those conventionally used for PDPs, but compared to the phosphor layers in conventional PDPs, the degradation of the thermal degradation of the phosphors during the manufacturing process has occurred. Due to the low degree, the emission color is better. Here, “good emission color” means that the chromaticity coordinate y value of the light emitted from the blue cell is small (the peak wavelength of blue emission is short) and the color reproduction range near blue is wide.
[0026]
In the conventional general PDP, the chromaticity coordinate y (CIE color system) of the emission color when only the blue cell is turned on is 0.085 or more (the peak wavelength of the emission spectrum is 456 nm or more), and the color is The color temperature is about 6000 K with white balance without correction.
As a technique for improving the color temperature in the white balance, for example, a technique is also known in which only the width of the blue cell (the partition pitch) is set to be large and the area of the blue cell is larger than the area of the green cell or the red cell. However, in order to increase the color temperature to 7000K or more by this method, the area of the blue cell must be set to about 1.3 times or more the area of the green cell or the red cell.
[0027]
On the other hand, in the PDP of the present embodiment, the chromaticity coordinate y of the emission color when only the blue cell is turned on is 0.08 or less, and the peak wavelength of the emission spectrum is 455 nm or less. Even if the area of the blue cell is not set large, the color temperature can be set to 7000 K or more with the white balance without color correction. Further, depending on the conditions at the time of manufacturing, the chromaticity coordinate y can be further reduced, and the color temperature can be set to about 10000K with white balance without color correction.
[0028]
Note that the fact that the value of the chromaticity coordinate y of the blue cell is small and the peak wavelength of blue light emission has the same meaning will be described in Embodiments 3 and 5.
Further, the smaller the value of the chromaticity coordinate y of the blue cell, the wider the color reproduction range,
The relationship between the chromaticity coordinate y value of the light emitted from the blue cell and the color temperature at the white balance without color correction will be described in detail in a later embodiment.
[0029]
In this embodiment, the thickness of the dielectric layer 13 is about 20 μm and the thickness of the protective layer 14 is about 0.5 μm in accordance with a 40-inch high-definition television. The height of the partition walls 24 is 0.1 to 0.15 mm, the partition pitch is 0.15 to 0.3 mm, and the thickness of the phosphor layer 25 is 5 to 50 μm. The discharge gas to be charged is a Ne—Xe system, the content of Xe is 5% by volume, and the charging pressure is set in the range of 500 to 800 Torr.
[0030]
At the time of driving the PDP, as shown in FIG. 2, each driver and the panel drive circuit 100 were connected to the PDP, and an address discharge was performed by applying the voltage between the scanning electrode 12a and the address electrode 22 of the cell to be turned on. Thereafter, a sustain voltage is applied by applying a pulse voltage between the display electrodes 12a and 12b. Then, the cell emits ultraviolet light with the discharge and is converted into visible light by the phosphor layer 25. An image is displayed by lighting the cell in this manner.
[About the production method of PDP]
Hereinafter, a method of manufacturing the PDP having the above configuration will be described.
[0031]
(Fabrication of front panel substrate)
The front panel substrate 10 forms a display electrode 12 by applying a silver electrode paste on the front glass substrate 11 by screen printing and then baking the paste, and forms a lead-based glass material (the The composition is, for example, 70% by weight of lead oxide [PbO], boron oxide [B ₂ O ₃ 15% by weight, silicon oxide [SiO ₂ ] 15% by weight. ) Is applied by screen printing and baked to form a dielectric layer 13, and a protective layer 14 made of magnesium oxide (MgO) is formed on the surface of the dielectric layer 13 by a vacuum deposition method or the like. It is produced by
[0032]
(Production of back panel substrate)
The rear panel substrate has an address electrode 22 formed on a rear glass substrate 21 by screen printing a paste for a silver electrode and then firing the silver paste. ₂ The paste containing the particles and the dielectric glass particles was applied by screen printing and baked to form the dielectric layer 23, and the paste containing the same glass particles was repeatedly applied at a predetermined pitch using the screen printing method. Thereafter, the partition wall 24 is formed by firing.
[0033]
Then, red, green, and blue phosphor pastes are prepared, applied to the gaps between the partitions 24 by a screen printing method, and fired in air as will be described in detail later to thereby form the phosphor layers 25 of each color. To form
Each color phosphor paste used here can be manufactured as follows.
[0034]
Blue phosphor (BaMgAl ₁₀ O ₁₇ : Eu) is used as a raw material for barium carbonate (BaCO 3). ₃ ), Magnesium carbonate (MgCO ₃ ), Aluminum oxide (α-Al ₂ O ₃ ) Is blended so that the atomic ratio of Ba, Mg, and Al is 1: 1: 1: 10. Next, a predetermined amount of europium oxide (Eu) was added to the mixture. ₂ 0 ₃ ) Is added. Then, an appropriate amount of flux (AlF ₂ , BaCl ₂ ) And a reducing atmosphere (H ₂ , N ₂ It is obtained by baking at a temperature of 1400 ° C. to 1650 ° C. for a predetermined time (for example, 0.5 hour) under (middle).
[0035]
Red phosphor (Y ₂ O ₃ : Eu) is yttrium hydroxide Y as a raw material ₂ (OH) ₃ A predetermined amount of europium oxide (Eu) ₂ O ₃ ) Is added. Then, it is obtained by mixing with a suitable amount of flux by a ball mill and firing in air at a temperature of 1200 ° C. to 1450 ° C. for a predetermined time (for example, 1 hour).
Green phosphor (Zn ₂ SiO ₄ : Mn) is zinc oxide (ZnO), silicon oxide (Si0 ₂ ) Is blended so that the atomic ratio of Zn and Si is 2: 1. Next, a predetermined amount of manganese oxide (Mn) was added to the mixture. ₂ O ₃ ) Is added. Then, after mixing in a ball mill, it is obtained by firing in air at a temperature of 1200 ° C. to 1350 ° C. for a predetermined time (for example, 0.5 hour).
[0036]
The phosphors of each color produced in this way are crushed and sieved to obtain phosphor particles of each color having a predetermined particle size distribution. The phosphor paste of each color is obtained by mixing the phosphor particles of each color with a binder and a solvent.
When forming the phosphor layer 25, in addition to the above-described screen printing method, a method of scanning while discharging phosphor ink from a nozzle, or a method of forming a photosensitive resin containing a phosphor material of each color. A sheet can be formed by attaching a sheet to the surface of the rear glass substrate 21 on the side where the partition walls 24 are arranged, patterning by photolithography, and developing to remove unnecessary portions.
[0037]
(Seal of front panel substrate and rear panel substrate, evacuating, filling discharge gas)
A glass frit for sealing is applied to one or both of the front panel substrate 10 and the rear panel substrate 20 thus manufactured to form a sealing glass layer. As described later in detail, a resin in the glass frit is used. In order to remove the components and the like, they are calcined, and the display electrodes 12 of the front panel substrate 10 and the address electrodes 22 of the rear panel substrate 20 are overlapped so as to be orthogonal to each other. The sealing is performed by heating to soften the sealing glass layer as described in detail later.
[0038]
Then, the panel is baked while evacuating the internal space of the sealed panel substrate (at 350 ° C. for 3 hours). Thereafter, a PDP is manufactured by filling a discharge gas having the above composition at a predetermined pressure.
(Details of phosphor baking process, frit calcining process, sealing process)
The firing step, frit calcination step, and sealing step of the phosphor will be described in detail below.
[0039]
FIG. 3 is a diagram schematically showing a configuration of a belt-type heating device used in firing and calcining the phosphor in the present embodiment.
The heating device 40 includes a heating furnace 41 for heating the substrate, a transport belt 42 for transporting the panel substrate so as to pass through the heating furnace 41, a gas introduction pipe 43 for introducing an atmospheric gas into the heating furnace 41, and the like. In addition, a plurality of heaters (not shown) are installed in the heating furnace 41 along the transport direction.
[0040]
By setting the temperature of each part from the inlet 44 to the outlet 45 of the heating furnace 41 with each heater, the substrate can be fired with an arbitrary temperature profile. Is introduced, the inside of the heating furnace 41 can be filled with the atmospheric gas.
When dry air is sent as atmospheric gas, the amount of water vapor in the air (steam partial pressure) is reduced through a gas dryer (not shown) that cools the air to a low temperature (minus tens of degrees) and condenses moisture. Thereby, dry air can be generated.
[0041]
When firing the phosphor, the back glass substrate 21 on which the phosphor layer 25 is formed is fired in dry air using the heating device 40 (peak temperature: 520 ° C., 10 minutes). As described above, by performing firing while flowing a dry gas during firing of the phosphor, thermal degradation due to water vapor in the atmosphere during firing of the phosphor can be suppressed.
The effect of suppressing thermal degradation of the phosphor is greater as the water vapor partial pressure in the dry air used at this time is set lower. That is, the water vapor partial pressure is desirably 15 Torr or less, and the effect becomes more remarkable as the pressure is reduced to 10 Torr or less, 5 Torr or less, 1 Torr or 0.1 Torr or less.
[0042]
Since the partial pressure of water vapor and the dew point temperature have a fixed relationship, in other words, using the "dew point temperature" for the moisture in the dry air, the lower the dew point temperature is set, the more the thermal degradation during phosphor firing is suppressed. The dew point temperature of the dry gas is preferably 20 ° C. or lower, more preferably 0 ° C. or lower, −20 ° C. or lower, and −40 ° C. or lower.
[0043]
At the time of frit calcination, the front glass substrate 11 or the rear glass substrate 21 having the sealing glass layer formed thereon is fired in dry air using the heating device 40 (at a peak temperature of 350 ° C. for 30 minutes).
Also in this calcining step, the dry air introduced into the heating furnace 41 preferably has a water vapor partial pressure of 15 Torr or less, and further has a water vapor partial pressure of 10 Torr or less and 5 Torr or less, similarly to the above-described phosphor baking step. The thermal degradation of the phosphor can be suppressed as the setting is made as low as 1 Torr or 0.1 Torr or less. That is, the dew point temperature of the dry air is preferably 20 ° C. or lower, more preferably 0 ° C. or lower, −20 ° C. or lower, and −40 ° C. or lower.
[0044]
FIG. 4 is a diagram schematically illustrating a configuration of a heating device for sealing.
The sealing heating device 50 includes a heating furnace 51 that heats substrates (here, the front panel substrate 10 and the back panel substrate 20 that are superimposed on each other) housed therein, and both panel substrates 10 from outside the heating furnace 51. A pipe 52a for sending the atmospheric gas into the internal space between the pipes 20 and a pipe 52b for discharging the atmospheric gas from the internal space to the outside of the heating furnace 51 are provided. A gas supply source 53 for feeding dry air as an atmospheric gas is connected to the pipe 52a, and a vacuum pump 54 is connected to the pipe 52b. The pipe 52a and the pipe 52b are provided with an adjustment valve 55a and an adjustment valve 55b for adjusting the flow rate of the gas passing therethrough.
[0045]
Using this heating device 50 for sealing, a sealing step is performed as follows.
The rear panel substrate 20 is provided with a vent 21a and a vent 21b at an outer peripheral portion outside the display area, and glass tubes 26a and 26b are attached to these vents 21a and 21b. In FIG. 4, the partition walls and the phosphor on the back panel substrate 20 are omitted.
[0046]
The front panel substrate 10 and the rear panel substrate 20 are overlapped with each other such that the sealing glass layer 15 is interposed between the two substrates while being positioned, and then placed in the heating furnace 51. Here, it is preferable that the front panel substrate 10 and the rear panel substrate 20 that have been aligned are fastened by a clamp or the like so as not to be displaced.
Then, the pipes 52a and 52b inserted from the outside of the heating furnace 51 are connected to the glass tubes 26a and 26b, and the interior space is once evacuated by evacuating the pipe 52b with a vacuum pump 54, and then the vacuum pump 54 The dry air is fed at a constant flow rate from the pipe 52a without using. As a result, the dry air flows through the internal space between the panel substrates 10 and 20 and is discharged from the pipe 52b.
[0047]
By heating the two panel substrates 10 and 20 (heating at a peak temperature of 450 ° C. for 30 minutes) while flowing dry air in this manner, the sealing glass layer 15 is softened and the two panel substrates 10 and 20 are sealed. .
When the sealing is completed, one of the glass tubes 26a and 26b is sealed, and the next vacuum evacuation step is performed by connecting a vacuum pump to the remaining glass tubes. Next, in the discharge gas sealing step, a cylinder containing the discharge gas is connected to the remaining glass tube, and the discharge gas is sealed in the internal space while operating the exhaust device.
[0048]
(Effects of the manufacturing method of the present embodiment)
According to the sealing method of the present embodiment, the following effects are achieved as compared with the conventional sealing method.
Normally, gases such as water vapor are adsorbed on the front panel substrate and the rear panel substrate. When these substrates are heated and heated, the adsorbed gas is released.
[0049]
In the conventional general manufacturing method, after the calcination step, in the sealing step, the front panel substrate and the back panel substrate are overlapped at room temperature and then heated and heated to be sealed. Then, the gas adsorbed on the front panel substrate and the rear panel substrate is released. In the calcination step, even if the gas adsorbed on the substrate escapes to some extent, the gas is adsorbed again by bringing it to room temperature in the atmosphere until the start of the sealing step. Occurs. Then, the released gas is confined in the narrow internal space. At this time, the measurement results show that the partial pressure of water vapor in the internal space is usually 20 Torr or more.
[0050]
Therefore, the phosphor layer 25 facing the internal space is likely to be thermally degraded due to the influence of the gas (particularly the influence of the water vapor released from the protective layer 14). Then, when the phosphor layer (particularly, the blue phosphor layer) is thermally degraded, the emission intensity decreases.
On the other hand, as in the present embodiment, by causing dry air to flow through the internal space during heating and continuously discharging water vapor generated in the internal space to the outside, thermal degradation of the phosphor layer due to water vapor can be prevented. Can be suppressed.
[0051]
Also in this sealing step, the dry air flowing through the internal space desirably has a water vapor partial pressure of 15 Torr or less, and further has a water vapor partial pressure of 10 Torr or less, 5 Torr or less, 1 Torr, similarly to the phosphor baking step. The thermal degradation of the phosphor can be suppressed as the setting is made as low as 0.1 Torr or less. That is, the dew point temperature of the dry air is preferably 20 ° C. or lower, more preferably 0 ° C. or lower, −20 ° C. or lower, and −40 ° C. or lower.
[0052]
(Consideration of partial pressure of water vapor in atmospheric gas)
It was experimentally considered that it is possible to prevent the thermal degradation of the blue phosphor by heating by reducing the partial pressure of water vapor in the atmospheric gas as follows:
FIGS. 5 and 6 show blue phosphors (BaMgAl) in air with various water vapor partial pressures. ₁₀ O ₁₇ : Measurement results of relative luminescence intensity and chromaticity coordinate y when Eu) was baked. As the firing conditions, the peak temperature was 450 ° C., and the time for maintaining the peak temperature was 20 minutes.
[0053]
The relative light emission intensity shown in FIG. 5 is a value obtained by expressing the measured light emission intensity as a reference value when the measured light emission intensity of the blue phosphor before firing is set to a reference value of 100.
The emission intensity is obtained by measuring the emission spectrum from the phosphor layer using a spectrophotometer, calculating the chromaticity coordinate y value from the measured value, and calculating the chromaticity coordinate y value and the luminance value measured in advance by a luminance meter. Is a value calculated by the equation (emission intensity = luminance / chromaticity coordinate y value).
[0054]
The chromaticity coordinate y of the blue phosphor before firing was 0.052.
5 and 6, when the water vapor partial pressure is around 0 Torr, no decrease in luminescence intensity and no change in chromaticity due to heating are observed, but as the water vapor partial pressure increases, the blue relative luminescence intensity decreases. It can be seen that the blue chromaticity coordinate y is large.
[0055]
By the way, the blue phosphor (BaMgAl ₁₀ O ₁₇ : When Eu) is heated, the emission intensity deteriorates or the chromaticity coordinate y value increases when the activator Eu is heated. ²⁺ The ions are oxidized by heating and Eu ³⁺ It has been conventionally thought that the ionization is caused by ionization (see J. Electrochem. Soc. Vol. 145, No. 11, November 1998). Considering in combination with the result that it depends on the water vapor partial pressure of Eu, ²⁺ It is considered that ions do not directly react with oxygen in a gas atmosphere (for example, air), but the reaction related to deterioration is promoted by water vapor in the gas atmosphere.
[0056]
By the way, by changing the heating temperature in various ways, the blue phosphor (BaMgAl ₁₀ O ₁₇ : When the heating temperature was in the range of 300 ° C to 600 ° C, the higher the heating temperature, the greater the decrease in the light emission intensity due to the heat. At any of the heating temperatures, there was a tendency that the higher the partial pressure of water vapor, the greater the decrease in emission intensity. On the other hand, there was a tendency that the change in the chromaticity coordinate y due to heat increased as the water vapor partial pressure increased, but there was no tendency that the degree of change in the chromaticity coordinate y depended on the heating temperature.
[0057]
In addition, when each member forming the front glass substrate 11, the display electrode 12, the dielectric layer 13, the protective layer 14, the rear glass substrate 21, the address electrode 22, the dielectric layer 23, the partition 24, and the phosphor layer 25 is heated. When the amount of released water vapor was measured, the amount of released water vapor from MgO as the material of the protective layer 14 was the largest. From this, it is presumed that the main cause of thermal degradation of the phosphor layer 25 at the time of sealing is that water vapor is released from the protective layer 14 (MgO).
[0058]
(Modification of this embodiment)
In the present embodiment, in the sealing step, a fixed amount of dry air is allowed to flow into the internal space. However, the internal space may be alternately repeated by evacuating the internal space and then introducing dry air. Can be efficiently discharged, and thermal degradation of the phosphor layer can be suppressed.
[0059]
Further, it is not always necessary to perform all of the phosphor baking step, the calcining step, and the sealing step in a dry gas dry gas atmosphere, but it is also possible to perform only one or two of these steps in a dry gas atmosphere. , A certain effect can be obtained.
Further, in the present embodiment, in the sealing step, dry air is flown as an atmospheric gas into the internal space, but an inert gas such as nitrogen which does not react with the phosphor layer and has a low water vapor partial pressure is flowed. Has the same effect.
[0060]
In the present embodiment, the sealing is performed while forcibly sending dry air from the glass tube 26a into the internal space between the two panel substrates 10 and 20 in the sealing step. Even if it is not sent, even if both panel substrates 10 and 20 are sealed in a dry air atmosphere using the heating device 40 shown in FIG. Because of the inflow, a certain effect can be obtained.
[0061]
Although not described in the present embodiment, the amount of moisture adsorbed on the protective layer 14 can also be reduced by firing the front panel substrate 10 on which the protective layer 14 is formed in a dry gas atmosphere. Since only a small amount is obtained, thermal degradation of the blue phosphor layer in the sealing step is suppressed to some extent. Further, if the firing of the front panel substrate 10 in such a dry gas atmosphere is combined with the manufacturing method of the present embodiment, further effects can be expected.
[0062]
In addition, the PDP manufactured by the manufacturing method of the present embodiment also has an effect of reducing abnormal discharge during driving of the PDP since the phosphor layer contains less moisture.
(Example 1)
[0063]
[Table 1]

[0064]
Panel No. Reference numerals 1 to 4 denote PDPs according to examples manufactured based on the present embodiment. The PDP has a water vapor partial pressure of 0 to 12 Torr in a phosphor baking step, a frit calcining step, and a sealing step. These values were changed to various values within the range. In addition, panel no. Reference numeral 5 denotes a PDP according to a comparative example, in which a phosphor burning step, a frit calcining step, and a sealing step are performed in undried air (water vapor partial pressure: 20 Torr).
[0065]
In each of these PDPs, the thickness of the phosphor layer was 30 μm, and the discharge gas was filled with Ne (95%)-Xe (5%) at 500 Torr.
<Emission characteristic test>
Test method and results:
For each of these PDPs, the light emission characteristics include panel luminance and color temperature in white balance without color correction (panel luminance and color temperature when blue, red, and green cells emit light with the same power), blue cell The peak intensity ratio of the emission spectrum when the green cell and the green cell were made to emit light at the same power was measured.
[0066]
These measurement results are as shown in Table 1.
Each of the produced PDPs is disassembled, and the rear panel substrate is irradiated with vacuum ultraviolet rays (central wavelength: 146 nm) using a krypton excimer lamp to emit all the blue, green, and red colors, and a color temperature. When the peak intensity ratio of the emission spectrum when emitting blue light and green light was measured, a result equivalent to the above-mentioned lighting result was obtained because no color filter or the like was provided on the manufactured front panel substrate.
[0067]
Further, the blue phosphor is taken out from the panel, and the amount of H desorbed from 1 g of the blue phosphor is determined by TDS analysis (thermal desorption gas mass spectrometry). ₂ The number of O gas molecules was measured. The a-axis length and the c-axis length of the blue phosphor crystal were also measured by X-ray diffraction.
In the TDS analysis, measurement was performed as follows using an infrared heating type thermal desorption gas mass spectrometer manufactured by Japan Vacuum Engineering Co., Ltd.
[0068]
10 pieces of phosphor material packed in a Ta tray ^-4 After exhausting to the order of Pa, ^-7 Evacuation was performed to the order of Pa. Then, using an infrared heater, H desorbed from the phosphor while increasing the temperature from room temperature to 1100 ° C. at a rate of 10 ° C./min. ₂ The number of O molecules (mass number 18) was measured in a scan mode with a measurement interval of 15 seconds. FIGS. 7A, 7B, and 7C show panel Nos. It is a chart which shows the result of having measured about the blue fluorescent substance taken out from 2, 4, and 5.
[0069]
In the chart of FIG. 7, H desorbed from the blue phosphor. ₂ The peak of the number of O molecules is seen at around 100 to 200 ° C and around 400 to 600 ° C.
It is considered that the peak around 100 to 200 ° C. is due to the desorption of the physically adsorbed gas, and the peak around 400 to 600 ° C. is due to the desorption of the chemically adsorbed gas.
Table 1 shows the desorption H appearing in the region above 200 ° C. ₂ The peak value of the number of O molecules, that is, the desorbed H around 400 to 600 ° C. ₂ The measurement results of the peak value of the number of O molecules and the ratio of the c-axis length to the a-axis length of the blue phosphor crystal are also shown.
[0070]
Discussion:
In the measurement results of Table 1, when the light emission characteristics of the example (panel Nos. 1 to 4) and the comparative example (panel No. 5) are compared, the examples have better light emission characteristics than the comparative example (panel No. 5). High brightness and high color temperature.)
Panel No. When the light emission characteristics are compared for panel Nos. 1 to 4, panel Nos. The light emission characteristics are improved in the order of 1, 2, 3, and 4.
[0071]
From this result, it can be seen that the lower the water vapor partial pressure in the phosphor baking step, the frit calcining step, and the sealing step, the better the light emission characteristics (panel luminance, color temperature).
The emission characteristics are improved by reducing the partial pressure of water vapor as described above because the blue phosphor layer (BaMgAl ₁₀ O ₁₇ : Eu) is prevented from being thermally degraded, and the value of the chromaticity coordinate y is reduced.
[0072]
Further, in the blue phosphor of the present embodiment, desorption H appearing in a region of 200 ° C. or more in thermal desorption gas mass spectrometry. ₂ The peak value of the number of O molecules is 1 × 10 ¹⁶ While the ratio of the c-axis length to the a-axis length is 4.0218 or less, whereas the blue phosphor of the comparative example shows values larger than the above values.
[Embodiment 2]
The PDP of the present embodiment has the same configuration as the PDP of the first embodiment shown in FIG.
[0073]
Although the method of manufacturing the PDP is the same as that of the first embodiment, there are differences in the opening position of the vent on the outer peripheral portion of the back glass substrate 21, the form of applying the sealing glass frit, and the like. That is, in the PDP manufacturing process, in the sealing process, the steam generated from the protective layer, the phosphor layer, the sealing glass, etc. on the front plate at the time of heating is more compared with the phosphor baking process and the frit calcining process. In consideration of the fact that the containing gas is confined in the narrow internal space partitioned by the partition walls, the phosphor layer is more susceptible to thermal degradation, and in the present embodiment, the phosphor layer was introduced into the internal space in the sealing step. The device is designed so that the dry air stably flows in the space between the partition walls, efficiently exhausts gas generated in the space between the partition walls, and enhances the effect of preventing thermal degradation of the phosphor layer. .
[0074]
FIGS. 8 to 16 are diagrams showing specific examples of the opening positions of the ventilation holes in the outer peripheral portion of the rear glass substrate 21 and the form in which the sealing glass frit is applied. Although the rear panel substrate 20 is provided with stripe-shaped barrier ribs 24 over the entire image display region, FIGS. 8 to 16 show only a few barrier ribs 24 on both sides, and The illustration of the partition wall 24 is omitted.
[0075]
As shown in these figures, a frame-shaped sealing glass region 60 (a region where the sealing glass layer 15 is disposed) is set on the outer peripheral portion of the rear glass substrate 21. The sealing glass region 60 includes a pair of vertical sealing regions 61 extending along the outermost arranged partitions 24 and a pair of horizontal sealing regions 62 extending in the width direction of the partitions 24.
Then, at the time of sealing, dry air flows through each gap 65 between the partition walls 24.
[0076]
Hereinafter, features of the example shown in each figure will be described.
In the example shown in FIGS. 8 to 12, the vent 21 a and the vent 21 b are opened at diagonal positions inside the sealing glass region 60, and at the time of sealing, from the vent 21 a as shown in FIG. The introduced dry air passes through the gap 63a between the partition wall end 24a and the horizontal sealing region 62, is distributed to each gap 65 between the partition walls 24, and flows therethrough. The air passes through the gap 63b between itself and the attachment area 62, and is discharged from the vent 21b.
[0077]
In the example shown in FIG. 8, the gap 63 a between the horizontal sealing region 62 and the partition end 24 a and the gap 63 b between the horizontal sealing region 62 and the partition end 24 b are different from the vertical sealing region 61 and the partition 24 adjacent thereto. (If the minimum width of the gap 63a is D1, the minimum width of the gap 63b is D2, the minimum width of the gap 64a is d1, and the minimum width of the gap 64b is D1, D2> d1 and d2).
[0078]
With this configuration, the gas flow resistance when the dry air introduced from the vent 21a flows through the gap 65 between the partition walls 24 becomes smaller than the gas flow resistance when flowing through the gaps 64a and 64b. The dry air easily spreads in the gaps 63a and 63b, and the dry air is stably distributed to the gaps 65 and flows therethrough.
Therefore, the gas generated in each gap 65 is efficiently exhausted, and the effect of preventing the phosphor layer from being thermally degraded in the sealing step is enhanced.
[0079]
And, as the minimum width D1 of the gap 63a and the minimum width D2 of the gap 63b are made twice or three times larger than the minimum width d1 of the gap 64a and the minimum width d2 of the gap 64b, the distance between the partition walls 24 becomes larger. The gas flow resistance when flowing through the gap 65 is reduced, and the dry air flows through each gap 65 more stably, so that the effect is also increased.
In the example shown in FIG. 9, the vertical sealing region 61 is in contact with the partition 24 adjacent thereto at the center, and the minimum width d1 of the gap 64a and the minimum width d2 of the gap 64b are zero. In this case, since the dry air does not flow through the gaps 64a and 64b, the dry air is more stably distributed to the gaps 65.
[0080]
In the example shown in FIGS. 10 to 16, the flow blocking wall 70 is provided along the inner periphery of the sealing glass region 60. The blocking wall 70 has a frame shape including a vertical partition 71 along the vertical sealing region 61 and a horizontal partition 72 along the horizontal sealing region 62, and the vents 21 a and 21 b are provided in the blocking wall 70. (However, in the example shown in FIG. 12, there is no vertical partition 71, but only a horizontal partition 72).
[0081]
Such a partition wall 70 is formed of the same shape and material as the partition wall 24, and the partition wall 70 can be formed together with the partition wall 24 when forming the partition wall 24.
The blocking wall 70 prevents the sealing glass provided in the sealing glass area 60 from flowing into the display area at the center of the panel when heated and softened.
[0082]
In the example shown in FIG. 10, as in the case of FIG. 8, the gap 63a between the horizontal partition 72 and the partition end 24a and the gap 63b between the horizontal partition 72 and the partition end 24b become the vertical partition 71 and the partition adjacent thereto. It is set wider than the gap 64a and the gap 64b with the gap 24 (D1, D2> d1, d2), and has the same effect as in FIG.
In the example shown in FIG. 11, a partition wall 73a and a partition wall 73b that partition the gap 64a and the gap 64b between the vertical partition 71 and the partition 24 adjacent thereto are further provided. Since the vertical partition 71 and the partition 24 adjacent thereto are partitioned at the center by the partition walls 73a and 73b, the minimum width d1 of the gap 64a and the minimum width d2 of the gap 64b are the same as in FIG. Is 0. Therefore, the same effect as in the case of FIG. 9 is obtained.
[0083]
In the example shown in FIG. 12, similarly to the case of FIG. 9, the vertical sealing region 61 is in contact with the partition 24 adjacent thereto at the center, and the minimum width d1 of the gap 64a and the minimum width d2 of the gap 64b Is 0, so that the same effect as in the case of FIG. 9 is achieved.
In the example shown in FIG. 13, the positions of the vents 21 a and 21 b inside the flow stop partition 70 are not provided diagonally, but are provided adjacent to the vicinity of the center of the vertical partition 71, and the gaps 64 a and 64 b A partition wall 73a and a partition wall 73b that partition the gap are provided at the ends. In this case, the dry air flows in the same manner as in the case of FIG. 11, and has the same effect as in the case of FIG.
[0084]
The example shown in FIG. 14 is substantially the same as the example shown in FIG. 11, except that a gas inlet 21a serving as a gas inlet and a gas outlet 21b serving as a gas outlet are formed at two locations and arranged in a stripe pattern. Among the plurality of partition walls 24, the central partition wall 27 located in the middle is extended so as to be connected to the horizontal partition wall 72. In this case, although dry air flows separately for each of the two regions divided by the central partition wall 27, the gaps 63a and 63b are set wider than the gaps 64a and 64b. The same effect as in the case of No. 11 can be obtained. In the example of FIG. 14, the flow rate of the dry air can be adjusted for each of the two regions.
[0085]
(Modification of this embodiment)
In the present embodiment, the dry air flowing into the internal space in the sealing step preferably has a water vapor partial pressure of 15 Torr or less (or a dew point temperature of 20 ° C. or less). Embodiment 1 is similar to Embodiment 1 in that the same effects can be obtained even when an inert gas such as nitrogen that does not react with the phosphor layer and has a low water vapor partial pressure is used. As described in the above.
[0086]
Further, in the present embodiment, the case where the partition wall is provided on the back panel substrate side has been described. However, the same effect can be obtained even when the partition wall is provided on the front panel substrate side.
(Example 2)
[0087]
[Table 2]

[0088]
Panel No. PDP No. 6 is a PDP manufactured based on the example of FIG. 10 in the present embodiment, and the partial pressure of the steam of the dry air flowing in the sealing step was 2 Torr (dew point temperature −10 ° C.).
Panel No. As shown in FIG. 15, the rear panel substrate 20 has a gap 63a between the horizontal partition 72 and the partition end 24a and a gap 63b between the horizontal partition 72 and the partition end 24b, as shown in FIG. The gaps 64a and 64b between the adjacent partition walls 24 are set to be smaller than the gaps 64a and 64b (D1, D2 <d1, d2), but otherwise the same as the example shown in FIG. This panel No. 7 is panel No. 7. This is a PDP produced by performing sealing under the same conditions as in Example 6.
[0089]
Panel No. In the PDP No. 8, as shown in FIG. 16, only one vent 21a is provided in the rear panel substrate 20. This panel No. Numeral 8 relates to a comparative example, in which in the sealing step, the front panel substrate 10 and the rear panel substrate 20 were overlapped and then heated and heated without flowing dry air into the internal space, and sealed. It is.
[0090]
These panel Nos. In the PDPs Nos. 6 to 8, the same manufacturing conditions were used except for the sealing step. The panel configuration was the same except for the vents and the barrier ribs. The thickness of the phosphor was 30 μm, and the discharge gas was filled with Ne (95%)-Xe (5%) at 500 Torr.
<Emission characteristic test>
Test method and results:
For each of these PDPs, the panel luminance and color temperature in white balance without color correction, and the peak intensity ratio of the emission spectrum when the blue cell and the green cell were made to emit light at the same power without color correction were measured.
[0091]
These measurement results are as shown in Table 2.
In addition, the prepared PDPs are disassembled, and the back panel substrate is irradiated with vacuum ultraviolet light using a krypton excimer lamp to emit all colors, and the emission temperature when emitting blue and green light. When the peak intensity ratio was measured, a result equivalent to the result of the above lighting was obtained.
[0092]
Further, the blue phosphor is taken out from the panel, and H is desorbed at a temperature of 200 ° C. or more from 1 g of the blue phosphor by TDS analysis. ₂ The number of O gas molecules was measured. The ratio of the c-axis length to the a-axis length of the blue phosphor crystal was also measured by X-ray diffraction. Table 2 also shows these results.
Discussion:
In the measurement results of Table 2, in panel no. No. 6 shows the best emission characteristics.
[0093]
Panel No. The light emission characteristics of panel No. 6 are panel no. 7 was better than the light emission characteristics of Panel No. 7. In the sealing process, dry air stably flowed in the space between the partition walls and gas generated inside could be efficiently discharged. 7 indicates that most of the dry air introduced from the vent 21a is discharged from the vent 21b through the gap 63a and the gap 63b and does not flow much into the gap 65 between the partition walls. This is probably because the wastewater was not efficiently discharged.
[0094]
In addition, panel no. It is considered that the reason why the light emission characteristics of No. 8 is poor is that the gas generated in the gap 65 is not discharged because the dry gas does not flow into the gap 65.
In the present embodiment, the PDP based on FIG. 10 has been described. However, in the PDP based on any of FIGS.
[Embodiment 3]
The PDP of the present embodiment has the same configuration as the PDP of the first embodiment shown in FIG.
[0095]
The PDP manufacturing method is also the same as that of the first embodiment, but when the front panel substrate 10 and the rear panel substrate 20 are sealed in the sealing step, the internal space is reduced to a pressure lower than the atmospheric pressure. Heating is performed while flowing dry air while adjusting the temperature.
That is, a sealing glass frit is applied to at least one of the front panel substrate 10 and the rear panel substrate 20 to form a sealing glass layer, and then calcined. After calcination, the two substrates 10 and 20 are superimposed, and the superposed two substrates 10 and 20 are put into the heating furnace 51 of the sealing heating device 50 shown in FIG. Dry air from the gas supply source 53 is fed at a constant flow rate through the pipe 52a while connecting the 52b and evacuating the pipe 52b with the vacuum pump 54 to reduce the internal space. At this time, the adjusting valves 55a and 55b are adjusted so that the internal space is maintained at a predetermined pressure lower than the atmospheric pressure.
[0096]
As described above, the panel substrates 10 and 20 are heated and heated at the sealing temperature (peak temperature of 450 ° C.) for 30 minutes while flowing the dry air under reduced pressure into the internal space, so that the sealing glass layer 15 is formed. The panel substrates 10 and 20 are softened and sealed.
Then, the panel is baked while evacuating the internal space of the attached panel substrate (at 350 ° C. for 3 hours). Thereafter, a PDP is manufactured by filling a discharge gas having the above composition at a predetermined pressure.
[0097]
(Effects in the present embodiment)
In the sealing step of the present embodiment, as in the first embodiment, since the sealing is performed while flowing the dry gas into the internal space, the thermal degradation due to the phosphor coming into contact with the water vapor as described above can be suppressed.
The vapor partial pressure of the dry air flowing through the internal space is desirably 15 Torr or less, as in Embodiment 1, and the vapor partial pressure is further reduced to 10 Torr or less, 5 Torr or less, 1 Torr, 0.1 Torr or less. The lower the setting, the more the thermal degradation of the phosphor can be suppressed, and the dew point temperature of the dry air is preferably set to 20 ° C or lower, and 0 ° C or lower, -20 ° C or lower, and -40 ° C or lower. Is more preferred.
[0098]
Furthermore, in the present embodiment, since the sealing is performed while maintaining the internal space at a pressure lower than the atmospheric pressure, the water vapor generated in the internal space is discharged to the outside more efficiently than in the first embodiment. In addition, since the dry air is introduced while maintaining the internal space at or below the atmospheric pressure, the front panel substrate 10 and the rear panel substrate 20 can be sealed with good adhesion without expanding the internal space during sealing.
[0099]
It is preferable that the pressure of the internal space at the time of sealing is set lower, since the water vapor partial pressure is easily reduced and the sealing can be performed with good adhesion. In this regard, the pressure in the internal space is preferably set to 500 Torr or less, and more preferably set to 300 Torr or less.
On the other hand, when flowing dry air, if the pressure is too low, the oxygen partial pressure of the atmospheric gas will be low. Therefore, BaMgAl, which is widely used in PDP, ₁₀ O ₁₇ : Eu, Zn ₂ SiO ₄ : Mn or Y ₂ O ₃ : When an oxide-based phosphor such as Eu is heated in an oxygen-free atmosphere, defects such as oxygen defects are formed, and the luminous efficiency is likely to be reduced. Therefore, from this point of view, it can be said that it is preferable to set the pressure to 300 Torr or more.
[0100]
(Modification of this embodiment)
In the present embodiment, in the sealing step, dry air is flown as an atmospheric gas into the internal space, but is an inert gas such as oxygen or nitrogen that does not react with the phosphor layer and has a low water vapor partial pressure. The same effect can be obtained by flowing the object. However, it is preferable to flow an atmosphere gas containing oxygen in that luminance degradation is suppressed.
[0101]
Further, in the present embodiment, the internal space is evacuated from a low temperature at which the sealing glass is not softened. In this case, however, the inside of the heating furnace 51 is removed from the gap between the front panel substrate 10 and the rear panel substrate 20. Since the gas may flow into the internal space, it is preferable that the heating furnace 51 is filled with dry air or flows therethrough.
In addition, in the sealing step, in order to prevent the gas in the heating furnace 51 from flowing into the internal space, at a low temperature when the sealing glass is not softened, the dry gas is not forcibly discharged from the internal space without being forced out. The internal space may be kept close to the atmospheric pressure, and the internal space may be made lower than the atmospheric pressure by forcibly discharging after the temperature has risen to some extent. In this case, the temperature at which the evacuation is started is desirably equal to or higher than the temperature at which the sealing glass starts to soften. From this point, the temperature at which the evacuation is started is preferably 300 ° C. or higher, more preferably 350 ° C. or higher, and further preferably 400 ° C. or higher.
[0102]
Further, in the present embodiment, the description has been made that the sealing step is performed while flowing dry air while keeping the internal space in a reduced pressure state. However, the phosphor baking step and the calcining step are also performed by flowing dry air in a reduced pressure state. It can be performed in an atmosphere, and the same effect can be obtained.
Also in this embodiment, it is more effective to apply the panel structure as described in the second embodiment.
(Example 3)
[0103]
[Table 3]

[0104]
Table 3 shows manufacturing conditions of the PDP according to the example manufactured based on the present embodiment and the first embodiment, and the PDP according to the comparative example.
Panel No. PDPs 11 to 21 are PDPs based on the present embodiment, and include a partial pressure of water vapor of a dry gas flowing into the panel in the sealing step, a gas pressure in the panel internal space, a temperature at which the panel internal space starts to be at or below the atmospheric pressure, And the type of the drying gas was changed.
[0105]
Panel No. PDP No. 22 is a PDP based on Embodiment 1, in which dry air was introduced into the internal space in the sealing step, but was not forcibly exhausted.
Panel No. PDP No. 23 is a PDP according to a comparative example, which was performed by a conventional method without introducing a dry gas into the internal space in the sealing step.
[0106]
In each of these PDPs, the thickness of the phosphor layer was 30 μm, and the discharge gas was filled with Ne (95%)-Xe (5%) at 500 Torr.
<Emission characteristic test>
Test method and results
For each of these PDPs, the emission characteristics include relative emission intensity of blue emission, value of chromaticity coordinate y of blue emission, peak wavelength of blue emission, color temperature of white display (no color correction), blue cell and green cell. The peak intensity ratio of the emission spectrum when emitted with the same power was measured.
[0107]
The blue light emission intensity, the value of the chromaticity coordinate y of blue light emission, and the color temperature of white display (no color correction) were measured by the method described in the first embodiment. The peak wavelength of blue emission was determined by lighting only the blue cell and measuring the emission spectrum. These measurement results are as shown in Table 3.
The relative luminous intensity of blue luminescence shown in Table 3 was obtained by measuring the measured luminous intensity with the panel No. of the comparative example. This is a relative value when the emission intensity measurement value for No. 23 is set to a reference value of 100.
[0108]
Further, each of the produced PDPs is disassembled, and the rear panel substrate is irradiated with vacuum ultraviolet rays using a krypton excimer lamp, the chromaticity coordinate y at the time of emitting blue light, the color temperature at which all colors are emitted, and blue and When the peak intensity ratio of the emission spectrum when emitting green light was measured, a result equivalent to the result of the above lighting was obtained.
Further, the blue phosphor is taken out from the panel, and H is desorbed at a temperature of 200 ° C. or more from 1 g of the blue phosphor by TDS analysis. ₂ The number of O gas molecules was measured. The ratio of the c-axis length to the a-axis length of the blue phosphor crystal was also measured by X-ray diffraction. Table 3 also shows these results.
[0109]
Discussion:
When the light emission characteristics of the example (panel Nos. 11 to 21) and the comparative example (panel No. 23) are compared, the light emission characteristics of the example are superior to the comparative example (the emission intensity of blue light emission is high, The color temperature of white display is high.)
Panel No. 14 and panel no. Comparing the light emission characteristics of No. 22, they show equivalent values. This indicates that if the partial pressure of water vapor of the dry air flowing in the internal space is the same, the same effect (luminous characteristics) can be obtained whether the internal space is under atmospheric pressure or under reduced pressure. I have.
[0110]
However, panel No. Among 22, some of them had a gap between the partition and the front panel substrate. This corresponds to panel no. In No. 22, it is considered that the internal space was slightly expanded by the dry gas introduced during the sealing.
Panel No. No. 11 to No. 14 are compared. It can be seen that the blue emission intensity is higher in the order of 11 to 14, and the chromaticity coordinate y of the blue emission is smaller. This indicates that the lower the water vapor partial pressure of the dry air, the higher the blue light emission intensity and the smaller the chromaticity coordinate y of the blue light emission. This is presumably because the thermal degradation of the blue phosphor was prevented by reducing the partial pressure of water vapor.
[0111]
Panel No. Comparing the light emission characteristics of Nos. 14 to 16, the chromaticity coordinates y of the blue light emission are equivalent, indicating that the chromaticity coordinates y of the blue light emission are not affected by the pressure in the internal space. On the other hand, with respect to the relative light emission intensity of blue light emission, panel no. It decreases in the order of 14-16. This indicates that when the oxygen partial pressure of the atmospheric gas decreases, defects such as oxygen defects occur in the phosphor, and the emission intensity of blue light emission decreases.
[0112]
Panel No. 14 and panel no. Comparing the light emission characteristics of 20 and 21, the chromaticity coordinate y of blue light emission is equivalent, indicating that the chromaticity coordinate y of blue light emission is not affected by the type of dry gas flowing into the internal space. On the other hand, with respect to the relative light emission intensity of blue light emission, panel no. 20 and 21, the panel Nos. It is lower than 14. This is because when a gas that does not contain oxygen, such as nitrogen or Ne (95%)-Xe (5%), is used as a dry gas, defects such as oxygen defects are generated in the phosphor, and the emission intensity is reduced. It is shown that.
[0113]
Panel No. 14 and panel no. When the light emission characteristics of Panel Nos. 17 to 19 are compared, Panel Nos. In the order of 17, 18, 14, and 19, the blue emission intensity increases and the chromaticity coordinate y also decreases. This indicates that the higher the temperature at which the internal space starts to be evacuated to a level lower than the atmospheric pressure, the higher the blue emission intensity and the smaller the chromaticity coordinate y, and the higher the exhaust start temperature of the internal space. It is considered that this prevented the atmosphere gas around the panel from flowing into the internal space of the panel.
[0114]
In addition, each panel No. shown in Table 3 was used. Looking at the relationship between the chromaticity coordinate y of blue light emission and the peak wavelength of blue light emission, it can be seen that the smaller the value of the chromaticity coordinate y of blue light emission, the shorter the peak wavelength of blue light emission. This indicates that the small chromaticity coordinate y value of blue light emission is equivalent to the short peak wavelength of blue light emission.
[Embodiment 4]
The PDP of the present embodiment has the same configuration as the PDP of the first embodiment shown in FIG.
[0115]
In the method of manufacturing the PDP according to the present embodiment, a method similar to a conventional method is performed up to a sealing step of sealing the front panel substrate 10 and the back panel substrate 20 (that is, in the sealing step, the front panel substrate 10 is sealed). 10 and the back panel substrate 20 are superimposed and heated without flowing dry air into the internal space.) In the evacuation step, heating is performed while flowing dry gas into the internal space before starting vacuum evacuation. The difference is that the treatment is performed, whereby the emission characteristics of the blue phosphor layer thermally degraded by the sealing step can be recovered.
[0116]
Hereinafter, the exhaust process in the present embodiment will be described in detail.
In the evacuation process of the present embodiment, the same device as the sealing heating device shown in FIG.
Glass tubes 26a and 26b are attached to the vents 21a and 21b of the back panel substrate 20 in advance. After connecting the pipes 52a and 52b to the glass tubes 26a and 26b and evacuating the internal space once by evacuating the pipe 52b with a vacuum pump 54, dry air is supplied at a constant flow rate from the pipe 52a without using the vacuum pump 54. Send. As a result, the dry air flows through the internal space between the panel substrates 10 and 20 and is discharged from the pipe 52b.
[0117]
As described above, while flowing the dry air through the internal space, the panel substrates 10 and 20 are heated and heated to a predetermined temperature.
Thereafter, the supply of the dry air is stopped, and the gas adsorbed inside the panel substrates 10 and 20 is exhausted by maintaining the exhaust temperature at a predetermined exhaust temperature while performing the exhaust using the vacuum pump 54.
[0118]
After the evacuation process is completed, a PDP is manufactured by filling a discharge gas.
(About the effect of this embodiment)
According to the evacuation process of the present embodiment, there is an effect of preventing thermal degradation of the phosphor layer in the evacuation process.
[0119]
Further, in a PDP manufacturing process, a phosphor baking step of applying a phosphor to form a phosphor layer and then firing the same, a calcining step of applying a sealing glass frit and calcining the same, In addition, in the sealing step in which the front panel substrate and the rear panel substrate are overlapped and sealed, thermal deterioration is likely to occur in the phosphor layer (particularly, the blue phosphor). Even if the light emission characteristics are deteriorated due to the thermal deterioration of the body layer, the light emission characteristics of the phosphor layer can be restored.
[0120]
The reason is considered as follows.
When the panel substrate sealed in the sealing step is heated and heated, a gas (particularly, water vapor) is released into the internal space. For example, when the sealed panel substrate is left in the air, moisture and the like are also adsorbed inside, and when heated, water vapor and the like are released. Here, according to the evacuation process of the present embodiment, before starting the evacuation, water vapor or the like is released by the dry gas treatment of heating and increasing the temperature of the panel substrate while circulating dry air in the internal space, and the panel is efficiently discharged. It is discharged outside. Therefore, thermal degradation is reduced as compared with a conventional evacuation process in which vacuum evacuation is simply performed without performing dry gas processing.
[0121]
In addition, it is considered that the gas discharge action by the dry gas treatment causes a reaction opposite to that when the phosphor layer is thermally degraded, discharges the gas, and recovers the light emission characteristics.
As described above, in the present embodiment, the emission characteristics of the blue phosphor once thermally degraded can be recovered in the exhaust step which is the last thermal process, and thus the practical effect is large.
[0122]
In order to further enhance the effect of restoring the emission characteristics of the blue phosphor in the evacuation step, it is preferable to set the following conditions.
The higher the peak temperature in the evacuation process (that is, the higher of the temperature when heating while flowing a dry gas and the temperature when performing vacuum evacuation), the more the emission characteristics of the blue phosphor are recovered. The effect is greater.
[0123]
In order to obtain a sufficient effect of restoring the light emission characteristics, the peak temperature (the higher of the drying gas processing temperature and the exhaust gas temperature) is preferably set to 300 ° C. or higher, and further, 360 ° C. and 380 ° C. , 400 ° C. is preferably set higher. However, the temperature must not be so high that the sealing glass softens and flows out.
Further, it is preferable to set the temperature at which the temperature is increased in the drying gas treatment to be higher than the exhaust temperature at the time of performing the vacuum exhaust. This is because if the exhaust temperature during evacuation is higher than the heating temperature in dry gas processing, the effect is reduced by the gas (especially water vapor) released from the substrate into the internal space during evacuation, whereas the dry gas processing It is considered that when the heating temperature at the time is higher, the gas released into the internal space during the evacuation is reduced.
[0124]
The lower the water vapor partial pressure of the drying gas circulated in the drying gas treatment, the better. That is, the effect of restoring the emission characteristics of the blue phosphor is improved as the water vapor partial pressure of the dry gas is lower. However, a remarkable effect appears as compared with the conventional vacuum evacuation process because the water vapor partial pressure is 15 Torr or less. Range.
It can be seen from the following experiments that the emission characteristics of the thermally degraded blue phosphor can be recovered.
[0125]
FIGS. 17 and 18 show a blue phosphor (BaMgAl). ₁₀ O ₁₇ : Eu) is a characteristic diagram showing the dependency of the effect of restoring the light emitting characteristics by recalcining in air after once thermally degrading Eu) on the partial pressure of water vapor, which was measured as follows.
First, a blue phosphor (having a chromaticity coordinate y value of 0.052) was thermally degraded by firing (at a peak temperature of 450 ° C. for 20 minutes) in air having a partial pressure of water vapor of 30 Torr. This thermally degraded blue phosphor had a chromaticity coordinate y value of 0.092 and a relative luminous intensity (an index of luminous intensity when the luminous intensity of the completely unfired blue phosphor was set to 100) of 85.
[0126]
The thermally degraded blue phosphor was refired at a predetermined peak temperature in air having various values of the partial pressure of water vapor, and the relative emission intensity and the chromaticity coordinate y value were measured. At the time of refiring, the peak temperature was set at 350 ° C. and 450 ° C., and the peak temperature maintaining time was 30 minutes.
FIG. 17 shows the relationship between the water vapor partial pressure in air during refiring and the measured relative luminescence intensity. FIG. 18 shows the relationship between the water vapor partial pressure in air during refiring and the measured chromaticity coordinate y value. Shows the relationship.
[0127]
From the characteristic diagrams of FIGS. 17 and 18, the relative blue light emission intensity is high when the re-firing temperature is 350 ° C. or 450 ° C. when the partial pressure of water vapor in the air during re-firing is in the range of 0 to 30 Torr. It can be seen that the blue chromaticity coordinate y value is small. This is because even if the blue phosphor is thermally degraded by firing in an atmosphere containing a large amount of water vapor and the light emitting characteristics are reduced, the light emitting characteristics are recovered by refiring in an atmosphere having a lower water vapor partial pressure. That is, it indicates that the thermal degradation of the blue phosphor is a reversible reaction.
[0128]
Also, from the characteristic diagrams of FIGS. 17 and 18, it can be seen that the lower the partial pressure of water vapor in the air during refiring and the higher the refiring temperature, the greater the effect of restoring the light emission characteristics.
Although detailed description is omitted, the same measurement was performed by changing the time for maintaining the peak temperature. As a result, it was found that the longer the time maintained at the peak temperature, the greater the effect of restoring the light emission characteristics.
[0129]
(Modification of this embodiment)
In the evacuation process of the present embodiment, dry air is used for performing the dry gas treatment. However, the same process can be performed using an inert gas such as nitrogen or argon, and the same effect can be obtained.
Further, in the evacuation process of the present embodiment, before starting the evacuation, a dry gas treatment for heating and raising the temperature of the panel substrate while flowing dry air was performed, but the evacuation was simply performed without performing the dry gas treatment. Even in the case of performing, the emission characteristics of the phosphor layer can be recovered to some extent by setting the exhaust temperature to a higher exhaust temperature (360 ° C. or higher) than the conventional general exhaust temperature. Also in this case, as the exhaust gas temperature is set higher, a larger light emission characteristic recovery effect is obtained.
[0130]
However, the effect of restoring the emission characteristics of the phosphor layer is greater when the dry gas treatment is performed. This is presumably because the internal space is narrow, and unless dry gas treatment is performed, the water vapor released during vacuum evacuation is not sufficiently exhausted to the outside of the panel.
Also in this embodiment, if the panel structure described in the second embodiment is applied, a greater gas discharge effect can be expected during dry gas processing.
[0131]
(Example 4)
[0132]
[Table 4]

[0133]
Panel No. Reference numerals 21 to 29 denote PDPs according to the present embodiment, which are manufactured by performing a dry gas treatment and then evacuating the vacuum gas. The PDPs have various heating temperatures and exhaust temperatures during the dry gas treatment. It was prepared by changing the temperature. In the drying gas treatment, the heating was maintained at a predetermined heating temperature for 30 minutes while flowing dry air, and the vacuum was maintained at a predetermined exhaust temperature for 2 hours during evacuation.
[0134]
Panel No. Reference numerals 30 to 32 denote PDPs according to the modified examples, in which the dry gas treatment is not performed, and the exhaust gas is evacuated at an exhaust temperature of 360 ° C. or more.
Panel No. Reference numeral 33 denotes a PDP according to a comparative example manufactured by evacuating for 2 hours while heating at 350 ° C. without performing dry gas treatment as in the related art.
In each of these PDPs, the panel configuration was the same, the thickness of the phosphor layer was 30 μm, and the discharge gas was filled with Ne (95%)-Xe (5%) at 500 Torr.
[0135]
<Emission characteristic test>
For each of these PDPs, the relative emission intensity of blue emission and the chromaticity coordinate y value of blue emission were measured as emission characteristics.
Test results and discussion:
These measurement results are as shown in Table 4. In addition, the luminous intensity was measured for Panel No. of the comparative example. The relative luminous intensity is shown with the luminous intensity of 33 as 100.
[0136]
Panel No. Panel Nos. 21 to 28 are all panel Nos. 33, the luminous intensity is higher and the chromaticity coordinate y value of blue light emission is smaller. This indicates that the PDP is manufactured using the evacuation process of the present embodiment, whereby the light emission characteristics of the PDP are improved as compared with the related art.
Panel No. When the light emission characteristics are compared among panel Nos. 21 to 24, panel Nos. The light emission characteristics are improved in the order of 21, 22, 23, and 24 (the relative light emission intensity increases, and the chromaticity coordinate y value decreases). This indicates that the higher the heating temperature during the dry gas treatment, the more the effect of restoring the emission characteristics of the blue phosphor layer is improved.
[0137]
In addition, panel no. 24, 25, and 26, the panel Nos. Light emission characteristics are improved in the order of 26, 25, and 24. This indicates that setting the heating temperature during the dry gas treatment higher than the exhaust temperature during vacuum evacuation improves the effect of restoring the emission characteristics of the blue phosphor layer.
In addition, panel no. 24, 27 to 29, the panel Nos. The light emission characteristics are improved in the order of 27, 28, 24, 29. This indicates that as the water vapor partial pressure during the dry gas treatment is set smaller, the effect of restoring the emission characteristics of the blue phosphor layer is improved.
[0138]
In addition, panel no. Panel Nos. 30 to 32 are panel Nos. As compared with 33, the emission intensity is higher and the chromaticity coordinate y value of blue emission is smaller. This shows that the light emission characteristics of the PDP are improved as compared with the related art even when the PDP is manufactured by using the evacuation process of the above modification.
However, panel no. Panel Nos. 30 to 32 are panel Nos. Light emission characteristics are inferior to those of No. 21 or the like. This indicates that performing the dry gas treatment has a greater effect of restoring the emission characteristics of the blue phosphor layer.
[0139]
[Embodiment 5]
The PDP of the present embodiment has the same configuration as the PDP of the first embodiment shown in FIG.
The method of manufacturing the PDP is the same as that of the first embodiment up to the calcining step, but when sealing the front panel substrate 10 and the rear panel substrate 20, the front panel substrate 10 and the rear panel substrate 20 are bonded together. The difference is that preheating is performed in a state where the facing surface is opened, and the heated surface is overlaid and sealed.
[0140]
The PDP of the present embodiment has a chromaticity coordinate y of an emission color of 0.08 or less and a peak wavelength of an emission spectrum of 455 nm or less when only the blue cell is lit, and has a white balance without color correction and a color temperature. Can be 7000K or more. Further, depending on the manufacturing conditions, by setting the chromaticity coordinate y of the blue light emission to 0.06 or less, it is possible to make the color temperature about 11000 K with white balance without color correction.
[0141]
Hereinafter, the sealing step in the present embodiment will be described in detail.
FIG. 19 is a diagram schematically illustrating a configuration of a sealing device used in a sealing process.
The sealing device 80 discharges the gas from the heating furnace 81 into the heating furnace 81 that heats the front panel substrate 10 and the rear panel substrate 20 by adjusting the amount of the atmospheric gas introduced into the heating furnace 81. A gas discharge valve 83 for adjusting the gas discharge amount and the like are attached.
[0142]
The inside of the heating furnace 81 can be heated to a high temperature by a heater (not shown). In addition, an atmosphere gas (for example, dry air) that forms an atmosphere in which the front panel substrate and the rear panel substrate are heated can be introduced into the heating furnace 81 from the gas introduction valve 82, and a vacuum gas can be introduced from the gas discharge valve 83. The inside of the heating furnace 81 can be evacuated by a pump (not shown) to a high vacuum. The degree of vacuum in the heating furnace 81 can be adjusted by the gas introduction valve 82 and the gas discharge valve 83.
A gas dryer (not shown) is provided between the atmosphere gas supply source and the heating furnace 81 for removing the atmosphere gas by cooling it to a low temperature (minus several tens of degrees) and condensing moisture. By passing through the gas dryer, the amount of steam (steam partial pressure) in the atmospheric gas is reduced.
[0143]
In the heating furnace 81, there is provided a mounting table 84 on which the front panel substrate 10 and the rear panel substrate 20 are superimposed and mounted. On the mounting table 84, a moving pin for moving the rear panel substrate 20 in parallel is provided. 85 are installed. A pressing mechanism 86 for pressing the back panel substrate 20 downward is provided above the mounting table 84.
[0144]
FIG. 20 is a perspective view illustrating an internal configuration of the heating furnace 81.
19 and 20, the rear panel substrate 20 is disposed such that the longitudinal direction of the partition wall is along the horizontal direction in the drawing.
As shown in FIGS. 19 and 20, the rear panel substrate 20 is set to be slightly longer than the front panel substrate 10 in the longitudinal direction of the partition wall (horizontal direction in the drawing), and both ends of the rear panel substrate 20 are connected to the front panel substrate. 10 protrudes outward from both ends. In this protruding portion, a lead line for connecting the address electrode 22 to the drive circuit is provided. The moving pins 85 and the pressing mechanism 86 are arranged so as to sandwich the protruding portion of the rear panel substrate 20 mounted on the mounting table 84 from above and below around four corners of the rear panel substrate 20.
[0145]
The four moving pins 85 have pin upper ends projecting upward from the upper surface of the mounting table 84, and can be simultaneously moved up and down by a pin elevating mechanism (not shown) provided inside the mounting table 84.
Each of the four pressing mechanisms 86 includes a cylindrical support portion 86a fixed to the upper portion of the heating furnace 81, a slide bar 86b supported in a vertically movable state inside the support portion 86a, and a support portion. A spring 86c is provided in the interior 86a and urges the slide bar 86b downward. The lower end of the slide bar 86b presses the rear panel substrate 20 by the urging force of the spring 86c.
[0146]
FIG. 21 is a diagram showing an operation when performing a preheating step and a sealing step using this sealing device.
The calcining, preheating, and sealing steps will be described with reference to FIG.
Calcination process:
The outer peripheral portion of the facing surface of the front panel substrate 10 (the surface facing the rear panel substrate 20), the outer peripheral portion of the facing surface of the rear panel substrate 20 (the surface facing the front panel substrate 10), or the front panel substrate 10 Then, a paste made of sealing glass (glass frit) is applied to the outer peripheral portion of the opposing surface of both the back panel substrate 20 and the sealing glass layer 15 is formed by calcination at about 350 ° C. for 10 to 30 minutes. (Note that, in the figure, the sealing glass layer 15 is formed on the facing surface of the front panel substrate 10).
[0147]
Preheating step:
Then, the front panel substrate 10 and the rear panel substrate 20 are placed at a fixed position on the mounting table 84 in a state where they are aligned and overlapped, and the pressing mechanism 86 is set to press the rear panel substrate 20 (FIG. 21). (A)).
Next, the following operation is performed while flowing the atmosphere gas (dry air) through the heating furnace 81 (or while using the vacuum exhaust from the gas discharge valve 83).
[0148]
The moving pins 85 are raised, and the rear panel substrate 20 is pushed upward to translate in parallel (see FIG. 21B). As a result, the gap between the opposing surfaces of the front panel substrate 10 and the rear panel substrate 20 is widened, and the surface of the rear panel substrate 20 on which the phosphor layer 25 is disposed is opened to a large space in the heating furnace 81.
In this state, gas is released from the panel substrates 10 and 20 by heating and heating the inside of the heating furnace 81. When the temperature reaches a predetermined temperature (for example, 400 ° C.), the preheating step is completed.
[0149]
Sealing process:
Subsequently, the moving pins 85 are lowered, and the rear panel substrate 20 is superimposed on the front panel substrate 10 again. At this time, the back panel substrate 20 is superimposed in a state where it is aligned as before (see FIG. 21C).
Then, when the inside of the heating furnace 81 reaches a predetermined sealing temperature (around 450 ° C.) higher than the softening point of the sealing glass layer 15, the sealing temperature is maintained for 10 to 20 minutes. At this time, the outer peripheral portions of the front panel substrate 10 and the rear panel substrate 20 are sealed by the softened sealing glass. During this time, since the rear panel substrate 20 is pressed against the front panel substrate 10 by the pressing mechanism 86, stable sealing can be performed.
[0150]
When the sealing is completed, the pressing mechanism 86 is released, and the sealed substrate is taken out.
After performing the sealing process in this manner, an exhaust process is performed.
In this embodiment, as shown in FIGS. 19 and 20, only one vent 21a is provided on the outer peripheral portion of the back panel substrate 20, and a vacuum pump (not shown) is attached to the glass tube 26 attached to the vent 21a. ) To exhaust. After this evacuation step, a discharge gas is sealed in the internal space from the glass tube 26, the vent 21a is sealed, and the glass tube 26 is cut off, whereby a PDP is manufactured.
[0151]
(About the effect of the manufacturing method of the present embodiment)
The manufacturing method of the present embodiment has the following effects as compared with the conventional manufacturing method.
As described in the first embodiment, in the conventional general manufacturing method, the emitted gas is confined in a narrow internal space in the sealing step, so that the phosphor layer 25 facing the internal space is affected by the gas. (Especially due to the influence of water vapor released from the protective layer 14), it is likely to be thermally degraded. Then, when the phosphor layer (particularly, the blue phosphor layer) is thermally degraded, the emission intensity decreases.
[0152]
On the other hand, according to the manufacturing method of the present embodiment, the gas such as water vapor adsorbed on the front panel substrate 10 and the back panel substrate 20 is released by the preheating. Since a wide gap is formed therebetween, the generated gas is not confined in the internal space. Then, after the preliminary heating, the panel substrates 10 and 20 are sealed in a heated state, so that moisture and the like do not adsorb to the panel substrates 10 and 20 after the preliminary heating. Therefore, gas generated from both panel substrates 10 and 20 at the time of sealing is reduced, and thermal degradation of the phosphor layer 25 is prevented.
[0153]
Furthermore, in the present embodiment, since the steps from the preheating step to the sealing step are performed in an atmosphere in which dry air flows, thermal degradation of the phosphor layer 25 due to water vapor in the atmospheric gas does not occur.
Further, by using the sealing device 80 as described above, the preheating step and the sealing step can be continuously performed in the same heating furnace 81, so that these steps can be performed quickly and with little energy consumption. It can be carried out.
[0154]
When the front panel substrate 10 and the rear panel substrate 20 are first positioned and placed using the sealing device 80 as described above, the sealing is performed in the aligned state.
(Consideration of the temperature to be raised by preheating and the timing of overlapping the front panel substrate and the rear panel substrate)
From the viewpoint of preventing the phosphor layer 25 from being thermally degraded by the gas (water vapor released from the protective layer 14) generated from the substrate at the time of sealing, it can be said that it is better to overlap the layers after heating them to the highest possible temperature.
[0155]
In order to examine this point in more detail, the following experiment was performed.
While the glass substrate on which the MgO layer was formed in the same manner as the front panel substrate 10 was gradually heated and heated at a constant heating rate, water vapor released from the MgO layer was measured using a thermal desorption gas mass spectrometer. The amount was measured over time.
FIG. 22 shows the measurement results, showing the amount of released steam at each heating temperature up to 700 ° C.
[0156]
In the graph of FIG. 22, the first peak is observed at around 200 ° C. to 300 ° C., and the second peak is seen at around 450 ° C. to 500 ° C.
From the results shown in FIG. 22, when the temperature of the protective layer 14 is increased by heating, a considerable amount of water vapor is released around 200 ° C. to 300 ° C. corresponding to the first peak, and when the temperature of the protective layer 14 is further increased by heating. It is presumed that a considerable amount of water vapor is released even at around 450 ° C. to 500 ° C. corresponding to the second peak.
[0157]
Therefore, at the time of heating and raising the temperature in the sealing step, in order to prevent water vapor released from the protective layer 14 from being trapped in the internal space, at least to a temperature of about 200 ° C., preferably to about 300 ° C. to 400 ° C. It is considered that the temperature should be increased while the front panel substrate 10 and the rear panel substrate 20 are separated from each other.
Further, if the front panel substrate 10 and the rear panel substrate 20 are separated from each other and the temperature is raised to a high temperature of about 450 ° C. or more and then the panels are superposed, gas is almost completely released from the panel after the superposition. It is thought that it can be completely suppressed. In this case, the phosphor can be sealed with little thermal degradation at the time of sealing, and even after completion of the PDP, the possibility that the water vapor adsorbed in the panel is gradually released during the discharge is extremely high. Since the number is reduced, a change with time after completion of the panel can be suppressed.
[0158]
However, since the firing temperature for forming the phosphor layer and the MgO protective layer is generally about 520 ° C., it is not preferable to exceed this temperature. Therefore, it can be said that it is more preferable to raise the temperature to a high temperature of about 450 ° C. to 520 ° C. and then to overlap.
On the other hand, if the front panel substrate and the rear panel substrate are separated and heated to a temperature higher than the softening point of the sealing glass, the sealing glass may flow out of its original position and may not be stably sealed.
[0159]
Therefore, from the viewpoint of preventing deterioration of the phosphor layer due to the generated gas and achieving stable sealing, the following considerations (1), (2), and (3) are considered. be able to.
(1) In a state where the front panel substrate and the rear panel substrate are separated from each other, it is considered that it is preferable to heat and raise the temperature to as high as possible below the softening point of the sealing glass to be used, and then to overlap and seal.
[0160]
Therefore, for example, in the case of using a sealing glass having a softening point of about 400 ° C. which has been generally used in the past, the front panel is preferably used in order to minimize the influence of the gas on the phosphor while keeping the sealing stable. It is thought that it is better to heat up the temperature to about 400 ° C with the substrate and the back panel substrate separated, then superimpose the front panel substrate and the back panel substrate, and further heat to above the softening point to seal. Can be
[0161]
(2) Here, if the sealing glass having a higher softening point is used, stable sealing can be achieved even if the front panel substrate and the rear panel substrate are separated from each other by heating to a higher temperature. Become. Therefore, using the sealing glass having a high softening point as described above, the temperature is heated to near the softening point, and then the front panel substrate and the rear panel substrate are overlapped, and further heated to a temperature higher than the softening point to seal. Then, the influence of the gas on the phosphor can be further reduced while maintaining the sealing stability.
[0162]
(3) On the other hand, if the sealing glass layer formed on the outer peripheral portion of the front panel substrate or the rear panel substrate is devised so as not to flow even if it is softened, the sealing is performed in a state where the front panel substrate and the rear panel substrate are separated. Even if the glass is heated to a temperature higher than the softening point of the glass to be worn, stable sealing can be achieved. For example, in the outer peripheral portion of the front panel substrate or the back panel substrate, if a partition wall for preventing flow is formed between the region where the sealing glass is applied and the display region, the display region is softened when the sealing glass is softened. Can be prevented from flowing out.
[0163]
Therefore, after taking such measures to prevent the sealing glass from leaking out, the temperature is raised to a temperature higher than the softening point of the sealing glass in a state where the front panel substrate and the rear panel substrate are separated from each other, and the front panel substrate and the rear surface are heated. When the panel substrates are overlapped and sealed, the effect of the gas on the phosphor can be further reduced while maintaining the sealing stability.
That is, in this case, since the sealing can be performed without heating and heating after the front panel substrate and the rear panel substrate are superimposed, gas emission from the panel after superimposition can be almost completely suppressed. Therefore, sealing can be performed in a state where the phosphor hardly undergoes thermal deterioration.
[0164]
(Consideration of atmosphere gas and pressure)
It is desirable to use a gas containing oxygen, such as air, as the atmosphere gas flowing through the heating furnace 81 at the time of sealing, rather than a gas containing no oxygen. This is because, as described in the first embodiment, the luminous efficiency of an oxide phosphor frequently used in a PDP tends to decrease when heated in an oxygen-free atmosphere.
[0165]
In addition, although a certain degree of effect can be obtained even when the outside air is sent at normal pressure as the atmospheric gas, in order to enhance the effect of preventing the phosphor layer from being deteriorated, a dry gas such as dry air is circulated in the heating furnace 81 or the like. It is desirable that the heating is performed while the inside of the heating furnace 81 is evacuated.
The flow of the drying gas is preferable because the water vapor contained in the atmospheric gas does not cause thermal degradation of the phosphor layer. The reason why the inside of the heating furnace 81 is desirably evacuated is that gas (such as water vapor) released from the panel substrates 10 and 20 due to heating is efficiently discharged.
[0166]
When a dry gas is circulated as the atmospheric gas, the lower the water vapor partial pressure is, the more the thermal degradation of the blue phosphor layer is suppressed (see the experimental results of FIGS. 5 and 6 described in the first embodiment). In order to obtain a sufficient effect, the water vapor partial pressure is desirably set to 15 Torr or less, and the lower the pressure is set to 10 Torr, 5 Torr, 1 Torr, and 0.1 Torr, the more effect can be expected.
[0167]
(About the application of glass for sealing)
At the time of sealing a PDP, it is common to apply sealing glass to only one substrate (generally, only the rear substrate side) and to seal both substrates together.
By the way, in the present embodiment, the rear panel substrate 20 is pressed against the front panel substrate 10 by the pressing mechanism 86 in the sealing device 80, so it is difficult to press down with a strong pressure such as clamping.
[0168]
Therefore, when the sealing glass layer is formed and sealed only on the rear glass substrate side, if the wettability between the sealing glass and the front glass plate is poor, the sealing with the sealing glass may not be completely performed. However, if the sealing glass layer is formed on both the front glass substrate and the rear glass substrate, the front glass substrate and the rear glass substrate are completely bonded after sealing, so that a PDP can be manufactured with high yield. .
[0169]
The method of forming and sealing the sealing glass layer on both the front glass substrate and the rear glass substrate in this manner is not limited to the case of the present embodiment, but in a general sealing process of PDP production, It is effective for sealing with good yield.
(Modification of this embodiment)
In the sealing device 80, the front panel substrate 10 and the rear panel substrate 20 are overlapped and aligned before heating, and the rear panel substrate 20 is pushed up by the moving pins 85 so that the rear panel substrate 20 is moved forward. Although the rear panel substrate 20 is separated from the front panel substrate 10, the method of separating the rear panel substrate 20 from the front panel substrate 10 is not limited thereto.
[0170]
For example, in the example shown in FIG. 23, a frame 87 that fits outside the outer periphery of the front panel substrate 10 is suspended from above the heating furnace by a suspension rod 88 that is driven to slide up and down. The protruding portion 20 is placed on the frame 87 so that the rear panel substrate 20 can be vertically translated. That is, the rear panel substrate 20 is separated from the front panel substrate 10 by pulling the frame 87 upward, and the rear panel substrate 20 can be overlapped with the front panel substrate 10 by lowering the frame 87 downward.
[0171]
Further, in the sealing device 80, the rear panel substrate 20 is pressed against the front panel substrate 10 by the pressing mechanism 86. However, in the example shown in FIG. Weight 89 is placed. In this case, when the frame 87 is lowered, the back panel substrate 20 is pressed against the front panel substrate 10 by the gravity acting on the weight 89.
[0172]
FIG. 24 is a diagram showing the operation of the sealing step in another modification.
In the example of FIG. 24, in the sealing step, the rear panel substrate 20 is rotated while being partially approached so as to be separated from the front panel substrate 10 or overlapped.
That is, as in the case of FIG. 20, a total of four pins 85a and 85b are provided near the four corners of the rear panel substrate 20 on the upper part of the mounting table 84, but on one side (the left side in FIG. 24). A certain pair of pins 85a support a fixed position of the rear panel substrate 20 at the tip thereof (for example, the tip of the pin 85a is formed in a spherical shape, and the rear panel substrate 20 is also provided with a spherical recess. The pair of pins 85b on the other side (the right side in FIG. 24) can be driven up and down.
[0173]
In this case, as shown in FIG. 24A, the front panel substrate 10 and the rear panel substrate 20 are placed on the mounting table 84 in a state of being overlapped, and as shown in FIG. Is moved upward, the rear panel substrate 20 can be rotated about the tips of the pair of pins 85a, and can be separated from the front panel substrate 10. Further, as shown in FIG. 24 (c), by moving the pair of pins 85b downward, the rear panel substrate 20 is rotated in the opposite direction in the same path, and is superimposed on the front panel substrate 10 while being aligned. You can also.
[0174]
In the state of FIG. 24B, the front panel substrate 10 and the rear panel substrate 20 are in contact with each other on the pair of pins 85a side, but the opposite surface of the rear panel substrate 20 on which the phosphor layer is disposed. Is open, so that even if gas is generated, it is not trapped in the internal space.
(Example 5)
[0175]
[Table 5]

[0176]
Panel No. The PDPs 41 to 50 are manufactured by performing a sealing process by changing the atmosphere gas and pressure when heating the front panel substrate and the rear panel substrate, and the temperature and timing when superimposing them on the basis of this embodiment. This is a working example.
The calcination was performed at 350 ° C. in all cases.
As the atmosphere gas, panel No. In 41 to 46, 48, 49 and 50, dry air in which the water vapor partial pressure was set to various values within the range of 0 to 12 Torr was used. In addition, panel no. In 47, heating was performed while evacuating.
[0177]
Panel No. In 43 to 47, in the sealing step, when the panel substrate was heated from room temperature to 400 ° C. (a temperature lower than the softening point of the glass to be sealed), the two panel substrates were overlapped. When the temperature is further raised to a sealing temperature of 450 ° C. (a temperature equal to or higher than the softening point of the glass to be sealed), the temperature is maintained for 10 minutes or more, and then the temperature is decreased to 350 ° C. and maintained at this exhaust temperature. The evacuation process was performed while performing.
[0178]
On the other hand, panel no. In 41 and 42, in the sealing step, both panel substrates were superposed at slightly lower temperatures of 250 ° C. and 350 ° C.
In addition, panel no. In No. 48, in the sealing step, after the temperature was raised to the sealing temperature of 450 ° C., both panel substrates were overlapped, and the panel No. In No. 49, in the sealing step, after the temperature was raised to the sealing temperature (peak temperature) of 500 ° C., the two panel substrates were overlapped.
[0179]
In addition, panel no. In No. 50, in the sealing step, after raising the temperature to the peak temperature of 480 ° C., the temperature was lowered to the sealing temperature of 450 ° C., and then both panel substrates were overlapped and sealed.
Panel No. The PDP 51 is obtained by raising the sealing temperature (peak temperature) to 450 ° C. based on the modified example of the fifth embodiment shown in FIG.
[0180]
Panel No. The PDP 52 is a comparative example manufactured by first stacking the front panel substrate and the rear panel substrate at room temperature, and heating and raising the temperature to 450 ° C. in dry air at atmospheric pressure.
The panel No. In the PDPs 41 to 52, the phosphor film thickness was 30 μm, the discharge gas was Ne (95%)-Xe (5%), the sealing pressure was 500 Torr, and the panel configuration was the same.
[0181]
<Emission characteristic test>
Test method and results:
The above panel No. For each of the PDPs 41 to 52, as emission characteristics, the emission intensity, chromaticity coordinate y, and peak wavelength of the emission spectrum when only the blue cell is turned on, and panel luminance and color temperature in white balance without color correction; The peak intensity ratio of the emission spectrum when the blue cell and the green cell emitted light at the same power was measured.
[0182]
Further, each of the produced PDPs was disassembled, and the blue phosphor layer on the back panel substrate was irradiated with vacuum ultraviolet rays (center wavelength: 146 nm) using a krypton excimer lamp, and the chromaticity coordinate y of the emitted light was measured.
These measurement results are as shown in Table 5. The emission intensity of the blue cell shown in Table 5 was measured for Panel No. This is a relative light emission intensity with the light emission intensity of 52 (Comparative Example) as 100.
[0183]
In addition, each prepared PDP is decomposed, the back panel substrate is irradiated with vacuum ultraviolet rays using a krypton excimer lamp, the color temperature at the time of full-color emission, and the peak intensity of the emission spectrum when blue and green are emitted. When the ratio was measured, a result equivalent to the result of the above lighting was obtained.
FIG. It is an emission spectrum at the time of lighting only a blue cell about 45, 50, and 52 PDP.
[0184]
Although not shown in Table 5, the chromaticity coordinates x and y of the emission colors of the red cell and the green cell are shown in Panel No. 41 to 53 were almost the same value, red was (0.636, 0.350) and green was (0.251, 0.692). In the PDP of the comparative example, the chromaticity coordinates of the blue cell emission color were (0.170, 0.090), and the peak wavelength of the emission spectrum was 458 nm.
[0185]
Further, the blue phosphor is taken out from the panel, and H is desorbed at a temperature of 200 ° C. or more from 1 g of the blue phosphor by TDS analysis. ₂ The number of O gas molecules was measured. The ratio of the c-axis length to the a-axis length of the blue phosphor crystal was also measured by X-ray diffraction. Table 5 also shows these results.
Discussion:
Panel No. 41 to 51 and panel Nos. Comparing the light emission characteristics with the panel No. 52, In any of the panels 41 to 51, the panel No. The light emission characteristics are superior to 52 (the relative light emission intensity is high and the chromaticity coordinate y is small). This is presumably because the sealing method of the above-described embodiment reduces the amount of gas released into the internal space after the two panel substrates are overlapped, as compared with the sealing method of the comparative example.
[0186]
Panel No. In the PDP of No. 52, the chromaticity coordinate y of the blue light emission is 0.088. In this case, the color temperature in the white balance without color correction is 5800 K, while the panel No. 52 has the same color temperature. In 41 to 51, the chromaticity coordinate y of blue light emission is 0.08 or less, and the color temperature in white balance without color correction is 6500K or more. In particular, panel no. In a PDP with a low blue chromaticity coordinate y, such as 48, 49, 50, and 51, a high color temperature of about 11000K is realized in white balance without color correction.
[0187]
FIG. 26 shows, on the CIE chromaticity diagram, the color gamut around blue for the PDPs of the example and the comparative example.
The region (a) in the figure shows the case where the chromaticity coordinate y of the blue light emission is about 0.09 (the peak wavelength of the light emission spectrum is 458 nm) (corresponding to panel No. 52), and the region (b) shows the chromaticity of the blue light emission In the case where the coordinate y is about 0.08 (the peak wavelength of the emission spectrum is about 455 nm) (corresponding to panel No. 41), the chromaticity coordinate y of the blue emission is 0.052 (the peak wavelength of the emission spectrum is in the area (c)). 448 nm) (corresponding to panel No. 50), the color reproduction range near blue is shown.
[0188]
From this figure, it can be seen that the color gamut around blue is wider in (b) and even wider in (c) than in (a). This indicates that a PDP with a wider color reproduction range near blue can be realized as the chromaticity coordinate y of the blue cell emission decreases (the peak wavelength of the emission spectrum decreases).
Next, panel no. When the light emission characteristics were compared between Nos. 41, 42, 45, and 48 (all of which had a partial pressure of water vapor of dry air of 2 Torr), panel Nos. The light emission characteristics are improved in the order of 41, 42, 45, and 48 (the relative light emission intensity is high and the chromaticity coordinate y is small). From this result, it is understood that the higher the temperature at which the front panel substrate 10 and the rear panel substrate 20 are overlapped, the higher the light emission characteristics of the PDP.
[0189]
This is because the more the pre-heating to a high temperature in a state where the front panel substrate 10 and the rear panel substrate 20 are separated from each other, the more the gas released from each panel substrate can be exhausted sufficiently. It is considered that the amount of gas released to the air is reduced.
In addition, panel no. When the light emission characteristics are compared among 43, 44, 45, and 46 (the temperature profile in the sealing step is the same), panel No. The light emission characteristics are improved in the order of 43, 44, 45, and 46 (the chromaticity coordinate y is small). From this result, it can be seen that the lower the partial pressure of water vapor in the atmosphere gas, the better the light emission characteristics.
[0190]
In addition, panel no. 46 and Panel No. When the light emission characteristics of the panel No. 47 (the same temperature profile in the sealing step) are compared, panel No. 46 has slightly better light emission characteristics of PDP.
This corresponds to panel no. Panel No. 46 was preheated in an atmosphere gas containing oxygen. It is presumed that the sample 47 was preheated in an oxygen-free atmosphere, so that oxygen in the phosphor, which was an oxide, partially escaped to form oxygen defects.
[0191]
In addition, panel no. 48 and panel no. Comparing the light emission characteristics of 51, it is understood that the light emission characteristics are almost the same. This is because when the pre-heating is performed, the light emitting characteristics of the PDP are almost completely different between the case where the opposing surfaces of the front panel substrate 10 and the rear panel substrate 20 are completely separated and opened, and the case where the front panel substrate 10 and the rear panel substrate 20 are partially opened. It shows that there is no difference.
[0192]
Further, each panel No. shown in Table 5 was used. In the above, the chromaticity coordinate y of the light emitted when the blue phosphor layer is excited by the vacuum ultraviolet light and the chromaticity coordinate y when only the blue cell is turned on have substantially the same value.
Further, each panel No. shown in Table 5 was used. Looking at the relationship between the chromaticity coordinate y of blue light emission and the peak wavelength of blue light emission, it can be seen that the smaller the value of the chromaticity coordinate y of blue light emission, the shorter the peak wavelength of blue light emission. This indicates that a small chromaticity coordinate y value of blue light emission and a short peak wavelength of blue light emission have the same meaning.
Embodiment 6
The PDP of the present embodiment has the same configuration as the PDP of the first embodiment shown in FIG.
[0193]
The method of manufacturing the PDP is substantially the same as that of the fifth embodiment, except that at least one of the front panel substrate 10 and the back panel substrate 20 is coated with a sealing glass, and then the inside of the heating furnace 81 of the sealing device 80 is heated. The calcination step, the sealing step, and the exhaust step are performed continuously.
Hereinafter, the calcining, sealing, and exhausting steps in the present embodiment will be described in detail below.
[0194]
The calcining step, the sealing step, and the evacuation step of the present embodiment are performed using the sealing apparatus shown in FIGS. However, in the present embodiment, as shown in FIG. 27, a pipe 90 inserted from the outside of the heating furnace 81 is connected to the glass tube 26 attached to the vent 21a of the back panel substrate 20.
FIG. 27 is a diagram showing an operation when performing from the calcination step to the exhaust step using this sealing device.
[0195]
The calcining, preheating, sealing, and exhausting steps will be described with reference to FIG.
Calcination process:
The outer peripheral portion of the facing surface of the front panel substrate 10 (the surface facing the rear panel substrate 20), the outer peripheral portion of the facing surface of the rear panel substrate 20 (the surface facing the front panel substrate 10), or the front panel substrate 10 A sealing glass layer 15 is formed by applying a sealing glass paste to the outer peripheral portion of the opposing surfaces of both the back panel substrate 20 and the rear panel substrate 20 (note that the sealing glass layer 15 is Formed on the facing surface.)
[0196]
Then, the front panel substrate 10 and the rear panel substrate 20 are placed at a fixed position on the mounting table 84 in a state where they are aligned and overlapped, and the pressing mechanism 86 is set to press the rear panel substrate 20 (FIG. 27). (A)).
Next, the following operation is performed while flowing the atmosphere gas (dry air) through the heating furnace 81 (or while using the vacuum exhaust from the gas discharge valve 83).
[0197]
The moving pins 85 are lifted, and the rear panel substrate 20 is pushed up and moved in parallel (see FIG. 27B). As a result, the gap between the opposing surfaces of the front panel substrate 10 and the rear panel substrate 20 is widened, and the surface of the rear panel substrate 20 on which the phosphor layer 25 is disposed is opened to a large space in the heating furnace 81.
In this state, the inside of the heating furnace 81 is heated to a calcining temperature (about 350 ° C.), and calcined by maintaining the calcining temperature for about 10 to 30 minutes.
[0198]
Preheating step:
The panel substrates 10 and 20 are further heated and heated to release the gas adsorbed on the panel substrates 10 and 20. When the temperature reaches a predetermined temperature (for example, 400 ° C.), the preheating step is completed.
Sealing process:
Subsequently, the moving pins 85 are lowered, and the rear panel substrate 20 is superimposed on the front panel substrate 10 again. At this time, the back panel substrate 20 is superimposed while being aligned as before (see FIG. 27C).
[0199]
Then, when the temperature in the heating furnace 81 reaches a sealing temperature (around 450 ° C.) higher than the softening point of the sealing glass layer 15, the sealing temperature is maintained for 10 to 20 minutes. At this time, the outer peripheral portions of the front panel substrate 10 and the rear panel substrate 20 are sealed by the softened sealing glass. During this time, since the rear panel substrate 20 is pressed against the front panel substrate 10 by the pressing mechanism 86, stable sealing can be performed.
[0200]
Exhaust process:
The inside of the heating furnace 81 is lowered to an exhaust temperature lower than the softening point of the glass to be sealed, and while maintaining the exhaust temperature, firing is performed (for example, at about 350 ° C. for 1 hour), and the internal space of both sealed panel substrates is raised. Vacuum (8 × 10 ^-7 The internal space is degassed by exhausting to Torr). This evacuation step is performed by connecting a vacuum pump (not shown) to the pipe 90.
[0201]
Then, after this evacuation step, the panel substrate is cooled to room temperature while the internal space is kept in a vacuum, a discharge gas is sealed from the glass tube 26 into the internal space, the vent 21a is sealed, and the glass tube 26 is cut off. Thus, a PDP is manufactured.
(About the effect of the sealing method of the present embodiment)
Conventionally, the calcining step, the sealing step, and the evacuation step are performed separately using a heating furnace, and since the substrate is cooled to room temperature in the step and the step, it takes a long time to heat up in a later step. Although time is required and energy consumption increases, in the present embodiment, the calcining step, the preheating step, the sealing step, and the exhausting step are continuously performed in the same sealing apparatus without lowering the temperature to room temperature. As a result, these series of steps can be performed quickly and energy consumption for heating can be reduced.
[0202]
Further, in the present embodiment, the calcination step and the preheating step are performed during the heating of the heating furnace 81 to the sealing temperature at which the sealing step is performed. It can be performed quickly and with low energy consumption, and furthermore, after the sealing step, the evacuation step is performed in the course of lowering the temperature of the sealed substrate to room temperature. And low energy consumption.
[0203]
Further, according to the sealing method of the present embodiment, as described below, the same effects as in the fifth embodiment can be obtained as compared with the conventional sealing method.
Normally, gases such as water vapor are adsorbed on the front panel substrate and the rear panel substrate. When these substrates are heated and heated, the adsorbed gas is released.
In the conventional general manufacturing method, after the calcination step, in the sealing step, the front panel substrate and the back panel substrate are overlapped at room temperature and then heated and heated to be sealed. Then, the gas adsorbed on the front panel substrate and the rear panel substrate is released. In the calcination step, even if the gas adsorbed on the substrate escapes to some extent, the gas is adsorbed again by bringing it to room temperature in the atmosphere until the start of the sealing step. Occurs. Here, since the released gas is confined in the narrow internal space, the phosphor layer is thermally degraded particularly under the influence of the water vapor released from the protective layer 14, and the luminous intensity tends to decrease.
[0204]
On the other hand, according to the manufacturing method of the present embodiment, gas such as water vapor adsorbed on the front panel substrate 10 and the rear panel substrate 20 is released by the sealing step and the preheating step. Since a wide gap is formed between the panel substrates 10 and 20, the generated gas is not confined in the internal space. Then, after the preliminary heating, the panel substrates 10 and 20 are sealed in a heated state, so that moisture and the like do not adsorb to the panel substrates 10 and 20 after the preliminary heating. Therefore, gas generated from both panel substrates 10 and 20 at the time of sealing is reduced, and thermal degradation of the phosphor layer 25 is prevented.
[0205]
In addition, by using the sealing device 80 as described above, if the front panel substrate 10 and the rear panel substrate 20 are first aligned, the sealing is performed in the aligned state.
Furthermore, in the present embodiment, since the steps from the preheating step to the sealing step are performed in an atmosphere in which dry air flows, thermal degradation of the phosphor layer 25 due to water vapor in the atmospheric gas does not occur.
[0206]
Note that the temperature to be increased by the preliminary heating, the preferable conditions of the timing of overlapping the front panel substrate and the rear panel substrate, and the preferable conditions of the type of the atmospheric gas, the pressure, and the partial pressure of the steam are described in Embodiment 5 above. As described.
(Modification of this embodiment)
In the present embodiment, as described above, the calcining step, the preheating step, the sealing step, and the evacuation step are continuously performed in the same apparatus. However, the preheating step can be omitted. Even in that case, a similar effect can be obtained to some extent. It is also possible to obtain a certain effect by continuously performing only the calcining step and the sealing step in the same apparatus or performing only the sealing step and the exhausting step in the same apparatus. it can.
[0207]
Further, in the present embodiment, after the sealing step, the inside of the heating furnace 81 is evacuated to a temperature lower than the softening point of the sealing glass (350 ° C.), and then the evacuation step is performed. If the evacuation process is performed at a temperature as high as the above, sufficient evacuation can be performed in a short time. However, in this case, it is considered necessary to provide a device for preventing the outflow of the glass for sealing (for example, the flow stop partition shown in FIGS. 10 to 16).
[0208]
Further, in the present embodiment, the calcination step and the preheating step are performed in a state where the opposing surfaces of the front panel substrate 10 and the rear panel substrate 20 are opened at the time of sealing, but as in the third embodiment. Even when the front panel substrate 10 and the rear panel substrate 20 are aligned and overlapped, and the internal space is directly decompressed and heated while heating while heating with dry air, sealing is performed as follows. It is possible to continuously perform the baking step-sealing step-evacuating step in the same apparatus.
[0209]
That is, using the sealing heating device 50 of FIG. 4, sealing glass is applied to at least one of the opposing surfaces of the front panel substrate 10 and the rear panel substrate 20 to form a sealing glass layer 15 and calcining is performed. The pieces are superposed with each other while being positioned, and are put into the heating furnace 51.
Then, the pipe 52a is connected to the glass tube 26a attached to the vent 21a of the rear panel substrate 20, and the gas is exhausted from the pipe 52a by a vacuum pump (not shown). At the same time, by connecting the pipe 52b to the glass tube 26b attached to the ventilation port 21b of the rear panel substrate 20 and sending dry air, the dry air is reduced while reducing the internal space between the two panel substrates 10 and 20. Make it flow.
[0210]
Then, while maintaining the internal space between the panel substrates 10 and 20 in this state, the inside of the heating furnace 51 is heated to a calcining temperature and calcined (held at 350 ° C. for 10 to 30 minutes).
At this time, simply heating and heating the panel in a state where the front panel substrate 10 and the rear panel substrate are overlapped with each other does not allow sufficient oxygen to be supplied to the sealing glass layer, so that calcination cannot be sufficiently performed. If heating is performed while flowing dry air inside the panel, calcination can be performed sufficiently.
[0211]
Next, sealing is further performed by heating to a sealing temperature equal to or higher than the softening point of the sealing glass and raising the temperature (for example, maintaining the peak temperature at 450 ° C. for 30 minutes).
Then, the inside of the heating furnace 51 is lowered to an exhaust temperature lower than the softening point of the glass to be sealed, and while maintaining the exhaust temperature, the interior space of both sealed panel substrates is evacuated with a high vacuum, so that the interior space is reduced. After degassing and evacuation, the panel substrate is cooled to room temperature, a discharge gas is sealed in the internal space from the glass tube 26, the vent 21a is sealed, and the glass tube 26 is cut off to produce a PDP. I do.
[0212]
Also in the case of this modification, the calcining step, the sealing step, and the evacuation step are continuously performed without lowering the temperature to room temperature in the same sealing apparatus as in the present embodiment. A series of steps can be performed quickly and energy consumption for heating can be reduced.
In this modification, in the heating furnace 51, only the calcining step and the sealing step, or only the sealing step and the evacuation step, can be continuously performed.
(Example 6)
[0213]
[Table 6]

[0214]
Panel No. Reference numerals 61 to 69 denote PDPs according to examples manufactured based on the present embodiment, which are sealed by changing the atmosphere gas, the pressure, and the temperature and timing for overlapping the front panel substrate and the rear panel substrate in various ways. A wearing process was performed.
FIG. It is a temperature profile used at the time of the calcination process-the sealing process-the exhaust process at the time of manufacturing PDP of 63-67.
[0215]
As the atmosphere gas, panel No. Panel Nos. 61 to 66, 68, and 69 used dry air in which the water vapor partial pressure was set to various values within a range of 0 to 12 Torr. In 70, undried air was used. In addition, panel no. In 67, heating was performed while evacuating.
Panel No. In 63 to 67, the panel substrate was heated from room temperature and heated to 350 ° C., held at 350 ° C. for 10 minutes, calcined, and further heated to 400 ° C. (from the softening point of the sealing glass). When the temperature reached (low temperature), both panel substrates were overlapped. When the temperature is further raised to a sealing temperature of 450 ° C. (a temperature equal to or higher than the softening point of the glass to be sealed), the temperature is maintained for 10 minutes or more, and then the furnace is lowered to 350 ° C. and maintained at 350 ° C. The evacuation process was performed while performing.
[0216]
On the other hand, panel no. In the sealing steps 61 and 62, both panel substrates were superimposed at slightly lower temperatures of 250 ° C. and 350 ° C.
In addition, panel no. In the sealing step of No. 68, after raising the sealing temperature to 450 ° C., the two panel substrates were overlapped, and the panel No. In the sealing step 69, after the temperature was raised to a peak temperature of 480 ° C, the temperature was lowered to a sealing temperature of 450 ° C, and then both panel substrates were overlapped and sealed.
[0219]
Panel No. Reference numeral 70 denotes a PDP according to a comparative example, in which the front panel substrate and the back panel substrate are superposed at room temperature and heated to a sealing temperature of 450 ° C. in air at atmospheric pressure after calcination as in the conventional sealing process. The temperature was raised to seal, and the temperature was once lowered to room temperature. Then, it was heated again to the exhaust temperature of 350 ° C. in the heating furnace, and the exhaust process was performed while maintaining the exhaust temperature at 350 ° C.
[0218]
The panel No. In each of 61 to 70, the thickness of the phosphor layer was 30 μm, the discharge gas was Ne (95%)-Xe (5%), the sealing pressure was 500 Torr, and the panel configuration was the same.
<Emission characteristic test>
Test method and results:
The above panel No. For each of the PDPs 61 to 70, as the emission characteristics, the emission intensity, the chromaticity coordinate y and the peak wavelength of the emission spectrum when only the blue cell is turned on, and the color temperature in white balance without color correction, the blue cell and The peak intensity ratio of the emission spectrum when the green cell emitted light at the same power was measured.
[0219]
These measurement results are as shown in Table 6. Note that the emission intensity of the blue cell shown in Table 6 was measured for Panel No. The relative luminous intensity is defined as the luminous intensity of 70 is set to 100.
In addition, each of the produced PDPs is disassembled, and the rear panel substrate is irradiated with vacuum ultraviolet rays using a krypton excimer lamp to emit chromaticity coordinates y for blue light emission, color temperature for all color light emission, and blue and green light. When the peak intensity ratio of the emission spectrum was measured, the same result as the result of the lighting was obtained.
[0220]
Further, the blue phosphor is taken out from the panel, and H is desorbed at a temperature of 200 ° C. or more from 1 g of the blue phosphor by TDS analysis. ₂ The number of O gas molecules was measured. The ratio of the c-axis length to the a-axis length of the blue phosphor crystal was also measured by X-ray diffraction. Table 6 also shows these results.
Discussion:
Panel No. 61 to 69, and panel Nos. When the light emission characteristics of the panel Nos. In any of Nos. 61 to 69, panel Nos. Light emission characteristics are better than 70 (high relative light emission intensity and small chromaticity coordinate y). This corresponds to panel no. According to the sealing method used in Panel Nos. 61 to 69, panel Nos. It is considered that the gas released into the internal space after the two panel substrates are overlapped with each other is reduced as compared with the sealing method used in 70.
[0221]
Panel No. In the PDP No. 70, the chromaticity coordinate y of the blue light emission is 0.090, and the color temperature in the white balance without color temperature correction is 5800K, whereas the panel No. In 61 to 69, the chromaticity coordinate y of the blue light emission is 0.08 or less, and the color temperature in the white balance without color temperature correction is 6500K or more. In particular, panel no. In a PDP having a low chromaticity coordinate y of blue, such as 68 and 69, a high color temperature of about 11000K is realized by white balance without color correction.
[0222]
Next, panel no. Panel Nos. 61, 62, 65, 68, and 69 (all of which have a partial pressure of water vapor of dry air of 2 Torr). The light emission characteristics are improved in the order of 61, 62, 65, 68, and 69 (the relative light emission intensity is high and the chromaticity coordinate y is small). From this result, it is understood that the higher the temperature at which the front panel substrate 10 and the rear panel substrate 20 are overlapped, the higher the light emission characteristics.
[0223]
In addition, panel no. When the light emission characteristics are compared among 63, 64, 65, and 66 (the temperature profile in the sealing step is the same), panel Nos. The light emission characteristics are improved in the order of 63, 64, 65, and 66 (the chromaticity coordinate y is small). From this result, it can be seen that the lower the partial pressure of water vapor in the atmosphere gas, the better the light emission characteristics.
In addition, panel no. 66 and panel no. Comparing the light emission characteristics of panel No. 67 (the same temperature profile in the sealing step), 66 has slightly better light emission characteristics.
[0224]
This corresponds to panel no. Panel No. 66 was heated in an atmosphere gas containing oxygen. It is considered that heating is performed in an oxygen-free atmosphere at 67, and when the phosphor layer is heated in the oxygen-free atmosphere, oxygen of the phosphor, which is an oxide, partially escapes to form oxygen defects.
(Other matters)
In the above first to sixth embodiments, the case where a surface discharge type PDP is manufactured has been described. However, the present invention can be applied to a case where a facing discharge type PDP is manufactured.
[0225]
Further, as the composition of the phosphor forming the phosphor layer, other than the above-described composition, a substance commonly used for a phosphor layer of a PDP can be similarly used.
In addition, as described in the first to sixth embodiments, it is general that the sealing glass is applied after the phosphor layer is formed. However, it is considered that the order may be changed.
[0226]
【The invention's effect】
As described above, according to the PDP manufacturing method of the present invention, the disposed phosphor is heated (phosphor firing step, sealing material calcination step, sealing step, exhaust step, etc.) By performing in a dry gas atmosphere or an atmosphere in which a dry gas flows under reduced pressure, the chromaticity coordinates y (CIE color system) of the emission color when only the blue cell is turned on or the blue phosphor layer is irradiated with vacuum ultraviolet rays. It is possible to manufacture a PDP having excellent emission chromaticity such that the chromaticity coordinate y of light emitted when excited is 0.08 or less.
[0227]
Such a PDP can have a color temperature in the white balance of 7000K or higher, and can also have a color temperature of 8000K or higher, 9000K or higher, or 10,000K or higher. Further, if the emission chromaticity of the blue phosphor layer is improved, the color reproducibility is also improved.
Further, as described above, the PDP having excellent emission chromaticity of the blue phosphor layer is prepared by calcining the front substrate and the rear substrate in a state where the opposing surfaces are opened, and drying the front substrate and the rear substrate in the internal space by drying gas. Or a method in which the front substrate and the rear substrate are preheated in a state where the opposing surfaces are open, and then the two substrates are overlapped and sealed. .
[0228]
Further, after performing a sealing step of keeping the sealing material at the sealing temperature in a state where the front panel substrate and the rear panel substrate are overlapped with each other, without lowering to room temperature, between the sealed two substrates. After starting the evacuation step of exhausting the gas in the internal space of the sealing material, or maintaining the substrate on which the sealing material is provided at a calcination temperature, the substrate is cooled to room temperature. It can also be manufactured by starting the sealing step without lowering, and in this case, the time required for heating and the energy consumption can be reduced.
[Brief description of the drawings]
FIG. 1 is a main part perspective view showing an AC surface discharge type PDP according to a first embodiment.
FIG. 2 is a diagram showing a PDP display device in which a drive circuit is connected to the PDP.
FIG. 3 is a diagram showing a configuration of a belt-type heating device used in the first embodiment.
FIG. 4 is a diagram illustrating a configuration of a sealing heating device used in the first embodiment.
FIG. 5 is a graph showing relative light emission intensity measurement results when a blue phosphor is fired in air with a changed partial pressure of water vapor.
FIG. 6 shows a measurement result of chromaticity coordinates y when a blue phosphor is fired in air in which the partial pressure of water vapor is changed.
FIG. 7: H desorbed from blue phosphor ₂ It is an example of the measurement result which measured the number of O molecules.
FIG. 8 is a diagram showing a specific example of a rear glass substrate according to the second embodiment.
FIG. 9 is a diagram showing a specific example of a rear glass substrate according to the second embodiment.
FIG. 10 is a diagram showing a specific example of a rear glass substrate according to the second embodiment.
FIG. 11 is a diagram showing a specific example of a rear glass substrate according to the second embodiment.
FIG. 12 is a diagram showing a specific example of a rear glass substrate according to the second embodiment.
FIG. 13 is a diagram showing a specific example of a rear glass substrate according to the second embodiment.
FIG. 14 is a diagram showing a specific example of a rear glass substrate according to the second embodiment.
FIG. 15 is a diagram showing a specific example of a rear glass substrate according to the second embodiment.
FIG. 16 is a diagram showing a specific example of a rear glass substrate according to the second embodiment.
FIG. 17 is a characteristic diagram showing the dependence of the effect of restoring the emission characteristics by recalcining in air after the blue phosphor is once thermally degraded, on the partial pressure of water vapor.
FIG. 18 is a characteristic diagram showing the partial pressure of water vapor on the effect of restoring the emission characteristics by recalcining in air after the blue phosphor is once thermally degraded.
FIG. 19 is a diagram showing a configuration of a sealing device used in a sealing step in Embodiment 5.
FIG. 20 is a perspective view showing an internal configuration of a heating furnace in the sealing device.
FIG. 21 is a diagram showing an operation when a preheating step and a sealing step are performed using the sealing device.
FIG. 22 is a diagram showing the result of measuring the amount of water vapor released from the MgO layer over time in an experiment according to the fifth embodiment.
FIG. 23 is a view showing a modification of the sealing device according to the fifth embodiment.
FIG. 24 is a diagram showing an operation of another modification of the sealing device according to the fifth embodiment.
FIG. 25 is an emission spectrum of the PDP of Example 5 when only blue cells were turned on.
FIG. 26 shows, on the CIE chromaticity diagram, the color reproduction range near blue for the PDPs of Example 5 and Comparative Example.
FIG. 27 is a diagram illustrating an operation in performing a process from a calcining process to an exhausting process using a sealing device in the sixth embodiment.
FIG. 28 is a temperature profile used in a calcining step, a sealing step, and an exhausting step when manufacturing a PDP in Example 6.
FIG. 29 is a schematic cross-sectional view showing an example of a general alternating current (AC) PDP.
[Explanation of symbols]
10 Front panel board
11 Front glass substrate
12a, 12b display electrode
13 Dielectric layer
14 Protective layer
15 Sealing glass layer
20 Back panel substrate
21 Back glass substrate
21a, 21b vent
22 address electrode
23 Dielectric layer
24 partition
25 phosphor layer
26 glass tube
30 Discharge space
40 heating device
41 heating furnace
42 conveyor belt
43 Gas introduction pipe
50 Sealing heating device
51 heating furnace
53 gas supply source
54 vacuum pump
60 Sealing glass area
70 Flow barrier
80 Sealing device

Claims (10)

A phosphor layer forming step of forming a phosphor layer on at least one of the facing surfaces of the front substrate and the back substrate,
After the phosphor layer forming step, a sealing step of sealing the front substrate and the rear substrate in a state of being overlapped so that an internal space is formed between the two substrates,
A method for manufacturing a plasma display panel, comprising: an exhaust step of exhausting gas in an inner space between both sealed substrates,
In the evacuation step, after the sealed substrates are heated to a predetermined temperature while flowing dry air into the internal space, the supply of the dry air is stopped, and both substrates are kept at an exhaust temperature higher than room temperature. A method for manufacturing a plasma display panel, wherein gas in an internal space between the panels is exhausted. A sealing step of sealing the front substrate and the back substrate by keeping the sealing material at a sealing temperature equal to or higher than a temperature at which the sealing material softens, in a state where the front substrate and the rear substrate are overlapped so that an internal space is formed between the two substrates,
A method for manufacturing a plasma display panel, comprising:
In the evacuation step, the sealed substrates are heated to a predetermined temperature while flowing a dry gas into the internal space, and then the gas in the internal space between the two substrates is exhausted while maintaining both substrates at an exhaust temperature higher than room temperature. A method for manufacturing a plasma display panel. 3. The method according to claim 1, wherein the predetermined temperature is equal to or higher than the exhaust temperature. Wherein the predetermined temperature and at least one of the exhaust temperature, the production method according to claim 1 or 2, wherein the plasma display panel, characterized in that at 360 ° C. or higher. At least one of The method according to claim 1 or 2, wherein the plasma display panel, characterized in that at 380 ° C. or more of the plant constant temperature and the exhaust temperature. 3. The method according to claim 1, wherein at least one of the predetermined temperature and the exhaust temperature is 400 ° C. or higher. The dry gas, the production method according to claim 1, wherein the plasma display panel, characterized in that it is water vapor partial pressure in the atmosphere to be used is not more than 15 Torr. 3. The method according to claim 1, wherein a dew point temperature of the dry gas is 20 [deg.] C. or less. 3. The method according to claim 1, wherein the dry gas contains oxygen. 3. The method according to claim 1, wherein the dry gas is dry air.

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