WO2000068974A2 - Systeme de traitement de tranches - Google Patents

Systeme de traitement de tranches Download PDF

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Publication number
WO2000068974A2
WO2000068974A2 PCT/DE2000/001452 DE0001452W WO0068974A2 WO 2000068974 A2 WO2000068974 A2 WO 2000068974A2 DE 0001452 W DE0001452 W DE 0001452W WO 0068974 A2 WO0068974 A2 WO 0068974A2
Authority
WO
WIPO (PCT)
Prior art keywords
control
units
plant according
unit
control station
Prior art date
Application number
PCT/DE2000/001452
Other languages
German (de)
English (en)
Other versions
WO2000068974A3 (fr
Inventor
Rolf-Arno KLÄBSCH
Ronald Huber
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Priority to EP00940171A priority Critical patent/EP1183715A2/fr
Publication of WO2000068974A2 publication Critical patent/WO2000068974A2/fr
Publication of WO2000068974A3 publication Critical patent/WO2000068974A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • G05B19/41825—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell machine tools and manipulators only, machining centre
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07C—TIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
    • G07C3/00—Registering or indicating the condition or the working of machines or other apparatus, other than vehicles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the invention relates to a system for processing wafers according to the preamble of claim 1.
  • Such systems include a large number of manufacturing units with which different manufacturing processes are carried out. These manufacturing processes are, in particular, etching processes, wet chemical processes, diffusion processes and various cleaning processes such as CMP processes (Chemical Mechanical Polishing). One or more manufacturing units are provided for each of these processes. In addition, measurement and control processes can also be carried out in these or in separate production units.
  • manufacturing processes are, in particular, etching processes, wet chemical processes, diffusion processes and various cleaning processes such as CMP processes (Chemical Mechanical Polishing).
  • CMP processes Chemical Mechanical Polishing
  • the entire manufacturing process is subject to strict cleanliness requirements, so that the manufacturing units are arranged in a clean room or in a system of clean rooms.
  • the wafers are fed into the individual production units in cassettes in predetermined lot sizes via a transport system.
  • the cassettes are also transported away after processing these wafers via the transport system.
  • the transport system typically has a conveyor system which is designed, for example, in the form of roller conveyors.
  • the cassettes with the wafers are transported lying on the roller conveyors.
  • the conveyor system can be formed by overhead conveyors or the like.
  • the transport system has several floors for storing the cassettes.
  • the cassettes with the wafers are temporarily stored there.
  • the material flow of the cassettes is controlled decentrally via the manufacturing units.
  • the individual production units have control units. These control units typically have computer units which are operated by the operating personnel.
  • the control units are each installed on the production unit assigned to them.
  • the planning of the wafers for a production unit is usually carried out by the operating personnel. Depending on the needs and specifications of the operating personnel, a certain number of cassettes with wafers are removed from a store and fed to the production unit. This type of scheduling requires a lot of time for the operating personnel of the production units.
  • a further disadvantage is that the number of cassettes required for the corresponding manufacturing unit can be scheduled by an operator without being coordinated with the need for other manufacturing units. This lack of coordination leads to long downtimes of individual production units and long throughput times of the wafers through the system.
  • the invention has for its object to design a system of the type mentioned so that it has the highest possible productivity when processing wafers.
  • the system has a control center for the automatic tracking and control of the material flow of the wafers.
  • the process data characterizing the wafers, the production units and / or the transport system are read into the control center by the production units and / or the transport system.
  • the process data characterizing the manufacturing units include in particular whether a manufacturing unit is functional or not.
  • information about the degree of utilization of the manufacturing unit is transmitted to the control center. In particular, it is forwarded to the control center whether a production unit is waiting for the delivery of wafers and is therefore currently idle.
  • the production units report the cassettes to the control center, which cassettes are currently being processed in the production unit and which cassettes have been delivered to the production unit and are ready for processing.
  • the transport system reports the cassettes with wafers to the control center, which are transported on the conveyor system at the respective time and which are temporarily stored in the store or other storage systems.
  • optical recording systems can be provided, for example, which record the individual cassettes at predetermined locations in the system.
  • the detection systems can be designed as code readers which are based on Read and identify the codes applied to the cassettes. Using these codes, the cassettes can be clearly assigned.
  • a production unit reports to the control center whether the processing of wafers in a cassette has been carried out without errors or whether a part of the wafers has to be reworked or even removed from the production process as a committee.
  • the material flow of the wafers in the entire system is tracked based on the process data read into the control center.
  • the manufacturing processes are controlled centrally via the control center.
  • the material flow from the transport system to the manufacturing units is controlled.
  • manufacturing parameters for the manufacturing units can also be specified via the control center.
  • the main advantage of the system according to the invention is that the control of the system takes place centrally via the control center in dependence on all essential process data of the wafers, the production units and the transport system.
  • the material flow is therefore not optimized in small individual areas of the system, but for the entire system. In this way, unnecessary downtimes of production units are avoided, which considerably increases the degree of utilization of the production units.
  • the central control is carried out by the control center with a minimum of personnel.
  • the control center preferably has a computer unit which automatically processes a large part of the optimization of the material flow. The operating personnel at the manufacturing units no longer need to be used to control the material flow.
  • Figure 1 Schematic representation of the spatial arrangement of a system controlled by a control center for processing wafers.
  • FIG. 1 Connection diagram of the units connected to the control station according to Figure 1.
  • a plant for processing wafers is shown schematically in FIG.
  • a large number of manufacturing units 2 are arranged in a clean room 1 in order to carry out the manufacturing processes required for processing the wafers and for checking the processing quality of the manufacturing processes.
  • the production units 2 can also be distributed over several clean rooms 1.
  • the manufacturing processes include in particular etching processes, wet chemical processes, diffusion processes and cleaning processes.
  • Each of the production units 2 has an operating unit 3 which can be operated by the operating personnel of the system.
  • the control units 3 are arranged directly on the respective production unit 2.
  • the control units 3 can be arranged in a room which is separated from the clean room 1 and in which there are no clean room conditions.
  • the wafers to be processed are fed to the individual production units 2 in cassettes 4.
  • cassettes 4 As a typical solution size, 25 wafers are accommodated in a cassette 4.
  • a transport system is provided which has a conveyor system and a storage system.
  • roller conveyors 5 are provided as the conveyor system.
  • the cassettes 4 are transported lying on the rollers of the roller conveyor 5.
  • the storage system serves for the intermediate storage of the cassettes 4, stockers 6 being used as the storage system, for example.
  • stockers 6 is shown schematically in FIG. 1.
  • the cassettes 4 can be removed from the roller conveyors 5 and fed to a production unit 2 or a stocker 6 either manually or via handling systems (not shown).
  • a control station 7 is provided for tracking and controlling the material flow of the wafers in the system.
  • the process data characterizing the wafers, the production units 2 and / or the transport system are read into the control center 7 by the production units 2 and / or the transport system.
  • the control center 7 itself can in principle be located in the clean room 1.
  • the control center 7 is located in a room 8 which is separated from the clean room 1. This is advantageous because there are no clean room conditions in this room 8, so that this room 8 is easily and quickly accessible to the operating personnel without clean room clothing is.
  • the control units 3 of the production units 2 can be arranged in the same room 8 in which the control station 7 is located.
  • the control center 7 has one or more computer units (not shown) which control the system.
  • the computer units of the control center 7 are connected to units of the system, in particular the production units 2.
  • connection diagram according to FIG. 2 represents a network which is controlled by the control center 7.
  • All production units 2 of the system are initially connected to this network.
  • the connection is expediently made via the operating units 3 of the production units 2.
  • the production units 2 can be assigned operating data acquisition devices, not shown, which are also connected to the control center 7.
  • decentralized computer units 9 can be provided on the transport system, which are also connected to the control center 7. Detection systems which detect the material flow of the wafers can each be connected to these decentralized computer units 9. These detection systems can be formed, for example, by code readers which read codes applied to the cassettes 4 for the classification of the wafers.
  • control center 7 On the basis of the process data read into the control center 7 by the operating units 3 and the operating data acquisition devices, all essential process data of the manufacturing units 2, such as downtimes, operational disturbances and the degree of utilization, are recorded and evaluated in the control center 7. It also provides information about the processing status the wafer won. For example, the control center 7 thereby detects which and how many wafers have to be removed from a production unit 2 for post-processing or as a reject.
  • control commands can be issued via the control center 7 to the decentralized computer units 9 on the transport system, by means of which wafers are deflected via the roller conveyors 5 or certain cassettes 4 with wafers are stored in the storage system or removed therefrom.
  • control commands or manufacturing parameters can also be transmitted from the control center 7 directly to the operating units 3 of the manufacturing units 2.
  • the operating parameters of the relevant manufacturing unit 2 are adjusted in a suitable manner in order to adapt the material flow.
  • operating instructions for the operating personnel can be output from the control center 7 to the operating units 3 of the production units 2.
  • a computer unit 10 for the maintenance facility of the system is connected to the control center 7.
  • At least one computer unit 11 for managing the spare parts store for the system is connected to the control center 7.
  • This fault message is evaluated in control center 7. Depending on this fault message, a control command to the appropriate unit to remedy the fault if the unit is still functional. If the malfunction is a malfunction of a manufacturing unit 2, a corresponding control command from the control center 7 can be displayed on the operating unit 3. In the simplest case, the operating personnel can use the control command displayed on the operating unit 3 to eliminate the fault immediately on site.
  • a control command is issued from the control center 7 to the computer unit 10 of the maintenance facility after the malfunction report has been detected.
  • the operating personnel can locate and eliminate the error on the production unit 2 with a very short reaction time.
  • a control command can also be sent from the control center 7 to a computer unit 11 of the system's spare parts store in response to the fault message from the production unit 2 concerned. This enables spare parts to be made available very quickly, so that production unit 2 can run again within a very short time.
  • the operating states of all the units connected to the control center 7 are expediently continuously displayed on at least one computer unit in the control center 7.
  • the operating states are particularly advantageously displayed graphically on the computer unit.
  • the operating personnel of the control center 7 can thus continuously check whether the system is working properly or whether critical conditions develop during operation.
  • decentralized control centers 7 can also be used be provided, to which a predetermined number of units is connected.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)

Abstract

Système de traitement de tranches situé dans au moins une salle blanche (1), qui comporte des unités de fabrication (2) destinées à effectuer des étapes de fabrication individuelles, ainsi qu'un système de transport destiné au transport des tranches entre les différentes unités de fabrication (2). Ledit système comporte en outre au moins un poste de commande (7) permettant le suivi et la commande automatiques du flux des tranches, les données de processus étant envoyées au poste de commande (7) par les unités de fabrication (2) et/ou le système de transport.
PCT/DE2000/001452 1999-05-07 2000-05-05 Systeme de traitement de tranches WO2000068974A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP00940171A EP1183715A2 (fr) 1999-05-07 2000-05-05 Systeme de traitement de tranches

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19921244A DE19921244A1 (de) 1999-05-07 1999-05-07 Anlage zur Bearbeitung von Wafern
DE19921244.9 1999-05-07

Publications (2)

Publication Number Publication Date
WO2000068974A2 true WO2000068974A2 (fr) 2000-11-16
WO2000068974A3 WO2000068974A3 (fr) 2001-04-05

Family

ID=7907410

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/001452 WO2000068974A2 (fr) 1999-05-07 2000-05-05 Systeme de traitement de tranches

Country Status (4)

Country Link
EP (1) EP1183715A2 (fr)
DE (1) DE19921244A1 (fr)
TW (1) TW480589B (fr)
WO (1) WO2000068974A2 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1217484A2 (fr) * 2000-12-21 2002-06-26 Infineon Technologies AG Méthode et dispositif de traitement d'objets
US7575406B2 (en) 2002-07-22 2009-08-18 Brooks Automation, Inc. Substrate processing apparatus
US7988398B2 (en) 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
US8960099B2 (en) 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5672230A (en) * 1995-05-11 1997-09-30 Samsung Electronics Co., Ltd. Central management system of wet chemical stations
US5751581A (en) * 1995-11-13 1998-05-12 Advanced Micro Devices Material movement server
EP0884765A2 (fr) * 1997-06-13 1998-12-16 Canon Kabushiki Kaisha Système de traitement pour semiconducteurs, sa méthode de contrôle, mémoire lisible par ordinateur et méthode de fabrication du dispositif
EP0915507A1 (fr) * 1996-06-07 1999-05-12 Tokyo Electron Limited Controleur de poste de traitement
US6050768A (en) * 1997-08-08 2000-04-18 Mitsubishi Denki Kabushiki Kaisha Automatic carrier control method in semiconductor wafer cassette transportation apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0616475B2 (ja) * 1987-04-03 1994-03-02 三菱電機株式会社 物品の製造システム及び物品の製造方法
US5474647A (en) * 1993-11-15 1995-12-12 Hughes Aircraft Company Wafer flow architecture for production wafer processing
TW309503B (fr) * 1995-06-27 1997-07-01 Tokyo Electron Co Ltd

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5672230A (en) * 1995-05-11 1997-09-30 Samsung Electronics Co., Ltd. Central management system of wet chemical stations
US5751581A (en) * 1995-11-13 1998-05-12 Advanced Micro Devices Material movement server
EP0915507A1 (fr) * 1996-06-07 1999-05-12 Tokyo Electron Limited Controleur de poste de traitement
EP0884765A2 (fr) * 1997-06-13 1998-12-16 Canon Kabushiki Kaisha Système de traitement pour semiconducteurs, sa méthode de contrôle, mémoire lisible par ordinateur et méthode de fabrication du dispositif
US6050768A (en) * 1997-08-08 2000-04-18 Mitsubishi Denki Kabushiki Kaisha Automatic carrier control method in semiconductor wafer cassette transportation apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1217484A2 (fr) * 2000-12-21 2002-06-26 Infineon Technologies AG Méthode et dispositif de traitement d'objets
EP1217484A3 (fr) * 2000-12-21 2005-01-26 Infineon Technologies AG Méthode et dispositif de traitement d'objets
US7575406B2 (en) 2002-07-22 2009-08-18 Brooks Automation, Inc. Substrate processing apparatus
US7988398B2 (en) 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
US8960099B2 (en) 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus

Also Published As

Publication number Publication date
WO2000068974A3 (fr) 2001-04-05
EP1183715A2 (fr) 2002-03-06
TW480589B (en) 2002-03-21
DE19921244A1 (de) 2000-11-16

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