WO2000047366A3 - Apparatus and method for grinding, lapping and polishing semiconductor wafers - Google Patents

Apparatus and method for grinding, lapping and polishing semiconductor wafers Download PDF

Info

Publication number
WO2000047366A3
WO2000047366A3 PCT/GB2000/000376 GB0000376W WO0047366A3 WO 2000047366 A3 WO2000047366 A3 WO 2000047366A3 GB 0000376 W GB0000376 W GB 0000376W WO 0047366 A3 WO0047366 A3 WO 0047366A3
Authority
WO
WIPO (PCT)
Prior art keywords
tool
lapping
spool
path
grinding
Prior art date
Application number
PCT/GB2000/000376
Other languages
French (fr)
Other versions
WO2000047366A2 (en
Inventor
Kobayashi Masayuki
Original Assignee
Shin Etsu Handotai Europ Ltd
Kobayashi Masayuki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Europ Ltd, Kobayashi Masayuki filed Critical Shin Etsu Handotai Europ Ltd
Priority to AU23110/00A priority Critical patent/AU2311000A/en
Publication of WO2000047366A2 publication Critical patent/WO2000047366A2/en
Publication of WO2000047366A3 publication Critical patent/WO2000047366A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B24B29/04—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for rotationally symmetrical workpieces, e.g. ball-, cylinder- or cone-shaped workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

Apparatus and methods for grinding, lapping and polishing semiconductor wafers (W), particularly the peripheral edges thereof, and most particularly the orientation notch (40). A lapping/polishing tool comprises a flexible, elongate member (10) which is substantially circular in transverse cross section, which is substantially inelastic in its longitudinal direction and which is elastic and deformable (compressible) in its radial direction. The tool has an inner core (12) which is substantially inelastic at least in its longitudinal direction surrounded by a cylindrical outer shell (14) which is elastic and deformable in its radial direction. Apparatus employing the tool comprises a first spool (30) upon which a length of said tool is wound, guide means for guiding said tool along a predetermined path from said first spool (30) to a second spool (32) may be wound, and drive means for driving said spools so as to drive the tool along said path between the spools, a portion of said path comprising a work station (33) at which a workpiece may be positioned to be operated on by said tool. The workstation (33) permits the wafer (W) to be translated and rotated relative to the tool to lap and/or polish the periphery of the wafer, including an orientation notch (40) formed therein. Methods of operation are also disclosed.
PCT/GB2000/000376 1999-02-10 2000-02-09 Apparatus and method for grinding, lapping and polishing semiconductor wafers WO2000047366A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU23110/00A AU2311000A (en) 1999-02-10 2000-02-09 Apparatus and method for grinding, lapping and polishing semiconductor wafers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9902818.5A GB9902818D0 (en) 1999-02-10 1999-02-10 Apparatus and method for grinding,lapping and polishing semiconductor wafers
GB9902818.5 1999-02-10

Publications (2)

Publication Number Publication Date
WO2000047366A2 WO2000047366A2 (en) 2000-08-17
WO2000047366A3 true WO2000047366A3 (en) 2000-11-16

Family

ID=10847358

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2000/000376 WO2000047366A2 (en) 1999-02-10 2000-02-09 Apparatus and method for grinding, lapping and polishing semiconductor wafers

Country Status (3)

Country Link
AU (1) AU2311000A (en)
GB (1) GB9902818D0 (en)
WO (1) WO2000047366A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109719592B (en) * 2018-12-25 2023-09-05 无锡蓝智自动化科技有限公司 Automatic pencil lead grinding device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4379042A (en) * 1977-06-14 1983-04-05 Inoue-Japax Research Incorporated Apparatus using an axially moving continuous elongated tool
US5509850A (en) * 1993-12-13 1996-04-23 Nihon Micro Coating Co., Ltd. Polishing apparatus
US5616411A (en) * 1992-03-19 1997-04-01 Minnesota Mining And Manufacturing Company Composite abrasive filaments, methods of making same, articles incorporating same, and methods of using said articles

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0976148A (en) * 1995-09-12 1997-03-25 Shin Etsu Handotai Co Ltd Device for polishing notch part of wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4379042A (en) * 1977-06-14 1983-04-05 Inoue-Japax Research Incorporated Apparatus using an axially moving continuous elongated tool
US5616411A (en) * 1992-03-19 1997-04-01 Minnesota Mining And Manufacturing Company Composite abrasive filaments, methods of making same, articles incorporating same, and methods of using said articles
US5509850A (en) * 1993-12-13 1996-04-23 Nihon Micro Coating Co., Ltd. Polishing apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN *

Also Published As

Publication number Publication date
AU2311000A (en) 2000-08-29
WO2000047366A2 (en) 2000-08-17
GB9902818D0 (en) 1999-03-31

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