Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
  • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
  • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
  • H01F41/041—Printed circuit coils
  • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F17/00—Fixed inductances of the signal type 
  • H01F17/0006—Printed inductances
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F17/00—Fixed inductances of the signal type 
  • H01F17/04—Fixed inductances of the signal type  with magnetic core

Definitions

• the invention relates to an inductive component with a planar line structure according to the preamble of claims 1 and 3 and a method for producing such a component.
• the z. B. coils or transformers consist of a ferrite core with one or more wire windings. These wire windings can be arranged completely outside of the ferrite core around it or can also be partially guided inside the same through openings.
• a disadvantage of such a component is that it has to be partially manufactured by hand, especially as regards the winding of the winding wire into the opening of the ferrite core. Furthermore, reproducibility, i.e. the manufacturing tolerance regarding the inductive properties, due to the winding process relatively low.
• inductive components that can be manufactured automatically. These components consist of a substantially flat carrier substrate made of a ferrite material, on which a line structure is applied using planar technology.
• a disadvantage of this component is that only relatively small inductances can be generated, because of the planar guide structure generated magnetic flux outside the carrier substrate in the air space, ie in an area with low permeability (ie high magnetic resistance).
• the object of the invention is therefore to create an inductive component which is suitable for automated production but has good inductive properties, and a method for producing such an inductive component.
• the inductive component according to the invention has a carrier substrate and at least one planar line structure, an insulation structure being arranged on the carrier substrate and having at least one essentially vertical recess, the at least one planar line structure also extending within at least one recess and is fixed vertically spaced from the carrier substrate by the insulation structure, and the at least one recess above and below the at least one planar line structure is completely filled with ferrite material.
• the at least one textile structure can also be arranged directly on the carrier substrate. Then the carrier substrate has a recess which, like the at least one recess is filled with ferrite material. This component can therefore be implemented in a particularly low design.
• the magnetic flux generated by the planar line structures is guided through ferrite material along its entire path.
• the components according to the invention have a lower magnetic resistance and can therefore be realized in smaller dimensions. This not only leads to a more compact design compared to conventional inductive components, but also to a higher operating frequency range of the component.
• the inductive components according to the invention are particularly well suited for high-frequency applications in the order of up to 2000 MHz.
• the line structures are applied to the carrier substrate in planar technology, inaccurate winding processes with wire are eliminated.
• the line structures therefore have defined geometric shapes (through the masks), which is why the electrical and magnetic properties of the component can be reproduced with high accuracy in series production.
• the manufacturing costs for the components and the costs for using them in the assembly of printed circuit boards can be considerably reduced.
• the components according to the invention are suitable for mechanical assembly (pick-and-place), for example in SMD technology.
• the inductive component according to the invention can also advantageously be used in Fhp chip technology.
• Areas of the insulation structure above and / or below the at least one line structure can be retained within the at least one recess for fixing them. This measure serves to additionally increase the mechanical stability of the component.
• the carrier substrate is preferably a ceramic or semiconductor material.
• the inductive components advantageously represent a coil or a transformer.
• the respective inductances are predetermined.
• a first insulating layer and at least one planar line structure are applied to an electrically insulating carrier substrate.
• the at least one line structure is covered with a second insulating layer.
• at least one substantially vertical recess is created through both insulating layers.
• the surrounding areas of the insulating layers thus form the insulation structure.
• the at least one line structure then floats freely within the vertical recess, because the insulating layer lying below the line structure is also removed.
• the 5 is surrounded on all sides by at least one guide structure.
• At least one recess can be formed in the carrier substrate and the first insulation layer can be introduced into the at least one recess.
• the at least one planar line structure is then applied directly to the carrier substrate or to the first insulation layer in the at least one recess.
• the manufacture of this component can be carried out in a highly automated manner.
• a thin-film technique such as a lithographic process, or a thick-film technique, such as a screen printing process, can be used.
• a low manufacturing tolerance is advantageously achieved, which leads to a high reproducibility and thus to a high yield in the manufacture of the building elements.
• Fis. 1 em inductive component according to a first embodiment of the
• Fig. 2 shows an inductive component according to a second embodiment of the invention
• Fig. 3 shows an inductive component according to a third embodiment of the invention.
• FIG. 1 a to h show manufacturing steps of an inductive component according to the invention according to the first exemplary embodiment of the invention, specifically using thin-film technology.
• the component forms a coil.
• an insulation structure 30, 31, 32 is applied, which has a vertical recess 40 through which planar line structures 20, 20 'run.
• the planar line structures 20, 20 ' are fixed by the insulation structure 30, 31, 32.
• the planar line structures are electrically connected to one another through the insulation structure 31.
• the recess 40 in the insulation structure 30, 31, 32 is filled with a ferrite-containing plastic matrix 50 above and below the planar line structures 20, 20 'without air space.
• the magnetic flux generated by the line structure 20 acting as a coil is completely conducted in ferrite. This results in a higher inductance compared to conventional components manufactured in planar technology, since there is no increase in magnetic resistance due to any air gap between the interfaces of the individual structures.
• the ferrite-containing plastic matrix 50 projects here in the lateral direction 36 and in the vertical direction 38 beyond the insulation structure 30, 31, 32, so that the edges of the insulation structure 30, 31, 32 are covered. This results in a particularly stable design of the inductive component according to the invention.
• the ferrite-containing plastic matrix 50 also serves to fix the planar line structure 20 within the vertical recess 40 in the insulation structure 30, 31, 32.
• a first insulation layer 30 (FIG. 1b) and then a first line structure 20 (FIG. 1c) are first applied to the carrier substrate 10 (FIG. 1 a).
• a second insulation layer 31 is then applied (FIG. 1d) and a second line structure 20 'is applied over it.
• This second line structure 20 ′ is electrically contacted with the first line structure 20 through the second insulation layer 31 (FIG. 1).
• a third insulation layer 32 (FIG. 1f)
• the insulation layers 30, 31, 32 selectively opened (Fig. lg).
• the resulting recess 40 with the line structures 20, 20 'floating there is filled with ferrite-containing material 50 (FIG. 1h).
• the inductive component represents a transformer, the two line structures 20 and 20 'of which run within a vertical recess 40 in the insulation structure 30.
• the two line structures 20 and 20 ' are inductively coupled to one another.
• the vertical recess 40 is filled by a ferrite-containing plastic matrix 50.
• the component is therefore suitable for surface mounting (SMD technology). This means that less assembly effort is required compared to the known solutions, and mechanical assembly (pick-and-place) can also be carried out.
• 3 a to f show a third embodiment of the invention as a modification of the transmitter according to the second embodiment.
• a recess 41 is provided in the carrier substrate 10, which is filled with ferrite material 50.
• an insulation structure 30 between the carrier substrate and conductive structure 20 can then be omitted, so that a particularly flat and compact design is achieved.
• the carrier substrate 10 is first provided with the cutout 41. This recess 41 is then filled with an insulation layer 30, which is later removed again when opening the recess 40.
• the Line structures 20, 20 ′ are applied directly to the carrier substrate 10 or to the insulation layer 30.
• the inductive component according to the invention is not limited to realizing the function of a coil or a transformer. Rather, precisely because of the implementation of the line structure by means of lithographic processes, any inductive components can be formed with one or more inductive circles. In this case, the inductive component according to the invention has a plurality of recesses 40.
• the component could also be implemented using thick-film technology, provided that the structure size allows this.

Landscapes

• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Coils Or Transformers For Communication (AREA)
• Non-Reversible Transmitting Devices (AREA)

Applications Claiming Priority (2)

Publications (1)

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ID=7888877

Family Applications (1)

Country Status (3)

Families Citing this family (1)

Citations (2)

Family Cites Families (1)

• 1998
  • 1998-11-24 DE DE1998154232 patent/DE19854232A1/de not_active Withdrawn
• 1999
  • 1999-08-20 WO PCT/DE1999/002618 patent/WO2000031759A1/de active Application Filing
  • 1999-08-24 TW TW88114454A patent/TW429384B/zh active

Patent Citations (2)

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