WO2000016400A8 - Application de ceramiques de protection - Google Patents
Application de ceramiques de protectionInfo
- Publication number
- WO2000016400A8 WO2000016400A8 PCT/CN1999/000147 CN9900147W WO0016400A8 WO 2000016400 A8 WO2000016400 A8 WO 2000016400A8 CN 9900147 W CN9900147 W CN 9900147W WO 0016400 A8 WO0016400 A8 WO 0016400A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- protective
- ceramics
- applications
- pilling
- ratio
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU57258/99A AU5725899A (en) | 1998-09-16 | 1999-09-15 | Applications of protective ceramics |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN98119257.2 | 1998-09-16 | ||
CN98119257A CN1087871C (zh) | 1998-09-16 | 1998-09-16 | 集成电路中的似电容元件 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000016400A1 WO2000016400A1 (fr) | 2000-03-23 |
WO2000016400A8 true WO2000016400A8 (fr) | 2000-07-27 |
Family
ID=5226312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN1999/000147 WO2000016400A1 (fr) | 1998-09-16 | 1999-09-15 | Application de ceramiques de protection |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN1087871C (fr) |
AU (1) | AU5725899A (fr) |
WO (1) | WO2000016400A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100818058B1 (ko) * | 2002-06-28 | 2008-03-31 | 매그나칩 반도체 유한회사 | 엠아이엠 캐패시터 형성방법 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5070384A (en) * | 1990-04-12 | 1991-12-03 | Actel Corporation | Electrically programmable antifuse element incorporating a dielectric and amorphous silicon interlayer |
US5521423A (en) * | 1993-04-19 | 1996-05-28 | Kawasaki Steel Corporation | Dielectric structure for anti-fuse programming element |
US5439840A (en) * | 1993-08-02 | 1995-08-08 | Motorola, Inc. | Method of forming a nonvolatile random access memory capacitor cell having a metal-oxide dielectric |
US5463244A (en) * | 1994-05-26 | 1995-10-31 | Symetrix Corporation | Antifuse programmable element using ferroelectric material |
JPH09246094A (ja) * | 1996-03-11 | 1997-09-19 | Murata Mfg Co Ltd | トリマブル積層セラミックコンデンサ |
US5838530A (en) * | 1996-07-22 | 1998-11-17 | Zhang; Guobiao | Applications of protective ceramics |
-
1998
- 1998-09-16 CN CN98119257A patent/CN1087871C/zh not_active Expired - Fee Related
-
1999
- 1999-09-15 AU AU57258/99A patent/AU5725899A/en not_active Abandoned
- 1999-09-15 WO PCT/CN1999/000147 patent/WO2000016400A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
AU5725899A (en) | 2000-04-03 |
WO2000016400A1 (fr) | 2000-03-23 |
CN1087871C (zh) | 2002-07-17 |
CN1211083A (zh) | 1999-03-17 |
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