WO2000007789A1 - Pastille pour moulage antivibrations de resine - Google Patents

Pastille pour moulage antivibrations de resine Download PDF

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Publication number
WO2000007789A1
WO2000007789A1 PCT/JP1998/003543 JP9803543W WO0007789A1 WO 2000007789 A1 WO2000007789 A1 WO 2000007789A1 JP 9803543 W JP9803543 W JP 9803543W WO 0007789 A1 WO0007789 A1 WO 0007789A1
Authority
WO
WIPO (PCT)
Prior art keywords
vibration
pellet
resin
active ingredient
base resin
Prior art date
Application number
PCT/JP1998/003543
Other languages
English (en)
Japanese (ja)
Inventor
Yasuyuki Ohira
Mitsuo Hori
Original Assignee
Shishiai-Kabushikigaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shishiai-Kabushikigaisha filed Critical Shishiai-Kabushikigaisha
Priority to PCT/JP1998/003543 priority Critical patent/WO2000007789A1/fr
Priority to PCT/JP1998/005195 priority patent/WO2000008100A1/fr
Publication of WO2000007789A1 publication Critical patent/WO2000007789A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59

Definitions

  • the present invention relates to automobiles, home appliances, electronic equipment, precision equipment, communication equipment, OA equipment, construction machinery, civil engineering buildings, various other machines, A system that can be applied as a molding material for components of equipment and structures, propagates to the machines, equipment, structures, etc., or absorbs and attenuates vibrations generated from machines, equipment, structures, etc.
  • the present invention relates to a pellet for a vibrating resin molded product.
  • vibration countermeasures Conventionally, in order to respond to such demands, automobiles, home appliances, electronic equipment, precision equipment, OA equipment, communication equipment, construction machinery, civil engineering buildings, various other machines, equipment, and structures have been used as vibration countermeasures.
  • the material (vibration damping material) that has viscoelastic properties such as rubber, plastic, and asphalt is cut or bent according to the size and shape of the application location of the machine, equipment, structure, etc. It was processed and affixed to the application area, and propagated to the machine, equipment, structure, etc., or absorbed and attenuated by vibration generated from the machine, equipment, structure, etc.
  • the present invention has been made in view of such technical problems, and includes automobiles, home appliances, precision equipment, electronic equipment, OA equipment, communication equipment, construction machinery, civil engineering buildings, other various machines, equipment, It is applied as a molding material for structural materials such as structures, and can absorb and attenuate vibrations that propagate to the machines, equipment, structures, etc., or are generated from machines, equipment, structures, etc. It is intended to provide a belt for vibration-damping resin molded products that can be cut or bent according to the size or shape, and does not need to be attached to the application location. is there. Disclosure of the invention
  • pellets for vibration-damping resin moldings of the present invention include automobiles, home appliances, electronic equipment, precision equipment, OA equipment, communication equipment, construction machinery, civil engineering buildings, various other machines, Components of equipment and structures, such as car interiors and dashboards, electric washing machines and refrigerators, video cameras and recorders, copiers and printers, telephone casings, partition walls, gears and pulleys, and other components It is applied as a molding material for such applications.
  • the shape, size, manufacturing method, and the like of the pellet are completely arbitrary.
  • a composition comprising a base resin, an active ingredient, and an inorganic filler, which will be described later, is extruded by an extruder and then formed into a round shape by a strand cutting method or a hot cutting method, or a sheet of the composition
  • the shape, size, and manufacturing method of the pellet such as the shape of the pellet, which is cut into a square shape, and the manufacturing method, are based on the type, size, It is better to determine as appropriate in consideration of the shape, use condition, etc.
  • the pellet of the present invention is characterized in that an active ingredient for increasing the amount of dipole moment in the base resin and an inorganic filler are blended in the base resin.
  • Base resins include, for example, polyvinyl chloride, polyethylene, chlorinated polyethylene, polypropylene, ethylene-vinyl acetate copolymer, polymethyl methacrylate, polyvinylidene fluoride, polyisoprene, polystyrene, styrene-butadiene Lilonitrile copolymer (ABS resin), styrene-acrylonitrile copolymer (AS resin), acrylonitrile-butadiene rubber (NBR), styrene-butadiene rubber (SBR), butadiene rubber (BR ), Natural rubber (NR), and isoprene rubber (IR), or a mixture thereof.
  • ABS resin styrene-acrylonitrile copolymer
  • AS resin styrene-acrylonitrile copolymer
  • NBR acrylonitrile-butadiene rubber
  • SBR styrene-butadiene rubber
  • BR buta
  • FIG. 1 shows an arrangement state of the dipoles 12 inside the base resin 11 before the vibration energy is transmitted. It can be said that the arrangement state of the dipoles 12 is in a stable state. However, when vibration energy is transmitted to this, the dipoles 12 existing inside the base resin 11 are displaced, and as shown in FIG. 2, each dipole inside the base resin 11 is displaced. The child 1 2 will be placed in an unstable state, and each dipole 1 2 will try to return to a stable state as shown in FIG. At this time, energy is consumed.
  • the active component is a component that dramatically increases the amount of dipole moment in the base resin.
  • the active component itself has a large amount of dipole moment, or the dipole moment of the active component itself. Although the amount is small, it refers to a component that can dramatically increase the amount of dipole moment in the base resin when the active component is blended.
  • N N-dicyclohexylbenzothiazyl-1-sulfenamide (DCHB SA), 2_mercaptobenzothiazol (MBT), dibenzothiazyl sulfide (MBTS), N-six hexinolebenzobenzothiazyl-1- Snorrefenamide (CBS), N-tert-butylbenzothiazirulu-2-sulfenamide (BBS), N-oxyjetj Lembenzothiazyl-1 Su painful'ami de (OB S), N, N- diisopropyl Rubenzochiajiru compound containing a benzothiazyl group such as single 2- Su criz'ami de (DPB S), Benzotriazole having an azole group bonded to the benzene ring is used as the mother nucleus, and a phenyl group is bonded to the nucleus.
  • DCHB SA N-dicyclohexylbenzothiazyl-1-sulfen
  • Some resins are benzophenones such as 2-hide mouth 4-methoxybenzophenone (HMBP), 2-no, hydroxy-4-hydroxybenzophenone-5-sulfonic acid (HM BPS)
  • HMBP 2-hide mouth 4-methoxybenzophenone
  • HM BPS hydroxy-4-hydroxybenzophenone-5-sulfonic acid
  • One or more compounds selected from compounds having a group can be exemplified.
  • the amount of the dipole moment in the above-mentioned active ingredient is variously different depending on the type of the active ingredient, similarly to the amount of the dipole moment in the base resin. Even when the same active component is used, the amount of dipole moment generated in the base resin changes depending on the temperature when vibration energy is applied. The amount of dipole moment also changes depending on the magnitude of the vibrational energy applied to the base resin.
  • the amount exceeds the above, even if the blending amount is increased, an increase in the amount of dipole moment by the increased amount cannot be expected, and in addition, there is a risk of causing a problem that the formability is deteriorated.
  • the above active ingredients are blended, at least two kinds of active ingredients having different glass transition points may be blended into the base resin to extend the temperature range where the vibration absorbing performance is exhibited. It is possible. Examples include the combination of DCHBSA and 2 HP MMB when ABS resin is used as the base resin, and the combination of DCHBSA, 2 HP MMB and ECDPA when using polyvinyl chloride as the base resin. Can be.
  • the inorganic filler examples include My rye scales, glass flakes, glass fiber, glass fiber, calcium carbonate, barite, and precipitated barium sulfate. These inorganic fillers are filled for the purpose of further improving the vibration absorbing performance.
  • the inorganic filler is preferably contained in a proportion of 100 to 100 parts by weight with respect to 100 parts by weight of the base resin. For example, when the filling amount of the inorganic filler is less than 10, even if the filling of the inorganic filler is not sufficiently improved, the vibration absorbing performance is not improved.
  • FIG. 1 is a schematic diagram showing a dipole in the base resin:
  • FIG. 2 is a schematic diagram showing a state of the dipole in the base resin when vibration energy is applied.
  • FIG. 3 is a schematic diagram showing a state of a dipole in the base resin when an active ingredient is blended.
  • FIG. 4 is a graph showing the mechanical properties E ′′ (dyne / cm 2 ) at each temperature under a frequency of 110 Hz for the samples of Examples 1 to 3 and Comparative Examples 1 to 4.
  • ABS resin (Sumika A & L Co., Ltd., GA-704) is used as a base resin, and CBS (Sanshin Chemical Industry Co., Ltd., CM Sancera I) is used as an active ingredient.
  • Kuraray Co., Ltd., 60 C) and calcium carbonate (Maruo Calcium Co., Ltd., heavy coal) were charged into a pelletizer at the mixing ratio shown in Table 1 below, extruded, and then extruded using a strand method. A round pellet with a length of 3 mm was produced.
  • FIG. 4 shows the mechanical properties E "(loss elastic modulus) at each temperature under the frequency of 11 OHz for each of the samples according to Example 13 and Comparative Example 14 described above.
  • the loss elastic modulus was measured using a dynamic viscoelasticity measurement test device (Leovive DDV-25FP, manufactured by Orientec Co., Ltd.).
  • Each of the samples according to Example 13 and Comparative Example 14 used an ABS resin having a glass transition point in the range of about 110 ° C to 120 ° C as the base resin.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Vibration Prevention Devices (AREA)

Abstract

L'invention concerne une pastille pour moulage antivibrations de résine. Cette pastille est capable d'absorber et d'amortir les vibrations traversant ou produites par des machines, des appareils, des structures, et autres, lorsqu'elle est utilisée comme matériau de moulage d'un matériau structurel dans des automobiles, des appareils électriques domestiques, des dispositifs électroniques, des instruments de précision, des dispositifs de communication, des dispositifs de bureautique, des machines de construction, des structures de construction ou dans d'autres machines, appareils ou structures. Cette pastille est caractérisée en ce qu'un composant actif augmentant le moment dipolaire de la résine de base et une charge inorganique sont mélangés dans ladite résine de base.
PCT/JP1998/003543 1998-08-07 1998-08-07 Pastille pour moulage antivibrations de resine WO2000007789A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP1998/003543 WO2000007789A1 (fr) 1998-08-07 1998-08-07 Pastille pour moulage antivibrations de resine
PCT/JP1998/005195 WO2000008100A1 (fr) 1998-08-07 1998-11-18 Pieces moulees antivibrations en resine et pastilles de resine antivibrations destinees au moulage desdites pieces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1998/003543 WO2000007789A1 (fr) 1998-08-07 1998-08-07 Pastille pour moulage antivibrations de resine

Publications (1)

Publication Number Publication Date
WO2000007789A1 true WO2000007789A1 (fr) 2000-02-17

Family

ID=14208767

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1998/003543 WO2000007789A1 (fr) 1998-08-07 1998-08-07 Pastille pour moulage antivibrations de resine

Country Status (1)

Country Link
WO (1) WO2000007789A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002179927A (ja) * 2000-12-15 2002-06-26 Cci Corp 低反発弾性・制振性ポリマー組成物
KR101429439B1 (ko) 2012-12-03 2014-08-12 주식회사 화인에스앤피 Ｔｐｏ 밴드의 제조방법 및 이의 제조방법에 의해 제조된 ｔｐｏ 밴드
US10178445B2 (en) 2016-11-23 2019-01-08 At&T Intellectual Property I, L.P. Methods, devices, and systems for load balancing between a plurality of waveguides

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0764346A (ja) * 1993-07-28 1995-03-10 Hewlett Packard Co <Hp> 液体電子写真トナー用キレート化正電荷誘導体
JPH09302139A (ja) * 1996-05-10 1997-11-25 Cci Corp 制振材
JPH09316295A (ja) * 1996-05-30 1997-12-09 Cci Corp エネルギー変換組成物
JPH10154892A (ja) * 1996-11-26 1998-06-09 Cci Corp 電磁波吸収材

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0764346A (ja) * 1993-07-28 1995-03-10 Hewlett Packard Co <Hp> 液体電子写真トナー用キレート化正電荷誘導体
JPH09302139A (ja) * 1996-05-10 1997-11-25 Cci Corp 制振材
JPH09316295A (ja) * 1996-05-30 1997-12-09 Cci Corp エネルギー変換組成物
JPH10154892A (ja) * 1996-11-26 1998-06-09 Cci Corp 電磁波吸収材

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002179927A (ja) * 2000-12-15 2002-06-26 Cci Corp 低反発弾性・制振性ポリマー組成物
KR101429439B1 (ko) 2012-12-03 2014-08-12 주식회사 화인에스앤피 Ｔｐｏ 밴드의 제조방법 및 이의 제조방법에 의해 제조된 ｔｐｏ 밴드
US10178445B2 (en) 2016-11-23 2019-01-08 At&T Intellectual Property I, L.P. Methods, devices, and systems for load balancing between a plurality of waveguides

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