WO2000002247A1 - Procede et dispositif pour la fabrication d'un composite entre un corps porteur et au moins un composant contenu a l'interieur - Google Patents

Procede et dispositif pour la fabrication d'un composite entre un corps porteur et au moins un composant contenu a l'interieur Download PDF

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Publication number
WO2000002247A1
WO2000002247A1 PCT/EP1999/004726 EP9904726W WO0002247A1 WO 2000002247 A1 WO2000002247 A1 WO 2000002247A1 EP 9904726 W EP9904726 W EP 9904726W WO 0002247 A1 WO0002247 A1 WO 0002247A1
Authority
WO
WIPO (PCT)
Prior art keywords
components
support body
carrier material
holder
composite
Prior art date
Application number
PCT/EP1999/004726
Other languages
German (de)
English (en)
Inventor
Detlef Krabe
Günter Lang
Martin HAGENBÜCHLE
Alf Springer
Klaus Buschick
Oswin Ehrmann
Wolfgang Scheel
Herbert Reichl
Original Assignee
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19932269A external-priority patent/DE19932269A1/de
Application filed by Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. filed Critical Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Publication of WO2000002247A1 publication Critical patent/WO2000002247A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips

Definitions

  • the invention relates to the production of basic building blocks on the basis of a composite between a carrier body and at least one component contained therein. Areas of application exist wherever systems are used that contain components at defined positions.
  • the basic building blocks produced with the invention are used in the fields of electronics / electrical engineering, sensor technology, optics, communications technology, biology and medicine.
  • Chip-first technology (0. Ehrmann, K. Buschick, G. Chmiel, A. Paredes, V. Glaw, H. Reichl: 3D multichip modules. Proc. ICEMCM'95, Denver, April 19-21 (1995), 358.).
  • This technique is based on the areas in which the chips are placed in a substrate being structured in a preceding process step, e.g. Laser cutting can be used. After this structuring step, a further process step is necessary to adjust and temporarily fix the components designed as chips. After this, the actual embedding of the component is carried out by gluing in with adhesive dispensing and then curing.
  • solder bumps solder bumps
  • the object of the invention is to reduce the manufacturing outlay when equipping the support body with components to reduce such a technology, which is applicable to a wide variety of component types and which is suitable for designing the component carrier for subsequent process steps in such a way that a simplified and more compact structure of the end product can be achieved.
  • the object is achieved by a method for producing a composite between a support body and at least one component contained therein in that the component is aligned outside the support body in a plane parallel to the surface of the support body, at least partially embossed in the support body and by enclosing it Carrier material is fixed.
  • the components can be embossed to a depth at which the components either form a planar surface with the surface of the carrier body or at which the components project slightly beyond the surface of the carrier body for the lateral connection of connecting elements.
  • Polymeric support material should preferably be used for the support body, but non-organic materials can also be suitable.
  • the components and possibly also additional functional structures are stamped into the carrier material by increasing the temperature and by applying pressure. A hardening of the carrier material fixes the components.
  • the stamping process which is usually completed by cooling the composite of stamped components and carrier material, can be carried out in one process step or in several successive steps be performed. However, it is also possible to subject the composite to a temperature treatment (tempering) after cooling.
  • the basic module is available as a component / carrier material network, it is then further processed into a functional overall system. This includes the application of functional layers, such as conductive, insulating and optical layers. It is also possible to install other components using SMD technology.
  • the components are designed as integrated circuits, they can be electrically connected by wire bonding, flip / chip, TAB technology and / or directly by conductor structures in thin-film technology.
  • Corresponding waveguide structures are suitable for optical components; fluidic connections to the components can be established through channels in the carrier material.
  • the wire bond and / or flip-chip technology can be used for the electrical connection of the overall functional system and optical waveguides can be used for optical connections to the outside.
  • the invention further relates to a device for producing a composite between a support body and at least one component contained therein with holders for the support body and the components used to impress the components in the support body against each other in a direction from which a change in distance of the support body and Components result from each other, are adjustable.
  • the holder for the components has receiving areas which, until the components have been impressed, have an aligned fixation of the components in a plane parallel to the surface of the support body and ensure protection of parts of the components and which release the components after being embossed in the support body.
  • vacuum suction devices are provided in the receiving areas for fixing the components.
  • the fixation can also be done by gluing with a non-permanent adhesive or by mechanical brackets.
  • the use of the non-permanent adhesive allows component holders which are removable from the device to be fitted outside the device.
  • At least one of the holders for the support body or the components with a tempering or. Heater connected. Furthermore, the adjustment of the two brackets against one another can be carried out with an adjustable force.
  • the receiving areas can either lie as flat areas in a common plane or be formed as depressions. Furthermore, it is possible that both brackets contain structures for transfer to the support body. Areas for the components are provided for this purpose adjacent to the receiving areas.
  • a decisive advantage of the present invention is that the additional connecting elements by means of wire bonds, TAB structures and / or solder balls are not absolutely necessary in order to establish electrical connections to the conductor structures on the surface of the carrier body.
  • the electrical conductor structures produced using planar techniques themselves make connections to the embossed components. With insulating intermediate layers, it is also possible to arrange conductor structures on the surface of the embossed components in further levels.
  • Fig. 1 is a schematic representation of a first type of embossing, in which a component holder with a flat receiving area is provided for the components
  • Fig. 2 is an outline representation for a second type of embossing, in which a component holder for receiving the components is provided with depressions
  • FIG 3 shows an outline representation for a third type of embossing, in which a component holder is provided, the receiving region for the components of which has both flat regions and depressions and is additionally provided with structures
  • Fig. 4 shows a cross section through a device with holders for the support body and for the components
  • Fig. 5 shows an enlarged cross section through a first
  • Fig. 6 shows an enlarged cross section through a second embodiment for the component holder, in which the components are inserted in depressions 7 shows an enlarged cross section through a second embodiment for the component holder, the receiving area for the components of which has both flat areas and depressions
  • Fig. 8 is a perspective view for the component holder
  • holders 1, 2 are used for carrying out the method, which are adjustable relative to each other in one direction, from which a mutual change in distance results. While the holder 1 is used to hold components 3, the holder 2 is provided for a support body 4. In the holder 1 3 channels 5 are incorporated for non-permanent fixation of the components, which on the one hand mouth on a surface facing the holder 2 into receiving areas for the components 3, and on the other hand are connected to a poorly illustrated device for generating a vacuum.
  • the brackets 1 differ according to their different structuring of the receiving areas for the components 3.
  • a completely flat receiving area 6 is provided for carrying out the method according to FIG. 1.
  • depressions 7 serving for adjustment are characteristic, the m a adapted to accommodate the components and the holder m are incorporated with a depth m, which nevertheless allows the components 3 to emerge from the surface of the holder 1.
  • the receiving area in Fig. 3 combines both flat areas 8 and depressions 9.
  • the latter holding device 1 contains z. B. raised structures 10, which are to be transferred into the support body 4 as a functional structure 10 '.
  • the structure 10 is neither limited to the type given here by way of example nor to the combination with the flat regions 8 and the depressions 9.
  • additional additional functional structures 12 can be incorporated into the support body 4, for example for waveguides, by means of additional projections 11 using the holder 1.
  • the carrier body 4 is attached to the holder 2 in the form of a disk (FIG. 1).
  • the components 3 are removed with the aid of the holder 1 from a receptacle, not shown, which holds the components 3 m of the desired geometric arrangement in relation to one another.
  • the components 3 are fixed in the flat receiving areas 6 by vacuum suction via the channels 5 led into the receiving areas 6.
  • the components 3 thus adjusted and fixed are now already arranged in the Bracket 1 and are prepared for stamping into the support body 4 (step ⁇ ).
  • step ® the holder 1 is moved together with the components 3 against the holder 2 using a force F until the components 3 come into contact with the support body 4 fastened on the holder 2 by touching their surfaces.
  • the components 3 can either have the same thickness, as a result of which their surfaces are simultaneously placed on the surface of the support body 4, or else their thickness is different from one another, as is the case in FIG. 1.
  • the carrier body 4 and the components 3 are heated + ⁇ T.
  • the pressing force F there is an increase in the pressing force F, with which the two brackets 1, 2 together with the components 3 and the support body 4 are pressed against one another.
  • the components 3 m are embossed into the carrier body 4, the carrier material flowing.
  • the flow process has the result that, on the one hand, superfluous carrier material is displaced and, on the other hand, the carrier material flows around components 3.
  • the holder 1 ensures that the top of the components 3 facing the receiving area 6 with functional areas located thereon for e.g. electrical, optical, thermal or mechanical connections (for example connection pads or light outputs / outputs) are kept free of the flowing material.
  • step ® in which the component and carrier body surfaces form a planar surface and the entire component / carrier material composite has been brought to the desired total thickness.
  • the basic module 13 m in the form of the component / carrier material composite produced by the method according to the invention can now be further processed by subsequent processes.
  • electrical line structures can be built up on the flat surface by means of metallization and photolithographic processes to increase the electrical functionality of the compact overall system.
  • the components 3 to be embossed are placed in the recesses 7 provided in the holder 1 as adjustment troughs when carrying out the method according to FIG. 2 and fixed by means of vacuum.
  • the further procedure for the stamping process corresponds to the process sequence according to FIG. 1.
  • a basic module 14 is created in the form of a component / carrier material composite, in which, during the stamping process, parts of components 3, such as their surfaces 15, are covered by the receiving areas. 16 and parts of the side areas 17, 18, slightly over the Extend the surface of the support body 4. Such an impression of the components 3 is such.
  • the components 3 are designed as optical components in the form of edge emitters, for which the beam exit is then above the surface ⁇ es of the carrier body 4.
  • additional light-guiding layers can be applied adjacent to the side region parts 17, 18, which the edge emitter can couple directly.
  • the method according to FIG. 3 is similar to the method according to FIG. 1, with the difference that the receiving area for the components 3 does not have a uniform area, which the components 3 would impress in an identical surface level, but also contains slightly recessed receiving areas 9 which some of the components 3 protrude slightly from the carrier surface (4).
  • the slight protrusion of e.g. 5 ⁇ m of some of the components 3 can also be used here, in the case of embossed edge emitters, to build up planar waveguides in subsequent process steps, which couple directly to the emitting components 3. (The emitting area of edge emitters is located in the area of the components near the surface - approx. 3 - 10 ⁇ m below the surface.)
  • the functional structure 12 produced with the aid of the projection 11 can also be used for the optical coupling of edge emitters, in that completely embossed edge emitters border on the embossed functional structure 12 with their radiating regions.
  • the functional structure 12 is filled with light-conducting material (core - higher refractive index than the surrounding material Claddmg) in a subsequent process step.
  • the embossed functional structures 12 can be used for fluidic applications, such as, for example, to flow through a means for heat exchange.
  • a device is suitable for carrying out the method according to the invention which, according to FIG. 4, contains mutually adjustable holders 19, 20 for receiving components and support bodies, the adjustment (arrow direction) associated with a change in distance being able to be carried out with adjustable force.
  • the bracket 19 consists of a support plate 21, which is inserted into a recess 22, an exchangeable holding plate 23 and is fastened by means of lugs 24.
  • the easy interchangeability of the holding plate 23 allows it to be fitted outside the device or in a simple manner, for. B. according to Figures 5 to 7 differently designed or transparent holding plates m to use the device.
  • a cutout m of the holding plate 23 forms a channel 25 with the support plate 21 placed above it, from which bores 26 lead to areas for receiving components 27.
  • the channel 25 can also widen a chamber.
  • a bore 28 in the carrier plate 21 opening into the channel 25 with an opening forms part of a connection to a vacuum source, not shown.
  • the holder 20 consists of a receiving plate 31 with laterally arranged spring elements 32 for temporarily fastening a support body 33.
  • Both brackets 19, 20 are connected to temperature control plates 34, 35, via which both heating and cooling can take place. Due to the thermal conductivity of the base plate 30, the interposition thereof between the temperature control plate 34 and the holder 19 poses no problems with the temperature control.
  • FIGS. 5 to 7 contain examples for modifying the receiving areas of a holding plate 23.
  • a first modified holding plate 36 has a flat receiving area 37.
  • a holding plate 38 contains the components 27 inserted into recesses 39 and a holding plate 40 has both flat receiving areas 41 and also such Wells 42 on. Additional raised structures 43 can also be provided on the holding plate for transmission during the stamping process.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un procédé et un dispositif pour la fabrication d'un composite entre un corps porteur (4) et au moins un composant (3) contenu à l'intérieur. Elle vise à réduire les frais de fabrication lors de l'équipement du corps porteur avec les composants par une technologie qui soit applicable à une large multiplicité de types de composants et qui soit appropriée pour configurer le support de composants équipé, en vue des étapes ultérieures du processus, de manière à permettre l'obtention d'une structure plus simple et plus compacte du produit final. Les composants sont alignés, à l'extérieur du corps de support (4), dans un plan parallèle à la surface de celui-ci, sont imprimés au moins partiellement dans le corps porteur (4) avec augmentation de la température et application d'une pression, et sont bloqués par le matériau de support les entourant. L'invention sert à la fabrication de modules de base s'utilisant dans l'électronique/l'électrotechnique, la technologie des détecteurs, l'optique, la technique des télécommunications, la biologie et la médecine.
PCT/EP1999/004726 1998-07-06 1999-07-06 Procede et dispositif pour la fabrication d'un composite entre un corps porteur et au moins un composant contenu a l'interieur WO2000002247A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19830135 1998-07-06
DE19830135.9 1998-07-06
DE19932269.4 1999-07-05
DE19932269A DE19932269A1 (de) 1998-07-06 1999-07-05 Verfahren und Vorrichtung zur Herstellung eines Verbundes zwischen einem Trägerkörper und mindestens einer darin enthaltenen Komponente

Publications (1)

Publication Number Publication Date
WO2000002247A1 true WO2000002247A1 (fr) 2000-01-13

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Application Number Title Priority Date Filing Date
PCT/EP1999/004726 WO2000002247A1 (fr) 1998-07-06 1999-07-06 Procede et dispositif pour la fabrication d'un composite entre un corps porteur et au moins un composant contenu a l'interieur

Country Status (1)

Country Link
WO (1) WO2000002247A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101937899A (zh) * 2010-05-17 2011-01-05 日月光半导体制造股份有限公司 半导体封装结构及封装工艺
US9177884B2 (en) 2012-10-09 2015-11-03 Avago Technologies General Ip (Singapore) Pte. Ltd. Two-sided-access extended wafer-level ball grid array (eWLB) package, assembly and method
US9305908B2 (en) 2014-03-14 2016-04-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Methods for performing extended wafer-level packaging (eWLP) and eWLP devices made by the methods
US9443835B2 (en) 2014-03-14 2016-09-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Methods for performing embedded wafer-level packaging (eWLP) and eWLP devices, packages and assemblies made by the methods
US9541717B2 (en) 2015-01-30 2017-01-10 Avago Technologies General IP (Singapore) Pta. Ltd. Optoelectronic assembly incorporating an optical fiber alignment structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2202673A (en) * 1987-03-26 1988-09-28 Haroon Ahmed Multiplechip assembly
US5565706A (en) * 1994-03-18 1996-10-15 Hitachi, Ltd. LSI package board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2202673A (en) * 1987-03-26 1988-09-28 Haroon Ahmed Multiplechip assembly
US5565706A (en) * 1994-03-18 1996-10-15 Hitachi, Ltd. LSI package board

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
CHANG-LEE CHEN ET AL: "BOND WIRELESS MULTICHIP PACKAGING TECHNOLOGY FOR HIGH-SPEED CIRCUITS", IEEE TRANSACTIONS ON COMPONENTS,HYBRIDS,AND MANUFACTURING TECHNOLOGY, vol. 15, no. 4, 1 August 1992 (1992-08-01), pages 451 - 456, XP000311384, ISSN: 0148-6411 *
LASKAR A S ET AL: "EPOXY MULTICHIP MODULES: A SOLUTION TO THE PROBLEM OF PACKAGING AND INTERCONNECTION OF SENSORS AND SIGNAL-PROCESSING CHIPS", SENSORS AND ACTUATORS A, vol. A36, no. 1, 1 March 1993 (1993-03-01), pages 1 - 27, XP000368512, ISSN: 0924-4247 *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101937899A (zh) * 2010-05-17 2011-01-05 日月光半导体制造股份有限公司 半导体封装结构及封装工艺
CN101937899B (zh) * 2010-05-17 2013-04-17 日月光半导体制造股份有限公司 半导体封装结构及封装工艺
US9177884B2 (en) 2012-10-09 2015-11-03 Avago Technologies General Ip (Singapore) Pte. Ltd. Two-sided-access extended wafer-level ball grid array (eWLB) package, assembly and method
US9305908B2 (en) 2014-03-14 2016-04-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Methods for performing extended wafer-level packaging (eWLP) and eWLP devices made by the methods
US9425175B2 (en) 2014-03-14 2016-08-23 Avago Technologies General Ip (Singapore) Pte. Ltd. Methods for performing extended wafer-level packaging (eWLP) and eWLP devices made by the methods
US9443835B2 (en) 2014-03-14 2016-09-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Methods for performing embedded wafer-level packaging (eWLP) and eWLP devices, packages and assemblies made by the methods
US9541717B2 (en) 2015-01-30 2017-01-10 Avago Technologies General IP (Singapore) Pta. Ltd. Optoelectronic assembly incorporating an optical fiber alignment structure

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