EP1269235A2 - Positionnement micro-mecanique de composants optiques actifs et passifs - Google Patents

Positionnement micro-mecanique de composants optiques actifs et passifs

Info

Publication number
EP1269235A2
EP1269235A2 EP01925530A EP01925530A EP1269235A2 EP 1269235 A2 EP1269235 A2 EP 1269235A2 EP 01925530 A EP01925530 A EP 01925530A EP 01925530 A EP01925530 A EP 01925530A EP 1269235 A2 EP1269235 A2 EP 1269235A2
Authority
EP
European Patent Office
Prior art keywords
carrier
microfunction
unit according
finger
receptacle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01925530A
Other languages
German (de)
English (en)
Inventor
Arnd Menschig
Marcus Scholl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Milasys GbR
Original Assignee
Milasys GbR
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Milasys GbR filed Critical Milasys GbR
Publication of EP1269235A2 publication Critical patent/EP1269235A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/003—Alignment of optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3688—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier using laser ablation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3696—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures

Definitions

  • the invention relates to a microfunctional unit produced in hybrid integrated microstructure technology, comprising microcomponents which can be used in microstructure technology and which also determine the function of the microfunctional unit, and at least one carrier comprising a piece of flat material for receiving the microcomponents.
  • microfunction units position at least some of the microcomponents exactly relative to the carrier.
  • an exempted finger is formed from the flat material piece of the respective carrier by two openings which are opposite one another and penetrate the entire carrier and in that the finger serves as a holding element for one of the microcomponents.
  • such a finger can be used to decouple the position-sensitive microcomponent from the rest of the carrier, since such a finger has a considerably reduced cross section with regard to heat conduction. It is particularly advantageous if one or more fingers of this type connect a portion of the carrier which forms a receptacle for the microcomponent to the remaining region of the carrier, on which, for example, the other microcomponents are arranged.
  • the position-sensitive microcomponent can be easily fixed on the sub-area forming the receptacle by thermal methods, since thermal heating of the sub-area carrying the position-sensitive micro-component is possible in a simple manner, without the heat flowing off significantly to the other carrier and without that the thermal fixation also takes place in the area of the rest of the support or this is reversed again.
  • the finger is designed to be elastically resilient, ie. that is, the finger has a dimension such that the material of the flat material piece forming the finger imparts spring-elastic properties to the finger.
  • Such a resilient design of the finger is conceivable for a wide variety of applications.
  • such a resilient design of the finger could serve to decouple a microcomponent from the rest of the carrier with regard to vibrations.
  • a particularly favorable solution provides that the finger is arranged opposite a receptacle for the microcomponent.
  • the receptacle can be designed so that it defines a defined positioning of the microcomponent, while the finger ensures that the microcomponent is always acted upon by the finger with a spring-elastic force in the direction of the receptacle and thus the position predetermined by the receptacle maintains.
  • the finger is connected with a first end to a remaining part of the carrier.
  • the second end of the finger could also be connected to the carrier again.
  • the finger is freely movable with a second end relative to the rest of the area of the carrier.
  • a microcomponent in the sense of the solution according to the invention is understood to mean active or passive components or assemblies, for example both optical and electrical or electronic circuit components or also active or passive mechanical or fluidic components in microstructure technology.
  • microcomponents are electrical or electronic components or assemblies, optical components or assemblies, and electro / optical or optically mechanical or electromechanical assemblies.
  • a width of the finger is at most twice the thickness of the carrier, better still corresponds to a maximum of the thickness of the carrier.
  • the length of the finger is a multiple of the thickness of the carrier.
  • breakthroughs according to the invention can be produced in the flat material piece of the carrier by a wide variety of methods.
  • Advantageous production options are material removal, such as laser cutting of the flat material piece or stamping or etching of the flat material piece, dry etching processes being particularly advantageous in the etching processes.
  • the receptacle is designed as a breakthrough penetrating the entire carrier. This makes it possible, in particular, to use microfunction units designed as optical components, in which case these can then be irradiated in a direction running transversely to the extent of the carrier.
  • An advantageous embodiment of the microfunction unit provides that the opening forming the receptacle is arranged in the same carrier as the finger, so that the finger and the receptacle can be positioned precisely with respect to one another.
  • the opening forming the receptacle opens towards the opening exposing the finger.
  • the microfunction unit comprises at least two carriers, that the fingers are formed in one of the carriers and that the receptacle is arranged in the other carrier.
  • the microcomponent can preferably be arranged between the two carriers.
  • This solution is particularly suitable for taking up macroscopic elements, such as optical imaging elements, such as spherical lenses. However, this solution is also suitable for accommodating mechanical components, such as connector pins. If necessary, the carriers are arranged at a defined distance from one another by spacer elements.
  • a microfunction unit according to the invention is preferably constructed from a plurality of carriers.
  • FIG. 1 shows a section through a microfunction unit according to the invention
  • Fig. 2 is a partial representation of a
  • FIG. 3 is a section along line 3-3 in Fig. 2;
  • FIG. 4 shows an enlarged detail of a region B of a second carrier in FIG. 1;
  • FIG. 5 shows an enlarged detail of the area C of a fourth carrier in FIG. 1;
  • Fig. 6 is an enlarged plan view in the direction of arrow D in Fig. 1 and
  • FIG. 7 shows a section along line 7-7 in FIG. 6.
  • FIG. 1 of a microfunction unit produced in hybrid integrated microstructure technology comprises a first carrier 10 on which a plurality of microcomponents 12 to 20 are arranged.
  • microcomponents can be, for example, an integrated electronic circuit 12, an integrated electronic amplifier circuit 14 constructed in a different integration design and an optical detector 16.
  • a driver circuit 18 manufactured in another integration technique is connected to the integrated electronic circuit and, in turn, an optical transmitter 20, for example a semiconductor laser, is connected to this.
  • the carrier 10 comprises a base plate 22 designed as a flat material piece, which has a metallic coating on an upper side 24.
  • the base plate 22 is made, for example, of ceramic, plastic, silicon or metal, and in the case of a conductive base plate 22 the metallic coating 26 can either be omitted or is insulated from the base plate 22 by an intermediate layer.
  • the optical detector 16 is used to receive electromagnetic radiation supplied via an optical waveguide 30, it being necessary to position the optical detector 16 precisely relative to the optical waveguide 30.
  • the optical detector 16 is attached to the metallic coating 26 of the carrier 10 by means of a thermal fixing method, for example by soldering, such a soldering process involving locally limited heating of a receptacle for the optical detector 16 and, for example, the optical detector 16 Sub-area 32 of the first carrier 10 requires.
  • the partial area 32 is connected to the remaining areas 34 by, for example, four fingers 36a, 36b, 36c and 36d, which each lie between two mutually opposite openings 38a and 38b and 38b and 38c as well as 38c and 38d as well as 38d and 38a, which penetrate the first carrier 10 over its entire thickness, so that a cross-section arises in the area of each of the fingers 36, which is formed on the one hand by the Thickness D of the first carrier 10, either predetermined by the thickness of the base board 22 or by the Thickness of the base plate 22 plus the thickness of the metallic coating 26 and possibly further coatings, and is determined by the width B of the fingers 36, the width B preferably being at most twice the thickness D, preferably at most corresponding to the thickness D.
  • the thickness D of the carrier 10 is on the order of approximately 100 ⁇ m and the width B is in the range of approximately 10 ⁇ m to a few 100 ⁇ m.
  • Each of the fingers 36 is connected to the remaining area 34 of the carrier 10 by a first end 39a and holds the partial area 32 by a second end 39b.
  • the sub-area 32 is thus largely thermally decoupled from the other areas 34 of the first carrier 10, so that by locally heating the sub-area 32, for example by means of a laser or with another locally acting energy source, the optical detector 16 can be soldered on in a precise positioning without the subsequent thermal fixing of the other microcomponents 12, 14 and 18 detaching or affecting the fixing of the optical detector 16 on the first carrier 10 again.
  • the remaining microcomponents 12, 14 and 18 can be soldered on by conventional soldering methods and subsequently, in a special method, the optical detector 16 is separately and precisely positioned locally on the first carrier 10.
  • a further partial region 32 for receiving the optical transmitter 20 can be defined on the carrier 10, which also has to be positioned precisely relative to the carrier 10 in order to be able to couple the entire radiation generated by it into an optical waveguide 40.
  • Precision is 5 ⁇ m or less.
  • lenses 42 and 44 for example spherical lenses, are provided, which are held between a second carrier 50 and a third carrier 60, the first Carrier 10 and the second carrier 50 and the third carrier 60 form a carrier stack.
  • fingers 56a, 56b and 56c are provided on the second carrier, as shown in FIGS. 1 and 4 with reference to the fixing of the lens 42, which fingers are thereby released from a base plate 52 of the carrier 50 that on both sides of the fingers 56a, 56b or 56c openings 58a, 58b, 58c, 58d and 58e and 58f are provided, the fingers 56a, b, c passing in the area of a first end 59a into a remaining area 54 of the base board while they are are freely movable with a second end 59b relative to the remaining area 54 of the base board, for example with a maximum deflection of approximately
  • Such a configuration of the second circuit board 50 allows the lenses 42 and 44 to be spring-loaded in the direction of receptacles 64 provided for them on the third carrier 60, so that the receptacles 64 in the third carrier 60 enable the lenses 44 to be precisely positioned in the microfunction unit according to the invention is possible.
  • positional fixation described for lenses can also be used for connecting elements, for example solder balls, in order to precisely connect printed circuit boards.
  • the microfunction unit according to the invention also comprises a fourth carrier 70, which forms a further element of a carrier stack, comprising, for example, the first, second and third carrier, which is precise, for example by, relative to the first carrier 10, the second carrier 50 and the third carrier 60 Orientation pins, is positioned and which in turn is used for the precise positioning of the optical fibers 30 and 40.
  • a fourth carrier 70 which forms a further element of a carrier stack, comprising, for example, the first, second and third carrier, which is precise, for example by, relative to the first carrier 10, the second carrier 50 and the third carrier 60 Orientation pins, is positioned and which in turn is used for the precise positioning of the optical fibers 30 and 40.
  • the fourth carrier 70 is constructed from a base plate 72 which forms a receptacle 80 for the optical waveguide 30 in that it has an opening 82 penetrating it, which has laterally two V-shaped side walls 84 and 86 is limited, the V-shaped mutually extending side walls 84 and 86 opening in the direction of a further opening 78 adjoining the V-shaped opening 82.
  • a finger 76 which is free from other regions 74 of the carrier 70 and which lies between the partial openings 78a and 78b which form the opening 78 and merges with a first end 79a into the remaining region of the fourth carrier 70, while a second end 79b of the finger 76 is freely movable in the opening 78 and can thus be moved away in a spring-elastic manner relative to the V-shaped opening 82.
  • the light guide 30 If the light guide 30 is now inserted into the V-shaped opening 82, it lies against the side walls 84 and 86 and is positioned exactly relative to the fourth support 70, while the finger 76 with its resiliently movable second end 79b guides the light guide 30 in the direction of the side walls 84 and 86 of the V-shaped opening 82.
  • the finger 70 is arranged before the insertion of the optical waveguide 30 in such a way that the inserted optical waveguide 30 leads to an elastic deformation of the finger 76 away from the V-shaped opening 82, so that when the optical waveguide 30 is inserted, the finger always guides the optical waveguide 30 in Direction of the side walls 84 and 86 spring-loaded.
  • the type of positionally accurate fixing of the optical waveguide can also be used for positioning alignment pins for exact mechanical alignment of printed circuit boards, carriers or microcomponents or for fixing contact pins.
  • the second carrier 50 is also provided on the edge with fingers 96a and 96b, which are separated from the remaining area 94 of the second carrier 50 by openings 98a and 98b as well as 98b and 98c and each connect to the remaining area 94 with their first ends 99a and with their second ends 99b are resiliently movable relative to the remaining area 94.
  • the fingers 96a and 96b together form a receptacle for a contact pin designated as a whole as 100, which, with a front end region 102 lying on a receptacle 106 on the third carrier 60, can be inserted between the second carrier 50 and the third carrier 60, and thereby the fingers 96a and 96b moved in the direction away from the third carrier 60, so that the front end region 102 is acted upon by the two fingers 96a and 96b in the direction of the third carrier 60 and thus establishes a clamping connection for the contact pin 100.
  • either the carrier 50 is provided with a contact layer 104 in the region of its fingers 96a, specifically on its side facing the front end region 102, or the carrier 60 is with the region forming the receptacle 106 for the front end region 102 with the contact layer Mistake.
  • An electrical plug connection to the microfunction unit according to the invention can thus be produced in a simple manner.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Micromachines (AREA)

Abstract

L'invention concerne une unité microfonctionnelle produite selon la technique des microstructures à intégration hybride. Cette unité microfonctionnelle comprend des microcomposants utilisables dans la technique des microstructures et codéterminant la fonction de cette unité microfonctionnelle, ainsi qu'au moins un support présentant une partie plate et servant à recevoir les microcomposants. L'invention vise à permettre de positionner au moins quelques uns des microcomposants de manière exacte par rapport au support. A cet effet, un doigt est dégagé de la partie plate de chaque support par l'intermédiaire de deux passages opposés qui traversent la totalité du support. De plus, ce doigt sert d'élément de support pour les microcomposants.
EP01925530A 2000-04-05 2001-04-04 Positionnement micro-mecanique de composants optiques actifs et passifs Withdrawn EP1269235A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10016869 2000-04-05
DE10016869A DE10016869A1 (de) 2000-04-05 2000-04-05 Mikrofunktionseinheit
PCT/EP2001/003818 WO2001078480A2 (fr) 2000-04-05 2001-04-04 Unite microfonctionnelle

Publications (1)

Publication Number Publication Date
EP1269235A2 true EP1269235A2 (fr) 2003-01-02

Family

ID=7637634

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01925530A Withdrawn EP1269235A2 (fr) 2000-04-05 2001-04-04 Positionnement micro-mecanique de composants optiques actifs et passifs

Country Status (4)

Country Link
US (1) US7166806B2 (fr)
EP (1) EP1269235A2 (fr)
DE (1) DE10016869A1 (fr)
WO (1) WO2001078480A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10304977B4 (de) * 2003-02-07 2006-06-29 Protron Mikrotechnik Gmbh Vorrichtung zur Positionierung optischer Fasern, Verbinder mit derartiger Vorrichtung sowie optisches Kabel mit derartigen Verbinder
DE102007028292B4 (de) * 2007-06-20 2019-06-19 Snaptrack, Inc. Bauelement mit spannungsreduzierter Befestigung
US20100245765A1 (en) * 2008-10-28 2010-09-30 Dyer Holdings, Llc Video infrared ophthalmoscope
US20130225496A1 (en) 2010-11-01 2013-08-29 Novozymes Biopharma Dk A/S Albumin Variants
WO2013150089A1 (fr) 2012-04-04 2013-10-10 Tyco Electronics Raychem Bvba Dispositif d'alignement mécanique pour le positionnement de fibres optiques
CN109856898B (zh) * 2017-11-30 2021-12-31 中强光电股份有限公司 投影机、光机模块、影像分辨率增强装置及其驱动方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60107017A (ja) * 1983-11-16 1985-06-12 Hitachi Ltd 光偏向素子
US5097354A (en) * 1989-07-27 1992-03-17 Omron Corporation Beam scanner
US5259054A (en) 1992-01-10 1993-11-02 At&T Bell Laboratories Self-aligned optical subassembly
US5315411A (en) * 1993-01-04 1994-05-24 Eastman Kodak Company Dithering mechanism for a high resolution imaging system
DE4306268A1 (de) * 1993-03-01 1994-09-08 Ust Umweltsensortechnik Gmbh Gehäuse für Sensoren
US5673139A (en) * 1993-07-19 1997-09-30 Medcom, Inc. Microelectromechanical television scanning device and method for making the same
FR2726905B1 (fr) * 1994-11-10 1996-12-06 Commissariat Energie Atomique Dispositif de compensation des deformations d'une partie d'un systeme optomecanique ou micromecanique
JPH09196682A (ja) * 1996-01-19 1997-07-31 Matsushita Electric Ind Co Ltd 角速度センサと加速度センサ
WO1997046896A1 (fr) * 1996-06-07 1997-12-11 Nihon Shingo Kabushiki Kaisha Photodetecteur a axe variable
US6220694B1 (en) * 1997-07-15 2001-04-24 Silverbrook Research Pty Ltd. Pulsed magnetic field ink jet printing mechanism
US6201629B1 (en) * 1997-08-27 2001-03-13 Microoptical Corporation Torsional micro-mechanical mirror system
US6414823B1 (en) * 1999-06-09 2002-07-02 Seagate Technology Llc Coil-structures for magnetic microactuator
US6583031B2 (en) * 2001-07-25 2003-06-24 Onix Microsystems, Inc. Method of making a MEMS element having perpendicular portion formed from substrate
JP3775276B2 (ja) * 2001-10-24 2006-05-17 株式会社デンソー 静電アクチュエータ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0178480A3 *

Also Published As

Publication number Publication date
US7166806B2 (en) 2007-01-23
WO2001078480A2 (fr) 2001-10-18
DE10016869A1 (de) 2001-10-18
WO2001078480A3 (fr) 2002-04-11
US20030076664A1 (en) 2003-04-24

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