WO1999048346A1 - Equipement electronique - Google Patents

Equipement electronique Download PDF

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Publication number
WO1999048346A1
WO1999048346A1 PCT/JP1998/001157 JP9801157W WO9948346A1 WO 1999048346 A1 WO1999048346 A1 WO 1999048346A1 JP 9801157 W JP9801157 W JP 9801157W WO 9948346 A1 WO9948346 A1 WO 9948346A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling air
fins
fin
heat exchanger
heat
Prior art date
Application number
PCT/JP1998/001157
Other languages
English (en)
Japanese (ja)
Inventor
Yoshihiro Kondo
Yoshiaki Horita
Shigeo Ohashi
Tadakatsu Nakajima
Masayoshi Miyazaki
Junichi Taguri
Original Assignee
Hitachi, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi, Ltd. filed Critical Hitachi, Ltd.
Priority to PCT/JP1998/001157 priority Critical patent/WO1999048346A1/fr
Publication of WO1999048346A1 publication Critical patent/WO1999048346A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to cooling of electronic equipment such as a combi- ter. Background art
  • a semiconductor device that is a heat generating source may be equipped with a heat exchanger to release heat.
  • a heat exchanger to release heat.
  • a plate-fin type radiator as described in Japanese Patent Application Laid-Open No. Hei 6-1777289 (prior art 1), a bar-shaped base is used. This radiator has a pair of radiators on which a plurality of fins that have been integrally raised along the longitudinal direction are attached on the upper surface of the radiator.
  • the fins extend from the upstream side to the downstream side in parallel with the direction of the flow of the cooling wind. As a result, the heat dissipating area is enlarged by the fins, and the heat dissipating performance is improved.
  • the arrangement of the fins in the direction of the flow of the cooling air is described in Japanese Patent Application Laid-Open No. Hei 6-104845 (prior art 2).
  • a plurality of fins are installed on the base that is the base in parallel with the direction of the cooling air flow, and the fins are further moved in the same direction as the cooling air flow. Is divided into a plurality of stages to create a plurality of fin groups, and an interval is provided between the fin groups.
  • the generation of the heat transfer boundary layer generated in each fin due to the space between the fin cuts is interrupted, and the development of the heat transfer boundary layer is stopped. Of heat transfer This is to prevent the decrease.
  • the number of boards (hereinafter referred to as "boards") on which semiconductor elements are mounted has increased, and the types of boards or Depending on the mounting position, the board can be mounted horizontally or vertically. Therefore, it was difficult to cool all the boards with one-way cooling air from the blower. Therefore, in recent years, a chamber has been installed in a part of the housing, and the cooling air from the blower has been temporarily stored in the chamber, and the high-pressure cooling air has been used as one of the chambers. Cooling air is introduced into the various boards from the slits installed in the section, and a uniform amount of cooling air is introduced into each board.
  • the prior arts 1 and 2 take into account the heat release to the cooling target that is installed with the heating part biased downstream. Since it has not been used, any of the conventional technologies for computer cooling in recent years, which require a higher processing speed, is not suitable.
  • An object of the present invention is to provide an electronic apparatus suitable for cooling an electronic component in which a heat generating portion is biased to the downstream side of a cooling wind.
  • the present invention provides a first element mounted on a substrate, a second element having a larger heat generation than the first element, and a second element having a larger heat generation than the first element.
  • the first element is disposed downstream of the cooling air. It is a thing.
  • a first element mounted on the substrate, a second element having a larger heat generation than the first element, and a core mounted on one side of the substrate.
  • the first element is arranged closer to the connector than the second element.
  • the fin is cooled. This is to reduce the ventilation resistance on the downstream side of the wind rather than on the upstream side.
  • the above-mentioned fins are divided into a plurality of fins in a cooling air flow direction to form a plurality of fin groups, and a space is provided between the fin groups. is there .
  • the space between the fins on the upstream side of the cooling air is reduced, and the space on the downstream side is increased.
  • the connector on the board side which is provided on the board member inside the housing, it is electrically connected to the elements mounted on the board.
  • the electronic component is mounted on the plate member.
  • the cooling air flow path structure is such that the connector flows downstream of the cooling air that passes through the fins. It is.
  • FIG. 1 is a perspective view of a processor board and a heat exchanger according to the present invention.
  • FIG. 2 is a front view illustrating the inside of the processor board according to the present invention.
  • FIG. 3 is a perspective view of an electronic apparatus provided with the heat exchanger according to the present invention.
  • FIG. 4 is a perspective view of the processor board and the heat exchanger according to the present invention.
  • FIG. 5 is a perspective view of the processor board and the heat exchanger according to the present invention.
  • Fig. 6 is a heat exchanger according to the present invention, which is a comparative example of a fin with no space and a fin with space. It is a side view of the fin of FIG.
  • Fig. 7 is a graph illustrating the characteristics of the fins according to the present invention.
  • FIG. 1 is a perspective view of a processor board and a heat exchanger according to the present invention.
  • FIG. 2 is a front view illustrating the inside of the processor board according to the present invention.
  • FIG. 8 is a graph for explaining the characteristics of the fin according to the present invention.
  • FIG. 9 is a perspective view of a heat exchanger for explaining another embodiment of the present invention.
  • FIG. 10 is a perspective view of a heat exchanger illustrating another embodiment of the present invention.
  • FIG. 11 is a perspective view of a heat exchanger for explaining another embodiment of the present invention.
  • FIG. 12 is a perspective view of a heat exchanger illustrating another embodiment of the present invention.
  • FIG. 13 is a perspective view of a heat exchanger illustrating another embodiment of the present invention.
  • FIG. 14 is a perspective view of a heat exchanger for explaining another embodiment of the present invention.
  • FIG. 15 is a perspective view of a heat exchanger for explaining another embodiment of the present invention.
  • FIG. 15 is a perspective view of a heat exchanger for explaining another embodiment of the present invention.
  • FIG. 16 is a perspective view of a heat exchanger illustrating another embodiment of the present invention.
  • FIG. 17 is a perspective view of a heat exchanger for explaining another embodiment of the present invention.
  • FIG. 18 is a perspective view of a heat exchanger illustrating another embodiment of the present invention.
  • FIG. 1 is a perspective view showing a state in which a heat exchanger is mounted on a processor board.
  • FIG. 2 is a front view showing an arrangement of the electronic components mounted on the processor board.
  • FIG. 3 is a perspective view of an electronic device in which a processor board to which the heat exchanger of the present invention is attached is mounted on the electronic device.
  • FIG. 4 is a perspective view of a heat exchanger having fins parallel to the direction of the flow of the cooling air and continuous from the upstream side to the downstream side. Fig.
  • FIG. 5 is a perspective view of a heat exchanger in which a plurality of fins arranged in parallel with the direction of the cooling air are divided into a plurality of stages in the direction of travel.
  • FIG. 6 is a side view of the fin explaining the characteristics of the heat exchanger shown in FIGS. 4 and 5.
  • Figure 7 illustrates the relationship between the flow direction length of the cooling air and the pressure loss. It's a graph to show.
  • FIG. 8 is a graph illustrating the relationship between the amount of cooling air and the pressure loss.
  • 1 is a processor board. As will be described in detail later, the processor board 1 is mounted horizontally on an electronic device.
  • Reference numeral 2 denotes a heat exchanger having a plurality of fins 4 mounted on the surface of a base 3 (FIG. 1 shows a heat exchanger for convenience of explanation of the present invention).
  • FIG. 1 shows a heat exchanger for convenience of explanation of the present invention.
  • a connector 5 is provided on the processor board 1 and is connected to a blade 11 described later in detail via the connector 5.
  • the heat exchanger 3 has a plurality of corrugated fins 4 adhered to the base 3 with a sizing agent or the like.
  • the wavy fin 4 is provided with a plurality of cutouts 4b.
  • Reference numeral 6 denotes cooling air.
  • the cooling air 6 flows into the first-stage corrugated fin 4 on the upstream side of the heat exchanger J_, where heat is exchanged. A part of the cooling air 6 is discharged to the outside of the heat exchanger 1 from a space 4 a provided between the wavy fin 4 and the second-stage wavy fin 4. .
  • the second-stage wavy fin 4 and the third-stage wavy fin 4 are used.
  • a part of the cooling air 6 is discharged to the outside of the heat exchanger 1 from the space 4 a provided between the heat exchanger 1 and the space 4 a.
  • the width of the final wavy fin 4 that intersects directly with the cooling air 6 is about 1 Z3 of the width of the upstream wavy fin 4. Every time it is shortened.
  • the cooling air 6 is discharged to the outside of the heat exchanger 1 after passing through the wavy fin 4 at the final stage.
  • FIG. 1 is a processor board, and a connector 5 is attached to one end. 6 is a cooling wind.
  • the dotted lines show the electronic components mounted on the processor board 1, and 7 is the CPU serving as the arithmetic unit, which generates a high temperature. Electrical components such as resistors and capacitors are mounted around the CPU.
  • Reference numeral 8 denotes a cache memory (hereinafter, referred to as a memory) serving as a storage unit, and four of them are mounted on the anti-connector side.
  • This memory 8 exchanges data from CPU cards and the like.
  • the memory 8 has a relatively lower temperature than the CPU 7 which has a higher temperature. In order to bring the CPU 7 close to the connector 5 side in this way, the processing speed is increased by approaching the distance between the connector 5 and the CPU 7 as much as possible. It is up to you.
  • ⁇ 1 is an electronic device, and is included in the electronic device.
  • 1 is a processor board, which implements the CPU.
  • a plurality of the processor boards 1 are mounted.
  • 10 is a memory board group for storing data as needed, and 11 is an I / O package group for storing data externally.
  • Reference numeral 12 denotes a group of hard disk drives that record data and an operating system.
  • the front for operating the operator the front of the unit It has a strong disk drive.
  • a group of blowers 14 for blowing cooling air 6 for releasing heat from these mounted components to the outside air is mounted.
  • Reference numeral 15 denotes a power supply for supplying electricity to these boards or blowers.
  • 16 is a bratter that divides the processor board 1 group, the memory board group 10 and the I / O package 11 group into two. The board 16 supplies electricity to these board groups.
  • the cooling air 6 to each mounted object The directions cannot all be in the same direction.
  • a group of processor boards 1 are mounted horizontally, and a group of memory boards 10 are mounted vertically.
  • a guide plate 18 for filling the cooling air 6 is formed between the package and the side plate of the electronic device by the guide plate 18. .
  • the guide plate 18 is provided with a slit hole 19 corresponding to the shape and heat generation of each mounted object.
  • the pressure of the cooling air 8 in the chamber 17 increases, and the cooling air 6 only for the opening area of each slit hole 19 is supplied to each component.
  • the ventilation path of the cooling air 6 will be described.
  • the cooling air 6 sucked in by the blower 14 has a high pressure inside the chamber 17.
  • the cooling air 6 is supplied to each of the components from the slit holes 19 provided in the guide plate 18 at a ratio of the opening area thereof.
  • the heat exchanger 1 is mounted on the processor board 1 which is particularly high in temperature among the mounted components.
  • the cooling air 6 supplied to the processor board 1 is bent at a right angle by the blower 16 and discharged to the outside air from the blower 14 for discharging. It is.
  • the high-power processor In order to minimize electric loss, mode 1 is equipped with a DC / DC con- nection plug 16.
  • the characteristic of the implementation in the processor board 1 is the arithmetic unit and the recording unit 5 ', and the arithmetic unit performs the arithmetic operation between other processors at high speed.
  • the one mounted close to the platter 16 is processed at higher speed. In this case, the operation part becomes much hotter than the recording part.
  • the package; I1 the path of the cooling air 6 on the node disk drive 12 side will be explained.
  • the blower 14 located upstream of the node disk drive 12 allows cooling between the installed hard disk drive 1 and 2.
  • the cooling air 6 passes through the channel 17, and the cooling air 6 becomes a high pressure inside the channel 17 by the channel 17 formed by the guide plate 18.
  • a slit hole 14 (not shown) provided in the guide plate 18 (not shown).
  • the cooling air 6 is uniformly blown to the package 1 1 group, and is discharged to the outside air by the blower 14 (not shown) for discharging.
  • a plurality of fins 4 are mounted on the surface of the base 3 in the direction and direction of the flow of the cooling air 6.
  • the fin 4 is a single fin connected from the upstream side to the downstream side of the cooling air 6.
  • the highest temperature in the processor board 1 (not shown) is located at the downstream side of the cooling air 6. At the same time, it is mounted at a position close to the connector 5.
  • the cooling air 6 that has entered the space between the fins 4 from the upstream side exchanges heat with the upstream side of the fins 4 to cool not only the fins 4 but also the base 3. It is done. However, the cooling air 6 flows into the space between the fins 4 and has a draft resistance on the downstream side. The cooling air 7 will not proceed downstream. The heat on the downstream side is transferred to the upstream fin 4 and the base 3 cooled sufficiently by the fresh cooling air 6, and the downstream heat is transferred to the downstream side. The heat will be dissipated.
  • FIG. 5 the case where the heat exchanger shown in FIG. 5 is mounted on a processor board will be described. Since the processor board, the blitter, and the like are completely the same as those described in FIG. 1, the description thereof will be omitted.
  • a plurality of fins 4 are attached to the surface of the base 3 in parallel with the traveling direction of the cooling air 6. Since the fins 4 are separated in multiple directions in the same direction as the direction of the cooling air 7, a plurality of fin groups orthogonal to the cooling air 7 are formed. It is done. A space 4a is formed between each fin group.
  • a CPU (not shown) that becomes high heat is provided on the downstream side of the cooling air 6 and the connector 5. It is mounted close to.
  • the cooling air 6 flows into the first-stage fin group and exchanges heat.
  • the cooling air 6 that has passed through the first-stage fin group partially flows out of the space 4a provided between the first-stage and the second-stage.
  • the cooling air 6 flowing into the second-stage fin group exchanges heat, and a portion of the cooling air 6 from the space 4 a between the second- and third-stage fin groups.
  • the cooling air 6 flows out and flows into the third stage fin group, but as the cooling air gradually approaches the downstream side, the ventilation resistance on the downstream side increases and the cooling air The wind 6 cannot flow into the downstream fins.
  • the fins in the first stage exchange heat with fresh cooling air 7 as described in Fig.
  • FIGS. 6 and 4 the characteristics of the fins of the heat exchanger shown in FIGS. 6 and 4 will be described with reference to FIGS. 6, 7 and 8.
  • FIG. 6 the characteristics of the fins of the heat exchanger shown in FIGS. 6 and 4 will be described with reference to FIGS. 6, 7 and 8.
  • the flat plate fin 4 having no space 4a has a uniform resistance to the fluid because there is no portion that becomes a resistance to the flow direction of the cooling air 7
  • the fins 4 having the space 4 a have resistance to the flow direction of the cooling air 6, while the fin 4 having the space 4 a has a force of the space 4 a and the cooling air 6 is discharged. Therefore, the fluid resistance is reduced by the amount of the cooling air 6 reduced.
  • the details are described in FIG. 7.
  • the horizontal axis indicates the fin flow direction length, and the vertical axis indicates the pressure loss (note that the fin does not have the space 4a).
  • the cooling air flowing into the fin 4 having the space 4 and the space 4a has the same condition and the same cooling force).
  • the pressure loss increases, but in particular, the space 4 is not provided.
  • the pressure on the fin 4 increases as the flow of the cooling air 8 on the fin 16 increases, as shown by the dotted line. This is because the friction loss between the fins increases in proportion to the length of the fins through which the cooling air 8 flows.
  • the pressure loss characteristic of the fin 4 having the space 4a is as shown by the solid line, where the cooling air 7 escapes from the space 4a, and the fin 4 on the downstream side As the pressure increases, the pressure loss decreases, and the characteristic curve of the pressure loss decreases.
  • the cooling air flowing between the fins 4 is filled on the downstream side, and the pressure loss is increased.
  • a part of the cooling air 6 is pushed out from the space, so that the cooling air 6 is filled between the fins 4 on the downstream side. Without this, the pressure drop is reduced.
  • the horizontal axis shows the amount of cooling air
  • the vertical axis shows the pressure loss.
  • the characteristics 20 of the blower, the flow characteristics (shown by the dotted line) of the fine 4 having no space 4a, and the flow characteristics of the fine 4 having the space 4a The point at which the solid line (shown by a solid line) intersects the fan characteristics 20 is the operating point, and this operating point is the amount of cooling air.
  • the airflow when using the fan 4 is larger than the airflow when using the fan 4 without the space 4a.
  • the heat exchange with the fin 4 is repeated as much as the pressure loss occurs, and the cooling air 7 raises the temperature.
  • the heat on the downstream side where the high-heat CPU is located is transferred to the upstream fins 4 and base 3 which are sufficiently cooled by fresh cooling air 6.
  • the heat is transferred to the heat and is cooled.
  • a space 4a is provided to reduce the pressure loss on the downstream side and a large amount of air flows to the fins on the upstream side, the heat radiation effect of the CPU is less.
  • FIG. 9 is a modification of FIG.
  • a plurality of wavy fins 4 having cutting edges 4b are arranged in a plurality of rows so as to be orthogonal to the traveling direction of the cooling air 6, and a space 4 is provided between the fins 4 a was set, and the distance between the waves was gradually changed from small to large from upstream to downstream.
  • FIG. 10 is also a modified example of FIG. 1, in which the space 4a between the groups of fins 4 is significantly larger than some of the other spaces 4a.
  • FIG. 11 is also a modification of FIG.
  • FIG. 12 is a modification of FIG.
  • a plurality of flat fins 4 are provided in parallel with the direction of travel of the cooling air 6, and a plurality of spaces 4 a are provided in the same direction as the cooling air 7, so that the fan 4 is orthogonal to the cooling air 7.
  • the cooling fan 6 is installed, and the space between the fins 4 in the direction orthogonal to the cooling air 6 is gradually increased from small to large as the cooling air 6 travels. It is what you do.
  • Fig. 13 is also a modified example of Fig. 5; the width of the space 4a between the fin groups is significantly larger than the other spaces 4a, and the space downstream of the fins is larger. Infinity 4 has not been set.
  • FIG. 14 is also a modification of FIG.
  • FIG. 15 shows a fan formed by stacking flat fins 4 having cuts and raised portions 4b on a support column 4c so as to be inserted perpendicular to the cooling air 6. In this case, a plurality of pins are provided so as to be orthogonal to the cooling air 6. A space 4a is provided between the fin groups.
  • FIG. 16 is a modification of FIG. 15 in which the number of the fins 16 stacked from the upstream side to the downstream side is gradually reduced. .
  • Fig. 17 is also a modified example of Fig.
  • FIG. 18 is also a modification of FIG. 15, and the length of the fin 4 on the downstream side is much shorter than that of the other fins 4 and the fin 4 is further cut.
  • the amount of c is gradually reduced from the upstream force to the downstream side, and the most downstream fin 4 is not cut out and 4 c is not provided at all. .
  • Figure 1 shows a heat exchanger with fins 4 of various shapes. It has the same action and effect as explained in Section 2.
  • a heat exchanger is attached via a metal plate (hereinafter referred to as a base) to a processor board whose heating part is biased downstream of the cooling air, the upstream force will be reduced.
  • the cooling air exchanges heat with the upstream fins, but the ventilation resistance increases as going downstream, and the wind speed decreases.
  • the fins hardly contribute to the heat radiation of the downstream heating part.
  • the heat from the heat-generating section which is condensed from the heat-generating part, flows through the base and the upstream base and the fin through the base because the upstream side is cooled. The heat is transferred to the heat and is dissipated.
  • the cooling air that has cooled the first-stage fin group on the upstream side is cooled by the second-stage fin group.
  • a part of the cooling air is discharged from the space provided between the first and second stages.
  • heat exchange and discharge are repeated in the order of the third and fourth stages, but the ventilation resistance is maximized in the final stage, and heat exchange in the final stage is expected. Absent .
  • the downstream heat is transferred to the upstream via the base. The movement disperses the heat and causes the heat to be dissipated.
  • the distance between the fins is gradually increased, the length of the fin row is shortened, and the fin group
  • the space provided in the fins can be made longer in the direction of cooling air flow, and the percentage of slits provided in the fins can be gradually reduced.
  • the cooling air that has entered the upstream fins can proceed in the direction in which the ventilation resistance is low, so that the pressure loss in the cooling air flow direction is reduced. It can be done. Therefore, simply The pressure loss of the heat exchanger itself per unit air volume can be reduced. Considering the relationship between the air volume of the blower and the pressure loss due to the ventilation resistance, if the pressure loss is reduced among the characteristics of the blower, the cooling air volume will increase.
  • the amount of cooling air to be supplied increases, the amount of air to the heat exchanger on the upstream side also increases, and the amount of heat exchange on the upstream side where heat transfer is the best in the heat exchanger
  • the heat transfer performance of the heat exchanger itself can be improved to the utmost, and the cooling air reaches the downstream side as much as the air volume increases, so that the heat is efficiently generated by the heat exchanger. Cooling comes out.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention porte sur un équipement électronique utilisant un échangeur de chaleur et comprenant une base et une pluralité d'ailettes de rayonnement. Lorsque les ailettes de rayonnement sont disposées sur la base, la densité des ailettes permet une diminution progressive, du côté amont au côté aval, du flux d'air de refroidissement, ou bien une réduction ou une augmentation progressive, dans le même sens, de l'espace entre les rangées d'ailettes, ou une diminution progressive, dans le même sens, du nombre des parties saillantes ménagées sur les ailettes. Par ce système, la perte de pression par rapport au sens du flux d'air de refroidissement peut être réduite, de même que la perte de pression de l'échangeur de chaleur, par unité de volume d'air. Lorsqu'on adapte l'échangeur de chaleur à un dispositif soufflant, on peut utiliser l'augmentation maximale du volume fourni d'air de refroidissement au moyen d'un dispositif de commande de refroidissement. Par conséquent, le volume d'air dirigé vers un échangeur de c
PCT/JP1998/001157 1998-03-18 1998-03-18 Equipement electronique WO1999048346A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP1998/001157 WO1999048346A1 (fr) 1998-03-18 1998-03-18 Equipement electronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1998/001157 WO1999048346A1 (fr) 1998-03-18 1998-03-18 Equipement electronique

Publications (1)

Publication Number Publication Date
WO1999048346A1 true WO1999048346A1 (fr) 1999-09-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220192058A1 (en) * 2019-04-02 2022-06-16 Lg Innotek Co., Ltd. Converter

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57191088U (fr) * 1981-05-29 1982-12-03
JPS61129349U (fr) * 1985-02-01 1986-08-13
JPS6357792U (fr) * 1986-10-02 1988-04-18
JPH01113355U (fr) * 1988-01-25 1989-07-31

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57191088U (fr) * 1981-05-29 1982-12-03
JPS61129349U (fr) * 1985-02-01 1986-08-13
JPS6357792U (fr) * 1986-10-02 1988-04-18
JPH01113355U (fr) * 1988-01-25 1989-07-31

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220192058A1 (en) * 2019-04-02 2022-06-16 Lg Innotek Co., Ltd. Converter
US11937411B2 (en) * 2019-04-02 2024-03-19 Lg Innotek Co., Ltd. Converter

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