WO1999039502A1 - Microplaquette de detection d'image et dispositif de lecture d'image la comportant - Google Patents
Microplaquette de detection d'image et dispositif de lecture d'image la comportant Download PDFInfo
- Publication number
- WO1999039502A1 WO1999039502A1 PCT/JP1999/000373 JP9900373W WO9939502A1 WO 1999039502 A1 WO1999039502 A1 WO 1999039502A1 JP 9900373 W JP9900373 W JP 9900373W WO 9939502 A1 WO9939502 A1 WO 9939502A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- image sensor
- sensor chip
- image
- light receiving
- read pixels
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
- H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
- H04N1/03—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array
- H04N1/031—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/04—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa
- H04N1/19—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using multi-element arrays
Definitions
- the present invention relates to an image sensor chip used as a component of a dual image reading device, and a black image reading device including the same.
- Some image sensor chips have a structure in which the whole is formed in a slender shape in a certain direction, and a plurality of light receiving elements having a photoelectric conversion function are integrally formed on a surface portion thereof.
- Each of the light receiving elements has a light receiving surface for receiving light. When light is received on this light receiving surface, an image signal having an output level corresponding to the amount of received light can be output.
- the light receiving surface is a portion to be a reading pixel of the image sensor chip, and the light receiving surfaces are arranged in a row at a constant pitch in the longitudinal direction of the image sensor chip.
- the overall length of the image sensor chip is about several mm to several tens of mm, and it is not possible to read a wider document by using only one image sensor chip. For this reason, when the above-mentioned image sensor chips are actually used as components of an image reading device, a plurality of image sensor chips are arranged so as to be connected in a row.
- an image signal output from one light receiving element of one block is obtained.
- the image signals output from the eight light receiving elements of the block were corrected collectively.
- the number of light-receiving elements built into one image sensor chip that is, the number of read pixels, has traditionally been an integer multiple of 16, for example, 32, 64, 1 There were 2 8 pieces. With such a number, a plurality of light receiving elements built in one image sensor chip can be divided into a plurality of blocks each having eight pieces, so that the above-described image signal Good condition for level correction.
- the conventional image sensor chip has the following problems.
- the above-mentioned appropriate margin is required to have a relatively small size when the document width is small, but to have a relatively large size when the document width is large.
- the original tends to be less likely to be misaligned in the main scanning direction (the column direction of the read pixels). This is because there is a tendency that the position tends to be largely displaced in the direction.
- Another example of a conventional image sensor chip has a total length of 8 mm, a resolution of 8 dots Zmm, and the number of read pixels is 64.
- the specifications were as shown in Table 2 below.
- An object of the present invention is to provide an image sensor chip that can solve or reduce the above-mentioned problems.
- Another object of the present invention is to provide an image reading device provided with such an image sensor chip.
- an image sensor chip includes a plurality of light receiving elements having a photoelectric conversion function, and the light receiving surface of each of the plurality of light receiving elements is a plurality of read pixels.
- An image sensor chip arranged in a row at a constant pitch on the chip surface.
- p is the A minimum difference determined reading width, characterized in that it is converted values to the reference unit the unit length.
- the semiconductor chip is formed as a semiconductor chip having a rectangular shape elongated in a certain direction in a plan view and having the light receiving elements arranged in the certain direction.
- a circuit for operating each of the light receiving elements is built therein.
- n 8
- 7 is 11.8 dots / mm
- the number N of read pixels is set to 152.
- n 8 8 dot mm
- N of read pixels is 104.
- an image reading device includes a plurality of light receiving elements having a photoelectric conversion function, and A plurality of image sensor chips in which each light receiving surface of the plurality of light receiving elements is a plurality of read pixels, and the plurality of read pixels are arranged in a row at a constant pitch on the chip surface; A substrate on which a plurality of image sensor chips are arranged in a row, a light source for irradiating light to a reading line area of a document image, and a plurality of lights emitted from the light source and reflected from the surface of the document.
- the number of image signals in one block k is the smallest integer that satisfies the condition 0 ⁇ (n * k-7p) ⁇ n, and 7 is the reading per unit length. This is the resolution as the number of pixels, and p is the minimum difference between a plurality of required reading widths, and is characterized in that it is a value converted so that the unit length is used as a reference unit.
- the reading width to be set is an integer multiple of p. If any of the above-mentioned required reading widths is set, the minimum required number of image sensor chips is used, and there is a margin of the actual reading width of the image sensor chip with respect to the reading width to be set. Therefore, the ratio can be kept constant.
- the margin of the image sensor chip can be reduced to a small size when the width of the document is small, while the margin of the image sensor chip is increased to a size when the width of the document is large. It becomes possible. Therefore, according to the present invention, unlike the related art, when a plurality of image sensor chips are arranged in a line so as to cope with a desired reading width, the number and length of the image sensor chips are increased. Waste can be prevented, and costs can be reduced, and the size of the image reading device using the image sensor chip can be reduced. Also, the margin of reading width of the image sensor chip Since the margin can be made appropriate, it is possible to minimize the difficulty in reading the original image due to the positional deviation of the original.
- the level correction of the image signal is A plurality of image signals output from one image sensor chip can be divided into a plurality of blocks so as not to generate odd parts. Therefore, in the present invention, even when a plurality of image sensor chips are used side by side, for example, a plurality of image signals separately output from the respective light receiving elements of the two image sensor chips are collectively corrected. You don't have to. Therefore, there is no disadvantage in performing the level correction of the image signal as compared with the related art.
- FIG. 1 is a plan view showing an example of an image sensor chip to which the present invention is applied.
- FIG. 2 is a circuit block diagram showing an example of a schematic circuit configuration of the image sensor chip shown in FIG.
- FIG. 3 is a schematic plan view showing a state where the image sensor chip shown in FIG. 1 is mounted on a circuit board.
- FIG. 4 is a schematic cross-sectional view showing an example of an image reading device configured using the image sensor chip shown in FIG.
- the image sensor chip A shown in FIG. 1 is a semiconductor chip formed in a rectangular shape whose overall shape in a plan view is elongated in a certain direction.
- N On a thin substrate 1 made of silicon, N
- the light receiving element 2 and the circuit for operating the light receiving element 2 are integrally formed.
- Each light receiving element 2 is configured using a phototransistor having a photoelectric conversion function, and has a substantially rectangular shape in plan view. It has a light receiving surface 20.
- the light receiving surfaces 20 correspond to the pixels to be read, and are arranged in a row at a constant pitch L in the direction over the substantially entire length region of the substrate 1 in the longitudinal direction.
- the surface of the image sensor chip A is covered with an insulating protective film (not shown).
- this protective film is provided with a plurality of opening windows of substantially the same size and the same arrangement as each light receiving surface 20, and each light receiving surface 20 receives light through these opening windows. I have. On the surface of the protective film, a plurality of pad portions 3 for electrically connecting a circuit built in the image sensor chip A to the outside are also provided.
- the image sensor chip A includes N phototransistors Tr constituting the light receiving elements 2, FETs connected to the emitter side of these phototransistors Tr, amplifiers OP and N for amplifying the current flowing from the FETs. It has a bit shift register 19, pad VDD, pad GND, pad AO, pad SI, pad CLK, and pad S ⁇ . These pads are distributed to a plurality of pad sections 3, and a power supply voltage of, for example, 5 V is supplied to the pad VDD.
- the pad GND is connected to the ground line.
- an 8 MHz clock signal is input to the pad CLK.
- a serial signal is input to the pad SI.
- An analog image signal corresponding to the amount of light received by the phototransistor Tr is output serially from the pad AO.
- a serial out signal is output from the pad SO.
- the shift register 19 sequentially turns on the N FETs. Then, the charges stored in the N phototransistors Tr are sequentially discharged in a certain order, amplified by the amplifier OP, and serially output to the pad AO.
- an image signal is output from the Nth last phototransistor by the operation of the shift register 19, a serial art signal is output to the pad SO.
- the image sensor chip A is configured to repeatedly execute such a series of operations.
- n is the number of image signals regarded as one block when a plurality of image signals output from each of the plurality of light receiving elements 2 are collectively subjected to level correction in units of blocks.
- the value of n is, for example, "8" as in the past.
- k is the smallest integer that satisfies the condition 0 (n ⁇ k-r ⁇ P) n.
- p is the minimum difference between the required read widths. More specifically, the minimum difference p is a value determined according to the customer's request and the type of the image reading device manufactured by the image reading device manufacturer.
- the multiple required reading widths S to be set using the image sensor chip A are 25.4 mm (1 inch), 50.8 mm (2 inch), 76.2 mm (3 inch)-203.2 mm (8 inch), 215.9 mm (8.5 inch), 254 mm (10 inch), the minimum difference ⁇ is 12.7 mm (1 / 2 inch).
- this minimum difference P is a value converted to an inch base so that the unit length (1 inch) used for the resolution 7 is used as a reference unit, and a specific numerical value is, for example, 1/2 inch. It is said.
- a plurality of image sensor chips A are prepared, they are arranged and mounted on the surface of the circuit board 4 so as to be connected in a row.
- a wiring pattern (not shown) for making electrical connection with the pad portions 3 of the plurality of image sensor chips A is formed, and the pads of the plurality of image sensor chips A are formed.
- the part 3 is conductively connected to the wiring pattern of the circuit board 4 via, for example, a gold wire so that the plurality of image sensor chips A are electrically connected to each other in series (not shown).
- the number of the image sensor chips A mounted on the circuit board 4 is arbitrarily selected according to the reading width required by the image reading device to be incorporated. Specifically, the specifications are as shown in Table 3. Table 3
- the required reading width S is, for example, 25.4 mm (1 inch)
- two image sensor chips A may be used.
- the total length La of the image sensor chips A is about 25.75 mm
- the margin Lb of the total length La of the image sensor chips with respect to the required reading width S is about 0.35 mm.
- the margin R at that time is about 1.37%.
- the required reading width S increases by 50.8 mm, 76.2 mm and 25.4 mm C l inch
- the margin Lb of the image sensor chip A with respect to the required reading width S gradually increases.
- the margin R remains about 1.37%, as in the case where the required reading width S is 25.4 mm.
- the required reading width S is, for example, 2 15.9 mm
- the required reading width S is 12.7 mm.
- the margin R can always be kept constant. Therefore, it is possible to prevent the use number of the image sensor chips A from being wasted. Also, if the margin ratio R is constant, if the required reading width S is small, the value of the margin Lb can be reduced, so that waste occurring in the reading area of the image sensor chip A is reduced. It can be further reduced. On the other hand, when the required reading width S is large, the value of the margin Lb can be increased. Reading can be performed appropriately.
- the margin of the image sensor chip is provided.
- the ratio R of Lb can be fixed at about 2.36%. Therefore, when the required reading width S is small, the margin Lb can be reduced, and as the required reading width S increases, the margin Lb can be gradually increased.
- the basic configuration of the image reading apparatus B shown in FIG. 4 is the same as that of a conventionally known apparatus. That is, in the image reading apparatus B, the transparent plate 51 is mounted on the upper surface of the case 50, and a predetermined linear area on the surface of the transparent plate 51 is set as the image reading area 52. At a position facing the image reading area 52, a platen roller 6 for transferring the original 59 in the sub-scanning direction is provided.
- a light source 53 using, for example, an LED for irradiating light to the image reading area 52 is provided, and directly below the image reading area 52.
- a focusing lens 54 is provided.
- the lens 54 for example, a lens in which a plurality of self-occurring lenses that form an image of an original at the same magnification as an erect image is used.
- the circuit board 4 on which a plurality of image sensor chips A are protruded is mounted on the bottom of the case 50, and the plurality of image sensor chips A are arranged immediately below the lens 54.
- the image reading device B when the light emitted from the light source 53 reaches the image reading area 52 and irradiates the surface of the original 59, the reflected light is condensed by the condenser lens 54 into a plurality of light beams. It is focused on each light receiving surface 20 of the image sensor chip A. Then, from the plurality of image sensor chips A, an image signal of an output level corresponding to the amount of light received on each light receiving surface 20 is serially output.
- the above-described image sensor chip A is used as the image sensor chip used in the image reading device B, useless use of the image sensor chip A is avoided as described above. For this reason, the length of the circuit board 4 can be reduced, and the size of other parts such as the lens 54 and the case 50 can be reduced. As a result, the size of the image reading device B can be reduced, and its manufacturing cost can be reduced.
- a plurality of image signals output from the plurality of image sensor chips A are collectively subjected to level correction for each of eight image signals, and their output levels are adjusted.
- the number N of read pixels of each image sensor chip A is, for example, 152 or 104, and these numbers are multiples of eight. Therefore, the level correction of the image signal can be appropriately performed for each image sensor chip A. More specifically, when the number N of read pixels is 152, the 152 image signals output from one image sensor chip A can be divided into 19 blocks. This eliminates the need to perform the correction process over two image sensor chips A.
- n and p can be different from the above-mentioned values, and these can be variously selected.
- the value of the resolution 7 "and the minimum difference P between a plurality of required reading widths to an inch-based value. mm, 150 mm, and 200 mm, and in the case of 50 mm intervals, the length of this 50 mm is the unit of resolution 7 and the minimum difference p between multiple required reading widths.
- the number of pixels to be read per 50 mm is used as the numerical value of the resolution, and if the minimum difference p between the plurality of required reading widths is 50 mm, this minimum difference ⁇ The value may be converted to 1.
- the number of read pixels per image sensor chip was an integral multiple of 16, so the number of read pixels N in the present invention is 16 Value excluding multiples of.
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Facsimile Heads (AREA)
- Facsimile Scanning Arrangements (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Image Input (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99901906A EP1091558A4 (en) | 1998-01-30 | 1999-01-28 | IMAGE DETECTION MICROPLATE AND IMAGE READING DEVICE COMPRISING SAME |
US09/402,701 US6486979B1 (en) | 1998-01-30 | 1999-01-28 | Image sensor chip and image reading device provided with it |
CA002285341A CA2285341C (en) | 1998-01-30 | 1999-01-28 | Image sensor chip and image reading apparatus incorporating the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP01904698A JP3771368B2 (ja) | 1998-01-30 | 1998-01-30 | イメージセンサチップの配置方法およびこの配置方法を用いた画像読み取り装置 |
JP10/19046 | 1998-01-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1999039502A1 true WO1999039502A1 (fr) | 1999-08-05 |
Family
ID=11988489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1999/000373 WO1999039502A1 (fr) | 1998-01-30 | 1999-01-28 | Microplaquette de detection d'image et dispositif de lecture d'image la comportant |
Country Status (7)
Country | Link |
---|---|
US (1) | US6486979B1 (ja) |
EP (1) | EP1091558A4 (ja) |
JP (1) | JP3771368B2 (ja) |
CN (1) | CN1158844C (ja) |
CA (1) | CA2285341C (ja) |
TW (1) | TW411717B (ja) |
WO (1) | WO1999039502A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003143381A (ja) * | 2001-08-22 | 2003-05-16 | Canon Inc | 画像処理装置 |
JP3829853B2 (ja) * | 2004-03-31 | 2006-10-04 | 三菱電機株式会社 | イメージセンサ |
JP5587392B2 (ja) * | 2011-12-22 | 2014-09-10 | キヤノン・コンポーネンツ株式会社 | イメージセンサユニット、画像読取装置および画像形成装置 |
WO2019037022A1 (zh) * | 2017-08-24 | 2019-02-28 | 深圳市大疆创新科技有限公司 | 图像处理方法、设备及无人机 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63250963A (ja) * | 1987-04-08 | 1988-10-18 | Mitsubishi Electric Corp | マルチチツプインライン形イメ−ジセンサ |
JPH0483462A (ja) * | 1990-07-26 | 1992-03-17 | Seiko Instr Inc | 密着型イメージセンサ |
JPH05292256A (ja) * | 1992-04-08 | 1993-11-05 | Fuji Xerox Co Ltd | 長尺イメージセンサ |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6411467A (en) * | 1987-07-03 | 1989-01-17 | Minolta Camera Kk | Image input device |
US5031032A (en) * | 1990-03-30 | 1991-07-09 | Xerox Corporation | Color array for use in fabricating full width arrays |
US5315412A (en) * | 1990-04-06 | 1994-05-24 | Canon Kabushiki Kaisha | Multi-chip color image sensor with light-receiving windows arranged to provide sensor output signals corresponding to the gap between adjacent sensors |
US5650864A (en) * | 1996-04-08 | 1997-07-22 | Scanvision | Full color single-sensor-array contact image sensor (CIS) using advanced signal processing techniques |
US6195183B1 (en) * | 1997-07-15 | 2001-02-27 | Rohm Co., Ltd. | Image reading apparatus and image sensor chip thererfor |
US6133565A (en) * | 1997-08-12 | 2000-10-17 | Rohm Co., Ltd. | Image reading apparatus |
US6025935A (en) * | 1997-12-31 | 2000-02-15 | Peripheral Imaging Corporation | Charge storage image scanner having equalizing pre-charge and reset improvements |
US6266438B1 (en) * | 1998-09-28 | 2001-07-24 | Xerox Corporation | Architecture for color space transformation to compensate for relative chip-to-chip spectral variations on a butted full-width array sensor bar |
US6381378B1 (en) * | 1999-05-28 | 2002-04-30 | Peripheral Imaging Corporation | Dynamic thresholding module |
-
1998
- 1998-01-30 JP JP01904698A patent/JP3771368B2/ja not_active Expired - Fee Related
-
1999
- 1999-01-28 WO PCT/JP1999/000373 patent/WO1999039502A1/ja active Application Filing
- 1999-01-28 EP EP99901906A patent/EP1091558A4/en not_active Withdrawn
- 1999-01-28 US US09/402,701 patent/US6486979B1/en not_active Expired - Lifetime
- 1999-01-28 CN CNB998000949A patent/CN1158844C/zh not_active Expired - Fee Related
- 1999-01-28 CA CA002285341A patent/CA2285341C/en not_active Expired - Fee Related
- 1999-01-29 TW TW088101360A patent/TW411717B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63250963A (ja) * | 1987-04-08 | 1988-10-18 | Mitsubishi Electric Corp | マルチチツプインライン形イメ−ジセンサ |
JPH0483462A (ja) * | 1990-07-26 | 1992-03-17 | Seiko Instr Inc | 密着型イメージセンサ |
JPH05292256A (ja) * | 1992-04-08 | 1993-11-05 | Fuji Xerox Co Ltd | 長尺イメージセンサ |
Also Published As
Publication number | Publication date |
---|---|
EP1091558A1 (en) | 2001-04-11 |
CA2285341A1 (en) | 1999-08-05 |
JPH11220571A (ja) | 1999-08-10 |
JP3771368B2 (ja) | 2006-04-26 |
CA2285341C (en) | 2001-11-13 |
CN1158844C (zh) | 2004-07-21 |
EP1091558A4 (en) | 2003-01-15 |
US6486979B1 (en) | 2002-11-26 |
TW411717B (en) | 2000-11-11 |
CN1256042A (zh) | 2000-06-07 |
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