WO1999021130A1 - Procede et dispositif pour produire des cartes a puces, des cartes d'identification ou similaires, comportant des sections superficielles saillantes - Google Patents

Procede et dispositif pour produire des cartes a puces, des cartes d'identification ou similaires, comportant des sections superficielles saillantes Download PDF

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Publication number
WO1999021130A1
WO1999021130A1 PCT/EP1998/006402 EP9806402W WO9921130A1 WO 1999021130 A1 WO1999021130 A1 WO 1999021130A1 EP 9806402 W EP9806402 W EP 9806402W WO 9921130 A1 WO9921130 A1 WO 9921130A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
card body
card
layer
cover layer
Prior art date
Application number
PCT/EP1998/006402
Other languages
German (de)
English (en)
Inventor
Tomas Meinen
Original Assignee
Meinen, Ziegel & Co. Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19752190A external-priority patent/DE19752190C1/de
Application filed by Meinen, Ziegel & Co. Gmbh filed Critical Meinen, Ziegel & Co. Gmbh
Priority to AU96300/98A priority Critical patent/AU9630098A/en
Publication of WO1999021130A1 publication Critical patent/WO1999021130A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a method for producing chip cards, ID cards or the like having raised surface sections according to the preamble of patent claim 1 and a device for carrying out the method.
  • ID cards 'particularly those which additive elements such as magnetic strips, photographs, or the like, are usually provided on at least one face with one or more cover layers which may are also be printed.
  • the production usually takes place by lamination, that is to say a thermal process in which stacks of cards (or card sheets) lying one above the other are produced.
  • additional elements such as magnetic strips, photographs or the like are laminated in, undesired height differences or irregularities in the outer contour can occur, so that difficulties in printing are the result.
  • the height structure or contour of the surface or the cover layer is not specified by the card body, but by a shaped surface which can be both planar (with high accuracy) and can be provided with a predetermined relief.
  • the adhesive is preferably applied or spread onto the card body by means of a squeegee, so that an essentially flat surface is produced. This is preferably done using a stencil printing or screen printing method.
  • the cover film is applied to the surface of the adhesive or the card before being fixed on the molding surface.
  • the plasticity of the adhesive is increased at least temporarily during or after the cover film is fixed on the molding surface, so that the adhesive flows and can therefore compensate for differences in height more easily.
  • the contour of the surface or the cover layer is not determined by the card body, but by a Predefined form surface, which is predominantly planar and also has recesses which correspond to the elevations to be formed quasi as a negative shape.
  • the recesses expediently have the shape of bores. These bores, which in particular have a very small diameter, serve to maintain raised structures, for example to identify essential properties of the chip cards in Braille or Braille.
  • the bores can have a diameter that corresponds to the typical size of a foil or so-called snap frog contact or switch.
  • a vacuum is created which serves on the one hand to expel air inclusions or gases which form when the adhesive sets and on the other hand draws the cover film or cover layer specifically to the recesses or bores via a further vacuum, so that the desired raised structures result with an otherwise remaining flat surface.
  • the vacuum surrounding the card body, including the adhesive and the cover film, is maintained at least until there is sufficient curing of the adhesive.
  • the adhesive is preferably applied or coated on the card body by means of a doctor blade, so that an essentially flat surface is produced.
  • the application is preferably carried out by means of a stencil or screen printing process.
  • the cover film is applied to the surface of the adhesive or the card before it comes into contact with the molding surface. It is also conceivable to first fix the cover film, for example electrostatically, to the molding surface and then to transfer it to the surface of the adhesive with the molding surface, which acts as a handling tool, and to apply it there.
  • a receiving plate for the card body is provided which interacts with a lowerable laminating die. The space remaining between the lowerable laminating die and the receiving plate for the card body can be evacuated, for which purpose a circumferential elastic seal is expediently provided.
  • the underside of the lowerable laminating stamp receives the cover film, which later forms the cover layer of the card body.
  • this cover film can be fixed electrostatically or by means of a separate vacuum supply to the lowerable lamination temp.
  • the vacuum in the above-mentioned space is maintained during the actual coating process and until the adhesive has hardened significantly, so that air pockets or gases which form during the hardening of the adhesive can be removed from the laminate or the sandwich structure obtained.
  • the lowerable lamination stamp acts as a molding surface for the cover film or cover layer. Because the cover layer is held on its surface facing away from the card body on the molded surface during the curing of the adhesive, the outer contour of the cover film and thus the outer contour of the finished card correspond to the contour of the molded surface, so that in combination with vacuum lamination desired optimal surface quality of the map and the formation of micro to macro surveys can be achieved on it.
  • the cover film is applied to the adhesive layer after the adhesive layer has been applied, the latter being in a not yet cured or plastic and / or flowable state, this already taking place under the action of vacuum can to avoid air pockets between the cover film and adhesive. Then, with the lowering of the laminating stamp, the cover film is pressed with its later visible side onto the surface of the stamp, for example by means of vacuum or electrostatically. When the adhesive hardens, the desired sandwich or laminate structure consisting of cover film, adhesive and card body is obtained, the cover film adopting the predetermined surface structure of the laminating stamp. Desired further contours of the cover layer are formed in that the shaped surface has the shape of a relief or the like, for example to form an identification or security feature.
  • the recesses and / or bores in the molding surface are connected to a pressure generating device, so that a pressure differentiated with respect to the environment or the ambient vacuum can be generated.
  • the height of the elevations to be trained can be controlled within predetermined limits via this differential pressure.
  • a cold-curable adhesive in particular an epoxy resin adhesive, is preferably used.
  • the adhesive is provided with a filler, which in turn reduces signs of shrinkage during curing.
  • 1 is a schematic plan view of a section of a sheet for the production of chip, ID cards or the like,
  • FIG. 3 shows a representation similar to that of FIG. 2 when the adhesive is spread
  • 4 shows a representation corresponding to that of FIG. 2 when a covering layer is applied
  • Fig. 5 is an illustration corresponding to that of FIG. 2 during the curing of the adhesive
  • FIG. 6 shows a schematic diagram of the device for vacuum lamination degassing.
  • a sheet 10 of card material which comprises a card body layer 11 and a magnetic strip 12 firmly connected thereto.
  • the card body layer 11 can of course consist of several interconnected layers.
  • Map outlines 13 are shown on the sheet 10 shown in FIG. 1, which are intended to illustrate that a large number of cards can be produced from one sheet.
  • a sheet 10 as shown in FIGS. 1 and 2 is now - as shown in FIG. 3 - provided with a continuous layer of an adhesive 14 which is spread with a doctor blade 15.
  • the application of the adhesive can preferably be carried out by means of a stencil printing process, so that the surface IG of the adhesive 14 is essentially flat.
  • a cover film 17 is rolled onto the surface 16 of the still soft and thus plastically deformable adhesive 14 so that air pockets are largely avoided.
  • the overall arrangement that is to say the card body layer 11 with magnetic strip 12, adhesive 14 and applied cover film 17, is fed by means of a carrier 18 to a molding surface 19 which Devices (eg suction devices, electrostatically chargeable surface areas or the like) in order to fix the cover film 17.
  • Devices eg suction devices, electrostatically chargeable surface areas or the like
  • the top surface 17 now remains fixed and held in the intended shape, that is to say with a flat surface or a predetermined relief, until the adhesive 14 has hardened.
  • height differences and internal tensions are compensated, which can occur, for example, due to shrinkage processes during the curing process.
  • Recesses 26 are connected via channels 27 to a pressure generating device, not shown, so that the cover film 17 can be moved into the recesses 26 and held there until the adhesive 14 has hardened.
  • a pressure generating device not shown
  • a film contact with a raised contact surface or so-called cracked frog contact can be produced with a recess of corresponding size and the use of a cover sheet material which is elastic per se.
  • the cover layer 17 is fixed by the molded surface 19, regardless of the surface structure of the card body layer 11 with magnetic strips 12 or the like, it is possible to ensure the desired card surfaces in a simple manner.
  • the overall arrangement, as shown in FIG. 6, is in a vacuum, as a result of which remaining air pockets and gases which can arise when the adhesive cures can be removed.
  • 6 shows a receiving plate 20 (carrier 18) which receives the card body layer 11 with magnetic strips 12 and adhesive 14.
  • the cover surface 17 can already be placed on the adhesive layer 14 or can be moved towards the adhesive layer with a laminating stamp 21.
  • the lowerable lamination stamp 21, the surface of which facing the card body forms the shaped surface 19, is located opposite the receiving plate 20.
  • the lowerable laminating die 21 and the receiving plate 20 are provided with a circumferential elastic seal 22 to maintain the vacuum, as indicated in the illustration according to FIG. 6.
  • the intermediate space 24 can be evacuated in connection with a suction opening 23.
  • suction openings 25; 28 is provided in the lowerable laminating die 21 in order to fix the cover film or cover surface 17 or to provide a differential pressure based on the vacuum in the space 24 for forming the elevations.
  • the cover film 17 is held, for example by means of vacuum, supplied through the suction opening 25 on the surface of the lowerable laminating stamp 21, after which the laminating stamp 21 with the cover film 17 is lowered in the direction of the card body 11 .
  • means are provided to heat the card body 11 and the adhesive layer 14, or at least the adhesive layer 14, so that it changes into a plastic state.
  • the lamination stamp is lowered afterwards the intermediate space 24 was at least partially evacuated, so that air pockets between the cover sheet 17 and the adhesive layer 14 can be reliably avoided.
  • the cards can be punched out along the outline 13 (see FIG. 1).
  • the cards can be punched out along the outline 13 (see FIG. 1).
  • small devices e.g. access authorization cards, membership cards for smaller clubs, etc.
  • the order of the steps is less important than the fact that the fixed top surface 17, which is predetermined in its contour or surface structure, is connected to the rest of the card body via a flowable adhesive layer 14 and so on is kept in the fixed state until the adhesive has essentially lost its fluidity or plasticity.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Selon l'invention, pour produire des cartes d'identification, il est prévu de pourvoir dans sa totalité la surface d'une carte d'identification à munir d'une couche de protection, d'une couche d'adhésif, d'appliquer la couche de protection sur la couche d'adhésif à l'état encore non durci ou non plastique ou coulant. Il est ensuite prévu de maintenir la couche de protection sur sa face opposée au corps de la carte, fixée sous vide sur une surface de moulage comportant des cavités ou des trous, pendant le durcissement de l'adhésif, le temps nécessaire et de manière que le contour extérieur du film de protection et par conséquent le contour extérieur de la carte d'identification finie, correspondent au contour de la surface de moulage, que la formation de bulles d'air puisse être évitée et que des gaz puissent être expulsés. Dans la zone des cavités pratiquées dans la surface de moulage, la couche de protection ou le film de protection est déformé(e) sous l'effet du vide, de manière à créer les surélévations voulues sur la carte terminée.
PCT/EP1998/006402 1997-10-22 1998-10-08 Procede et dispositif pour produire des cartes a puces, des cartes d'identification ou similaires, comportant des sections superficielles saillantes WO1999021130A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU96300/98A AU9630098A (en) 1997-10-22 1998-10-08 Method and device for producing chip cards, id cards and similar which have raised surface segments

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19746638.9 1997-10-22
DE19746638 1997-10-22
DE19752190A DE19752190C1 (de) 1997-10-22 1997-11-25 Verfahren zum Herstellen von erhabene Oberflächenabschnitte aufweisenden Chipkarten, ID-Karten oder dergleichen Informationsträgern
DE19752190.8 1997-11-25

Publications (1)

Publication Number Publication Date
WO1999021130A1 true WO1999021130A1 (fr) 1999-04-29

Family

ID=26041010

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1998/006402 WO1999021130A1 (fr) 1997-10-22 1998-10-08 Procede et dispositif pour produire des cartes a puces, des cartes d'identification ou similaires, comportant des sections superficielles saillantes

Country Status (2)

Country Link
AU (1) AU9630098A (fr)
WO (1) WO1999021130A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0587011A1 (fr) * 1992-08-31 1994-03-16 Sony Chemicals Corporation Carte de mémorisation et procédé pour la fabriquer
GB2279610A (en) * 1993-07-02 1995-01-11 Gec Avery Ltd A method of manufacturing a laminated integrated circuit or smart card.
WO1996031841A1 (fr) * 1995-04-05 1996-10-10 Tomas Meinen Procede et dispositif permettant de remplir des cavites
WO1998018623A1 (fr) * 1996-10-31 1998-05-07 Tomas Meinen Procede et dispositif pour produire des cartes a puce, des cartes d'identification ou similaires

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0587011A1 (fr) * 1992-08-31 1994-03-16 Sony Chemicals Corporation Carte de mémorisation et procédé pour la fabriquer
GB2279610A (en) * 1993-07-02 1995-01-11 Gec Avery Ltd A method of manufacturing a laminated integrated circuit or smart card.
WO1996031841A1 (fr) * 1995-04-05 1996-10-10 Tomas Meinen Procede et dispositif permettant de remplir des cavites
WO1998018623A1 (fr) * 1996-10-31 1998-05-07 Tomas Meinen Procede et dispositif pour produire des cartes a puce, des cartes d'identification ou similaires

Also Published As

Publication number Publication date
AU9630098A (en) 1999-05-10

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