WO1998009252A1 - Procede pour la fabrication de cartes a puce - Google Patents

Procede pour la fabrication de cartes a puce Download PDF

Info

Publication number
WO1998009252A1
WO1998009252A1 PCT/EP1997/004645 EP9704645W WO9809252A1 WO 1998009252 A1 WO1998009252 A1 WO 1998009252A1 EP 9704645 W EP9704645 W EP 9704645W WO 9809252 A1 WO9809252 A1 WO 9809252A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
card body
cover
cover film
card
Prior art date
Application number
PCT/EP1997/004645
Other languages
German (de)
English (en)
Inventor
Tomas Meinen
Original Assignee
Tomas Meinen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE1996145071 external-priority patent/DE19645071C2/de
Application filed by Tomas Meinen filed Critical Tomas Meinen
Publication of WO1998009252A1 publication Critical patent/WO1998009252A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Definitions

  • the invention relates to a method for the production of chip cards and a device for carrying out the method, whereby "chip cards” mean such ID cards or similar identification or access authorization cards in which components such as integrated modules (IC's) contact tracks, antennas or the like are accommodated .
  • chip cards mean such ID cards or similar identification or access authorization cards in which components such as integrated modules (IC's) contact tracks, antennas or the like are accommodated .
  • the intended use also includes card-shaped anti-theft devices or the like, from which it can be seen that the field of application is primarily concerned with the fact that building blocks are to be accommodated in a flat structure.
  • an antenna can also be provided, which is designed as a winding body with a relatively large diameter.
  • the invention is based, task and method
  • This task is alternatively carried out by a method according to the
  • cover surfaces or overlay foils are, so to speak, "laid in a floating manner", that is to say they are placed on a bed of still elastic adhesive and are fixed in this way until the adhesive changes to its elastic (or essentially hardened) state that this flat surface is created.
  • flat surface does not exclude the fact that sections or depressions are present in sections, for example in the form of patterns, which are provided, for example, as further security or design features. It is possible to produce the entire “card body” from cast material (adhesive) or to fill a card body with adhesive where its recesses are provided with the electronic components contained therein.
  • the adhesive is applied or spread onto the card body by means of a squeegee, for which a stencil printing method is particularly suitable.
  • a screen printing process is also possible.
  • the cover film or cover films (if both sides are covered with one) or the overlays are preferably applied to the surface of the adhesive before being fixed on the molding surface. This can be done, for example, by rolling up, the film being removed from the card body. rolls or is placed in the adhesive bed so that no air pockets can occur. As soon as the film is fixed, it is brought into contact with the mold surface and fixed to it. In a preferred embodiment of the invention, this fixing takes place by creating a vacuum between the outer surface of the cover film or the card and the molding surface or (optionally also additionally) by generating electrostatic charges between the molding surface and the film. Alternatively, the film can first be fixed to the molding surface and then - so to speak with the molding surface as a handling tool - placed in the adhesive bed.
  • a cold-curing adhesive in particular an epoxy adhesive, is preferably used as the filling plastic.
  • the adhesive is preferably filled with a filling material such as glass, quartz or the like.
  • This filling material can also be used in whole or in part for identification purposes, for example also include magnetizable powders or other filling materials which can be identified or even "described" by electrical, magnetic or also mechanical interactions.
  • magnetizable powders or other filling materials which can be identified or even "described” by electrical, magnetic or also mechanical interactions.
  • the first embodiment of the method according to the invention for producing chip cards comprises the following steps:
  • the card body is provided with openings, depressions or the like cavities;
  • the electrical components to be arranged in the card body are inserted into the cavities;
  • the card body is coated with an adhesive such that the cavities are filled and the adhesive forms a substantially flat surface;
  • a cover film (overlay) is applied to the surface of the adhesive that has not yet set or hardened and is therefore still plastically deformable;
  • the cover film with its surface facing away from the card body, is held on a shaped surface for such a long time during the curing of the adhesive that the outer contour of the cover film and thus the outer contour of the finished chip card correspond to the contour of the shaped surface.
  • Cover foils are fixed on two opposing mold surfaces;
  • the elastic members are arranged between the cover foils *;
  • the space between the cover foils corresponding to the thickness of the card body is filled with an adhesive
  • the cover foils are held in such a way and during the curing of the adhesive that the outer contours of the cover foils and thus the outer contours of the finished chip card correspond to the contours of the shaped surfaces.
  • the entire ensemble is preferably exposed to a vacuum in such a way that air pockets are avoided or eliminated.
  • the device suitable for carrying out the invention according to the first embodiment comprises a coating device, in particular a stencil printing device for coating a card body with an adhesive such that the cavities are filled and the adhesive forms an essentially flat surface.
  • a placement device is provided for placing a cover film on the surface of the still plastic adhesive.
  • a mold surface is equipped with devices for fixing the cover film in such a way that the outer contour of the cover film corresponds to the outer contour of the mold surface.
  • two mutually opposite shaped surfaces are provided which are designed such that cover foils can be fixed on them.
  • the shaped surfaces are designed such that electronic components can be arranged between them and the space between the cover foils can be filled with an adhesive.
  • FIG. 1 shows a schematic plan view of the detail of a card body
  • FIG. 2 shows a top view as in FIG. 1, but with inserted electronic components
  • FIG. 3 shows a section along the line III-III from FIG. 2,
  • Figure 4 is a view similar to that of Figure 3 but during the filling process
  • FIG. 5 shows a view similar to that of FIG. 3, but in the fully filled state
  • Figure 6 shows the view of Figure 5, however, during the
  • Figure 7 is a sectional view similar to that of Figure 6 with the cover film applied and fixed
  • Figure 8 is a schematic sectional view similar to that of Figures 3 to 7 through a second preferred embodiment of the invention.
  • a (or more) recess 12 is first removed from a sheet of material 10, which comprises a plurality of card areas 11, such that, as shown in FIG. 3, a central area 8 is removed in places and only a sub-area 9 is left.
  • the central region 8 and the lower region 9 can be formed in one piece as well as formed from individual surfaces (welded or glued), as is the case with the exemplary embodiment shown here.
  • Electronic components are now inserted into the recess 12 formed in this way, with an antenna 13 in FIG. 2-6 of the electronic components, which is connected to a chip 15 via lead wires 14.
  • This arrangement is known for contactless chip cards.
  • the electronic components can also be fixed in the recess 12 by means of small adhesive areas.
  • the arrangement is - as shown in FIG. 3 - transferred to a filling device which comprises a frame 16 with a template 17, the opening of which essentially corresponds to the (later) card area 11 or is slightly larger.
  • a cover film (overlay) 22 is placed on the surface 28 of the adhesive 19 from above such that there are no air bubbles in between. In a preferred embodiment of the invention, this is done in such a way that (as shown in FIG. 6) the cover film or overlay is rolled on the surface 28 of the adhesive 19.
  • the entire arrangement (consisting of a large number of surface sections provided with adhesive in this way) is then transferred to a curing device.
  • the curing device comprises a carrier 27, on which the arrangement shown in detail in FIG. 6 is fastened, and an upper mold surface 25, which is arranged at a defined distance from the carrier 27.
  • the molding surface 25 has devices (not shown), for example air suction devices and / or electrostatic charging devices, which are designed in such a way that the cover film 22 bears firmly against a flat (or provided with a predetermined relief) surface of the upper mold surface 25 or is held fixed to it, which lies opposite the carrier 27. In this fixed state, which determines the later contour of the chip card, the arrangement is held until the adhesive has substantially hardened and all shrinking processes etc. have been completed.
  • devices for example shaking devices or field generating devices
  • a magnetic or electrical field are additionally provided, which serve to bring the adhesive, in particular an epoxy resin adhesive, into a state of low viscosity in such a way that compensation and Flow processes are facilitated.
  • the cover film 22 is released from the (upper) molding surface 25.
  • the overall arrangement can then be transferred to a punch, so that the card areas 11 can be punched out.
  • This method ensures that the outer contours of the upper cover film 22 in the arrangement shown in FIG. 7 correspond exactly to the area which the
  • Form surface 25 specifies. It is also possible to form the lower surface by an appropriate arrangement.
  • the electronic components 15 are placed directly on a lower film 23 or fixed on it and surrounded by a frame piece 24. Then the electronic components 15 fill the space within the frame piece 24 with adhesive 19 and cover 22 is placed on. The lower cover sheet 23 and the upper cover sheet 22 are now held in place by means of an upper molding surface 25 and a lower molding surface 26 (as described above) until the adhesive has hardened and the final shape of the overall card body is fixed. References

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne la fabrication de cartes à puce dans lesquelles les évidements d'un corps de carte doivent être revêtus d'une colle (19) de telle manière que les cavités soient remplies et que la colle forme une surface (28) sensiblement plane. Une feuille de revêtement (22) est appliquée sur la surface de la colle (19) non encore prise ou durcie et ainsi encore déformable plastiquement. Dans le but d'obtenir des surfaces absolument planes, la feuille de revêtement (22) est maintenue fixée pendant le durcissement de la colle, avec sa surface opposée au corps de carte, sur une surface moulée, de telle manière et jusqu'à ce que le contour extérieur de la feuille de revêtement et ainsi le contour extérieur de la carte à puce terminée correspondent au contour de la surface moulée.
PCT/EP1997/004645 1996-08-26 1997-08-26 Procede pour la fabrication de cartes a puce WO1998009252A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19634481 1996-08-26
DE19634481.6 1996-08-26
DE19645071.3 1996-10-31
DE1996145071 DE19645071C2 (de) 1996-10-31 1996-10-31 Verfahren zur Herstellung von Chipkarten

Publications (1)

Publication Number Publication Date
WO1998009252A1 true WO1998009252A1 (fr) 1998-03-05

Family

ID=26028764

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1997/004645 WO1998009252A1 (fr) 1996-08-26 1997-08-26 Procede pour la fabrication de cartes a puce

Country Status (1)

Country Link
WO (1) WO1998009252A1 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1154391A1 (fr) * 1999-08-31 2001-11-14 LINTEC Corporation Etiquette d'adhesion
GB2371263A (en) * 2001-01-18 2002-07-24 Pioneer Oriental Engineering L Forming a low frequency contact-less smart card with an antenna coil
EP1406209A2 (fr) * 2002-09-27 2004-04-07 Eastman Kodak Company Carte à puce sans contact comportant un transpondeur placé dans une cavité du corps de la carte
WO2004049247A1 (fr) * 2002-11-25 2004-06-10 Rafsec Oy Transpondeur et procede de production correspondant
FR2895547A1 (fr) * 2005-12-26 2007-06-29 Oberthur Card Syst Sa Procede de fabrication d'une carte a microcircuit
FR2995709A1 (fr) * 2012-09-18 2014-03-21 Arjowiggins Security Procede de fabrication d'une structure a puce electronique et structure ainsi fabriquee.
WO2018022755A1 (fr) 2016-07-27 2018-02-01 Composecure, Llc Composants électroniques surmoulés pour cartes de transaction et leurs procédés de fabrication
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US10885419B2 (en) 2017-09-07 2021-01-05 Composecure, Llc Transaction card with embedded electronic components and process for manufacture
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US11232341B2 (en) 2017-10-18 2022-01-25 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0488574A2 (fr) * 1990-11-30 1992-06-03 AT&T Corp. Construction d'une carte de données individuelle
EP0587011A1 (fr) * 1992-08-31 1994-03-16 Sony Chemicals Corporation Carte de mémorisation et procédé pour la fabriquer
GB2279817A (en) * 1993-07-02 1995-01-11 Gec Avery Ltd A method of encapsulating components on a printed circuit
GB2279907A (en) * 1993-07-02 1995-01-18 Gec Avery Ltd Flexible mountings for electronic components in smart cards.

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0488574A2 (fr) * 1990-11-30 1992-06-03 AT&T Corp. Construction d'une carte de données individuelle
EP0587011A1 (fr) * 1992-08-31 1994-03-16 Sony Chemicals Corporation Carte de mémorisation et procédé pour la fabriquer
GB2279817A (en) * 1993-07-02 1995-01-11 Gec Avery Ltd A method of encapsulating components on a printed circuit
GB2279907A (en) * 1993-07-02 1995-01-18 Gec Avery Ltd Flexible mountings for electronic components in smart cards.

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1154391A1 (fr) * 1999-08-31 2001-11-14 LINTEC Corporation Etiquette d'adhesion
EP1154391A4 (fr) * 1999-08-31 2005-03-30 Lintec Corp Etiquette d'adhesion
GB2371263A (en) * 2001-01-18 2002-07-24 Pioneer Oriental Engineering L Forming a low frequency contact-less smart card with an antenna coil
EP1406209A2 (fr) * 2002-09-27 2004-04-07 Eastman Kodak Company Carte à puce sans contact comportant un transpondeur placé dans une cavité du corps de la carte
EP1406209A3 (fr) * 2002-09-27 2006-05-31 Eastman Kodak Company Carte à puce sans contact comportant un transpondeur placé dans une cavité du corps de la carte
WO2004049247A1 (fr) * 2002-11-25 2004-06-10 Rafsec Oy Transpondeur et procede de production correspondant
FR2895547A1 (fr) * 2005-12-26 2007-06-29 Oberthur Card Syst Sa Procede de fabrication d'une carte a microcircuit
WO2007077355A1 (fr) * 2005-12-26 2007-07-12 Oberthur Technologies Procede de fabrication d’une carte a microcircuit
FR2995709A1 (fr) * 2012-09-18 2014-03-21 Arjowiggins Security Procede de fabrication d'une structure a puce electronique et structure ainsi fabriquee.
WO2014045195A1 (fr) 2012-09-18 2014-03-27 Arjowiggins Security Procédé de fabrication d'une structure a puce électronique et structure ainsi fabriquée
EP3491584B1 (fr) * 2016-07-27 2022-07-13 Composecure LLC Composants électroniques surmoulés pour cartes de transaction et leurs procédés de fabrication
US11267172B2 (en) 2016-07-27 2022-03-08 Composecure, Llc Overmolded electronic components for transaction cards and methods of making thereof
US12079681B2 (en) 2016-07-27 2024-09-03 Composecure, Llc RFID device
US11829826B2 (en) 2016-07-27 2023-11-28 Composecure, Llc RFID device
US10926439B2 (en) 2016-07-27 2021-02-23 Composecure, Llc Overmolded electronic components for transaction cards and methods of making thereof
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
JP7247086B2 (ja) 2016-07-27 2023-03-28 コンポセキュア，リミティド ライアビリティ カンパニー 取引カードのためのオーバーモールド加工電子部品及びその製造方法
JP2019531918A (ja) * 2016-07-27 2019-11-07 コンポーズキュア，リミティド ライアビリティ カンパニー 取引カードのためのオーバーモールド加工電子部品及びその製造方法
US11247371B2 (en) 2016-07-27 2022-02-15 Composecure, Llc Overmolded electronic components for transaction cards and methods of making thereof
US11461608B2 (en) 2016-07-27 2022-10-04 Composecure, Llc RFID device
WO2018022755A1 (fr) 2016-07-27 2018-02-01 Composecure, Llc Composants électroniques surmoulés pour cartes de transaction et leurs procédés de fabrication
US11501128B2 (en) 2017-09-07 2022-11-15 Composecure, Llc Transaction card with embedded electronic components and process for manufacture
US11669708B2 (en) 2017-09-07 2023-06-06 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US10885419B2 (en) 2017-09-07 2021-01-05 Composecure, Llc Transaction card with embedded electronic components and process for manufacture
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US11315002B2 (en) 2017-09-07 2022-04-26 Composecure, Llc Transaction card with embedded electronic components and process for manufacture
US11232341B2 (en) 2017-10-18 2022-01-25 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US12086669B2 (en) 2017-10-18 2024-09-10 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
USD944323S1 (en) 2018-01-30 2022-02-22 Composecure, Llc Layer of a transaction card
USD943669S1 (en) 2018-01-30 2022-02-15 Composecure, Llc Layer of a transaction card
USD943670S1 (en) 2018-01-30 2022-02-15 Composecure, Llc Layer of a transaction card
US11301743B2 (en) 2018-01-30 2022-04-12 Composecure, Llc Di capacitive embedded metal card
USD944322S1 (en) 2018-01-30 2022-02-22 Composecure, Llc Layer of a transaction card
US11710024B2 (en) 2018-01-30 2023-07-25 Composecure, Llc Di capacitive embedded metal card
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US12093772B2 (en) 2018-01-30 2024-09-17 Composecure, Llc DI capacitive embedded metal card
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card

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