WO1999020093A1 - Verfahren zur beleuchtungseinstellung in einer einrichtung zur lageerkennung und/oder qualitätskontrolle von bauelementen und/oder substraten - Google Patents

Verfahren zur beleuchtungseinstellung in einer einrichtung zur lageerkennung und/oder qualitätskontrolle von bauelementen und/oder substraten Download PDF

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Publication number
WO1999020093A1
WO1999020093A1 PCT/DE1998/002795 DE9802795W WO9920093A1 WO 1999020093 A1 WO1999020093 A1 WO 1999020093A1 DE 9802795 W DE9802795 W DE 9802795W WO 9920093 A1 WO9920093 A1 WO 9920093A1
Authority
WO
WIPO (PCT)
Prior art keywords
lighting
components
parameters
substrates
markings
Prior art date
Application number
PCT/DE1998/002795
Other languages
German (de)
English (en)
French (fr)
Inventor
Gerhard Haas
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Priority to EP98954206A priority Critical patent/EP1020105B1/de
Priority to JP2000516517A priority patent/JP2001520392A/ja
Priority to KR1020007003844A priority patent/KR100356957B1/ko
Priority to DE59803363T priority patent/DE59803363D1/de
Publication of WO1999020093A1 publication Critical patent/WO1999020093A1/de

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features

Definitions

  • the invention relates to a method for adjusting the lighting in a device for position detection and / or quality control of components and / or substrates according to the preamble of claim 1.
  • the position of the components relative to the placement position on the printed circuit board is determined by means of position detection devices before the assembly.
  • components includes all objects that can be fitted, for example shielding plates.
  • Vision systems which comprise a camera, for example a CCD camera, and an illumination device are generally used as position detection devices.
  • a visual inspection of the components is carried out in analog quality control devices in order to identify defective components and to remove them from the assembly process.
  • Centering marks applied to the substrates serve to identify the position of the substrates.
  • Reject markings made on the substrates are used for marking defective substrates, so that these defective substrates are identified in the quality control device and then removed from the placement process.
  • a wide variety of substrates epoxy / glass fiber composites, plastic films, ceramics, hard paper
  • Different materials such as shiny or matt metals / metal oxides or plastic or lacquer covers are also used for the markings.
  • the optical surface properties markings of different materials for substrates and Mar ⁇ vary extremely and thus the illumination by a Be ⁇ caused contrast between the label and the substrate. The lighting should therefore be selected so that useful structures (in general the connections of the components or the markings) are displayed in high contrast to interference structures (for example the body of the components or substrate background).
  • Markings and substrates and / or components are each made from materials with mutually different optical properties, such as absorption, metallic or diffuse reflection, in order to be distinguished from one another when illuminated with an illumination device with an almost constant spectral distribution due to their different backscattering behavior in an image evaluation unit.
  • the optical properties vary with the wavelength of the illuminating light, so that, in the case of illumination with an almost constant spectral distribution, material combinations for markings, substrates and / or components are not distinguished from one another disadvantageously can.
  • Replacement of the lighting equipment in depen ⁇ dependence on the materials used is not feasible very complex and at a aspired high placement due to the time loss.
  • JP 5-332939 discloses a method for quality control of components with a number of lighting units, each of which has its own intensity control device.
  • the light emitted by the lighting units is changed by changing the intensity until optimal lighting (maximum contrast) is achieved, in which the component is reliably recognized.
  • JP 8-219716 A A method for illuminating objects with different colors is known from JP 8-219716 A, in which the color of the light emitted by an illumination unit is changed via an illumination control.
  • the method according to the invention has the advantage that the spectral distribution of the illumination by varying the parameters of the intensity control rt Pl P a ⁇ P ) : cn d P- cn LJ. cn li ⁇ al li ⁇ Q dd r ⁇ j ⁇ öd öd ⁇ ⁇ C ⁇ öd ⁇
  • Training phase first the optimum lighting for it determines ⁇ stes component 19 and then used for further similar components 19th
  • the method according to the invention therefore has the advantage of ensuring optimized lighting for components 19, substrates 5 and / or markings 7 consisting of a wide variety of materials.

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Input (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
PCT/DE1998/002795 1997-10-08 1998-09-21 Verfahren zur beleuchtungseinstellung in einer einrichtung zur lageerkennung und/oder qualitätskontrolle von bauelementen und/oder substraten WO1999020093A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP98954206A EP1020105B1 (de) 1997-10-08 1998-09-21 Verfahren zur beleuchtungseinstellung in einer einrichtung zur lageerkennung und/oder qualitätskontrolle von bauelementen und/oder substraten
JP2000516517A JP2001520392A (ja) 1997-10-08 1998-09-21 構成要素および/または基板の位置識別および/または品質検査のための装置における照明設定方法
KR1020007003844A KR100356957B1 (ko) 1997-10-08 1998-09-21 소자 또는 기판의 위치 식별 또는 품질을 제어하기 위한 장치에서의 조명 설정 방법
DE59803363T DE59803363D1 (de) 1997-10-08 1998-09-21 Verfahren zur beleuchtungseinstellung in einer einrichtung zur lageerkennung und/oder qualitätskontrolle von bauelementen und/oder substraten

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19744454.7 1997-10-08
DE19744454 1997-10-08

Publications (1)

Publication Number Publication Date
WO1999020093A1 true WO1999020093A1 (de) 1999-04-22

Family

ID=7844945

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/002795 WO1999020093A1 (de) 1997-10-08 1998-09-21 Verfahren zur beleuchtungseinstellung in einer einrichtung zur lageerkennung und/oder qualitätskontrolle von bauelementen und/oder substraten

Country Status (7)

Country Link
US (1) US6040895A (ja)
EP (1) EP1020105B1 (ja)
JP (1) JP2001520392A (ja)
KR (1) KR100356957B1 (ja)
CN (1) CN1183819C (ja)
DE (1) DE59803363D1 (ja)
WO (1) WO1999020093A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002102128A1 (de) * 2001-06-12 2002-12-19 Siemens Aktiengesellschaft Optische sensorvorrichtung
DE10162270A1 (de) * 2001-12-18 2003-07-10 Siemens Ag Optische Sensorvorrichtung
EP1568985A2 (en) * 2004-02-27 2005-08-31 Omron Co., Ltd. Apparatus for surface inspection and method and apparatus for inspecting substrate
DE102008016766A1 (de) * 2008-04-02 2009-11-19 Sick Ag Optoelektronischer Sensor und Verfahren zur Detektion von Objekten
EP2807905A1 (de) 2013-02-28 2014-12-03 A.B. Mikroelektronik Gesellschaft mit beschränkter Haftung Bestückungsverfahren für schaltungsträger und schaltungsträger
AT516638A1 (de) * 2014-12-17 2016-07-15 A B Mikroelektronik Ges Mit Beschränkter Haftung Verfahren zur Herstellung eines Schaltungsträgers und Schaltungsträger
DE10066519B3 (de) 1999-11-30 2019-08-14 Mitutoyo Corporation Bilderzeugungssonde
AT517259B1 (de) * 2015-06-09 2020-01-15 Zkw Group Gmbh Verfahren zur positionsgenauen Bestückung eines Schaltungsträgers

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JP3745564B2 (ja) * 1999-07-08 2006-02-15 三菱電機株式会社 欠陥検査方法および欠陥検査装置
WO2001035049A1 (fr) * 1999-11-08 2001-05-17 Matsushita Electric Industrial Co., Ltd. Procede et appareil de reconnaissance de composants
US7145165B2 (en) * 2001-09-12 2006-12-05 Honeywell International Inc. Tunable laser fluid sensor
US20070133001A1 (en) * 2001-09-12 2007-06-14 Honeywell International Inc. Laser sensor having a block ring activity
JP3551188B2 (ja) * 2002-01-10 2004-08-04 オムロン株式会社 表面状態検査方法および基板検査装置
US7470894B2 (en) * 2002-03-18 2008-12-30 Honeywell International Inc. Multi-substrate package assembly
JP3593119B2 (ja) * 2002-08-01 2004-11-24 株式会社東芝 照明装置
EP1595138B1 (en) * 2003-01-09 2010-07-07 Panasonic Corporation Image recognition apparatus and image recognition method
WO2004088588A1 (ja) * 2003-03-28 2004-10-14 Fujitsu Limited 撮影装置、光源制御方法、およびコンピュータプログラム
JP4746841B2 (ja) 2004-01-23 2011-08-10 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US7586114B2 (en) * 2004-09-28 2009-09-08 Honeywell International Inc. Optical cavity system having an orthogonal input
US7902534B2 (en) * 2004-09-28 2011-03-08 Honeywell International Inc. Cavity ring down system having a common input/output port
JP4629590B2 (ja) * 2006-02-03 2011-02-09 三菱電機株式会社 個人識別装置
US7656532B2 (en) * 2006-04-18 2010-02-02 Honeywell International Inc. Cavity ring-down spectrometer having mirror isolation
CN101150732B (zh) * 2006-09-20 2010-08-11 王锦峰 用黑白相机拍摄彩色图像的成像方法和装置
US7649189B2 (en) * 2006-12-04 2010-01-19 Honeywell International Inc. CRDS mirror for normal incidence fiber optic coupling
US7710611B2 (en) * 2007-02-16 2010-05-04 Illinois Tool Works, Inc. Single and multi-spectral illumination system and method
US7663756B2 (en) * 2008-07-21 2010-02-16 Honeywell International Inc Cavity enhanced photo acoustic gas sensor
US8198590B2 (en) * 2008-10-30 2012-06-12 Honeywell International Inc. High reflectance terahertz mirror and related method
US7864326B2 (en) 2008-10-30 2011-01-04 Honeywell International Inc. Compact gas sensor using high reflectance terahertz mirror and related system and method
CN101771824B (zh) * 2008-12-30 2012-01-04 财团法人金属工业研究发展中心 自动调节所需照明亮度的影像撷取方法
US8437000B2 (en) 2010-06-29 2013-05-07 Honeywell International Inc. Multiple wavelength cavity ring down gas sensor
US8269972B2 (en) 2010-06-29 2012-09-18 Honeywell International Inc. Beam intensity detection in a cavity ring down sensor
US8322191B2 (en) 2010-06-30 2012-12-04 Honeywell International Inc. Enhanced cavity for a photoacoustic gas sensor
CN110140084B (zh) * 2017-01-06 2022-03-18 株式会社富士 拍摄用照明装置
EP3653030B1 (en) * 2017-07-12 2024-09-18 Mycronic Ab Method and system for determining component illumination settings
CN108802046B (zh) * 2018-06-01 2021-01-29 中国电子科技集团公司第三十八研究所 一种混合集成电路组件缺陷光学检测装置及其检测方法
KR102597603B1 (ko) 2018-12-10 2023-11-02 삼성전자주식회사 검사 장치 및 이를 포함하는 반도체 구조 제조 장치

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DE4222804A1 (de) * 1991-07-10 1993-04-01 Raytheon Co Einrichtung und verfahren zur automatischen visuellen pruefung elektrischer und elektronischer baueinheiten
US5469294A (en) * 1992-05-01 1995-11-21 Xrl, Inc. Illumination system for OCR of indicia on a substrate

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US5010412A (en) * 1988-12-27 1991-04-23 The Boeing Company High frequency, low power light source for video camera
JP2969401B2 (ja) * 1991-10-29 1999-11-02 株式会社新川 ボンデイングワイヤ検査装置
JP2981941B2 (ja) * 1991-12-02 1999-11-22 株式会社新川 ボンデイングワイヤ検査装置
JP2969402B2 (ja) * 1991-12-02 1999-11-02 株式会社新川 ボンデイングワイヤ検査装置
JP2969403B2 (ja) * 1991-12-02 1999-11-02 株式会社新川 ボンデイングワイヤ検査装置
JPH05332939A (ja) * 1992-06-01 1993-12-17 Matsushita Electric Ind Co Ltd 視覚認識装置
JPH07335706A (ja) * 1994-06-03 1995-12-22 Nec Corp ワイヤの高さ測定装置
JPH08219716A (ja) * 1994-12-13 1996-08-30 Toshiba Corp 入力画像コントラスト処理装置およびこれを用いた装置
EP0800756B1 (de) * 1994-12-30 1998-09-02 Siemens Aktiengesellschaft Vorrichtung zur lageerkennung der anschlüsse von bauelementen
US5943125A (en) * 1997-02-26 1999-08-24 Acuity Imaging, Llc Ring illumination apparatus for illuminating reflective elements on a generally planar surface

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
DE4222804A1 (de) * 1991-07-10 1993-04-01 Raytheon Co Einrichtung und verfahren zur automatischen visuellen pruefung elektrischer und elektronischer baueinheiten
US5469294A (en) * 1992-05-01 1995-11-21 Xrl, Inc. Illumination system for OCR of indicia on a substrate

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10066519B3 (de) 1999-11-30 2019-08-14 Mitutoyo Corporation Bilderzeugungssonde
DE10128476C2 (de) * 2001-06-12 2003-06-12 Siemens Dematic Ag Optische Sensorvorrichtung zur visuellen Erfassung von Substraten
KR100914802B1 (ko) * 2001-06-12 2009-09-02 지멘스 일렉트로닉스 어셈블리 시스템즈 게엠베하 운트 콤파니 카게 광학 센서 장치
WO2002102128A1 (de) * 2001-06-12 2002-12-19 Siemens Aktiengesellschaft Optische sensorvorrichtung
DE10162270A1 (de) * 2001-12-18 2003-07-10 Siemens Ag Optische Sensorvorrichtung
DE10162270B4 (de) * 2001-12-18 2004-05-13 Siemens Ag Optische Sensorvorrichtung
EP1568985A2 (en) * 2004-02-27 2005-08-31 Omron Co., Ltd. Apparatus for surface inspection and method and apparatus for inspecting substrate
EP1568985A3 (en) * 2004-02-27 2010-12-29 Omron Corporation Apparatus for surface inspection and method and apparatus for inspecting substrate
DE102008016766B4 (de) * 2008-04-02 2016-07-21 Sick Ag Sicherheitskamera und Verfahren zur Detektion von Objekten
DE102008016766A1 (de) * 2008-04-02 2009-11-19 Sick Ag Optoelektronischer Sensor und Verfahren zur Detektion von Objekten
EP2807905A1 (de) 2013-02-28 2014-12-03 A.B. Mikroelektronik Gesellschaft mit beschränkter Haftung Bestückungsverfahren für schaltungsträger und schaltungsträger
US10217675B2 (en) 2013-02-28 2019-02-26 A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier
EP2807905B1 (de) 2013-02-28 2015-11-18 A.B. Mikroelektronik Gesellschaft mit beschränkter Haftung Bestückungsverfahren für schaltungsträger
US10672672B2 (en) 2013-02-28 2020-06-02 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier
US10991632B2 (en) 2013-02-28 2021-04-27 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Assembly process for circuit carrier and circuit carrier
AT516638A1 (de) * 2014-12-17 2016-07-15 A B Mikroelektronik Ges Mit Beschränkter Haftung Verfahren zur Herstellung eines Schaltungsträgers und Schaltungsträger
AT517259B1 (de) * 2015-06-09 2020-01-15 Zkw Group Gmbh Verfahren zur positionsgenauen Bestückung eines Schaltungsträgers

Also Published As

Publication number Publication date
US6040895A (en) 2000-03-21
KR20010031029A (ko) 2001-04-16
EP1020105B1 (de) 2002-03-13
CN1275307A (zh) 2000-11-29
CN1183819C (zh) 2005-01-05
JP2001520392A (ja) 2001-10-30
KR100356957B1 (ko) 2002-10-18
DE59803363D1 (de) 2002-04-18
EP1020105A1 (de) 2000-07-19

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