WO1999018604A1 - Procede et appareil d'exposition par projection - Google Patents
Procede et appareil d'exposition par projection Download PDFInfo
- Publication number
- WO1999018604A1 WO1999018604A1 PCT/JP1998/004536 JP9804536W WO9918604A1 WO 1999018604 A1 WO1999018604 A1 WO 1999018604A1 JP 9804536 W JP9804536 W JP 9804536W WO 9918604 A1 WO9918604 A1 WO 9918604A1
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- WO
- WIPO (PCT)
- Prior art keywords
- optical system
- projection optical
- mask
- reticle
- projection
- Prior art date
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/701—Off-axis setting using an aperture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
Definitions
- the present invention is used for transferring a mask pattern onto a substrate such as a wafer, for example, in a lithographic process for manufacturing a semiconductor device, an imaging device (such as a CCD), a liquid crystal display device, or a thin film magnetic head.
- Projection exposure method and apparatus in particular, a step-and-scan method in which a mask and a substrate are provided with a mechanism for correcting an imaging characteristic and exposure is performed by synchronously scanning a mask and a substrate with respect to a projection optical system. It is suitable for use in an exposure type projection exposure apparatus.
- a projection exposure apparatus that transfers a reticle pattern as a mask onto a resist-coated wafer (or a glass plate or the like) via a projection optical system
- exposure is performed while always maintaining high imaging characteristics.
- One of the factors affecting the imaging characteristics is thermal deformation of a reticle or an optical element of a projection optical system due to exposure light exposure.
- various proposals have been made to correct a change in imaging characteristics due to thermal deformation of a reticle due to, for example, exposure. For example, in Japanese Patent Application Laid-Open No.
- the distribution of the amount of deformation in the pattern plane of the reticle is obtained by calculation, and the change in the imaging characteristics due to the deformation is determined by a part of the lens of the projection optical system.
- a technique has been proposed in which the correction is performed by driving the element in the optical axis direction or by tilting the element with respect to the optical axis.
- a batch exposure type projection exposure apparatus (stepper) was often used, but recently, in order to transfer a large area reticle pattern with high precision without increasing the size of the projection optical system, Step of performing exposure by synchronously scanning the reticle and laser beam with respect to the projection optical system. Attention has been focused on a scanning exposure type projection exposure apparatus (scanning exposure apparatus).
- the correction of the imaging characteristic change due to the irradiation of the exposure light in the scanning type exposure apparatus is described in, for example, Japanese Patent Application Laid-Open No. Hei 6-291016 and US Pat. No. 2,608 discloses a technique for correcting the amount of change in the imaging characteristics of a projection optical system due to irradiation by applying a correction method for the one-shot exposure type.
- the original pattern drawn on the reticle used in the scanning exposure apparatus has the same or larger area than the reticle for the batch exposure type. Is illuminated sequentially in a so-called slit-shaped illumination area.
- the projection optical system is always illuminated non-axisymmetrically in the slit-shaped illumination area, the method of calculating the amount of thermal deformation between the reticle and the projection optical system and the corresponding results A difference naturally occurs in the method of correcting the image characteristics.
- the effect on the projected image formed on the wafer differs between when the reticle thermally expands and when the projection optical system thermally expands.
- a first object of the present invention is to provide a projection exposure method capable of correcting an imaging characteristic with high accuracy.
- the present invention can accurately determine the amount of change in the imaging characteristic of the projection optical system due to absorption of exposure light or the amount of change in the imaging characteristic due to thermal deformation of a retinal, particularly in a scanning type exposure apparatus.
- a third object of the present invention is to provide a projection exposure apparatus capable of performing such a projection exposure method.
- a projection exposure apparatus includes: a projection optical system that projects a mask pattern onto a photosensitive substrate; and a plane parallel plate that is disposed on the photosensitive substrate side of the projection optical system substantially perpendicular to an optical axis of the projection optical system. And an adjusting device for adjusting at least one of a tilt angle of a normal line of the plane parallel plate with respect to an optical axis of the projection optical system and a tilt direction of the plane parallel plate.
- the apparatus further comprises an illumination optical system that changes at least one of a size and a shape of a secondary light source according to a pattern of the mask, wherein the adjustment device is interlocked with the change of the secondary light source. Then, at least one of the tilt angle and the tilt direction of the parallel flat plate is adjusted.
- a projection exposure apparatus that exposes a photosensitive substrate with a pattern of a mask
- the plurality of optical elements arranged along an optical axis substantially orthogonal to each of the mask and the photosensitive substrate;
- a projection optical system having a parallel plane plate disposed on the photosensitive substrate side; and an adjusting device for adjusting the aberration of the projection optical system by moving the parallel plane plate according to a change in exposure conditions of the photosensitive substrate.
- the adjusting device tilts the projection optical system relative to a plane perpendicular to the optical axis of the projection optical system without substantially rotating the parallel plane plate.
- At least one of aberration, projection magnification, and a focal position of the projection optical system other than decentered coma at least one of the plurality of optical elements of the projection optical system is adjusted.
- a driving device for moving the motor for moving the motor.
- an illumination optical system that changes at least one of a size and a shape of a secondary light source according to a pattern of the mask, and an aperture stop that changes a numerical aperture of the illumination optical system. Further comprising: The exposure condition includes at least one of the size and shape of the secondary light source, the type of pattern on the mask, and the numerical aperture of the projection optical system.
- the projection exposure apparatus in a projection exposure apparatus that exposes a photosensitive substrate with a pattern of a mask, includes a parallel plane plate arranged along an optical axis substantially orthogonal to each of the mask and the photosensitive substrate.
- An optical system and a drive mechanism for inclining the plane-parallel plate with respect to a plane perpendicular to the optical axis of the projection optical system.
- the apparatus further comprises a stage system that synchronously moves the mask and the photosensitive substrate at a speed ratio according to a projection magnification of the projection optical system, and drives the stage system to move the The photosensitive substrate is scanned and exposed in a pattern.
- the first projection exposure method of the present invention is the projection exposure method of exposing a photosensitive substrate with a pattern of a mask via a projection optical system, wherein the projection optical system emits a light beam emitted from a secondary light source and passing through the mask.
- the first step changes at least one of a size and a shape of the secondary light source according to a pattern of the mask.
- the second step includes tilting the projection optical system relative to a plane perpendicular to the optical axis of the projection optical system without substantially rotating the parallel plane plate. Adjust the decentering coma of the system.
- a second projection exposure method is a projection exposure method for transferring an image of a pattern of the mask onto the substrate via a projection optical system by synchronously moving the mask and the substrate.
- the position of at least one optical element of the projection optical system in the optical axis direction, the inclination angle of at least one optical element in the optical axis direction, the relative scanning speed between the mask and the substrate is adjusted to correct the imaging characteristics.
- a magnification error of a projection image and a predetermined error can be adjusted.
- the distortion is corrected.
- a magnification error in the scanning direction of the projected image can be corrected.
- a parallelogram can be formed. Distortion (so-called skew error) can be corrected. In particular, if these adjustments are performed during scanning exposure, it is possible to cope with partial thermal deformation in the mask scanning direction.
- a third projection exposure method is a projection exposure method for transferring an image of a pattern of the mask onto the substrate via a projection optical system by synchronously moving the mask and the substrate.
- the change in the imaging characteristics due to the thermal deformation of the mask is adjusted by adjusting the relative scanning speed between the mask and the substrate in the scanning direction, and by adjusting the projection magnification of the projection optical system in the non-scanning direction. , Respectively.
- the scanning speed of the substrate is slower than a reference speed determined by multiplying the scanning speed of the mask by the projection magnification of the projection optical system. By doing so, the magnification in only the scanning direction is corrected.
- the projection magnification of the projection optical system is adjusted, and the relative scanning speed between the mask and the substrate is adjusted so as to cancel the expansion. The adjustment corrects the magnification in the non-scanning direction only.
- the amount of heat absorption of the mask can be calculated based on the heat transfer occurring outside the pattern area of the mask and the pattern abundance of the mask, and the amount of thermal deformation of the mask can be calculated from the amount of heat absorption. desirable.
- the amount of thermal deformation of the mask can be determined with high accuracy, and the change in imaging characteristics due to the thermal deformation can be corrected with high accuracy. can do.
- the image of the pattern of the mask is moved via the projection optical system by moving the mask and the substrate in synchronization.
- a blind mechanism capable of adjusting the width of an illumination area of the mask is provided, and a scanning pattern and a non-scanning direction of an image of the mask pattern formed on the substrate are provided.
- the blind mechanism is driven in accordance with the difference in magnification change from the above to correct the contrast of the projected image.
- the width of the illumination area on the mask in both the scanning direction and the non-scanning direction
- the illuminance in that direction on the substrate increases, and conversely, the illumination area increases.
- the width of is reduced, the illuminance in that direction on the substrate decreases.
- the illuminance on the mask is the same, the illuminance on the substrate decreases as the projection magnification increases, and the illuminance on the substrate increases as the projection magnification decreases.
- the width of the illumination area is changed via a blind mechanism so as to cancel out the magnification, so that the illuminance in the scanning direction and the non-scanning direction on the substrate is changed. Is kept constant, and the unevenness of the contrast of the projected image is eliminated.
- a fifth projection exposure method is a projection exposure method for transferring an image of a pattern of the mask onto the substrate via a projection optical system by moving the mask and the substrate in synchronization.
- a light transmission window for measuring the transmittance of the projection optical system is provided on a mask stage on which the mask is mounted, and the transmittance of the projection optical system is measured through the light transmission window.
- Either light transmission window can be used according to the scanning direction of the mask, so that the measurement efficiency is maintained high.
- a sixth projection exposure method is directed to a projection exposure method for transferring an image of a pattern of a mask onto a substrate via a projection optical system.
- the imaging characteristics of the projection optical system are corrected, and the projection optical system is provided with a first parallel flat plate on its substrate side.
- the parallel plate is driven in the direction of the optical axis to capture a predetermined imaging characteristic.
- various imaging characteristics can be corrected with high accuracy by combining the driving of the plurality of optical elements of the projection optical system and the driving of the first parallel plane plate of the projection optical system.
- the projection optical system includes, on the mask side, a second parallel flat plate having a surface subjected to a predetermined uneven processing in order to capture a residual component of aberration of the projection optical system.
- the residual distortion and the like can be corrected by the second parallel plane plate.
- the mask is illuminated with a light beam from a secondary light source, and each time at least one of the shape and size of the secondary light source is changed, the first parallel plane plate is driven to drive the projection optical system.
- the decentering coma may be corrected.
- an ArF excimer laser light source When an ArF excimer laser light source is used as an exposure light source, it is desirable to replace the inside of the projection optical system with an inert gas (such as helium) or a nitrogen gas.
- an inert gas such as helium
- nitrogen gas when replacing with an inert gas, there is almost no oxygen having an absorption band near the wavelength (193 nm) of the ArF excimer laser beam, so that the transmittance to the exposure light is improved.
- nitrogen gas when replacing with nitrogen gas, the nitrogen gas hardly absorbs the ArF excimer laser light, so that the transmittance to the exposure light is improved.
- a projection exposure apparatus is a projection exposure apparatus for transferring a pattern of a mask onto a substrate via a projection optical system, wherein the projection optical system is arranged along the optical axis between the mask and the substrate.
- the first parallel plane plate is moved for adjustment, and the second parallel plane is adjusted for adjusting at least one of the aberration of the projection optical system other than the eccentric coma, the projection magnification, and the focal position.
- a drive device is provided for moving at least one of the plurality of optical elements without moving the face plate relative to the mask.
- the sixth projection exposure method of the present invention can be performed.
- the driving device moves at least three optical elements of the projection optical system as an example. Thereby, the projection magnification, distortion, and astigmatism can be adjusted.
- the driving device may move at least four optical elements of the projection optical system. This makes it possible to adjust the projection magnification, distortion, astigmatism, and coma.
- the driving device may move at least five optical elements of the projection optical system. This allows adjustment of the projection magnification, distortion, astigmatism, coma, and spherical aberration.
- an adjusting device for changing a refractive index in at least one of a plurality of spaces formed by the mask and the plurality of optical elements is further provided. It is desirable to have.
- the illumination optical system when at least one of the shape and size of the secondary light source is changed in accordance with the pattern of the mask, the plurality of optical elements and the first parallel light source are linked to the change of the secondary light source. It is desirable to move at least one of the flat plates.
- the apparatus further comprises a measuring device for measuring the atmospheric pressure in the projection optical system, and the driving device interlocks with the change in the atmospheric pressure, and the plurality of optical elements and the first optical device. It is desirable to move at least one of the parallel plane plates.
- the driving device be tilted relatively to the image plane of the projection optical system without substantially rotating the first plane-parallel plate to adjust the decentering coma of the projection optical system.
- the surface of the second plane-parallel plate is unevenly processed so as to correct asymmetric aberration of the projection optical system.
- the present invention is applied to a scanning exposure type projection exposure apparatus.
- FIG. 1 is a diagram showing a structure of a projection exposure apparatus according to a first embodiment.
- FIG. 2 is a view for explaining the structure of a sunset plate incorporated in the projection exposure apparatus of FIG.
- FIGS. 3A and 3B are diagrams illustrating the structure of an adjustment device provided in the projection exposure apparatus of FIG.
- FIG. 4 is a diagram for explaining the relationship between the inclination of the parallel flat plate fixed and held by the adjusting device of FIGS. 3 (a) and 3 (b) and the eccentric coma.
- FIG. 5 is a view showing a modification of the structure of the projection exposure apparatus of the first embodiment.
- 6 (a) and 6 (b) are views for explaining the structure of a main part of an adjusting device provided in the projection exposure apparatus of FIG.
- FIG. 7 is a schematic configuration diagram showing a projection exposure apparatus used in an example of the second embodiment of the present invention.
- FIG. 8 is a partially cut-away configuration diagram showing the internal configuration of the projection optical system of FIG.
- FIG. 9 is a plan view showing a part of the lens group of the projection optical system of FIG.
- FIG. 10 is a diagram showing a plurality of aperture stops provided on an aperture stop plate of the illumination system of FIG. 7;
- FIG. 11 is a plan view showing a drive mechanism and the like of the reticle stage in FIG.
- FIG. 12 is a diagram for explaining a method of calculating the amount of thermal deformation of a reticle.
- FIGS. 13 (a) to 13 (g) are diagrams showing the relationship between each component obtained by decomposing the amount of thermal deformation of the reticle and the corresponding correction amount of the imaging characteristic.
- FIG. 14 is a diagram for explaining a method of converting each component of the amount of thermal deformation into a function according to the coordinates in the scanning direction.
- FIG. 15 is a diagram illustrating an example of a distribution of calculation points of a thermal deformation amount of a reticle when heat transfer outside an exposure area is taken into consideration.
- FIG. 16 is a diagram for explaining a method of calculating the amount of thermal deformation of the reticle when only a part of the reticle is used as an exposure region.
- Figs. 17 (a) and 17 (b) explain how to calculate the amount of thermal deformation of the reticle in consideration of heat transfer outside the exposure area when only a part of the reticle is used as the exposure area. Figure to offer.
- Figures 18 (a) and 18 (b) show other examples of calculating the amount of thermal deformation of the reticle taking heat transfer outside the exposure area into account when only a part of the reticle is used as the exposure area.
- FIG. 18 (a) and 18 (b) show other examples of calculating the amount of thermal deformation of the reticle taking heat transfer outside the exposure area into account when only a part of the reticle is used as the exposure area.
- FIG. 19 is a diagram showing the relationship between the reflectance of the wafer and the output of the reflectance sensor.
- Fig. 20 (al), Fig. 20 (a2), Fig. 20 (a3), Fig. 20 (bl), Fig. 20 (b2), Fig. 20 (b3) show the opening of the reticle blind in Fig. 7.
- FIG. 4 is a diagram showing the relationship between the width of the image and the shift amount of the projected image.
- FIGS. 21 (a) to 21 (f) are diagrams showing examples of thermal deformation of the reticle corresponding to coefficients k1 to k6.
- FIGS. 22 (a) to 22 (f) are diagrams showing examples of thermal deformation of a reticle corresponding to coefficients k7 to k12.
- FIGS. 23 (a) to 23 (f) are diagrams showing examples of thermal deformation of the reticle corresponding to coefficients k13 to k18.
- FIGS. 24 (a) and 24 (b) show examples of thermal deformation of the reticle corresponding to the coefficients kl9 and k20.
- FIG. 1 is a view for explaining a schematic configuration of a projection exposure apparatus according to a first embodiment of the present invention.
- the projection exposure apparatus main body is housed in a chamber 100, and is controlled so that the internal temperature is kept constant.
- the ArF excimer laser light source 1 provided outside the champ 100 emits the laser light as a substantially parallel light beam.
- the laser light from the ArF excimer laser light source 1 is guided through a shutter 2 to a light transmission window 3 on the main body side of the projection exposure apparatus.
- the laser light that has passed through the light transmission window 3 is shaped into a laser beam having a predetermined cross-sectional shape by a beam shaping optical system 4 provided in the chamber 100, and the transmittance of the laser light provided on the night lett plate TP is mutually increased.
- the light passes through one of a plurality of different ND filters (ND 1 in FIG. 1), is sealed off by a reflection mirror 5, and is guided to a fly-eye lens 6, which is an optical integrator (homogenizer).
- Light beams from a number of secondary light sources formed by the flyer lens 6 pass through the variable aperture stop of the turret plate 7 and are split into two optical paths by the beam splitter 9.
- the reflected light from the beam splitter 9 is guided to the photoelectric detector 10 and the illuminance (intensity) of the illumination light is detected.
- a signal corresponding to the detected illuminance is input to the main controller 40.
- the transmitted light from the beam splitter 9 passes through a pair of relay lenses 11 and 13 sandwiching the variable field stop 12 and is reflected by a reflecting mirror 14 before being refracted by a plurality of lenses.
- the light is focused by the condenser optical system 15 composed of optical elements.
- the illumination area on the reticle 16 defined by the aperture of the variable field stop 12 provided between the relay lenses 11 and 13 is superimposed and substantially uniformly illuminated.
- Projection optical system 2 3 moves a main body part 70 composed of a plurality of lenses as optical elements and a parallel flat plate 81 arranged below the main body part 70 to adjust a specific aberration of the main body part 70 And an adjusting device 80 for performing the adjustment.
- the image of the circuit pattern on the reticle 16 illuminated by the illumination optical system is reduced and projected on the wafer 25 by the projection optical system 23, and the resist applied on the wafer 25 is exposed to light.
- the circuit pattern image is transferred onto the wafer 25.
- the ArF excimer laser light source 1 constituting the illumination optical system generates, for example, a laser beam having a wavelength of 193 nm.
- the ArF excimer laser light source 1 oscillates pulsed light in response to a trigger pulse sent from the light source control circuit 45.
- the light source control circuit 45 adjusts the applied voltage (charging voltage) to the ArF excimer laser light source 1 to adjust the intensity of the pulse light emitted from the ArF excimer laser light source 1.
- the light source control circuit 45 controls the ArF excimer laser light source 1 in accordance with a command from a main controller 40 that controls the entire projection exposure apparatus.
- the shirt 2 closes the illumination light path during replacement of the wafer or reticle, thereby causing the ArF excimer laser light source 1 to self-oscillate and reduce at least one of the center wavelength, wavelength width, and intensity of the pulsed light. Stabilize (adjust) the included beam characteristics.
- the evening plate TP holds six ND filters (only ND 1 and ND 2 are shown in Fig. 1), and the turret plate TP is rotated by the motor MT 1 controlled by the main controller 40. As a result, each of the six filters is arranged rotatably in the illumination light path.
- the six ND filters are used to determine the resist sensitivity on the wafer 25, the variation in the intensity of the ArF excimer laser light source 1, and the number of pulsed lights to be applied to one point on the wafer 25 (exposure pulse). Number) is selected as appropriate.
- the number of exposure pulses is defined as a region conjugate to the illumination area on the reticle 16 defined by the variable field stop 12 and the projection optical system 23 (that is, the pattern of the reticle 16 existing in the illumination area). Area on the wafer 25 while the point crosses along the scanning direction. This is the number of pulsed lights applied to the point.
- two plates each having a plurality of slits are arranged to face each other, and the two plates are positioned relative to each other in the slit arrangement direction. It may move to adjust the intensity of the pulse light. .
- At least one of the adjustment of the oscillation intensity of the ArF excimer laser light source 1 by the light source control circuit 45 and the adjustment of the transmittance (extinction rate) of the pulse light by the turret plate TP are performed.
- the intensity of the pulse light on the reticle 16, that is, the wafer 25, can be adjusted.
- the mirror 5 is rotated by the motor MT 2 while the reticle 16 and the wafer 25 are synchronously moved to expose the wafer 25 with an image of the pattern of the reticle 16.
- the control method of the mirror 15 is disclosed in, for example, Japanese Patent Application Laid-Open No. 7-142354 and US Patent Nos. 5,534,970 corresponding thereto. Due to the rotation of the mirror 5, during scanning exposure, interference fringes such as speckles move within the illumination area on the reticle 16 defined by the variable field stop 12 and thereby the wafer 25 The integrated light quantity distribution of the above pulse light is almost uniform.
- the interference fringes move once while a point on the reticle 16 crosses the illumination area along the scanning direction. . Further, it is preferable to vibrate the reflection mirror 5 so that the interference fringes move in the scanning direction and in the direction orthogonal to the scanning direction in the illumination area.
- one point on the reticle 16 is considered in consideration of the distance that the reticle 16 moves between a pair of front and rear pulse emission.
- the swing angle of the reflection mirror 5 between the pulsed light emission that is, the amount of movement of the interference fringes is determined so that the positional relationship between the one point and the interference fringes appropriately changes while the light crosses the illumination area.
- the fly-eye lens 6 is formed by bundling a large number of lens elements, and a lens constituting the fly-eye lens 6 A number of light source images (secondary light sources) corresponding to the number of elements are formed.
- one fly-eye lens 6 is provided.
- Japanese Patent Application Laid-Open No. Hei 1-259533 and US Pat. Nos. 5,307,207 corresponding thereto are disclosed.
- a second fly-eye lens may be provided between the reflection mirror 15 and the evening reticle plate TP.
- an internal reflection type integret may be used instead of the fly-eye lens 6, instead of the fly-eye lens 6, an internal reflection type integret may be used.
- an evening ret plate 7 for adjusting at least one of the shape and size of the secondary light source is provided.
- the turret plate 7 is made of a quartz transparent substrate, and as shown in FIG. 2, a plurality of aperture stops 7a to 7f having at least one different shape and size from each other are formed. Of these, three aperture stops 7a to 7c with circular apertures are used to positively change the ⁇ value (coherent 'factor). The remaining three aperture stops 7 d to 7 i are for improving the resolution (depth of focus) of the projection optical system 23. Apertures 7d and 7e are apertures with different aperture ratios (ratio between inner and outer diameters of the orbital aperture). The remaining one aperture stop 7f has four eccentricities. It has four eccentric apertures to form a secondary light source area.
- the threshold value will be briefly described. As shown in FIG. 1, it is determined by the principal ray Ri traveling parallel to the optical axis AX from the outermost edge (outermost diameter) of the aperture stop on the turret plate 7 inserted in the optical path of the illumination optical system.
- the projection optical system is determined by the principal ray R 0 that travels in parallel with the optical axis AX from the outermost edge of the aperture stop Ep of the projection optical element 23. 23 Set the numerical aperture on the illumination optical system side (reticle side) to NA 0
- the ⁇ value of a projection exposure apparatus in one optical lithography process is 0.
- It is configured to be set in the range of 3 to 0.8.
- This evening plate 7 is controlled by the main controller 40.
- One aperture stop is selected according to the pattern of the reticle 16 to be transferred onto the wafer 25 and is inserted into the optical path of the illumination optical system.
- the variable field stop 12 defines an illumination area on the reticle 16, and the illumination area has a width in the scanning direction of the reticle 16 smaller than the pattern area and in a direction perpendicular to the scanning direction. The width is wider than the pattern area. Furthermore, the illumination area extends around the optical axis AX of the projection optical system 23 and along its diameter within the circular image field of the projection optical system 23.
- the shape and size of the rectangular aperture of the variable field stop 12 are moved by moving at least one blade constituting the variable field stop 12 by the motor MT 3 controlled by the main controller 40. It can be changed.
- the width of the rectangular opening in the short direction is changed, the width of the illumination area on the reticle 16 in the scanning direction changes, thereby causing a plurality of spots on the wafer 25 to be exposed to the scanning exposure.
- the oscillation frequency of the ArF excimer laser light source 1 can be changed by the trigger pulse sent from the light source control circuit 45. It is possible to adjust the integrated light amount of a plurality of pulsed lights irradiated to the light. Further, by changing the scanning speed of the wafer 25 (and the reticle 16), it is also possible to adjust the integrated light quantity of a plurality of pulsed lights applied to one point on the wafer 25 during the scanning exposure. Similarly to the above, the change in the oscillation frequency and the scanning speed causes the point on the wafer 25 to cross the projection area conjugate with the illumination area on the reticle 16 along the scanning direction. This is because the number of pulse lights applied to one point is changed.
- the intensity of the pulse light on the wafer 25 and each point on the wafer 25 are irradiated during the scanning exposure. At least one of the number of pulsed lights is adjusted, whereby the integrated light quantity of the plurality of pulsed lights applied to each point in the area on the wafer 25 onto which the pattern image of the reticle 16 is transferred 5 The value is controlled to an appropriate value according to the sensitivity of the upper photoresist.
- the main body 70 of the projection optical system 23 is composed entirely of a refractive optical element such as a lens, and an aperture stop Ep is arranged at the position of the pupil (entrance pupil) of the projection optical system 23.
- the aperture stop Ep has a structure in which the aperture size can be appropriately changed by an aperture driving device 61 controlled by a main controller 40 so that the numerical aperture of the projection optical system 23 can be changed. Note that the aperture stop Ep in the projection optical system 23 and the variable aperture stops 7a to 7g in the illumination optical system are arranged at optically conjugate positions.
- the specific lens 70a disposed on the main body 70 of the projection optical system 23 can be appropriately moved by a lens driving device 62 controlled by the main controller 40. Movement of the lens 70a adjusts at least one of aberrations other than decentered coma (such as field curvature, astigmatism, coma, distortion, and spherical aberration), projection magnification, and focal position.
- aberrations other than decentered coma such as field curvature, astigmatism, coma, distortion, and spherical aberration
- the adjusting device 80 constituting the projection optical system 23 is provided between the main body 70 and the wafer 25, and includes a parallel flat plate 81 for correcting eccentric coma of the projection optical system 23.
- the parallel plane plate 81 is arranged almost perpendicular to the optical axis AX of the projection optical system 23, but can be moved as appropriate by a parallel plate driving device 63 controlled by the main controller 40. For example, parallel By slightly tilting the plane plate 81 from the plane perpendicular to the optical axis AX, only the eccentric coma generated in the main body 70 can be independently corrected.
- the parallel plate driving device 63 is driven to perform correction such that the eccentric coma of the projection optical system 23 is minimized.
- Reticle 16 is held and fixed to reticle stage 18 by reticle holder 17.
- the reticle stage 18 is attached to the base 22 so as to move two-dimensionally along a plane perpendicular to the plane of FIG.
- the reticle holder 17 is provided with a mirror 21.
- the laser light from the laser interferometer 20 is reflected by the mirror 21 and is projected onto the laser interferometer 20.
- the position of the reticle stage 18 is measured by such a laser interferometer 20.
- This position information is input to the main controller 40, and based on this position information, the main controller 40 drives the reticle stage drive module 19 to set the position of the reticle 16 and the reticle during scanning exposure.
- the speed of 16 is controlled.
- the wafer 25 is held and fixed on a wafer stage 27 by a wafer holder 26.
- the wafer stage 27 is provided so as to move two-dimensionally along a plane orthogonal to the plane of FIG.
- a mirror 31 is provided on the wafer stage 27, and a laser beam from the laser interferometer 30 is reflected by the mirror 31 and enters the laser interferometer 30.
- the position of the wafer stage 27 is measured by such a laser interferometer 30.
- This position information is input to the main controller 40, and the main controller 40 drives the wafer stage drive motor 29 based on this position information, and The position and the speed of the wafer 25 during the scanning exposure are controlled.
- An illuminance sensor (photoelectric detector) 28 is provided on the wafer stage 27 to detect the illuminance of the exposure light applied to the wafer 25.
- the detection signal of the illuminance sensor 28 is input to the main controller 40.
- the illumination optical system is provided in an atmosphere of an inert gas such as nitrogen gas or helium. Therefore, as disclosed in, for example, Japanese Patent Application Laid-Open No. 6-260385 and US Patent Nos. 5,559,584 corresponding thereto, a housing of an illumination optical system (not shown) An inert gas supply device for supplying an inert gas to the housing and an inert gas discharge device for discharging contaminated inert gas from the housing are provided. In addition, an inert gas such as a nitrogen gas is also supplied to a plurality of spaces formed between the plurality of optical elements constituting the projection optical system 23, and the polluted inert gas is discharged from the plurality of spaces.
- an inert gas such as nitrogen gas
- an inert gas supply device 41 and an inert gas discharge device 42 are provided, and the gas supply device 41 is connected to the inside of the projection optical element 23 through a pipe 43 so as to remove dried nitrogen or the like.
- the active gas is supplied, and the discharge device 42 discharges the gas inside the projection optical system 23 to the outside via the pipe 44.
- FIGS. 3 (a) and 3 (b) are diagrams illustrating the structure of the adjusting device 80 arranged at the lower end of the projection optical system 23.
- Fig. 3 (a) schematically shows the cross-sectional structure on the side
- Fig. 3 (b) shows the structure on the side.
- the adjusting device 80 includes a first member 82, which is a metal fitting for holding and fixing the parallel flat plate 81 therein, and a first member 82 and a main body portion 70 between the first member 82 and the main body 70.
- a second member 83 which is a metal fitting to be arranged.
- the first member 82 and the second member 83 are slidably connected via a sliding surface 86 slightly inclined from a plane perpendicular to the optical axis AX.
- the angle of inclination of the normal of the plane parallel plate 81 to the optical axis AX can be adjusted by relatively rotating the optical axis AX about the optical axis AX.
- the inclination angle between the optical axis AX and the sliding surface 86 is set to 1/2 of the maximum inclination angle with respect to the optical axis AX of the normal of the parallel plane plate 81.
- the first member 82 rotates 180 ° with respect to the second member 83 from the state shown in the figure.
- the angle of inclination of the normal of the parallel plane plate 81 to the optical axis AX is twice the angle of inclination between the optical axis AX and the sliding surface 86.
- the second member 83 and the main body 70 are slidably connected to each other via a sliding surface 87 perpendicular to the optical axis AX, and the second member 83 and the main body 70 are connected to the optical axis AX. Relative to the optical axis AX, the inclination direction of the normal line of the parallel plane plate 81 can be adjusted.
- the relative rotation position of the first member 82 and the second member 83 is such that a scale ring 84 provided around the upper end of the first member 82 is provided at one position at the lower end of the second member 83. It can be visually detected by reading with index 89. Further, the relative rotation position of the second member 83 with respect to the main body portion 70 is such that a scale ring 87 provided around the upper end of the second member 83 is provided at one position of the lower end of the main body portion 70. It can be visually detected by reading with index 89.
- the first driving unit 63 a provided in the driving device 63 adjusts the relative rotational position of the first member 82 and the second member 83 to drop the parallel flat plate 81 to the optical axis AX. Incline by a desired angle from a straight surface. This makes it possible to independently correct only the decentered coma in the specific direction generated in the main body 70.
- the second drive unit 63 b adjusts the relative rotation position between the first member 82 and the main body 70 to set the tilt direction of the plane-parallel plate 81 as appropriate. Thereby, the correction direction of the eccentric coma can be adjusted.
- the relative rotational positions of the first member 82 and the second member 83 and the relative rotational position of the first member 82 and the main body 70 are determined by the drive units 63 a and 63 By monitoring the amount of drive by b, it can also be detected electrically. For example, by detecting the relative rotational position of the first member 82 and the second member 83 based on the drive amount of both the drive units 63 a, the rotational position of the first member 82 can be determined. It can be converted to a corner.
- first member 82 and the second member 83 are fixed to the first member 82 side so as to be surely fixed at an arbitrary angle around the optical axis AX. Slotted holes are machined. Furthermore, the second member 83 and the main body 70 can be securely fixed at an arbitrary angle about the optical axis AX. W
- the fixing screw long hole is machined on the second member 83 side.
- FIG. 4 is a diagram conceptually illustrating the relationship between the tilt angle of the parallel plane plate 81 held by the first member 82 and the occurrence and correction of eccentric coma.
- the laser beam LB for exposure from the main body 70 is focused on the point P1 on the wafer 25. It shall be. If the parallel plane plate 81 is slightly tilted from this state as shown by a two-dot chain line, the exposure laser beam LB will not form an image at the point P1 due to the eccentric coma.
- the laser beam LB the light traveling along the optical axis AX is translated by the parallel plane plate 81 and forms an image at a point P2 near the point P1, but the laser beam LB Of the light, the light traveling at the aperture angle is translated by the relatively large action of the parallel plane plate 81 and forms an image at a point P3 farther from the point P1 than the point P2. That is, even if eccentric coma is not generated by the main body 70, eccentric coma is generated by tilting the parallel plane plate 81. This means that, when the eccentric coma such as the laser beam LB indicated by the two-dot chain line is generated, the eccentric coma can be corrected by rotating the parallel plane plate 81 clockwise.
- FIG. 5 is a diagram conceptually illustrating a main part of the projection exposure apparatus of the present example.
- the micro head 18 and the actuator 1 A fine adjustment mechanism consisting of 83 is provided. According to this fine adjustment mechanism, the parallel flat plate 81 is not rotated around the optical axis AX of the main body, and the possibility of generating other aberrations can be reduced.
- the pedestal 185 fixed to the lower part of the main body part 70 that composes the projection optical system is guided by a device not shown and moves relatively to the parallel plate holding chamber 186 in the optical axis direction. It is possible.
- the distance between the pedestal 185 and the parallel flat plate holding chamber 186 is determined by three micrometers fixed at three places around the pedestal 185. Yotsu Can be adjusted.
- the parallel plate holding chamber 18 The parallel flat plate 81 fixedly held at 6 can be inclined at an arbitrary angle in an arbitrary direction with respect to a plane perpendicular to the optical axis AX.
- the driving amount of the micrometer head 18 2 and the inclination angle and direction of the parallel plane plate 81 are in a fixed relationship, the necessary inclination angle and direction are set in the main controller 40 in advance.
- the driving amount of each micro head 182 can be calculated according to a certain calculation formula.
- FIG. 6 (a) is a plan view of the projection optical system shown in FIG. 5, and FIG. 6 (b) is a plan view of a parallel plate holding chamber 1886 provided below the projection optical system.
- the micrometer head 182 is arranged at a position that equally divides the periphery of the pedestal 180 fixed to the lower end of the main body 70.
- the spindle 1884 of the micrometer head 182 abuts on the parallel plate holding chamber 1886 at a position as shown in FIG. 6 (b). That is, the pedestal 185 and the main body portion 70 are placed on the parallel plate holding chamber 186 while being supported at three points.
- a sensor 14 for detecting the light amount and other illumination conditions is arranged between the condenser optical system 15 and the reticle 16.
- the change in the lighting condition detected by the sensor 14 is transmitted to the main controller 40.
- the main controller 40 drives the actuator 183 in accordance with a change in the illumination condition detected by the sensor 14 or the like, and appropriately adjusts the inclination angle and direction of the parallel plane plate 81.
- the parallel plane plate disposed substantially perpendicular to the optical axis of the projection optical system on the photosensitive substrate side of the projection optical system, and the parallel plane parallel to the inclination angle of the normal of the parallel plane plate to the optical axis of the projection optical system
- an illumination optical system for changing at least one of the size and the shape of the secondary light source in accordance with the pattern of the mask, wherein the adjustment device interlocks with the change of the secondary light source. Adjust at least one of the tilt angle and tilt direction of the parallel flat plate. For this reason, even if the illumination conditions change with the change of the secondary light source and the preconditions for the correction of the eccentric coma change, the eccentric coma can be optimized in accordance with the change of the precondition. The exposure can be corrected and the exposure performance of the exposure apparatus can be effectively prevented from deteriorating.
- the adjusting device adjusts the eccentric coma of the projection optical system by substantially tilting the plane parallel to the plane perpendicular to the optical axis of the projection optical system without substantially rotating the parallel plane plate. I do. For this reason, when the preconditions for the correction of the eccentric coma change in accordance with the change in the exposure conditions, the eccentric coma can be optimally corrected in accordance with the change in the preconditions. Deterioration of exposure performance can be effectively prevented.
- a drive device for moving at least one of the plurality of optical elements of the projection optical system is further provided. Therefore, it is possible to optimize the image formation by the projection optical system while optimally correcting the eccentric coma.
- the illumination optical system further includes an illumination optical system that changes at least one of the size and the shape of the secondary light source according to the pattern of the mask, and an aperture stop that changes the numerical aperture of the illumination optical system. Since the exposure conditions of the photosensitive substrate include at least one of the size and shape of the secondary light source, the type of pattern on the mask, and the numerical aperture of the projection optical system, it is possible to optimally correct eccentric coma, etc. Various exposure conditions as described above can be appropriately changed.
- the present invention is applied when performing exposure with a step-and-scan projection exposure apparatus.
- FIG. 7 shows a step-and-scan projection exposure apparatus used in this example.
- the exposure light composed of an ultraviolet pulse light emitted from an exposure light source 201 composed of a KrF excimer laser light source or an ArF excimer laser light source is supplied to a beam shaping optical system (not shown).
- the light enters the fly-eye lens 204 through a vessel or the like.
- an aperture stop plate 205 for the illumination system is rotatably arranged.
- Circular aperture stop 205 a for normal illumination, small circle for small coherence factor ( ⁇ value)
- a shaped aperture stop 205b, a ring-shaped aperture stop 205c for annular illumination, and an aperture stop 205b for deformed illumination composed of a plurality of eccentric small apertures are arranged. Note that more illumination system aperture stops may be provided as necessary.
- the main control system 234 that controls the overall operation of the apparatus rotates the aperture stop plate 205 via the drive motor 206 to apply the light to the exit surface of the fly-eye lens 204. It is configured so that a desired illumination system aperture stop can be arranged.
- the main control system 234 also includes a computer for calculating the amount of deformation of the reticle, the amount of correction of the imaging characteristics, and the like, as described later.
- a part of the exposure light IL that has passed through the aperture stop on the exit surface of the fly-eye lens 204 is reflected by the beam splitter 207, and then enters an integrator sensor 208 including a photoelectric detector.
- the detection signal of the integrator sensor 208 is supplied to the main control system 234, and the main control system 234 receives the illuminance (pulse energy) of the exposure light IL on the surface of the wafer 220 from the detection signal, In addition, the integrated exposure amount at each point on the wafer 220 is indirectly monitored. Then, the main control system 234 controls the output of the exposure light source 201 via the power supply device 203 so that the illuminance or the integrated exposure amount monitored in this manner becomes the target value. It controls the decay rate of exposure light by a light amount attenuator (not shown).
- the exposure light IL transmitted through the beam splitter 207 passes through a relay lens (not shown), a reticle blind 210, a mirror 121 for bending the optical path, and a condenser lens 213, and then passes through the reticle 214.
- the pattern in the illumination area of the reticle 214 is applied to the resist through the projection optical system 216 at a predetermined projection magnification of 3 () 3 at 1Z4, 1/5, etc.).
- the image is reduced and projected on an exposure area on 220.
- An aperture stop 2 17 is arranged in the optical Fourier transform plane (pupil plane) for the pattern surface of the reticle 2 14 in the projection optical system 2 16, and the main control system 2 3 4 is driven by the drive system
- the numerical aperture NA of the projection optical system 2 16 is set by controlling the aperture diameter of the aperture stop 2 17 via 2 3 3.
- the arrangement surface of reticle blind 210 is almost conjugate with the reticle plane of reticle 214, and the rectangular shape on reticle 214 is formed by the opening shape of reticle blind 210.
- the shape and size of the illumination area are set.
- the main control system 234 can control the opening shape of the reticle blind 210 via the drive system 211, thereby scanning the illumination area on the reticle 214.
- the direction and the width in the non-scanning direction orthogonal to the direction can be adjusted.
- the width of the illumination region By controlling the width of the illumination region, the illuminance in the scanning direction and the non-scanning direction on the wafer 220 can be adjusted.
- an opening of the reticle blind 210 is provided near the reticle blind 210 (fixed blind) immediately after the start and end of the scanning exposure in order to prevent exposure of unnecessary portions.
- a movable blind for covering is also provided. However, the function of the movable blind may be shared by the reticle blind 210.
- the Z axis is taken parallel to the optical axis AX of the projection optical system 2 16 and the Y axis is set along the scanning direction during scanning exposure (the direction perpendicular to the plane of FIG. 7) in a plane perpendicular to the Z axis.
- the X-axis is taken along the non-scanning direction (the direction parallel to the plane of FIG. 7).
- FIG. 11 shows a drive mechanism of the reticle stage 2 15.
- the reticle stage 2 15 is rotatably mounted on the fine movement stage 2 48, and the fine movement stage 2 48 Is mounted on the coarse movement stage 250 so that it can be finely moved in the X direction by the drive motor 251.
- the coarse movement stage 250 is installed via an air bearing on a pair of guides 252 arranged along the Y direction (scanning direction), and the coarse movement stage 250 is mounted on the guide 2.
- the reticle stage 2 15 is connected via a rotation mechanism 24 9 to the c fine movement stage 2 48 that moves continuously in the Y direction, for example, Is urged toward the rotation mechanism 249 by three tension coil springs 260, and the reticle stage 2 15 rotates with respect to the fine movement stage 248 by the rotation mechanism 249. That is, the reticle stage 2 15 can move continuously in the Y direction. In addition, it is supported so that it can finely move in the X, Y, and rotation directions. Further, a ⁇ -axis movable mirror 254 and an X-axis movable mirror 253 are fixed to one end of the reticle stage 215 on one side and the other end on the + side, and the movable mirror is fixed.
- a laser beam is irradiated to 254 from a ⁇ -axis laser interferometer (not shown), for example, and a laser beam is irradiated to a movable mirror 253 from an X-axis laser interferometer (not shown).
- the X coordinate, the ⁇ coordinate, and the rotation angle of the reticle stage 2 15 are measured by these laser interferometers. These measured values are supplied to the main control system 234 in FIG. 7, and the main control system 234 based on these measured values is transmitted to the reticle stage 215 via a linear motor or the like (not shown). Control the moving speed and position.
- the wafer 220 is sucked and held on a wafer holder (not shown), and the wafer holder is fixed on the sample stage 221, and the vicinity of the wafer 22 (wafer holder) on the sample stage 22 1
- a radiation dose monitor 228 composed of a photoelectric detector is attached, and a detection signal of the radiation dose monitor 228 is supplied to the main control system 234.
- the sample stage 22 1 is fixed on a wafer stage 22 2 which continuously moves the sample stage 2 21 in the ⁇ direction and drives stepping in the X direction and the ⁇ direction.
- the wafer stage 222 also incorporates a stage mechanism for controlling the position (focus position) in the ⁇ direction of the sample stage 221 and the tilt angle.
- an auto focus sensor (hereinafter, referred to as “AF sensors 2 2 6 and 2 2 7”) consisting of a light transmission system 2 26 and a light reception system 2 27 is arranged.
- a plurality of slit images projected obliquely from the system 222 to the surface of the wafer 220 are re-imaged by the light-receiving system 222, and by detecting the amount of lateral shift of the re-imaged image, Focus positions at a plurality of measurement points on which the slit images are projected are detected, and the detection results are supplied to a wafer stage drive system 225.
- the wafer stage drive system 2 25 has a plurality of focus positions detected by the AF sensors 2 2 6 and 2 2 7, with respect to the image plane of the projection optical system 2 16 which is input in advance from the main control system 2 3 4. Auto focus and auto leveling wafers to match the position Drives the Z stage mechanism in stage 2 2 2.
- a movable mirror 222 having a reflection surface orthogonal to the wafer stage 222 is fixed, and a laser beam is applied to the movable mirror 222 from an external three-axis laser interferometer 222, and these are reflected.
- the X- and Y-coordinates and the rotation angle of the sample stage 22 1 (the wafer 220) are measured by the laser interferometer, and the measured values are used as the wafer stage drive system 2 25 and the main control system 2 3 Supplied to 4.
- the wafer stage drive system 222 drives the wafer stage 222 in the X direction and the Y direction based on the measurement values of the laser interferometer 222 and the control information from the main control system 230.
- the wafer stage 22 is synchronized with the movement of the reticle 214 in the + Y direction (or one Y direction) at a speed VR with respect to the rectangular illumination area via the reticle stage 21.
- the wafer 220 is moved to the rectangular exposure area in one Y direction (or + Y direction) at a speed j3'VR (/ 3 is the projection magnification from the reticle 214 to the wafer 220) via the wafer 2
- the pattern image in the pattern area of the reticle 214 is sequentially transferred to one shot area on the wafer 220.
- the wafer stage 222 is stepped, the next shot area on the wafer 220 is moved to the scanning start position, and scanning exposure is repeated in a step-and-scan manner. Exposure is performed on each shot area on the wafer 220.
- the main control system 234 controls the exposure amount for each point on each shot area to a predetermined target value based on the detection signal of the integrator sensor 208.
- the reticle 214 and the optical members constituting the projection optical system 216 expand or deform due to the irradiation heat of the exposure light IL.
- the magnification of the projected image projected onto the wafer 220 and the imaging characteristics such as various aberrations also gradually change, and the target projected image cannot be exposed as it is.
- the imaging characteristics also change due to changes in environmental conditions such as atmospheric pressure.
- the projection exposure apparatus of this example employs a mechanism for measuring the amount of exposure light IL and the environmental conditions, and And a mechanism for correcting the imaging characteristics of the projected image.
- a part of the measurement mechanism of the irradiation amount of the exposure light IL is the irradiation amount monitor 228 on the sample stage 221.
- the irradiation amount monitor 228 is configured to measure the amount of exposure light IL that has actually passed through the projection optical system 216, and the position of the image plane (best focus position) of the projection optical system 216 is determined. Even if it changes, the light receiving surface of the irradiation amount monitor 222 can be positioned at the best focus position by driving the wafer stage 222 in the Z direction.
- a silicon photodiode / photomultiplier can be used as the dose monitor 228, a silicon photodiode / photomultiplier can be used.
- the irradiation amount monitor 228 is installed on the wafer stage 222, but only the focusing optical system is incorporated on the wafer stage 222, and the light is collected by this focusing optical system.
- the exposure light obtained may be guided to an external irradiation amount monitor 228 via a relay optical system, an optical fiber, or the like.
- the exposure light IL reflected by the wafer 220 returns to the beam splitter 207 through the projection optical system 216, the reticle 214, and the condenser lens 213, etc.
- the light beam reflected by the beam splitter 207 enters a reflectance sensor 209 composed of a photoelectric detector, and a detection signal of the reflectance sensor 9 is supplied to a main control system 234.
- the main control system 234 calculates the reflectance of the wafer 220 based on the detection signal of the reflectance sensor 209.
- the projection is calculated from the sum of the illuminance (pulse energy) of the exposure light IL measured by the irradiation amount monitor 228 and the illuminance obtained by multiplying the illuminance by the reflectance detected via the reflectance sensor 209. The energy per unit time of the exposure light IL passing through the optical system 216 is determined.
- the reticle 2 14 when measuring the amount of light that has passed through the projection optical system 2 16 using the irradiation amount monitor 2 28, the reticle 2 14 It is also affected by transmittance fluctuations.
- This A transmission window is provided on the reticle stage 215 in order to avoid the influence of the transmittance fluctuation of the reticle 214.
- light-transmitting windows 255 and 256 made of through holes are formed at two places on the reticle stage 215 that sandwich the reticle 214 in the scanning direction (Y direction). ing.
- the irradiation amount monitor 2 28 is arranged in the exposure area on the wafer stage 222 side and the reticle 214 is scanned in the + Y direction, the light transmission window 2 on the + Y direction side is used.
- the detection signal of the dose monitor 2 28 is taken in, and the reticle 2 14 is scanned in one Y direction.
- 56 is in the exposure light illumination area, by detecting the detection signal of the irradiation amount monitor 222, the amount of light that has passed through the projection optical system 211 without passing through the reticle 214 is detected. it can.
- an illuminance sensor 257 composed of a photoelectric detector is installed near the light transmission window 256 on the reticle stage 215, and an illumination area on the reticle 216 near this illuminance sensor 257.
- a reference reflector 258 having an area larger than that of the reference reflector 258 is provided.
- the detection signal of the illuminance sensor 257 is supplied to the main control system 234 of FIG. 7, and the illuminance of the exposure light IL on the reticle 214 can be detected with high accuracy by the illuminance sensor 257.
- the transmittance variation of the illumination optical system after the beam splitter 2007 can be measured without being affected by the transmittance variation of FIG.
- a silicon photodiode, a photomultiplier, or the like can be used as the illuminance sensor 255 in FIG.
- the illuminance sensor 257 only the condensing optical system is incorporated on the reticle stage 215, and the exposure light condensed by this condensing optical system is relay optical system or optical fiber.
- the illuminance sensor 257 may be guided to an external illuminance sensor 257 via the like. In this case, since the illuminance sensor 257 does not need to be set on the reticle stage 215, the reticle stage 215 due to the heat generated by the illuminance sensor 257 is not necessary. Deterioration of positioning accuracy and the like can be prevented.
- a pressure sensor 229 is provided inside the projection optical system 216 (inside the lens barrel), and the measured value of the pressure sensor 229 is measured. Is supplied to the main control system 2 3 4. Further, the temperature and pressure of the gas surrounding the projection optical system 2 16 measured by the temperature sensor 230, the pressure sensor 2 31 and the humidity sensor 2 32 provided near the projection optical system 2 16 respectively. , And humidity information are also supplied to the main control system 234.
- an imaging characteristic correction unit 218 is provided inside the projection optical system 216, and the main control system 234 is connected to the imaging characteristic correction unit 219 via the imaging characteristic control unit 219. It is configured such that a predetermined imaging characteristic can be corrected by displacing a predetermined lens constituting the 218.
- the configuration of the imaging characteristic correction unit 218 will be described with reference to FIG.
- FIG. 8 shows the internal configuration of the projection optical system 211 of the projection exposure apparatus of this example.
- five lens groups 23 out of a plurality of lens groups constituting the projection optical system 211 are shown.
- 6 to 240 are supported such that they can be driven by telescopic drive elements 2422 to 246 such as corresponding piezoelectric elements (piezo elements, etc.).
- Each of the driving elements 242 to 246 is composed of three driving elements, and can move the corresponding lens groups 236 to 240 in the optical axis direction of the projection optical system 216. It can be tilted with respect to a plane perpendicular to the optical axis, which changes the corresponding imaging characteristics.
- the corresponding driving element 2 42 to 246 are driven by an amount corresponding to the correction amount. Thereby, the predetermined imaging characteristic is corrected.
- the two lens groups 2 36 and 2 37 on the reticle 2 14 side are configured to be driven collectively by the driving element 2 43.
- Each of the three lens groups 238, 239, and 240 on the side of the lens 220 can be driven independently, and each of the two lens groups on the upper and lower sides is driven by driving one lens group.
- the interval can be changed at the same time.
- This method has an advantage that the driving amount of the lens groups 2336 to 240 can be reduced as a whole. It should be noted that the relationship between the driving amount of each lens group 236 to 240 and the amount of change in the imaging characteristics indicates that the above two lens groups 236 and 237 are not driven together.
- the following two groups (for example, lens groups 239, 240) may be collectively driven, and which method is used depends on each lens group 2 3 6 for correction. Drive amount of up to 240 and each lens group 2
- a parallel plane plate 241 is installed so as to be driven by a driving element 247, and an image forming characteristic control unit 2 is provided.
- the eccentric coma aberration is mainly corrected.
- a parallel plane plate 2 35 is installed.
- FIG. 9 is a plan view showing the lens group 23 6 in the projection optical system 21 6 of FIG. 8.
- the lens group 23 36 is held in a metal lens frame (not shown).
- This lens frame has three drive elements 2 4 2 a, 2 4 2 b, 2
- the driving elements 242a to 242c are represented by one driving element 242 in FIG.
- the three drive elements 242 a to 242 c are independently extended and contracted in the Z direction, thereby driving and tilting the lens group 236 in the Z direction (optical axis direction).
- position sensors are disposed at positions (driving points) where the driving elements 242 a to 242 c are disposed, and the position sensors are detected by these position sensors.
- the information on the amount of expansion and contraction of the driving elements 2 4 2 a to 2 4 2 c is supplied to the imaging characteristic control unit 2 19, and the amount of expansion and contraction detected by the imaging characteristic control unit 2 19 becomes the target value
- Drive elements 242a to 242c are driven by the closed-lipped method as described above.
- the position sensor for example, a capacitance type gap sensor, an optical or magnetic linear encoder, or an interferometer can be used.
- the positions of the lens groups 236 to 240, the parallel flat plate 241, and the parallel flat plate 235 in the projection optical system 2 16 in the Z direction, and the inclination angle By changing the combination, various imaging characteristics can be corrected to a predetermined state.
- the parallel flat plate 235 When the parallel flat plate 235 is installed at a position close to the reticle 214 as in this example, the exposure light transmitted through the reticle 214 is applied to the pupil plane (optically with respect to the reticle pattern surface). Unlike the near (Fourier transform plane), it is separated at the position of the parallel plane plate 2 35. Therefore, when the projection optical system 211 is a reduced projection optical system, there is an advantage that processing accuracy can be reduced. Conversely, if the projection optical system 2 16 is an equal-magnification projection optical system, the parallel plane plate 2 35 may be installed on either the reticle 214 side or the wafer 220 side. In the case where 16 is an enlarged projection optical system, a similar effect can be obtained by installing a parallel plane plate 2 35 on the wafer 220 side.
- the imaging characteristics are corrected by driving each of the lens groups 236 to 240 and the plane-parallel plates 235 and 241.
- a mechanism that corrects the imaging characteristics by sealing the space between some of the lenses and changing the internal pressure may be employed. That is, in FIG. 1, by controlling the pressure of the gas in a predetermined space 218 A in the projection optical system 216 by the imaging characteristic control unit 219 A, the imaging characteristics such as magnification can be improved. It may be corrected.
- a mechanism for controlling the internal pressure between the lenses and a mechanism for driving the lens or the plane-parallel plate as described above may be used in combination. Further, a mechanism for controlling the position and tilt angle of the reticle 214 in the Z direction may be combined.
- this temperature distribution there is a method of decomposing the reticle 214 into predetermined finite elements, and calculating a temperature change at each point by a difference method, a finite element method, or the like. In this example, the calculation is performed using a relatively simple difference method.
- Figure 12 shows the pattern area 261 of the reticle 214 divided into 5 in the scanning direction (Y direction) and 4 in the non-scanning direction (X direction), that is, divided into 5 X 4 20 blocks.
- the divided blocks are referred to as blocks B 1 to B 20, and the center points of the blocks B 1 to B 20 are referred to as P 1 to P 20.
- the number of divisions and the selection of the calculation method may be determined based on the accuracy required, the calculation speed of the computer, and the like.
- the pattern area 261 is simply divided into 20 for convenience.
- the amount of heat absorbed by the reticle 214 depends on the distribution of the pattern existence ratio. Different for every 20. Therefore, it is necessary to calculate the pattern existence ratio for each of the blocks B 1 to B 20 on the reticle 2 14. However, it is assumed that the amount of heat absorbed is uniform in each block.
- the pattern abundance ratio in each of the blocks B1 to B20 can be obtained from the output ratio between the integration sensor 208 and the irradiation amount monitor 228 on the sample stage 221, as shown in FIG.
- a reticle test reticle
- a reticle having the same shape as the reticle 214 in FIG. 12 and having no pattern drawn is placed at the center in the scanning direction of the blocks B1 to B4 in the illumination area of the exposure light IL. Positioning is performed so as to substantially coincide with the center (in this example, the optical axis AX of the projection optical system 216).
- the center of the irradiation amount monitor 222 is sent to almost the center of the exposure area by the projection optical system 216. Since the dose monitor 228 must receive all the exposure light radiated onto the wafer 220 and detect the photoelectrode, the light-receiving surface of the dose monitor 228 is It is slightly larger than the exposure area. Then, the irradiation amount of exposure light reaching the sample stage 221 via the test reticle or the like is measured. Then, the shape of the opening of the reticle blind 210 is changed via the drive system 211 to illuminate only the block B1, and the output of the dose monitor 228 is measured. At the same time, the output of the Integra sensor 208 is also measured.
- the shape of the opening of the reticle blind 210 is changed, and the blocks B2 to B4 are sequentially illuminated. Measure the output of the INTEGRA overnight sensor 208. Thereafter, the reticle stage 215 is driven to position the centers of the blocks B5 to B8 in the next row in FIG. 12 near the center of the exposure light illumination area, and the blocks are sequentially blocked through the reticle blind 210. Lights B5 to B8 and measure the outputs of the dose monitor 222 and the integer sensor 208, respectively. Further, the same measurement is performed for the following blocks B 9 to B 12, B 13 to B 16, and B 17 to B 20.
- the same measurement as that of the above-described test reticle is repeated, and the dose monitor 222 and the integer gray scale are set for each block B1 to B20. Measure the output of evening sensor 208. Then, the ratio between the output of the dose monitor 222 on the test reticle on which the pattern is not drawn and the output of the integral sensor 208, and the dose monitor on the reticle 214 on which the pattern is drawn Based on the ratio of the output of the 228 and the output of the integrator sensor 208, the pattern existence rate on the reticle 214 is obtained for each of the blocks B1 to B20.
- the output ratio between the dose monitor 2 28 and the integrator sensor 208 may be obtained without the tickle 2 14. In this case, since there is no need to prepare a test reticle, there is an advantage that the throughput of the exposure step is improved and the manufacturing cost is reduced.
- the width of the opening of the reticle blind 210 is measured after being adjusted to the size of the blocks B1 to B20, respectively.
- the size of the reticle blind 210 is expanded to a size that can illuminate all of the blocks B1 to B4.
- the light amounts of the four blocks B1 to B4 may be measured at the same time by using the irradiation amount monitor divided into four. Since the integrator sensor 208 is located on the side of the exposure light source 201 from the reticle 214 and is not affected by the pattern of the reticle 214, the integrator sensor 208 in blocks B1 to B4 is used. There is no problem if the same value is used for the output of.
- the light receiving surface of the integrator sensor 208 at a position conjugate with the pupil plane of the projection optical system 211, the influence of the pattern of the reticle 214 can be reduced.
- the light receiving area of the integrator sensor 208 does not need to be large enough to receive all of the exposure light, and the size of the entire illumination optical system can be reduced.
- the pattern presence ratio of the reticle 214 may be measured each time the reticle 214 is replaced, or may be measured in advance at the time of manufacture of the reticle 214, for example, to the main control system 234. You may memorize it. In this case, a decrease in throughput during exposure can be prevented. If the areas of the blocks B 1 to B 20 that divide the reticle 2 14 are equal, the area of the light receiving surface of the irradiation amount monitor 2 28 is set to a size corresponding to the area of each block, and the pattern efficiency is determined. At the time of “determination”, the amount of transmitted light on the entire surface of the reticle 214 may be measured by moving the irradiation amount monitor 222 through the wafer stage 222.
- each block absorbs heat in proportion to the illuminance of the exposure light IL (proportional to the power of the exposure light source 201) and the pattern abundance.
- the absorbed heat moves to the air or to the reticle stage 215 by radiation or diffusion. Heat transfer also occurs between the blocks.
- the heat transfer in this case is basically proportional to the temperature difference between the two objects.
- the rate of change of temperature due to heat transfer is proportional to the amount of heat transfer.
- block B1 exchanges heat (heat conduction) with the adjacent blocks # 2 and # 5.
- the block # 1 also exchanges heat with the surrounding air / reticle stage 215, but for the sake of simplicity, the amount of change in the air temperature and the temperature of the reticle stage 215 depends on each block # 1 to # 20. It is assumed that the temperature is very small compared to the change in temperature, and the temperature of the air and the reticle stage 215 is always constant. Then, the temperature of each block ⁇ 1 ⁇ ⁇ 20 Ding, ⁇ ! ⁇ .
- the air temperature When the temperature of the cycle stage 2 1 5 and T H, the following equation holds with respect to the block B 1.
- D is a coefficient representing the ratio of the portion illuminated by the illumination light in the block ⁇ 1, and takes a value of 0 to 1.
- Block ⁇ 1 When illumination light is applied to the entire surface, D
- the value of D t is the position of the reticle stage 2 1 5, obtained by calculation from the opening area of ⁇ beauty reticle blind 2 1 0.
- k p is a coefficient that relates the amount of heat absorbed by each block to the illuminating light and 7] ⁇ P.
- the last term in the above equation shows the amount of heat absorbed from the illuminating light, and the other terms are the variances. Shows the amount of heat to be applied.
- the calculation cycle may be determined based on the computer's capabilities and the required accuracy. If the computation cycle coarse for the required accuracy, the coefficient P and the coefficient D, the calculation cycle and to D 2D It is necessary to memorize it as the average value between.
- Coefficient P i P When calculating the power, it is possible to improve the calculation accuracy by sequentially measuring the output of the integer sensor 208 and measuring the power fluctuation of the exposure light source 201. When the calculation cycle is sufficiently fine for the required accuracy, the coefficients P, to P 2 . And engaging number D i ⁇ D 2. It is good to use the value at the moment of calculation. In this case, there is an advantage that the program can be simplified and the memory for the combination can be saved because it is not necessary to store the average value.
- each coefficient k R , k 0 , k H) k p can be obtained by calculation from the physical properties of the reticle 214, the physical properties of air, the flow velocity of air, and the like. Alternatively, experiments may be performed on various reticles, and the coefficients may be determined so as to best match the actual situation.
- Temperature distribution of reticle 2 1 4 found! From the expansion coefficient of the reticle and the reticle 2 1 4 (Shi Ying glass), the change in the mutual distance between the center points P 1 to P 20 of each block B 1 to B 20 can be obtained. The displacement of each point on 14 can be determined. Based on this, it is possible to calculate the fluctuation of the imaging characteristics, for example, the distortion of the image projected on the wafer 220 and the like.
- the reticle has a different coefficient or the like representing the conduction of heat with air.
- the air around the reticle 2 14 is calculated as air.
- the same method can be applied to another fluid.
- nitrogen is used as another fluid, ozone is prevented from being generated when the exposure light source 201 is an ArF excimer laser light source or the like, that is, there is an advantage that absorption of exposure light by oxygen is eliminated.
- helium in addition to the effect of preventing ozone generation, since the refractive index is smaller than that of air or nitrogen, the change in the imaging characteristics of the projection optical system 216 when the atmospheric pressure changes There is also an effect of reducing the amount, and the driving amount of the imaging characteristic correction unit 218 can be reduced.
- the temperature distribution ⁇ of the reticle 214 is calculated once, then the motion of the center point P of each block is calculated, and the image distortion is calculated.
- ⁇ direct image distortion (distortion) is used.
- imaging characteristics such as field curvature) can also be calculated.
- the coefficients k R , k 0 , k H , and k p are obtained by experiments, deformations due to the deflection of the reticle 214 are also included in the calculation.
- the reticle 214 expands in a similar manner.
- the complicated calculation as described above is not necessary, and the image distortion may be calculated by a simpler calculation.
- FIGS. 13 (a) to 13 (g) show an example of the relationship between the Y coordinate of the reticle 214 and each component of the decomposed thermal deformation and the correction amount corresponding thereto.
- the horizontal axis represents the position (Y coordinate) of the reticle 214 in the scanning direction
- the vertical axis represents the amount of thermal deformation or correction of the reticle 214 corresponding to the Y coordinate.
- the dotted curves C1 to C7 represent the calculated values of the deformation amount
- the solid curves D1 to D7 represent the corresponding correction amounts.
- the X magnification 1 in Fig. 13 (a) is the magnification change amount calculated from the movement amount in the X direction between the outer center points P1 and P4 in Fig. 12.
- the X magnification 2 in (b) is the amount of movement in the X direction between the inner center points P2 and P3. This is a magnification change amount calculated from the above.
- the X magnification slope 1 in Fig. 13 (c) is a value calculated from the difference in the amount of movement in the X direction between the outer center points P1 and P4, and the X magnification slope in Fig. 13 (d). 2 is a value calculated from the difference in the amount of movement in the X direction between the inner center points P 2 and P 3.
- the amount of thermal deformation increases on the side of blocks ⁇ 3 and ⁇ 4, and the magnification in the X direction is biased.
- the Y shift in Fig. 13 (e) is the average movement of the center points P1 to P4 in Fig. 12 in the Y direction
- the rotation in Fig. 13 (f) is the center point P1 to P4
- the X shift in Fig. 13 (g) is the average X direction of the center points P1 to P4. Represents the amount of movement.
- Each of the above components is calculated every time the reticle 214 is sequentially moved in the Y direction by a predetermined step amount.
- FIG. 14 shows an example of the value ⁇ of the X magnification 1 obtained at each position of the Y coordinate.
- the value of the Y coordinate is defined as y
- the value of the X magnification 1 corresponding to the Y coordinate is defined as ⁇ (y).
- Equation 6 the following function in which the differential coefficients of three points excluding the end points among the five points are added as calculation conditions may be used.
- Equation 7 is a 7th-order function that passes through 5 points, and the 7th-order function can be uniquely obtained from a total of eight pieces of information including the condition that passes through 5 points and the derivative of 3 points. This function is smoother at each point than the quartic function passing through the above five points. In order to further improve the calculation accuracy of the amount of thermal deformation, it is desirable to consider the deformation of the reticle 214 outside the pattern area.
- FIG. 15 shows a model in which calculation points are provided outside the pattern area 261 of the reticle 214, and calculation is performed.
- calculation points 267 are also provided around the pattern area 261.
- the model function expressing the value f (y) of the X magnification 1 is as follows, as in (Equation 7). 2xa-S
- n 7.
- This function is also smooth at the two center points at both ends in the pattern area 2 61.
- the other components shown in Figs. 13 (b) to 13 (g) are similarly represented as functions of the Y coordinate.
- the components of these imaging characteristics that have been functioned are stored in the storage unit in the main control system 234 in FIG. 7, and the main control system 234 cancels out the stored components as an example. The respective imaging characteristics are corrected as described above.
- FIG. 16 shows a model in which only a part of the pattern area is exposed without using the entire pattern area.
- a part of the area in the pattern area of the reticle 214 is shown. Only 2 shall be exposed.
- the amount of thermal deformation is calculated at the measurement points including the entire pattern area 261, as shown in Fig. 12 or Fig. 16, but actually, Fig. 13 (a) to 13 (g)
- the thermal deformation data used to decompose into each component is only the thermal deformation data of the measurement points (the center point of each block) in a part of the area 262.
- the thermal deformation of the reticle 2 14 As shown in Fig. 17 (b), the calculation point of the quantity is set as the area 2 64 which is obtained by expanding the area 2 63 by one block in the X direction, and the measurement data in the area 26 3 is obtained when obtaining each component. You may use it.
- the area to be exposed is the area 2 65 at the end of the pattern area as shown in FIG. 18 (a)
- the calculation point of the amount of thermal deformation is set to one block inside the area 2 65.
- the extended area 2 6 6 may be used.
- calculation points may be provided outside the pattern area.
- the scanning direction of the reticle 214 is changed from the + Y direction to the ⁇ Y direction or from the one Y direction to the + Y direction every time the exposure to the next shot area is started.
- the direction is reversed.
- the function representing the above-described imaging characteristic is a function corresponding to the Y coordinate, the function can be applied as it is even when the scanning direction is switched.
- a method may be used in which the values of the above functions are stored in the memory at regular intervals of the Y coordinate, and the values of the Y coordinate are not directly stored. In this case, there is an advantage that the storage capacity of the memory can be saved.
- the order of the addresses to be read out may be reversed from that in the forward direction scanning, and each component of the imaging characteristic may be ejected from the memory.
- X magnification 1 and X magnification 2 in FIGS. 13 (a) and (b) are obtained by driving the five lens groups 2 36 to 240 of the projection optical system 2 16 in FIG. 8 in the optical axis direction. Can be changed.
- the ratio between the X magnification 1 and the X magnification 2 of the reticle 2 14 and the ratio of the magnification change amount of the image height equal to the X magnification 1 and the X magnification 2 when a certain lens group is driven are Since they do not match, it is necessary to simultaneously drive at least two lens groups to correct X magnification 1 and X magnification 2 at the same time. At this time, the other imaging characteristics
- the lens units are driven simultaneously, and the five lens units 236-240 are driven to change the X magnification 1 and X magnification 2 to predetermined values, thereby causing curvature of field, coma, and spherical surface. Variation in aberration can also be suppressed.
- the number of lens groups 2 36 to 240 to be performed may be reduced. If the change in magnification of the intermediate image height between X magnification 1 and X magnification 2 due to the correction cannot be ignored, it is advisable to add one more lens group to be driven and perform correction by driving a total of six lens groups.
- the position of the image plane (best focus position) changes.
- the target value for driving the sample stage 221 in the Z direction is corrected based on the focus position detection results from the AF sensors 222 and 227 in Fig. 7. do it.
- the target value of the Z coordinate of the sample stage 2 21 may change according to the Y coordinate.
- the correction may be performed by adding a function of moving the reticle 214 up and down in the optical axis direction. In this case, when a reduction projection system is used as the projection optical system 2 16, there is an advantage that the positioning accuracy in the optical axis direction may be somewhat coarse.
- the X magnification tilt 1 and X magnification tilt 2 are obtained by moving the five lens groups 2 36 to 240 in Fig. 8 in the X direction with respect to the optical axis (parallel to the ⁇ axis). (Around the axis). Normally, the ratio between the X magnification tilt 1 and the X magnification tilt 2 of the reticle 2 14 and the magnification tilt of the same image height as the X magnification 1 and X magnification 2 when a certain lens group is tilted.
- the ratios of the amounts of change do not coincide with each other, at least two lens groups must be simultaneously tilted in the optical axis direction to correct the X magnification tilt 1 and the X magnification tilt 2 at the same time.
- the other imaging characteristics image plane inclination, coma inclination, spherical inclination
- the X magnification tilt 1 and the X magnification tilt 2 are set to predetermined values, and the image plane tilt, coma tilt, and spherical aberration tilt are set. Suppress change.
- the tilt amount of the coma aberration and the spherical aberration generated by tilting the lens groups 236 to 240 are small and may be ignored. In such a case, the number of tilting lens units may be reduced. If the change in magnification of the intermediate image height between the X magnification tilt 1 and the X magnification tilt 2 cannot be ignored, one more lens group is added, and the image forming characteristics are obtained by tilting a total of six lens groups. Should be corrected.
- the inclination of the coma aberration may be corrected by inclining the parallel plane plate 241 at the tip of the projection optical system 216.
- the change in the imaging characteristics caused by tilting the parallel plane plate 241 at the tip of the projection optical system 216 is largely due to the tilt of coma, correction with high independence becomes possible.
- the amount of inclination of the lens groups 236 to 240 can be reduced.
- the image plane tilt that occurs when the normal lens groups 236 to 240 are tilted also causes an astigmatism tilt at the same time.
- correction may be performed by changing the relative parallelism between the reticle 214 and the wafer 220.
- the amount of tilt can be small, and when the reticle 214 is tilted, the positioning can be relatively loose.
- the amount of tilt on the wafer 220 side is reduced, and fine positioning is performed on the reticle 214 side. be able to.
- the image plane tilt is corrected by tilting the lens groups 236 to 240.However, this correction method is performed by irradiating the projection optical system 216 with the exposure light. If the surface tilts, the lighting conditions (the type of aperture stop for the illumination system, the aperture shape of the reticle blind 210, the pattern of the reticle 214, and the aperture stop of the projection optical system 211) It can also be applied when correcting the image plane tilt caused by changing the aperture shape, etc., or the image plane tilt generated when the flatness of the wafer 220 or reticle 214 is poor. .
- the position of the pattern image of the reticle 214 projected onto the wafer 220 may be slightly shifted. is there.
- the relationship between the tilt angle of the lens groups 236 to 240 and the shift amount of the image position must be obtained by experiment and stored in advance.
- the total shift amount is obtained from the stored relationship, and the X shift correction described later is performed.
- the correction may be made by adding the amount and the Y shift correction amount.
- the Y shift in FIG. 13E is corrected by shifting the relative position between the reticle 214 and the wafer 220 in the Y direction.
- the reticle 214 changes in the direction in which the magnification increases due to exposure light absorption, and as a result, the relative speed between the reticle 214 and the wafer 220 changes according to the Y coordinate of the reticle 214. do it.
- the Y shift amount Is obtained, and correction is performed by changing the scanning speed of the reticle 214 so as to cancel the Y shift amount according to the Y coordinate.
- the correction is performed including the ⁇ shift amount generated by driving and tilting of the lens groups 236-240 in FIG.
- the scanning speed of the reticle 214 is increased, and conversely, the scanning speed of the reticle 214 is increased. Slow down.
- the ⁇ shift may be corrected in the wafer stage 222. In this case, when the ⁇ shift occurs as the reticle 2 14 expands in the ⁇ direction, the scanning speed of the wafer stage 222 is reduced, and conversely, the scanning speed of the wafer stage 222 is reduced. Make it faster.
- the rotation component in FIG. 13 (f) is corrected by changing the relative rotation amount between the reticle 214 and the wafer 220. That is, the reticle 214 may be rotated by the rotation mechanism 249 on the reticle stage 215 shown in FIG. At this time, when the blocks 81 to 84 of the reticle 2 14 in FIG. 12 are illuminated, the center points P 1 to P 4 of the blocks B 1 to B 4 move in the scanning direction with respect to the illumination area. The amount of rotation is controlled according to the Y coordinate so that it is perpendicular to the axis. The rotation may be corrected on the wafer 220 side. In this case, a rotation mechanism (not shown) is also provided on the wafer stage 222 side, and the rotation mechanism rotates the wafer 220.
- the X shift in Fig. 13 (g) is corrected by shifting the reticle stage 2 15 in the X direction. At that time, the correction is made to include the X shift amount generated by driving and tilting the lens groups 236 to 240. At this time, when the blocks B1 to B4 of the reticle 2 14 are illuminated, the center points P1 to P1 of the blocks B1 to B4 with respect to the illumination area.
- the X shift amount is controlled according to the Y coordinate so that the shift amount of 4 becomes the shift amount at the center of the illumination area. Note that the X shift may be corrected on the wafer 220 side. In this case, same as X shift The wafer 220 may be shifted in the X direction by an amount of 49.
- the reflectance R of the wafer 220 is determined.
- two reflectors (not shown) having a size to cover the rectangular exposure area and having reflectances of RH and RL (RH> RL) are installed. It is.
- the wafer stage 222 is driven to move the reflector having the reflectance RH to the exposure area of the projection optical system 216.
- the illumination conditions (the type of the illumination system aperture stop, the aperture shape of the reticle blind 210, the pattern of the reticle 214, and the aperture shape of the aperture stop 217 of the projection optical system 211) are set in a predetermined state. Then, the output VH of the reflectance sensor 209 is measured while moving the reticle 214 in the Y direction by a predetermined distance. Next, by driving the wafer stage 222, the reflector having the reflectance RL is moved to the exposure area of the projection optical system 216, and the output of the reflectance sensor 209 is moved while moving the reticle 214 in the Y direction by a predetermined distance. Measure VL.
- FIG. 19 shows the relationship between the measured reflectance of the wafer 220 and the output of the reflectance sensor 209.
- the horizontal axis represents the measured reflectance R
- the vertical axis represents the reflectance sensor 209.
- the relationship between 209 and the output V can be represented by a straight line (linear function).
- the reflectance R was obtained from a separate linear relationship according to the Y coordinate.
- the reticle 2 1 4 It is not necessary to calculate the reflectance R according to the Y coordinate of the image, and a method of calculating the average reflectance during scanning may be employed. That is, when measuring the reflectance of the two reflectors, the relationship between the reflectance and the output of the reflectance sensor 209 is not determined for each Y coordinate, but is determined as an average value during scanning, and thus depends on the Y coordinate. You can get a relationship that doesn't. In this case, there is an advantage that it is not necessary to store the output of the reflectance sensor 209 corresponding to the Y coordinate.
- the wafer stage 222 in FIG. 7 is driven to move the irradiation amount monitor 228 to the exposure area of the projection optical system 216.
- the reticle 2 14 is set on the reticle stage 2 15, and the illumination conditions (type of illumination system aperture stop, reticle blind 210 opening shape, reticle 2 14 pattern, and projection optical system 2 16) an aperture stop 2 1 7 of the opening shape, etc.) to illuminate the irradiation monitor 2 2 8 in the predetermined state, the output I. output P M and the Integrated evening sensor 8 2 0 of irradiation monitor 22 8 at that time Is stored.
- the calculation may be performed by the following equation using the output I of the integrator sensor 208 and the reflectance R obtained from the reflectance sensor 209.
- M h , K m , and Tm are a magnification change amount, a magnification change coefficient, and a time constant of the projection optical system 2 16 due to exposure light absorption, respectively.
- the output I of the integer sensor 208 has a role of measuring the change over time of the irradiation amount of the exposure light source 201 and a role of determining whether the exposure light is incident on the projection optical system 216. There are two roles. Note that the reticle stage 2 1 shown in FIG. 11 was used to measure the change over time of the irradiation amount of the exposure light source 201. Using the light-transmitting windows 2 5 5 and 2 5 6 above, one of the light-transmitting windows 2 5 5 and 2 5 6 drives the reticle stage 2 15 within the illumination area every time one shot is exposed.
- the wafer stage 2 22 may be driven to move the dose monitor 2 28 to the exposure area, and the dose of the exposure light source 201 may be measured by the dose monitor 2 28 .
- the scanning direction of the reticle 214 at the time of exposure is forward and reverse to the Y axis.
- the light transmissive windows 255, 256 can be moved into the illumination area while scanning continues, so that the exposure from the end of one shot to the measurement of the exposure amount of the exposure light source 201 can be performed. There is an advantage that time is shortened.
- the optical system from the beam splitter 207 to the condenser lens 21 in FIG. 7 and the projection optical system 216 in FIG. It is possible to accurately measure a change in the energy arrival ratio from the exposure light source 201 to the wafer 220 due to a change in transmittance or reflectance.
- the fluctuation time of the exposure light source 201 is sufficiently long with respect to the exposure time of one shot, only one of the light transmission windows 255, 256 is used.
- a method of measuring the transmittance only after scanning and exposing the reticle 214 in the direction of, or a method of measuring the transmittance only when the wafer 220 is replaced may be adopted.
- the reticle stage 215 can be made smaller, there is an advantage that the drivability and positioning accuracy of the reticle stage 215 are improved.
- the aperture will be reduced and the rigidity of the entire reticle stage 215 will be reduced. There is an advantage that is improved.
- the change coefficient and the time constant of each imaging characteristic may be obtained in advance by experiments, or may be obtained by calculation by simulation of heat conduction.
- the change coefficient and the time constant of the imaging characteristic may be changed.
- the aperture stop 20 Subtle changes in imaging characteristics due to differences between 5a to 205d can also be calculated with high accuracy.
- the change in imaging characteristics due to irradiation heat absorption was a first-order lag system, but a secondary system, a dead time system, or a transfer function combining them was introduced for more accurate calculations. May be.
- the atmospheric pressure, temperature, and humidity around the projection optical system 216 are measured via the temperature sensor 230 to the humidity sensor 232 shown in FIG. 7, and the projection is performed via the atmospheric pressure sensor 229.
- the pressure inside the optical system 216 is measured, the magnification change amount of the projection optical system 216 is calculated from these measurement results, and the change amount of the imaging characteristics as a whole is obtained from the following equation.
- M is the total magnification change amount of the magnification change amount due to irradiation of the projection optical system 216 and the magnification change amount due to environmental change
- P 2 is the projection Atmospheric pressure inside the optical system 2
- T is the temperature around the projection optical system 2 16 (this can be regarded as the temperature of the projection optical system 2 16)
- H is the temperature around the projection optical system 2 16 Humidity.
- K BPI is a magnification change coefficient for a change in atmospheric pressure around the projection optical system 211
- K BP2 is a magnification change coefficient for a change in air pressure inside the projection optical system 216
- is a temperature of the projection optical system 216.
- the magnification change coefficient for the change, KBh is a magnification change coefficient for a humidity change around the projection optical system 211 .
- a fluid such as dry nitrogen gas may be circulated inside the projection optical system 216 in order to prevent impurities from being mixed into the projection optical system 216 and fogging the lens surface.
- a pressure sensor 2 2 is provided between the inside and the periphery of the projection optical system 2 16.
- 9 and 2 3 1 are arranged.
- the lens surface of the projection optical system 2 16 closest to the reticle 2 14 and the lens surface closest to the wafer 220 are the air pressure around the projection optical system 2 16 Sensor 2 53
- the magnification change due to the atmospheric pressure change is calculated using the measured value of 31 and the measured value of the atmospheric pressure sensor 229 inside the lens for the other lens surfaces.
- air, nitrogen, helium, or the like is selected as the fluid circulated inside the projection optical system 211. Air is selected primarily to avoid contamination. Nitrogen is selected to avoid generating ozone by reacting with oxygen when a short wavelength light source (for example, an ArF excimer laser light source) is used as the exposure light source 201. Helium is selected mainly to suppress changes in imaging characteristics due to changes in the atmospheric pressure of the projection optical system 211. Of course, the magnification change coefficient for the pressure change is changed according to the fluid.
- the pressure in a predetermined closed space (airtight chamber) between a plurality of lenses may be adjusted to change the imaging characteristics.
- the field curvature that cannot be corrected by driving the lens groups 236 to 240 is adjusted by adjusting the pressure in a predetermined closed space (airtight chamber) between the plurality of lenses 236 to 240. This can be corrected.
- the air pressure around the projection optical system 2 16 and the inside of the projection optical system 2 16 are almost the same, only one atmospheric pressure sensor 2 229, 2 31 may be used. If the difference in temperature and humidity between the inside and outside of the projection optical system 211 poses a problem in terms of accuracy, the same sensor as the temperature sensor 230 or the humidity sensor 232 is installed in the projection optical system 216. The temperature and humidity terms in the above equations may be calculated using the outputs of the two sensors inside and around the projection optical system 2 16 as in the case of the atmospheric pressure.
- the amount of change in the imaging characteristics is calculated as being proportional to the amount of change in each environment.However, in order to obtain the imaging characteristics with higher accuracy, for example, a first-order lag system with respect to temperature is used. A time-delay system considering heat transfer and heat transfer, or a transfer function of a combination thereof may be adopted. Any model can be used as long as it can calculate the amount of change in imaging characteristics due to changes in temperature, humidity, and atmospheric pressure.
- the magnification change amount of the projection optical system 2 16 is obtained. Further, changes in other respective imaging characteristics can be obtained by the same method.
- image characteristics a change in magnification C at two image heights, a change in C coma aberration C 3 , a change in spherical aberration C 4 , and a change in field curvature C s are calculated.
- the amount of change and the time constant are experimentally obtained and stored.
- the calculation may be performed by changing the magnification change amount and the time constant according to the change in the illumination condition. Further, since the changes Te cowpea the lighting conditions change offset change amount C t -C 5 each imaging characteristics, the offset change amount C t C s of the imaging characteristics in various lighting conditions previously experimentally It is obtained and stored, and at the time of exposure, the offset of the amount of change of each imaging characteristic is added to the amount of change of each imaging characteristic C i -C 5 in accordance with the illumination condition, and is corrected. As for the correction of the best focus position, the AF sensor 226,
- the offset may be added and corrected by an autofocus mechanism including 227.
- a plurality of types 35 can be switched as in the case of the aperture stop 205a to 205d of the illumination system.
- the distance between the reticle 214 and the wafer 220 may be sufficient, and the imaging characteristic that can be corrected can be changed depending on the installation location.
- the matrix of (Equation 13) is expressed by 4 rows ⁇ 4 columns. It may be calculated by reducing to Also, in this example, the amount of change in distortion is suppressed by calculating the amount of change in magnification at two image heights.However, the image height of the magnification to be corrected is further increased, and the distortion is further finely corrected. good. For example, when correcting the magnification change at a total of three image heights, one driving lens group is added, and the matrix of (Equation 13) is also extended to 6 ⁇ 6.
- the rotationally symmetric image forming characteristic is corrected.However, since each lens group 236 to 240 is configured to be tiltable with respect to the optical axis AX direction, a non-rotationally symmetric image forming characteristic is obtained. Can also be corrected.
- the tilt components in the X and Y directions for each imaging characteristic are also obtained by the same calculation, and the X direction and Y From the relationship between the tilt angle of each lens group 236 to 240 and the amount of change in imaging characteristics for each direction, solve the 5X5 matrix in the same way as correcting the amount of change in the rotationally symmetric imaging characteristics.
- the inclination angle of each lens group 236 to 240 is determined.
- the matrix may be reduced or expanded according to the degree of change in the imaging characteristics.
- the factors that change the best focus position include those due to irradiation, those due to environmental changes, those due to the driving of the lens groups 236 to 240, and those due to changes in lighting conditions.
- the change in the best focus position due to the irradiation heat and the change in the best focus position due to the environmental change may be calculated and calculated in the same manner as the above-described change in the magnification of the projection optical system 216.
- the amount of change in the best focus position due to the driving of the lens group 236-240 when compensating the respective imaging characteristics is determined by the driving amount of the lens group 236-240 and the lens group 23.
- the wafer 220 may be deformed isotropically or anisotropically by a process such as development or etching after exposure. In this case, it is necessary to correct the imaging characteristics according to the wafer 220. If the amount of deformation of the wafer 220 is known, the imaging characteristics may be corrected in accordance with the amount of deformation of the wafer 220 in the same manner as the correction so far. Further, when the amount of deformation differs depending on the position in the wafer 220, the target value of the correction of the imaging characteristic may be changed accordingly.
- the most common method is to measure the amount of deviation of the alignment mark (wafer mark) on the wafer 220 from the target position using a mark detection sensor for the wafer 220, and determine the amount of deformation of the wafer 220.
- a mark detection sensor a sensor for detecting a diffracted light by applying a He—Ne laser beam to a test mark on a wafer 220 through a projection optical system 216 or a projection optical system 216 is used as a mark detection sensor.
- a separate optical system can be provided and a sensor that detects by image processing in the off-axis system can be used, and the position of the test mark on the wafer 220 can be detected by a measuring device completely different from the exposure device. Then, a method of transferring the measurement data to the exposure apparatus and correcting the data may be used.
- the amount of deformation of the wafer 220 due to the process is known in advance, it is not necessary to measure the amount of deformation of the wafer 220.
- the thermal deformation of the wafer 220 due to the process processing generally has a large isotropic component
- only the isotropic magnification of the wafer 220 may be calculated and corrected.
- the component of the amount of deformation of the wafer 220 to be calculated is only a magnification
- the number of test marks on the wafer 220 can be reduced, and there is an advantage that the measurement time can be reduced.
- the overlay accuracy can be improved.
- the relationship between the reflectance of the wafer 220 and the measurement value of the irradiation amount monitor 228 is experimentally obtained in advance.
- the irradiation variation should be calculated from this relationship.
- the amount of change in the imaging characteristic is calculated for each of the blocks B 1 to B 20 of the reticle 214, and the imaging is performed in consideration of the rotation angle of the reticle 214. Correction of image characteristics is being performed. Therefore, as shown in FIG. 11, it was necessary to install a rotating mechanism 249 on the reticle stage 215, and the reticle stage 215 was heavy as a whole. On the other hand, when importance is placed on throughput, there is a need to reduce the weight of reticle stage 2 15. Therefore, in this example, the imaging characteristics according to the thermal deformation of the reticle 214 are corrected by a simpler mechanism.
- the pattern existence ratio of the reticle 2 14 is measured. Therefore, Figure 7
- the illumination conditions ′ the type of illumination system aperture stop, the opening shape of the reticle blind 210, and The projection optical system 2 16 aperture stop 2 17 aperture shape, etc.
- the wafer stage 222 is driven to move the irradiation amount monitor 228 to the exposure area side of the projection optical system 216, and the effective light receiving area of the irradiation amount monitor 228 powers the exposure area.
- the output P D of the dose monitor 222 are measured and stored.
- the integrator sensor 208 is also used to monitor the power fluctuation of the exposure light source 201. If the lighting conditions at the time of measurement with a test reticle on which a pattern is not drawn are different from the lighting conditions at the time of measurement with a reticle 214 on which a pattern is drawn, the values are converted into the respective lighting conditions. To determine the pattern existence rate. For example, with respect to the reticle blind 2 10 shown in FIG. 20 (a 1), as shown by the openings 2 10 a and 2 10 b in FIGS. 20 (a 2) and 20 (a 3), respectively.
- the width in the direction corresponding to the scanning direction of the opening of the reticle blind 210 (also referred to as the Y direction) is different, the area of the opening at the time of measurement with the reticle 214 on which the pattern is drawn and the pattern
- the output P of the dose monitor 228 to the value of the ratio to the area of the opening when measuring with a test reticle with no pattern drawn. Will be converted in proportion.
- the output of the sensor 208 and the output of the dose monitor 228 May be measured and stored in advance. In this example, a test reticle without a pattern is used, but measurement may be performed without the reticle 214.
- the illuminance measurement on the pattern surface (reticle surface) of reticle 214 will be described.
- the reticle stage 2 15 shown in Fig. 11 is driven to move the illuminance sensor 2 57 on the reticle stage 2 15 to almost the center of the illumination area, and the output W of the illuminance sensor 2 57 is Measure.
- the illuminance may be measured by the irradiation amount monitor 228 through one of the light transmission windows 255 and 256.
- the relationship between the output of the dose monitor 228 and the transmittance of the projection optical system 216 is stored, and the output of the dose monitor 228 is determined by the transmittance of the projection optical system 216.
- the illuminance on the reticle surface can be calculated.
- the illuminance on the reticle surface is calculated in consideration of the projection magnification.
- the relationship between the output of the integrator sensor 208 and the illuminance on the reticle surface is experimentally determined in advance, and the illuminance of the reticle surface is calculated from the output of the integrator sensor 208 during exposure. good.
- throughput is improved because it is not necessary to move the illuminance sensor 255 and the irradiation amount monitor 222 to the illumination area.
- the illuminance sensor 257 which is a heating substance on the reticle stage 215, the thermal stability of the reticle stage 215 can be improved.
- the reflectivity of the reticle 214 is measured.
- a method similar to the reflectance measurement of the wafer 220 is applied.
- two reference reflectors (not shown) whose reflectances are known are provided on the reticle stage 2 15, and these reference reflectors are sequentially moved into the illumination area, and the reflectances shown in FIG. Measure the output of sensor 209.
- the relationship between the reflectance on the reticle surface and the output of the reflectance sensor 209 is obtained as a linear relationship (linear function).
- the reticle 214 used for actual exposure is set on the reticle stage 2 15, the portion where the pattern is drawn is moved into the illumination area, and the output of the reflectance sensor 209 is measured.
- the reflectance of the reticle 214 on which the pattern is drawn can be calculated from the measurement result, the linear relationship between the reflectance previously obtained and the output of the reflectance sensor 209.
- the outermost peripheral portion of the reticle 214 is covered with a chrome pattern, it is preferable to perform reflectance measurement using that portion. If the reflectance of the reticle 214 is known in advance, it is only necessary to store the reflectance of the reticle 214. In this case, there is an advantage that it is not necessary to measure the reflectance and the throughput is improved.
- the thermal deformation of the reticle 214 is calculated from the following equation.
- M x (t) M x (t-At) -exp (- ⁇ ) + x 1 / ⁇ t)
- M ⁇ (t- ⁇ t) is calculated period ratio change in X direction before one
- K x is the saturation value to display the power variation in the X-direction with respect to the irradiation
- T ⁇ is the time constant of the change in magnification in the X direction due to irradiation.
- the suffix ⁇ refers to the magnification in the ⁇ direction.
- the saturation value and the time constant are determined in advance by experiments.
- the above equation is expressed in time series by solving the first-order differentiation method in the same manner as the equation for calculating the change in magnification of the projection optical system 216 due to irradiation in the first embodiment.
- the equation used for the calculation is not limited to the above equation.
- the transfer function with the time constant component expanded to two A transfer function of a dead time system may be introduced.
- each of the lens groups 236 to 240 in FIG. 8 is driven to change the magnification change in the X direction due to the thermal deformation of the reticle 214. Is corrected. If the change in other imaging characteristics is small, only one lens group may be driven. If the other amount of change in the imaging characteristics due to the driving of the lens groups 236 to 240 cannot be ignored, the number of driven lens groups may be increased.
- the magnification change amount in the Y direction is corrected by changing the relative scanning speed between the reticle 214 and the wafer 220. Since the reticle 214 is thermally deformed each time it is exposed, the relative scanning speed is changed for each shot in accordance with the amount of thermal deformation of the reticle 214. If the change of the reticle 214 due to the thermal deformation is gradual, the amount of thermal deformation of the reticle 214 is determined by a predetermined threshold value every time one wafer 220 is exposed, every time several wafers 220 are exposed, at the beginning of the lot process, or at a predetermined threshold. The interval at which the relative scanning speed is changed may be changed, for example, every time the value exceeds.
- the projected image will be in a predetermined state by the respective corrections in the X and Y directions, and the relative scanning between the reticle 214 and the wafer 220 will be performed.
- the speed does not change.
- the contrast of the projected image decreases. This correction method will be described with reference to FIGS. 20 (a1) to 20 (a3) and FIGS. 20 (b1) to 20 (b3).
- FIGS. 20 (a 1) to 20 (a 3) and FIGS. 20 (bl) to 20 (b 3) show the relationship between the width of the reticle blind 210 and the contrast of the projected image.
- FIGS. 20 (b1) to (b3) show the illuminance distributions of the projected images on wafer 220 in the cases shown in FIGS. 20 (a1) to (a3), respectively.
- scanning is performed by setting the width of the opening of the reticle blind 210 to a predetermined width as shown in Fig. 20 (a1). If exposed, the difference Causes a displacement in the position of the projection image.
- the resist applied to the wafer 220 is exposed to light in accordance with the integrated value of the width in the Y direction of the opening of the reticle blind 210, so that the con- Trust drops.
- Fig. 20 (a2) if the width of the opening 210a of the reticle blind 210 is narrowed in the scanning direction and scanning exposure is performed, the displacement of the projected image in the Y It decreases in proportion to the width of the part 210a in the Y direction.
- FIG. 20 (a3) when the width of the opening 2110b of the reticle blind 210 in the scanning direction is further reduced, the contrast of the projected image can be further improved.
- the relationship between the width of the opening of the reticle blind 210 in the Y direction and the contrast of the projected image may be determined in advance, for example, by simulation. At this time, by simulating and storing a plurality of patterns separately, it is possible to set the optimum width of the opening of the reticle blind 210 according to the type of the pattern. For example, in the case of a pattern having a small line width compared to the case of a pattern having a large line width, the width of the opening of the reticle blind 210 in the Y direction may be reduced.
- the exposure amount on the wafer 220 is reduced. Run out.
- the scanning speed between the reticle 214 and the wafer 220 is kept constant (projection magnification) according to the amount by which the width of the opening of the reticle blind 210 in the Y direction is reduced.
- the exposure can be kept constant by slowing down the exposure.
- the exposure light source 201 is increased in power or if the exposure light source 201 is a pulse laser light source such as an rF excimer laser or an ArF excimer laser as in this example, The same effect can be obtained by increasing the oscillation frequency of the light source 201. In this case, since it is not necessary to reduce the scanning speed, it is possible to prevent a decrease in throughput.
- one type of the thermal deformation of the reticle 2 14 is calculated for each of the X direction and the Y direction, but the thermal deformation is large for the required accuracy.
- at least two lens groups to be driven to correct the imaging characteristics are required.
- the number of lens groups to be driven may be increased in accordance with the type of the imaging characteristic that changes due to the driving of the lens groups 236 to 240 in FIG.
- the exposure amount control according to the magnification change amount in the X direction and the magnification change amount in the Y direction of the reticle 214 has been described.
- the magnification change amount of the projection optical system 2 16 is calculated separately in the X direction and the Y direction, similarly to the calculation of the thermal deformation amount of the reticle 2 14. Then, as in the case of reticle 214, in accordance with the residual after the correction of the difference between the magnification change amount in the X direction and the magnification change amount in the Y direction, the Y direction of the opening of reticle blind 210 is changed.
- the exposure amount can be kept constant by changing the width and the scanning speed.
- the relationship between the change in magnification in the X direction and the change in magnification in the Y direction due to irradiation of the projection optical system 216 may be determined by experiments.
- the computer calculates the amount of thermal deformation of the reticle 214 and the amount of change in the imaging characteristics due to the irradiation of the projection optical system 216
- the discrete time is calculated by the calculation interval of the computer. Error may occur.
- the control target value is set so continuously in consideration of the amount of change in the imaging characteristics and the required accuracy. If there is no need to change, a method of changing the control target value discontinuously may be adopted.
- the correction error becomes somewhat coarse, but the same effect as before can be obtained. That is, when the correction amount is small, it can be said that the calculation interval or the change interval of the control target value may be coarse. The same can be said for the correction of the various amounts of change in the imaging characteristics calculated in this example, and when the correction amount is smaller than the required accuracy, The calculation interval or the change interval of the control target value may be made coarse to allow the computer to have a margin.
- the amount of thermal deformation of the reticle 214 is large (the pattern abundance ratio is large and the amount of heat absorption is large)
- the amount of exposure light going to the projection optical system 216 decreases, and Since the fluctuation amount (irradiation fluctuation amount) of the imaging characteristic of the projection optical system 2 16 becomes small, if either the thermal deformation amount of the reticle 2 14 or the irradiation fluctuation amount of the projection optical system 2 16 is larger, The other is in a smaller relationship.
- the pattern existence ratio of the reticle 214 the calculation interval of the thermal deformation amount of the reticle 214, or the change interval of the control target value, and the calculation interval of the irradiation variation amount of the projection optical system 211, or The change interval of the control target value may be changed.
- the reticle 214 is for a contact hole pattern
- only fine contact holes are scattered in the reticle 214, and the pattern area of the reticle 214 is almost covered with a chrome film. Therefore, the pattern existence rate is close to 100%.
- the correction interval of the thermal deformation amount of the reticle 216 and the calculation interval of the irradiation variation amount of the projection optical system 216 are set to lmsec, even if the computer cannot process the data, A small calculation error can be corrected by setting the calculation interval of the irradiation fluctuation amount of the projection optical system 216 to 10 msec while keeping the calculation interval of the thermal deformation amount of the reticle 214 at 1 msec.
- this calculation interval is not limited to the above numerical value.
- the correction interval may be determined based on control guidelines such as avoiding resonance in selecting the correction interval, for example, control stability / response speed.
- the amount of thermal deformation of the reticle 214 is decomposed by the least squares method using the following equation.
- Dx and Dy are the change amounts of the respective distortions in the X and Y directions at each calculated image height
- k 1 Kk 20 is a coefficient representing the amount of deformation for each component
- X and y represent the coordinates of each calculated image height.
- the model is up to the third-order component. However, if it is necessary to perform correction with higher accuracy, the order may be extended to a higher order as necessary.
- Figures 21 (a) to 21 (f), Figures 22 (a) to 22 ( ⁇ ), Figures 23 (a) to 23 (f), and Figures 24 (a) and 24 (b) An example of the distribution of the amount of deformation of the reticle corresponding to the coefficients k1 to k20 for each component of the deformation amount is shown in Figs. 21 (a) to 21 (f), Figs. 22 (a) to 22 (f), In FIGS. 23 (a) to 23 ( ⁇ ) and FIGS. 24 (a) and 24 (b), the state before thermal deformation of the reticle 214 is represented by a white circle grid point 269, and the state after deformation is indicated by a black circle. It is represented by grid point 268.
- FIGS. 21 (a) to 21 ( ⁇ ), FIGS. 22 (a) to 22 (f), FIGS. 23 (a) to 23 ( ⁇ ), and FIGS. 24 (a) and 24 (b) an example of the amount of thermal deformation of the reticle 214 and a correction method thereof will be described for each of the coefficients k1 to k20.
- FIG. 21 (a) shows the deformation of the reticle corresponding to the coefficient k1, and the X shift is generated in a fixed amount regardless of the Y coordinate.
- This can be corrected by shifting the reticle 214 by a fixed amount in the X direction during scanning exposure in FIG.
- the phase of reticle 214 and wafer 220 Since the position in the X direction only needs to be shifted, scanning exposure may be performed by shifting the wafer 220 side by a certain amount in consideration of the projection magnification. Scanning exposure may be performed by shifting both the reticle 214 and the wafer 220.
- FIG. 21 (b) shows a deformation corresponding to the coefficient k2, and also shows a case where a certain amount of Y shift occurs regardless of the Y coordinate. This can be corrected by shifting the reticle 214 by a fixed amount in the Y direction during scanning exposure. Note that, as in the case of FIG. 21 (a), the relative position between the reticle 214 and the wafer 220 in the Y direction may be shifted, so that the correction may be performed on the wafer 220 side. The correction may be performed for both the wafer 214 and the wafer 220.
- X magnification 1 and X magnification 2 of 3 (g) are generated in proportion to each calculated image height. This is corrected by adjusting the magnification change by combining the driving of the lens groups 2336 to 240 in FIG. 8 in the optical axis direction, and then performing scanning exposure.
- the lens groups 2336 to 240 are driven in the optical axis direction, a change in magnification occurs in the Y direction, and the contrast of the projected image is reduced. If this poses a problem, the contrast of the projected image may be adjusted by changing the width of the opening of the reticle blind 210 in the Y direction or the amount of exposure before scanning exposure.
- the correction can be made by inclining the scanning axis of reticle 214 and wafer 220 relatively. If the laser interferometer on the X axis of the reticle stage 215 is configured to always refer to the illumination area of the reticle 214, Accordingly, the offset in the X direction may be changed linearly. The correction may be performed on the wafer 220 side or on both the reticle 214 and the wafer 220.
- the correction can be performed by tilting the scanning axis of the reticle 214 and the scanning axis of the wafer 220 relatively. If the laser interferometer on the X axis of reticle stage 215 is configured to always refer to the illumination area of reticle 214, the rotation of reticle 214 causes the movement mirror 253 of reticle stage 215 to move. (Refer to Fig.
- the reticle 214 also rotates together, so that the reticle 214 is automatically and gradually moved in the X direction by scanning by performing the servo control so that the measured value of the laser interferometer becomes a predetermined value.
- the scanning axis is tilted.
- the rotating mechanism 249 of the reticle 2 14 and the moving mirror 253 of the reticle stage 2 15 are not linked, the reticle 2 14 is rotated by a predetermined amount and shifted in the X direction according to the scanning. The effect of is obtained.
- correction can be made by scanning and exposing after tilting with respect to the optical axis by combining the lens groups 236 to 240.
- the lens groups 236 to 240 are tilted and a magnification tilt occurs, the magnification in the Y direction increases on the side where the magnification is increased, and the magnification in the Y direction decreases on the side where the magnification is reduced.
- the correction may be made by combining a change in the width of the opening of the reticle blind 210 in the Y direction and a change in the exposure amount.
- X magnification 2 has changed. Therefore, the correction can be made by changing the projection magnification according to the scanning position. Specifically, the correction can be made by driving the lens groups 236-240 in the optical axis direction according to the scanning position.
- the correction may be made by combining other components so as to minimize the error.
- the component of coefficient k2 and the coefficient k8 The error can be reduced by correcting with the component. in this case,
- the deformation shown in Fig. 22 (f) also means that the larger the deviation of the X coordinate from the center of the reticle, the more deformed it is in the specific (+ direction or one direction) Y direction. Therefore, as another correction method, scanning is performed while tilting some lenses constituting the projection optical system 216 around an axis parallel to the X axis (in the non-scanning direction), that is, in the Y direction (scanning direction). Exposure may be used.
- the distortion can be corrected by driving each lens group 2336 to 240 in the optical axis direction to correct the X magnification 1 and the X magnification 2 respectively, and then performing scanning exposure.
- the lens groups 2336 to 240 are driven in the optical axis direction, a change in magnification occurs in the Y direction, and the contrast of the projected image is reduced. If this poses a problem, it is advisable to change the width of the opening of the reticle blind 210 in the Y direction and the amount of exposure before scanning exposure before starting exposure.
- This distortion can be corrected by changing the scanning speed between the reticle 214 and the wafer 220 according to the scanning position.
- This distortion can be corrected by changing the tilt angles of the lens units 236-240 so as to correct the X magnification tilt 1 and the X magnification tilt 2 according to the scanning position.
- the error may be corrected by combining other components so as to minimize the error.
- the error can be reduced by correcting the component of the coefficient k4 and the component of the coefficient k14. In this case, by removing the term of the coefficient 18 from (Equation 17) and calculating by the least squares method, the component of the coefficient k 18 can be distributed to other components.
- the deformation in Fig. 23 (f) is a deformation in which the larger the deviation of the X coordinate from the center of the reticle, the larger the magnification in the Y direction (scanning direction). Therefore, as another method for correcting this deformation, applying the correction method of FIG. 22 (2), the inclination angle in the ⁇ ⁇ direction of some of the lenses constituting the projection optical system 2 16 is calculated as follows. There is also a method of performing scanning exposure while changing the reticle continuously according to the position in the scanning direction. If the tilt angle of the lens is continuously changed, the position of the projected image on the wafer also changes. Therefore, the relative position between the reticle and the wafer is corrected according to the position of the reticle in the scanning direction. Is desirable.
- the other components may be combined so as to minimize the error. For example, it is possible to reduce the error by correcting the component of the coefficient k5 and the component of the coefficient k16. In this case, by removing the term of the coefficient k 20 from (Equation 17) and calculating by the least squares method, the component of the coefficient k 20 is automatically distributed to other components.
- the reticle 2 14 side of the projection optical system 2 16 and the wafer 2 as shown in FIG.
- the 20 side there are provided parallel flat plates 235 and 241 that can control the position and tilt angle in the Z direction (optical axis direction).
- the plane-parallel plate includes a plane having minute irregularities on its surface, an optical member in the form of a plane-parallel plate used for correcting imaging characteristics, that is, Parallel flat plate-shaped optics including those with minute unevenness distribution (phase distribution), those with partially different refractive index distribution, and those with a certain degree of refractive power (power) locally
- the members are simply referred to as "plates".
- the random fluctuation of the imaging characteristics means the fluctuation of the imaging characteristics that occurs partially (locally) in the projected image.
- a plurality of types of flat plates are arranged in a replaceable manner, and a flat plate suitable for canceling the amount of change in the imaging characteristics generated according to the state of thermal deformation of the reticle is appropriately set as an image forming beam. It may be arranged on the optical path of the camera. As a result, it is possible to correct the gradually changing fluctuation of the imaging characteristic.
- correction can be made by arranging a flat plate having a partial refractive power distribution between the wafer and the wafer.
- the correction can be made by arranging one or a plurality of flat plates whose inclination angles are partially changed outside the projection optical system 216.
- a plurality of flat plates are used, it is possible to prevent the telecentricity of the projection optical system 211 from deteriorating.
- the wavefront of the illumination light partially cancels (or advances).
- This can be corrected by arranging a flat plate having a concavo-convex distribution (that is, a shape giving a phase difference). Further, the correction can be made even if a process of giving such a concavo-convex distribution to the lens surface near the pupil surface is performed.
- a flat plate having a concavo-convex distribution (that is, a shape that gives a phase difference) that partially cancels the delay (or advance) of the wavefront of the illumination light is provided inside the projection optical system 211 at a position away from the pupil plane. It can be corrected by arranging. In addition, the correction can be performed by performing processing for providing such a concave / convex distribution on the surface of the lens near the pupil plane.
- the correction can be made by arranging a flat plate partially having a refractive power distribution in the sagittal direction outside the projection optical system 211.
- the correction can be made by arranging one or a plurality of flat plates whose inclination angles are partially changed outside the projection optical system 216. Use multiple plates In this case, it is possible to prevent the telecentricity of the projection optical system 2 16 from deteriorating.
- a flat plate made of an optical material (glass material) with a partially different dispersion (Abbe number) or an optical material with a partially different refractive index distribution is used. It can be corrected by arranging. .
- the correction can be made by arranging one or a plurality of flat plates whose inclination angles are partially changed outside the projection optical system 216. When multiple flat plates are used, it is possible to have no effect on the distortion of the projected image (lateral shift of the imaging point).
- the thermal deformation of the reticle 214 has been described.However, the case where the wafer 220 is distorted, or the case where the distortion characteristic of the previous exposure apparatus is distorted when performing overlay exposure.
- the present invention may be applied to a case where anisotropic distortion occurs in the projection optical system 216. In this case, the overall error is reduced from the thermal deformation of the reticle 214, the irradiation variation of the projection optical system 216, the distortion of the wafer 220, and the distortion characteristics of the previous exposure apparatus. May be corrected as follows.
- a step-and-scan projection exposure apparatus is used as the exposure apparatus.
- correction of the imaging characteristics according to the amount of thermal deformation of the reticle is performed by the exposure apparatus.
- the present invention can be applied to a case where a batch exposure type projection exposure apparatus such as a stepper is used.
- the position of at least one optical element in the projection optical system in the optical axis direction, the inclination angle of at least one optical element in the optical axis direction, the relative position between the mask and the substrate Scanning speed and scanning of mask and substrate By adjusting at least one of the parallelism in the direction, there is an advantage that the imaging characteristics can be corrected with high accuracy.
- the pattern image of the mask can be transferred onto the substrate with high accuracy.
- the thermal deformation of the mask can be accurately obtained. Furthermore, by calculating the thermal deformation of the mask in consideration of the heat transfer occurring outside the pattern area of the mask, the thermal deformation of the mask and, consequently, the change in the imaging characteristics due to this can be determined with high accuracy. Based on this, the imaging characteristics can be corrected with high accuracy.
- the blind mechanism is driven to adjust the width of the illuminated area according to the difference in magnification change between the scanning direction and the non-scanning direction of the image of the mask pattern formed on the substrate, so that the imaging characteristics are improved.
- the contrast of the projected image can be corrected with high accuracy.
- the transmittance of the projection optical system is determined by measuring the exposure of the exposure light source using the exposure sensor on the wafer stage through the light transmission window on the mask stage, so that it is highly accurate without being affected by the mask. Changes in the imaging characteristics of the projection optical system due to absorption of illumination light can be obtained, and as a result, the imaging characteristics can be corrected with high accuracy.
- the two light transmission windows are placed with the mask interposed and separated in the mask movement direction, regardless of whether the mask is scanned in the forward or reverse scanning direction, the light transmission windows are kept while scanning is continued. Since it can be moved into the illumination area, throughput does not decrease.
- the imaging characteristics of the projection optical system can be corrected, and the first parallel plane plate provided on the substrate side of the projection optical system
- predetermined imaging characteristics can be corrected with high accuracy.
- the surface of the second parallel flat plate provided on the mask side of the projection optical system has been subjected to predetermined irregular processing, distortion caused by a manufacturing error of the optical element of the projection optical system or the like may occur. It can be corrected with high accuracy.
- the first parallel plane By driving the plate, the decentering coma of the projection optical system according to the shape and size of the secondary light source is changed. Corrections can be made.
- the imaging characteristics of the projection optical system can be corrected with higher accuracy based on the measurement result.
- the eccentric coma of the projection optical system can be adjusted by moving the first parallel plane plate. By moving at least one of the plurality of optical elements without moving the optical element relative to the mask, at least one of the aberration of the projection optical system, the projection magnification, and the focal position can be adjusted in addition to the eccentric coma. Can be adjusted.
- a predetermined imaging characteristic can be corrected with a simple control by an adjusting device that changes a refractive index in at least one of a plurality of spaces formed by the mask and the plurality of optical elements.
- the illumination optical system can change at least one of the shape and the size of the secondary light source according to the pattern of the mask, and at least one of the plurality of optical elements and the first plane-parallel plate is changed for each change.
- the imaging characteristics can be corrected according to the lighting conditions.
- the imaging characteristics can be corrected with higher accuracy.
- first parallel plane plate or the second parallel plane plate can adjust decentered coma aberration or asymmetric aberration of the projection optical system, respectively.
- ultraviolet light having a wavelength of 100 nm or more such as g-line, i-line, far ultraviolet (DUV) light such as KrF excimer laser, and ArF excimer laser , and F 2 laser (wavelength 1 5 7 nm) can be used vacuum ultraviolet (VUV) light such as.
- VUV vacuum ultraviolet
- a harmonic of a YAG laser may be used.
- a single-wavelength laser in the infrared or visible range oscillated by a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and yttrium), and the nonlinear optical crystal is amplified.
- a harmonic that has been wavelength-converted into ultraviolet light by using the above method may be used.
- the oscillation wavelength of a single-wavelength laser is in the range of 1.51 to 1.59 m
- the 8th harmonic whose generation wavelength is in the range of 189 to 199 nm, or the generation wavelength is The 10th harmonic within the range of 151 to 159 nm is output.
- the oscillation wavelength is in the range of 1.544 to 1.553 im, it will be the same as the 8th harmonic in the range of 93 to 194 nm, that is, the same wavelength as the ArF excimer laser.
- ultraviolet light was obtained, approximately the same when within the range of the oscillation wavelength 1. 5 7 ⁇ 1. 5 8 / zm , 1 0 harmonic in the range of 1 5 7 ⁇ 1 58 nm, i.e. the F 2 laser Ultraviolet light having a wavelength is obtained.
- the oscillation wavelength is in the range of 1.03 to 1.12
- the 7th harmonic whose output wavelength is in the range of 147 to 160 nm is output, and especially the oscillation wavelength is 1. 0 9 9 1. in the range of 1 0 6 m
- 7 harmonic in the range generation wavelength of 1 5 7 ⁇ 1 5 8 m, i.e. F 2 laser and ultraviolet light having almost the same wave length can get.
- a single-wavelength oscillation laser is used as an it-lived-doped-fiber laser.
- the wavelength of the illumination light for exposure is, of course, not limited to 100 nm or more.
- a pattern of 70 nm or less To generate EUV (Extreme Ultra Violet) light in the soft X-ray region for example, a wavelength range of 5 to 15 nm
- EUV Extreme Ultra Violet
- An EUV lithography system using an all-reflection reduction optical system designed based on the exposure wavelength (for example, 13.5 nm) and a reflective mask is being developed.
- a configuration in which scan exposure is performed by synchronously scanning the mask and the wafer using arc illumination can be considered, and such an apparatus is also included in the scope of the present invention.
- the present invention can be applied to an exposure apparatus that uses a charged particle beam such as an electron beam or an ion beam.
- a charged particle beam such as an electron beam or an ion beam.
- a thermionic emission type lanthanum hexaborite (L a B 6 ) or an evening light (T a) can be used as an electron gun.
- the electron beam exposure apparatus may be any of a pencil beam system, a variable shaped beam system, a cell projection system, a blanking 'aperture' array system, and a mask projection system.
- a circuit pattern is decomposed and formed into a large number of subfields of about 250 nm square separated from each other on a mask, and the electron beam is sequentially shifted in a first direction on the mask, and the first Synchronizes the movement of the mask in the second direction perpendicular to the direction, the wafer is moved relative to the electron optical system that reduces and projects the decomposition pattern, and the reduced images of the decomposition pattern are joined together on the wafer and combined. It forms a pattern.
- a step-and-scan type reduction projection exposure apparatus (scanning stepper) is used.
- the reticle and the wafer are almost stationary, and the reticle is projected through the projection optical system.
- the present invention can be applied to a reduction projection exposure apparatus (stepper) of a step-and-repeat type that repeats an operation of transferring a pattern onto a wafer, or to a mirror projection aligner or the like.
- the projection optical system may use not only a reduction system but also an equal magnification system or an enlargement system (for example, an exposure apparatus for manufacturing a liquid crystal display).
- the projection optical system may be any of a refractive system, a reflective system, and a catadioptric system.
- the types of glass materials and coating materials that can be used for optical elements are limited by the wavelength of the illumination light for exposure, and the maximum diameter that can be manufactured differs for each glass material. Select a refraction system, reflection system, or catadioptric system in consideration of the exposure wavelength and its wavelength width (narrow bandwidth) determined from the specifications, and the field size and numerical aperture of the projection optical system. It will be.
- the exposure wavelength is about 190 nm or more
- synthetic glass and fluorite can be used as the glass material, so that the refractive system is relatively easy as well as the reflective system and the catadioptric system.
- vacuum ultraviolet light having a wavelength of about 200 nm or less
- a refraction system can be used depending on the narrowed wavelength width. Since there is no suitable material other than fluorite as a glass material, and it is difficult to narrow the wavelength band, it is advantageous to employ a reflection system or a catadioptric system.
- a reflection system consisting of only a plurality of (for example, about 3 to 6) reflection elements is employed.
- the electron beam exposure apparatus uses an electron optical system including an electron lens and a deflector.
- the optical path is filled with a gas that reduces the attenuation (for example, an inert gas such as nitrogen or helium), or the optical path is evacuated.
- the optical path is vacuum.
- the exposure equipment used in the manufacture of semiconductor devices it is also used in the manufacture of exposure equipment that transfers device patterns onto glass plates and in the manufacture of thin-film magnetic heads that are used in the manufacture of displays that include liquid crystal display elements.
- the present invention can also be applied to an exposure apparatus used to transfer a device pattern onto a ceramic wafer, an exposure apparatus used to manufacture an image sensor (such as a CCD), and the like.
- the present invention can be applied to an exposure apparatus for transferring a circuit pattern onto a glass substrate, a silicon wafer, or the like in order to manufacture a reticle or a mask.
- a transmissive reticle is generally used in an exposure apparatus that uses DUV light or VUV light, and quartz is used as a reticle substrate.
- 79 Glass, fluorine-doped quartz glass, fluorite, or quartz are used.
- a reflective mask is used in an EUV exposure apparatus, and a transmission type mask (stencil mask, membrane mask) is used in a proximity type X-ray exposure apparatus, or a mask projection type electron beam exposure apparatus.
- a silicon wafer is used.
- the illumination optical system composed of a plurality of lenses and the projection optical system are incorporated in the main body of the exposure apparatus to perform optical adjustment, and the reticle stage and wafer stage consisting of many mechanical parts are attached to the main body of the exposure apparatus and wired.
- the exposure apparatus of the above-described embodiment can be manufactured by connecting the pipes and pipes and further performing overall adjustment (electrical adjustment, operation check, etc.). It is desirable to manufacture the exposure equipment in a clean room where the temperature and cleanliness are controlled.
- a step of designing the function and performance of the device a step of manufacturing a reticle based on this design step, a step of manufacturing a wafer from a silicon material, and a reticle pattern by the exposure apparatus of the above-described embodiment. It is manufactured through the steps of exposing wafers to wafers, device assembly steps (including dicing, bonding, and packaging processes) and inspection steps. '
- the present invention is not limited to the above-described embodiment, and can take various configurations without departing from the gist of the present invention.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP98947777A EP1037266A4 (en) | 1997-10-07 | 1998-10-07 | PROJECTION EXPOSURE METHOD AND DEVICE |
KR1020007003666A KR20010015698A (ko) | 1997-10-07 | 1998-10-07 | 투영노광방법 및 장치 |
AU94581/98A AU9458198A (en) | 1997-10-07 | 1998-10-07 | Projection exposure method and apparatus |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27417397 | 1997-10-07 | ||
JP9/274173 | 1997-10-07 | ||
JP9/291807 | 1997-10-09 | ||
JP9291807A JPH11121322A (ja) | 1997-10-09 | 1997-10-09 | 投影露光装置及び方法 |
JP10/283898 | 1998-10-06 | ||
JP10283898A JPH11195602A (ja) | 1997-10-07 | 1998-10-06 | 投影露光方法及び装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1999018604A1 true WO1999018604A1 (fr) | 1999-04-15 |
Family
ID=27336164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1998/004536 WO1999018604A1 (fr) | 1997-10-07 | 1998-10-07 | Procede et appareil d'exposition par projection |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1037266A4 (ja) |
KR (1) | KR20010015698A (ja) |
AU (1) | AU9458198A (ja) |
WO (1) | WO1999018604A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1164397A1 (de) * | 2000-06-17 | 2001-12-19 | Carl Zeiss | Objektivfassung, insbesondere für Projektionsobjektiv in der Halbleiter-Lithographie |
US8609301B2 (en) | 2006-09-08 | 2013-12-17 | Nikon Corporation | Mask, exposure apparatus and device manufacturing method |
CN108803243A (zh) * | 2017-04-27 | 2018-11-13 | 中国科学院福建物质结构研究所 | 一种数字投影3d成型装置 |
CN111694225A (zh) * | 2019-03-12 | 2020-09-22 | 佳能株式会社 | 曝光装置和物品制造方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003085456A2 (de) * | 2002-04-11 | 2003-10-16 | Heidelberg Instruments Mikrotechnik Gmbh | Verfahren und vorrichtung zum abbilden einer maske auf einem substrat |
EP1513017A1 (en) * | 2003-09-04 | 2005-03-09 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR100746221B1 (ko) | 2005-12-23 | 2007-08-03 | 삼성전자주식회사 | 사입사 조명장치, 노광장비 및 사입사 조명방법 |
KR101476370B1 (ko) * | 2010-02-19 | 2014-12-24 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치, 디바이스 제조 방법 및 연계된 데이터 처리 장치 그리고 컴퓨터 프로그램 제품 |
EP3617800A1 (en) * | 2018-09-03 | 2020-03-04 | ASML Netherlands B.V. | Method and apparatus for configuring spatial dimensions of a beam during a scan |
US11366396B2 (en) | 2018-09-03 | 2022-06-21 | Asml Netherlands B.V. | Method and apparatus for configuring spatial dimensions of a beam during a scan |
JP7431319B2 (ja) * | 2019-09-10 | 2024-02-14 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィプロセスのサブフィールド制御及び関連する装置 |
EP3792693A1 (en) * | 2019-09-16 | 2021-03-17 | ASML Netherlands B.V. | Sub-field control of a lithographic process and associated apparatus |
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- 1998-10-07 WO PCT/JP1998/004536 patent/WO1999018604A1/ja not_active Application Discontinuation
- 1998-10-07 KR KR1020007003666A patent/KR20010015698A/ko active IP Right Grant
- 1998-10-07 AU AU94581/98A patent/AU9458198A/en not_active Abandoned
- 1998-10-07 EP EP98947777A patent/EP1037266A4/en not_active Ceased
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1164397A1 (de) * | 2000-06-17 | 2001-12-19 | Carl Zeiss | Objektivfassung, insbesondere für Projektionsobjektiv in der Halbleiter-Lithographie |
US8609301B2 (en) | 2006-09-08 | 2013-12-17 | Nikon Corporation | Mask, exposure apparatus and device manufacturing method |
US9563116B2 (en) | 2006-09-08 | 2017-02-07 | Nikon Corporation | Mask, exposure apparatus and device manufacturing method |
CN108803243A (zh) * | 2017-04-27 | 2018-11-13 | 中国科学院福建物质结构研究所 | 一种数字投影3d成型装置 |
CN111694225A (zh) * | 2019-03-12 | 2020-09-22 | 佳能株式会社 | 曝光装置和物品制造方法 |
CN111694225B (zh) * | 2019-03-12 | 2023-11-21 | 佳能株式会社 | 曝光装置和物品制造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1037266A4 (en) | 2002-09-11 |
KR20010015698A (ko) | 2001-02-26 |
EP1037266A1 (en) | 2000-09-20 |
AU9458198A (en) | 1999-04-27 |
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