WO1999016132A3 - Verfahren zum herstellen eines kunststoffverbundkörpers sowie kunststoffverbundkörper - Google Patents

Verfahren zum herstellen eines kunststoffverbundkörpers sowie kunststoffverbundkörper Download PDF

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Publication number
WO1999016132A3
WO1999016132A3 PCT/DE1998/002797 DE9802797W WO9916132A3 WO 1999016132 A3 WO1999016132 A3 WO 1999016132A3 DE 9802797 W DE9802797 W DE 9802797W WO 9916132 A3 WO9916132 A3 WO 9916132A3
Authority
WO
WIPO (PCT)
Prior art keywords
plastic composite
composite body
producing
electric circuit
coating material
Prior art date
Application number
PCT/DE1998/002797
Other languages
English (en)
French (fr)
Other versions
WO1999016132A2 (de
Inventor
Detlef Houdeau
Alexandra Atzesdorfer
Juergen Bednarz
Hans-Friedrich Schmidt
Rainer Wetter
Werner Lang
Frank Teepen
Heinz Breitenhuber
Original Assignee
Siemens Ag
Detlef Houdeau
Alexandra Atzesdorfer
Juergen Bednarz
Schmidt Hans Friedrich
Rainer Wetter
Werner Lang
Frank Teepen
Heinz Breitenhuber
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19741713A external-priority patent/DE19741713C1/de
Priority claimed from DE19751109A external-priority patent/DE19751109A1/de
Application filed by Siemens Ag, Detlef Houdeau, Alexandra Atzesdorfer, Juergen Bednarz, Schmidt Hans Friedrich, Rainer Wetter, Werner Lang, Frank Teepen, Heinz Breitenhuber filed Critical Siemens Ag
Publication of WO1999016132A2 publication Critical patent/WO1999016132A2/de
Publication of WO1999016132A3 publication Critical patent/WO1999016132A3/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00—Foams characterized by the expanding agent
    • C08J2203/22—Expandable microspheres, e.g. Expancel®
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Ein eine elektrische Schaltung (7) umgebendes Gehäuse (17) weist ein Hüllmaterial (22) sowie wenigstens ein Beschichtungsmaterial (23) auf, das die elektrische Schaltung (7) bedeckt. Das Beschichtungsmaterial (23) und das Hüllmaterial (22) haben dieselbe chemische Basis.
PCT/DE1998/002797 1997-09-22 1998-09-21 Verfahren zum herstellen eines kunststoffverbundkörpers sowie kunststoffverbundkörper WO1999016132A2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19741713A DE19741713C1 (de) 1997-09-22 1997-09-22 Verfahren zum Herstellen eines Kunststoffverbundkörpers sowie Kunststoffverbundkörper
DE19741713.2 1997-09-22
DE19751109A DE19751109A1 (de) 1997-11-18 1997-11-18 Kunststoffverbundkörper sowie Verfahren und Werkstoff zum Herstellen eines Kunststoffverbundkörpers
DE19751109.0 1997-11-18

Publications (2)

Publication Number Publication Date
WO1999016132A2 WO1999016132A2 (de) 1999-04-01
WO1999016132A3 true WO1999016132A3 (de) 1999-06-17

Family

ID=26040192

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/DE1998/002797 WO1999016132A2 (de) 1997-09-22 1998-09-21 Verfahren zum herstellen eines kunststoffverbundkörpers sowie kunststoffverbundkörper
PCT/DE1998/002796 WO1999015582A1 (de) 1997-09-22 1998-09-21 Duroplast verbundwerkstoff mit ausdehnbare mikrohohlkugeln, sowie seine verwendung zur verkapselung

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/002796 WO1999015582A1 (de) 1997-09-22 1998-09-21 Duroplast verbundwerkstoff mit ausdehnbare mikrohohlkugeln, sowie seine verwendung zur verkapselung

Country Status (1)

Country Link
WO (2) WO1999016132A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2360781B8 (en) 2000-03-31 2005-03-07 Unigel Ltd Gel compositions
DE10329727A1 (de) * 2003-07-01 2005-02-03 Evi Gmbh Verbundplatte und Verfahren zur Herstellung einer Verbundplatte
DE102009027343A1 (de) 2009-06-30 2011-01-05 Robert Bosch Gmbh Verfahren zur Herstellung eines elektronischen Bauteils
DE102009027995A1 (de) * 2009-07-24 2011-01-27 Robert Bosch Gmbh Vorrichtung mit einem Halbleiterbauelement und einem Gehäuse und Verfahren zur Herstellung der Vorrichtung

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3019239A1 (de) * 1980-05-20 1981-11-26 SIEMENS AG AAAAA, 1000 Berlin und 8000 München Umhuellung fuer halbleiterbauelement
JPS5873125A (ja) * 1981-10-26 1983-05-02 Ricoh Co Ltd 電子部品の粉体塗装方法
EP0258098A1 (de) * 1986-07-25 1988-03-02 Fujitsu Limited Verkapselte Halbleiteranordnung und Verfahren zu deren Herstellung
DE4041347A1 (de) * 1990-12-21 1992-06-25 Siemens Ag Verfahren zur verbesserung der zuverlaessigkeit verkapselter integrierter schaltkreise (ic)
US5331205A (en) * 1992-02-21 1994-07-19 Motorola, Inc. Molded plastic package with wire protection
EP0684641A2 (de) * 1994-05-26 1995-11-29 Nec Corporation Einkapselung eines Halbleiterbauelementes mit hoher Feuchtigkeitsfestigkeit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0336001A1 (de) * 1988-04-08 1989-10-11 Essex Composite Systems Duroplastgranulat und Verfahren und Vorrichtung zur dessen Herstellung
US4888634A (en) * 1987-07-24 1989-12-19 Linear Technology Corporation High thermal resistance bonding material and semiconductor structures using same
US4923902A (en) * 1988-03-10 1990-05-08 Essex Composite Systems Process and compositions for reinforcing structural members
US5086088A (en) * 1989-03-09 1992-02-04 Minnesota Mining And Manufacturing Company Epoxy-acrylate blend pressure-sensitive thermosetting adhesives
US5470886A (en) * 1994-03-31 1995-11-28 Ppg Industries, Inc. Curable, sprayable compositions for reinforced thin rigid plates

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3019239A1 (de) * 1980-05-20 1981-11-26 SIEMENS AG AAAAA, 1000 Berlin und 8000 München Umhuellung fuer halbleiterbauelement
JPS5873125A (ja) * 1981-10-26 1983-05-02 Ricoh Co Ltd 電子部品の粉体塗装方法
EP0258098A1 (de) * 1986-07-25 1988-03-02 Fujitsu Limited Verkapselte Halbleiteranordnung und Verfahren zu deren Herstellung
DE4041347A1 (de) * 1990-12-21 1992-06-25 Siemens Ag Verfahren zur verbesserung der zuverlaessigkeit verkapselter integrierter schaltkreise (ic)
US5331205A (en) * 1992-02-21 1994-07-19 Motorola, Inc. Molded plastic package with wire protection
EP0684641A2 (de) * 1994-05-26 1995-11-29 Nec Corporation Einkapselung eines Halbleiterbauelementes mit hoher Feuchtigkeitsfestigkeit

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 007, no. 166 (E - 188) 21 July 1983 (1983-07-21) *

Also Published As

Publication number Publication date
WO1999016132A2 (de) 1999-04-01
WO1999015582A1 (de) 1999-04-01

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