WO1998053719A2 - Verfahren zum einprägen von mikrostrukturen in metalle oder andere hartstoffe, prägewerkzeug sowie münze - Google Patents
Verfahren zum einprägen von mikrostrukturen in metalle oder andere hartstoffe, prägewerkzeug sowie münze Download PDFInfo
- Publication number
- WO1998053719A2 WO1998053719A2 PCT/DE1998/001461 DE9801461W WO9853719A2 WO 1998053719 A2 WO1998053719 A2 WO 1998053719A2 DE 9801461 W DE9801461 W DE 9801461W WO 9853719 A2 WO9853719 A2 WO 9853719A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- embossing
- microstructures
- embossed
- coin
- stamp
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 43
- 239000000463 material Substances 0.000 title claims description 18
- 239000002184 metal Substances 0.000 title claims description 13
- 229910052751 metal Inorganic materials 0.000 title claims description 13
- 150000002739 metals Chemical class 0.000 title claims description 8
- 238000004049 embossing Methods 0.000 claims description 40
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000013461 design Methods 0.000 claims description 11
- 239000011159 matrix material Substances 0.000 claims description 11
- 229910000831 Steel Inorganic materials 0.000 claims description 9
- 239000010959 steel Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 239000002243 precursor Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000000630 rising effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 26
- 235000019589 hardness Nutrition 0.000 description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 239000004033 plastic Substances 0.000 description 11
- 229920003023 plastic Polymers 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 229910001315 Tool steel Inorganic materials 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910000760 Hardened steel Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910001096 P alloy Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000001093 holography Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- MHESUICHGPWXRV-UHFFFAOYSA-N methanediolate silicon(4+) Chemical compound C([O-])[O-].[Si+4].C([O-])[O-] MHESUICHGPWXRV-UHFFFAOYSA-N 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000002436 steel type Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 238000009757 thermoplastic moulding Methods 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H1/0276—Replicating a master hologram without interference recording
- G03H1/028—Replicating a master hologram without interference recording by embossing
-
- A—HUMAN NECESSITIES
- A44—HABERDASHERY; JEWELLERY
- A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
- A44C21/00—Coins; Emergency money; Beer or gambling coins or tokens, or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
- B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
- B44B5/02—Dies; Accessories
- B44B5/026—Dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/24—Pressing or stamping ornamental designs on surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H1/0272—Substrate bearing the hologram
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H1/024—Hologram nature or properties
- G03H1/0244—Surface relief holograms
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H1/0276—Replicating a master hologram without interference recording
- G03H2001/0296—Formation of the master hologram
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H2270/00—Substrate bearing the hologram
- G03H2270/10—Composition
- G03H2270/13—Metallic
Definitions
- the invention relates to a method for embossing microstructures into metals or other hard materials according to the preamble of claim 1, an embossing tool according to the preamble of claim 6 and a coin according to the preamble of claim 9.
- the invention is based on the object of specifying a method by means of which the aforementioned classic, plastic design elements can be combined in a piece of metal, in particular a coin, with microstructures, in particular holograms.
- a novel stamping tool for carrying out such a method and a novel coin are also to be specified.
- the idea underlying this invention is to replace the classic design elements, or preferably in combination and supplement with these elements, to integrate additional optically effective elements into the coin or metals, which safeguard against counterfeiting Use value and the aesthetic value of the coin or other product significantly increased.
- optically effective, light-diffracting microstructures mentioned can be integrated into the flat regions of the metal piece or the coin using the method according to the invention using the tool according to the invention.
- the microstructures can also be integrated into the surface of plastically raised design elements.
- the additional optically active elements can be imaging holograms or holographically generated optical light diffraction or refraction elements, or mechanically generated light diffraction or light refraction elements or other fine structures.
- These additional coin design elements e.g. holographic microstructures, give the coin or other minted product four essential elements of added value:
- the basis and / or the first stage of the method according to the invention lies in the use of a new method of stamp production, in which the classic design elements are combined with the additional optically effective elements and then converted into a material-homogeneous, uniform master die.
- This stage is preferably manufactured in metals or other materials that are comparatively softer than the later stamping steel.
- the separately manufactured optically effective diffraction elements are preferably electroplated in e.g. a nickel sulfamate bath.
- This impression copy of the optically effective pre-master in nickel is still relatively easy to process and e.g. Milling or laser cutting according to shape or shape and can then be combined mechanically with the still unhardened steel blank, which already contains the classic form elements.
- optical pre-master copies which are also identical in size, are embedded in the form-matched (engraved or lasered) recesses.
- the impression medium can consist of metal or plastic. Additional duplicates can be drawn from this overall impression or from the mechanical combination (preliminary stage) for further operations and for archiving. According to the invention, the overall impression referred to here is to be referred to as a preliminary stage matrix.
- this preliminary stage matrix is now molded into a particularly hard-elastic stamp in a multilayer structure.
- This further impression which is to be referred to as the master die, is preferably produced with a greater hardness than that of the uncured tool steel.
- This steel stamp manufactured in accordance with the invention is now hardened and then "embossed" into any number of pieces for the further copies of the copies into further still unhardened blanks. After subsequent hardening, these are called Embossing stamp for the production process.
- the steel stamp has to be hardened in such a way that the optically effective microstructure is not negatively influenced by the hardening process and the light diffraction efficiency is reduced.
- the surface hardness of the master die can be set so hard that the microstructures can be embossed directly into the already hardened embossing die, ie into the production tool.
- Another preferred procedure is a manufacturing technique for the production of the master die, which is already set so hard in the impression copy that an embossing in tool steel and subsequent hardening or embossing in the already hardened steel stamp can be dispensed with, thus making the use of classic steel stamps superfluous.
- the edition stamping is carried out directly from the duplicates of the master matrices produced in the required number.
- the alloy deposits of particular hardness also being matrix-reinforcing hard materials, such as Diamond, silicon carbonite or boron carbite can be incorporated, and the finely structured surface layer consisting of e.g. plasma-generated, diamond-like carbon layer is formed.
- the multi-layer structure gives the embossing stamp an elasticity which Ripping, jumping or breaking of the stamp during the embossing process is excluded.
- the plasma coating is not applied according to the invention as the last layer on the microstructure of the embossed surface, but in reverse order as the first layer on the pre-master.
- This preliminary stage master is the relief-developed laser-exposed photoresist or an impression thereof.
- the preliminary stage master is to be detached from the diamond-like carbon layer after completion of the multilayer structure or after an intermediate stage. This is done using solvents, alkalis or acids, depending on whether it is the photoresist precursor master itself or an impression or a casting thereof or an engraving or etching in another material.
- the now exposed surface of the diamond-like carbon layer serves as an embossing surface.
- This method according to the invention ensures a 1 to 1 impression of the relief structure without flattening and loss of diffraction efficiency.
- Another procedure according to the invention for stamping production is to produce a hard-elastic master matrix only from the holographically or otherwise optically active areas of the stamp to be produced and then only "stamping" this partial master matrix into the still unhardened steel stamp, which already has the rest includes engraved design elements.
- a variant of the coin minting method according to the invention derived therefrom is to work in two stages. Only the holographic or otherwise optically effective areas are embossed by the partial optical embossing stamp, while the classic plastic elements are embossed by another embossing stamp of the classic embodiment.
- the embossing is carried out in accordance with the respective designs and the technical conditions in the following four different production methods:
- embossing all-over flat motifs and surfaces formed by light-diffracting microstructures of various designs. According to the invention, the embossing takes place in one step.
- the embossing takes place according to the invention in two steps, each with a conventional stamp, which contains the plastic elements, and with a second stamp, which is adapted to the shape of the plastic elements and which contains the light-diffracting microstructures.
- the light-diffractive microstructure can also be integrated into the surface of the plastic elements, in the method according to the invention first in two steps with Microstructure stamp is used to emboss the flat surface of the material and then use the plastically conventional stamp to emphasize raised or recessed elements. The micro structure is retained if the embossing pressure is not too high.
- the figure shows a matrix structure of an embossing stamp.
- optically active elements achieved by laser exposure can be image-forming holographic interference patterns or other light-refractive or light-diffracting surface structures, all of which are used individually or in combination due to their optical properties in the security, scientific, technical and decorative fields.
- microstructures can also be electroplated from substrates other than laser-exposed photoresist layers.
- optically effective microstructures and light-diffractive or refractive elements does not necessarily have to be done by laser exposure in photoresist.
- light diffraction elements can also be done by direct Engraving can be introduced into glass and other substrates using diamond tools.
- electron beam or laser engraving can be used, or various fine etching techniques.
- pre-master optically effective, light-refractive, light-diffractive or image-forming elements or surfaces or other fine structures produced by means of various techniques.
- These nickel matrices which are electroplated from a prepress master, have a hardness of 200 - 300 HV, which can be achieved depending on the deposition process and are therefore adjusted to the thermoplastic embossing process (reproduction process) currently used in the holography sector in plastics, e.g. various types of foils and varnishes.
- holographic embossing stamps or embossing stamps with other optically effective diffraction elements with a degree of hardness of greater than 400 HV are preferably more than 1000 HV manufactured.
- Nickel-cobalt deposits 400 - 550 HV 0.1
- Nickel-tin deposits 600 - 750 HV 0.1 Reductive (“external currentless”) nickel
- Unhardened, soft tool steel has a hardness starting at approx. 400 HV depending on the steel type. Nickel-cobalt separation alone exceeds the hardness of unhardened tool steel.
- An increase in hardness> 1000 HV 0.1 happens e.g. B. by storage of hard materials such as finely divided diamond dust, silicon carbide or boron carbite in the nickel matrix during the electrodeposition. This can be done electrolytically or without external current (reductive).
- the hard material granules should have a grain size of less than 0.3 ⁇ , so that they can be built into the relief of the microstructures to be embossed in a matrix-reinforcing manner.
- the layer hardness can be increased from 570 to 1400 HV 0.1 by temperatures of 400 ° C for about 1 h.
- H layer metal-doped, electrically conductive layer with
- H layer electrically insulating layer with hydrogen content
- hardness 2,000 - 4,000 HV 0.1 i-C layer electrically insulating, hydrogen-free layer
- the last surface layer being formed from a diamond-like carbon-containing layer which has a hardness of 1,000 to 6,000 HV 0.1 and the stamping dies are so elastic despite the high surface hardness that cracking, cracking or breaking during the Embossing process is excluded.
- Layer 1 shows a holographic microstructure, alternatively formed from a plasmatic deposit of a diamond-like carbon layer with a surface hardness of up to 6,000 HV 0.1 as required.
- Layer 2 is an electrolessly (reductively) deposited nickel-phosphorus alloy, which is adjusted to approx. 1,400 HV 0.1 by tempering and possibly by matrix-reinforcing storage of hard materials.
- Layer 3 is an electrolytically deposited hard material-reinforced nickel-cobalt alloy of approx. 750 HV 0.1, produced by, for example, diamond incorporation or silicon carbide incorporation in the metal matrix.
- the layers 4, 5, 6 have different hardnesses, produced by different alloy baths or metal spraying processes or other metal deposition processes.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Holo Graphy (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU84320/98A AU8432098A (en) | 1997-05-29 | 1998-05-28 | Method for impressing microstructures into metals or other hard materials, corresponding impression tool and coin |
DE19880673T DE19880673D2 (de) | 1997-05-29 | 1998-05-28 | Verfahren zum Einprägen von Mikrostrukturen in Metalle oder andere Hartstoffe, Prägewerkzeug sowie Münze |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19722575.6 | 1997-05-29 | ||
DE1997122575 DE19722575A1 (de) | 1997-05-29 | 1997-05-29 | Verfahren zum Einprägen von Mikrostrukturen in Metalle oder andere Hartstoffe |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1998053719A2 true WO1998053719A2 (de) | 1998-12-03 |
WO1998053719A3 WO1998053719A3 (de) | 1999-03-04 |
Family
ID=7830877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1998/001461 WO1998053719A2 (de) | 1997-05-29 | 1998-05-28 | Verfahren zum einprägen von mikrostrukturen in metalle oder andere hartstoffe, prägewerkzeug sowie münze |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU8432098A (de) |
DE (2) | DE19722575A1 (de) |
WO (1) | WO1998053719A2 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU756424B1 (en) * | 2001-10-24 | 2003-01-09 | Singapore Mint, The | Method and apparatus for creating a hologram on a surface |
US20210170784A1 (en) * | 2019-12-10 | 2021-06-10 | Firma | Coin or medal |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10146635B4 (de) * | 2001-09-21 | 2005-06-23 | Alcan Deutschland Gmbh | Verfahren zur Herstellung eines mit einer Hologrammprägung versehenen Folienmaterials sowie Folienmaterial |
CA2505503A1 (en) * | 2002-11-16 | 2004-06-03 | Stefan Fellenberg | Nano-optical color embossing |
DE102006052511B3 (de) * | 2006-11-06 | 2008-07-31 | Schuler Pressen Gmbh & Co. Kg | Prägeeinrichtung und Verfahren zur Herstellung eines Prägewerkzeugs |
DE102009021880B4 (de) | 2009-05-19 | 2013-01-31 | Schuler Pressen Gmbh & Co. Kg | Prägeverfahren und Prägeeinrichtung zur Erzeugung beugungswirksamer Strukturen |
DE102013206043A1 (de) * | 2013-04-05 | 2014-10-09 | Bayerische Motoren Werke Aktiengesellschaft | Verfahren zur Herstellung eines Bauteils mit Hologramm |
DE102015213236A1 (de) * | 2015-07-15 | 2017-01-19 | Heidelberger Druckmaschinen Ag | Platte zum Herstellen von Hologrammen und Verfahren zum Herstellen der Platte |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3509551C1 (de) * | 1985-03-16 | 1986-08-07 | Spindler & Hoyer GmbH & Co, 3400 Göttingen | Verfahren zur Herstellung eines metallischen Prägestempels zum Drucken von Hologrammen |
EP0421181A1 (de) * | 1989-10-04 | 1991-04-10 | Pamp S.A. | Verfahren zur Herstellung eines holographischen Bildes und Werkzeug zur Durchführung des Verfahrens |
EP0650853A1 (de) * | 1993-11-02 | 1995-05-03 | Fabrica Nacional De Moneda Y Timbre | Verfahren zum Erhalten von zwei Druckbildern auf harten Oberflächen |
DE4338218A1 (de) * | 1993-11-09 | 1995-05-11 | Ralf Igler | Verfahren und Vorrichtung zur Herstellung von Hologrammen, Beugungsgittern oder ähnlichen Strukturen sowie danach hergestellte Hologramme oder Beugungsgitter |
-
1997
- 1997-05-29 DE DE1997122575 patent/DE19722575A1/de not_active Withdrawn
-
1998
- 1998-05-28 AU AU84320/98A patent/AU8432098A/en not_active Abandoned
- 1998-05-28 WO PCT/DE1998/001461 patent/WO1998053719A2/de active Application Filing
- 1998-05-28 DE DE19880673T patent/DE19880673D2/de not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3509551C1 (de) * | 1985-03-16 | 1986-08-07 | Spindler & Hoyer GmbH & Co, 3400 Göttingen | Verfahren zur Herstellung eines metallischen Prägestempels zum Drucken von Hologrammen |
EP0421181A1 (de) * | 1989-10-04 | 1991-04-10 | Pamp S.A. | Verfahren zur Herstellung eines holographischen Bildes und Werkzeug zur Durchführung des Verfahrens |
EP0650853A1 (de) * | 1993-11-02 | 1995-05-03 | Fabrica Nacional De Moneda Y Timbre | Verfahren zum Erhalten von zwei Druckbildern auf harten Oberflächen |
DE4338218A1 (de) * | 1993-11-09 | 1995-05-11 | Ralf Igler | Verfahren und Vorrichtung zur Herstellung von Hologrammen, Beugungsgittern oder ähnlichen Strukturen sowie danach hergestellte Hologramme oder Beugungsgitter |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU756424B1 (en) * | 2001-10-24 | 2003-01-09 | Singapore Mint, The | Method and apparatus for creating a hologram on a surface |
US20210170784A1 (en) * | 2019-12-10 | 2021-06-10 | Firma | Coin or medal |
Also Published As
Publication number | Publication date |
---|---|
DE19722575A1 (de) | 1998-12-03 |
WO1998053719A3 (de) | 1999-03-04 |
DE19880673D2 (de) | 2000-03-16 |
AU8432098A (en) | 1998-12-30 |
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