AU756424B1 - Method and apparatus for creating a hologram on a surface - Google Patents
Method and apparatus for creating a hologram on a surface Download PDFInfo
- Publication number
- AU756424B1 AU756424B1 AU83614/01A AU8361401A AU756424B1 AU 756424 B1 AU756424 B1 AU 756424B1 AU 83614/01 A AU83614/01 A AU 83614/01A AU 8361401 A AU8361401 A AU 8361401A AU 756424 B1 AU756424 B1 AU 756424B1
- Authority
- AU
- Australia
- Prior art keywords
- hologram
- parts
- stamping
- tool
- receiving surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Holo Graphy (AREA)
Description
P/00/011 28/5/91 Regulation 3.2(2)
AUSTRALIA
Patents Act 1990 COMPLETE SPECIFICATION STANDARD PATENT Application Number: Lodged: Invention Title: METHOD AND APPARATUS FOR CREATING A HOLOGRAM ON A
SURFACE
The following statement is a full description of this invention, including the best method of performing it known to us METHOD AND APPARATUS FOR CREATING A HOLOGRAM ON A
SURFACE
Field of Invention This invention relates to a method of selectively stamping a hologram on a hologram-receiving surface, and also relates to products having surface holograms that are produced according to the method.
PRIOR ART In the prior art, there are various approaches to creating permanent holograms on hard surfaces, some of which involve stamping the surface with a tool that has an underside having a hologram-stamping pattern. When the tool is impressed on the hologram-receiving surface, the hologram-stamping pattern creates the hologram. These prior art methods involve creating the hologramstamping pattern directly on the undersurface or undersurface region of the tool, in situ. In other words, the steps of creating the hologram-stamping pattern are performed directly onto the undersurface of the tool itself. These known methods include, for example, casting, electro-forming, electrolytic processes, thermal or plasma spraying, ion-beam etching within a vacuum environment, and mechanical forming processes such as embossing. These known processes, in which the hologram-stamping pattern is formed directly onto the undersurface region of the tool, are complex and expensive.
Moreover, for aesthetic reasons, it is desirable to create the hologram only on selected parts of the hologram-receiving-surface. The abovementioned known processes are poorly adapted for the task of creating the hologram-stamping pattern only on parts of the tool's undersurface. For instance, it is impossible to control the precision of application of plasma and thermally-sprayed layers of material. Similarly, the known processes that require immersion in liquids are likewise not ideally adapted to create the hologram-stamping pattern on selected portions of the undersurface of the stamping tool.
Also, the known methods that involve selectively creating the hologramstamping pattern on finely defined portions of the tool's undersurface, in which the pattern is directly inscribed or engraved onto the undersurface or undersurface region, are very delicate and precise operations, which are expensive to perform.
The high manufacturing cost raises the overall cost of the final product, and may make the product economically un-viable.
If the hologram-receiving-surface contains uneven parts-such as surface relief, undulating parts or surface depressions-there is a problem in using known methods to create stamping tools that can selectively impress holograms onto such base surfaces. In the prior art, when the hologram-stamping pattern is directly inscribed or engraved on the undersurface or undersurface region of the stamping tool, the difficulties and costs are increased when the undersurface of the tool involves uneven portions.
Also, when mistakes are made while creating the hologram-stamping pattern directly onto the undersurface of the stamping tool, the whole tool must be discarded or re-worked, since the hologram-stamping pattern has become part of the tool itself. Moreover, during use, when the hologram-stamping pattern becomes worn and ineffective at creating the hologram, the whole tool once again must be discarded or re-worked, since the hologram-stamping pattern forms part of the tool itself. Also, it is expensive to excoriate a bonded layer from the undersurface of the tool. It is believed that such problems would be present, for example, in application PCT/DE98/01461 (WO 98/53719) where the hologramstamping pattern is created directly onto the tool's undersurface.
The above description of prior art is not an admission of common general knowledge of the skilled addressee.
An object of the present invention is to overcome or ameliorate one or more of the problems in the prior art.
Another object of the invention is to provide an improved method of selectively stamping a hologram onto at least parts of a surface, the method being simpler and cheaper to perform that known methods.
A preferred object is to provide an improved method of selectively stamping a hologram onto uneven parts of the hard surface.
Another preferred object is to provide an improved method of selectively stamping a hologram onto flat, even parts of the hard surface that are in between the uneven parts of the surface, particularly onto very fine flat regions that are closely positioned in between the uneven parts.
SUMMARY OF INVENTION According to a first aspect of the invention, there is provided a method of selectively stamping a hologram onto at least parts of a hologram-receiving surface that has a surface-topography having flat parts and uneven parts, the method including: providing a stamping tool having an undersurface that has an undersurface-topography which complements and correspondingly fits said surface-topography when the tool is pressed against the hologram-receiving surface; providing a layer of hologram-stamping-material at least one side of which has a hologram-stamping surface having a microstructure adapted to create the hologram on the hologram-receiving surface; attaching the layer to the undersurface of the tool; creating on the layer an arrangement where selected portions of the layer are free of the microstructure of the hologram-stamping-surface which correspond to parts of the hologram-receiving surface that are to be free of the hologram, and where other selected portions of the layer are provided with the microstructure of the hologram-stamping surface which correspond to other parts of the hologramreceiving surface that are to have the hologram created thereon; and pressing the tool against the hologram-receiving surface so that the hologram-stamping-surface of the layer is pressed against the hologram-receiving surface to create the hologram on all parts thereof which underlie the tool except for those parts that underlie the portions that are free of microstructure of the hologram-stamping-surface.
Preferably, the layer is attached to the tool by inwardly bending edge margins of the layer to grip edges of the tool.
Preferably, the edges of the toot are angled inwardly to form projecting portions around which the edge margins of the layer are bent.
Preferably, the projecting portions are wedge-shaped.
In an embodiment, the step of creating the arrangement on the layer may occur after the step of attaching the layer to the undersurface of the tool.
Alternatively, the step of creating the arrangement on the layer may occur before the step of attaching the layer to the undersurface of the tool.
In which case, the step of creating the arrangement on the layer may include creating the microstructure of the hologram-stamping surface only on portions that correspond to the parts of the hologram-receiving surface which are to have the hologram created thereon.
Preferably, the step of creating the arrangement on the layer includes substantially removing the microstructure from any selected portions of the hologram-stamping-surface that correspond to parts of the hologram-receiving surface which are to be free of the hologram, and retaining the microstructure of the hologram-stamping surface on portions that correspond to other parts of the hologram-receiving surface which are to have the hologram created thereon.
In one embodiment, in the arrangement on the layer, the microstructure of the hologram-stamping surface is only on portions that correspond to parts of the hologram-receiving surface that are uneven, so that the hologram is created only on uneven parts of the hologram-receiving surface.
In an alternative embodiment, in the arrangement on the layer, the microstructure of the hologram-stamping surface is only on portions that correspond to flat parts of the hologram-receiving surface including flat parts that are located between at least two uneven parts, so that the hologram is created on flat parts of the surface including flat parts that are located between the at least two uneven parts of the hologram-receiving surface.
The uneven parts may include depressed parts, or the uneven parts may include raised parts. Alternatively, the uneven parts include both raised and depressed parts. The raised parts may be formed as undulating surface relief.
Preferably, the layer is separably attached to the undersurface of the tool.
According to a second aspect of the invention, there is provided a coin, medallion or the like, produced according to the inventive method descrihbed above, wherein the coin has the hologram only on uneven parts of the hologramreceiving surface.
According to a third aspect of the invention, there is provided a coin, medallion or the like, produced according to the inventive method described above, wherein the coin has the hologram on flat parts of the hologram-receiving surface that are located between at least two uneven parts.
According to a fourth aspect of the present invention, there is provided a hologram-stamping tool that is adapted to selectively stamp a hologram on at least parts of a hologram-receiving surface that has a surface-topography having flat parts and uneven parts, the stamping tool having an undersurface that has an undersurfacetopography which complements and correspondingly fits said surface-topography when the tool is pressed against the hologram-receiving surface; a layer of hologram-stamping-material attached to the undersurface of the tool, the layer including a hologram-stamping surface having a microstructure adapted to create the hologram on the hologram-receiving surface; the hologram-stamping surface having selectively smoothened portions of the hologram-stamping-surface that correspond to parts of the hologramreceiving surface which are to be free of the hologram, and portions in which the microstructure of the hologram-stamping surface has been retained that correspond to other parts of the hologram-receiving surface which are to have the hologram created thereon, wherein, the tool is adapted to be used by pressing the tool against the hologram-receiving surface so that the hologram-stamping-surface of the layer is pressed against the hologram-receiving surface to create the hologram on all parts thereof which underlie the tool except for those parts that underlie the portions where the microstructure of the hologram-stamping-material has been smoothened.
According to a fifth aspect of the present invention, there is provided a method of selectively stamping a hologram onto at least parts of a hologramreceiving surface that has a surface-topography having flat parts and uneven parts, the method including: providing a stamping tool having an undersurface that has an undersurface-topography which complements and correspondingly fits said surface-topography when the tool is brought against the hologram-receiving surface; providing a layer of hologram-stamping-material at least one side of which has a hologram-stamping surface having a microstructure adapted to create the hologram on the hologram-receiving surface; attaching the layer to the undersurface of the tool; substantially removing the microstructure from any selected portions of the hologram-stamping-surface that correspond to parts of the hologram-receiving surface which are to be free of the hologram, and retaining the microstructure of the hologram-stamping surface on portions that correspond to other parts of the hologram-receiving surface which are to have the hologram created thereon; and bringing the tool against the hologram-receiving surface so that the hologram-stamping-surface of the layer causes deformation of the hologramreceiving surface to create the hologram on all parts thereof which underlie the tool except for those parts that underlie the portions where the microstructure of the hologram-stamping-material has been substantially removed.
In an embodiment of this aspect of the invention, the step of substantially removing the microstructure may occur before the attachment step.
In an embodiment of this aspect of the invention, the microstructure of the hologram-stamping surface may be retained only on portions that correspond to parts of the hologram-receiving surface that are uneven, so that the hologram is created only on uneven parts of the hologram-receiving surface.
Alternatively, in an embodiment of this aspect of the invention, the microstructure of the hologram-stamping surface may be retained on portions that correspond to flat parts of the hologram-receiving surface that are located between at least two uneven parts, so that the hologram is created on flat parts of the surface that are located between the at least two uneven parts of the hologram-receiving surface.
DRAWINGS
In order that the invention might be more fully understood, embodiments of the invention will be described, by way of example only with reference to the accompanying drawings, in which: Figure 1A illustrates a coin face having undulating uneven portions onto which a hologram has been selectively applied, with the flat even parts being free of the hologram; Figure 1B illustrates another coin having the same illustration as the coin in Figure 1A, except that the hologram has been applied to the flat surfaces, particularly the flat parts which are in between the uneven parts of the coin; Figure 1C illustrates a third coin which has been created by a further embodiment of the invention in which the hologram has been applied to all surfaces of the coin face, including the even and uneven parts; Figure 2 illustrates an example of a cross-sectional view of the coins of Figures 1lA, 1B and 1C; Figures 3A relates to side cross-sectional views of an embodiment of a stamping tool that is used to selectively stamp a hologram onto the underlying surface according to Figure 1A where the hologram is on the uneven parts of the coin; Figures 3B relates to side cross-sectional views of an embodiment of a stamping tool that is used to selectively stamp a hologram onto the underlying surface according to Figure 1 B where the hologram is on the even parts of the coin; Figure 4A shows a side perspective view of the stamping tool of Figure 3A; Figure 5A shows a side view of the stamping tool of Figures 3A and 4A being provided with a thin layer of hologram-stamping material; Figure 6A shows the stamping tool of Figure 5A with the thin layer of hologram-stamping material attached to the underside of the stamping tool; Figure 7A shows the smoothening of the microstructure of the thin layer in Figure 6A, with the microstructure being smoothened away from the even portions; Figure 7B shows an alternative embodiment in which the microstructure of the uneven portions is smoothened away, leaving the microstructure on the even portions; Figures 8A shows the tool of Figure 7A being impressed on'the coin surface to produce the hologram structures of Figures 1A; Figures 8B and 8C- shows similar views to Figure 8A, except that the undersurfaces of the tools have been modified to produce the hologram structures of Figures 1 B and 1C respectively; Figure 9 shows details of the mechanism of how the thin layer of hologram-stamping material is attached to the undersurface of the tool; Figure 10 shows a detail of the edge of the tool of Figure 9, illustrating the manner in which the edge margin of.the thin layer grips the edge of the tool; Figure 11 shows an alternative embodiment to Figure 10; and Figure 12 shows detail of the microstructure of the thin layer from Figure 9, indicating the transition between the smoothened portions, and the unsmoothened portions that contain the microstructure that is used to stamp the hologram on the surface.
Throughout the drawings, the suffix relates to the end result of Figure 1A, the suffix relates to the end result of Figure 1B, and so forth.
The drawings are not drawn to scale, and have been exaggerated to illustrate the details of the embodiments. For instance, the microstructure of the hologram-stamping surface would be very fine, but has been exaggerated in the diagrams.
In the embodiments in the drawings, like numerals have been used to refer to similar components, merely for ease of understanding the description.
EMBODIMENTS
Before describing embodiments of a method of the present invention, Figures 1A and 1B show the end result after an embodiment of the invention has been used.
Figures 1A and 1B each show a coin having an illustration of two horses on the coin surface. On the coin, the horses are created using raised surface relief of the coin surface.
In Figure 1A, a hologram has been stamped on the undulating, uneven surface relief on the bodies 20 of the horses. The flat surfaces 30 of the coin which surround the horses and which are in between the horses, are free of the hologram. These flat surfaces are provided with the plain surface finish of the coin face.
Figure 1B shows another embodiment in which the uneven surfaces (the illustration of the horses) are rendered in a plain non-hologram finish.
Instead, the hologram has been stamped onto flat parts 30 of the coin particular the flat part that is in between the undulating, uneven, parts of the coin S 30 face particularly the regions in between the horses).
Figure 1C illustrates an end result of a further variation in which the hologram has been stamped onto the entire surface of the coin 10C, both on the flat and on the uneven portions.
To produce the embodiments of Figures 1A and 1B requires the selective creation of the hologram on finely demarcated regions on the coin surface that are immediately bordered by other fine regions that are free of the hologram microstructure. In the embodiments, the demarcation of the hologram and nonhologram parts is very precise. The transition between hologram to non-hologram parts is achieved precisely at the interface of the even and uneven portions. For instance, in Figure 1A, the transition from the hologram to the non-hologram parts of the coin is found along a line that precisely follows the contour of the horses' bodies.
In Figure 1B, a significant degree of precision is required to create the hologram on the flat part of the coin that is in between the fine slivers of the manes of the horses, but not to have the hologram on the manes themselves.
This degree of precision, which is readily achievable by embodiments of the present invention, cannot be easily or economically achieved by prior art processes such as thermal or plasma spraying, or where the hologram-stamping microstructure is directly and physically created entirely on the undersurface of stamping tool.
To achieve this degree of precision, the stamping tool for creating the embodiments in Figures 1A and 1B has an undersurface region that comprises numerous fine adjacent portions, some having a hologram-stamping microstructure, others being free of this microstructure.
Figure 2 illustrates an example of a cross-sectional view of the coins of Figures 1A, 1B and 1C. The face of each coin act as a hologram-receiving surface. The intention is to selectively create a hologram on at least parts of the coin face. The coin face has a surface-topography that has flat parts 30 and uneven parts Figures 3A and 3B each relate to different-embodiments of the invention, each corresponding respectively to a stamping tool that produces the end results in Figures 1A and lB. (Figure 3A relates to Figure 1A. Figure 3B relates to Figure 1 B).
In Figure 3A, a stamping tool 40A is pr6vided. The stamping tool 40A has an undersurface 50 that has an undersurface-topography which compliments and corresponding fits the surface-topography 20, 30 of the coin. when the tool is pressed against the surface of the coin face. In Figure 3A, the microstructure of the hologram-stamping surface has been retained on the uneven portions of the tool. This corresponds to Figure 1A where the hologram is created exclusively on the uneven parts of the coin.
In the alternative shown in Figure 3B, the microstructure of the hologramstamping surface has been retained on the even flat portions of the tool, particularly the flat portion that is in between the two uneven portions. This corresponds to Figure 1B where the hologram is created exclusively on the even parts of the coin, particularly the even parts located between at least two uneven parts.
Figure 4A shows a side perspective view of the configuration in Figure 3A.
Now, a first embodiment of a method will be described by referring to the sequence in Figures 5A, 6A, 7A and 8A. These relate to the coin shown in Figure 1A. It is understood that these steps can be modified to create the coins in Figures 1B and 1C by altering the configuration of the stamping tool as described herein.
A thin layer 60 of hologram-stamping material is provided. At least one side 61 of the thin layer 60 is provided with a hologram-stamping surface. The hologram-stamping surface consists of a microstructure that is adapted to create the hologram on the coin surface 10 when impressed onto the coin surface.
The thin layer 60 of hologram-stamping material is an entity in itself, capable of being provided, transported and manipulated as a separate article. It is therefore conceptually different from thin layers found in the prior art which are created by thermal or plasma spraying, electrolysis or other deposition methods, and which cannot themselves exist as a separate. layer except for being deposited on a surface. Hence, the step of providing the thin layer is distinguishable from the step of attaching the layer to the underside of the tool.
The thin layer of hologram-stamping material can be made from material which is suitably hard to act as a hologram-stamping material. The prime requirement of the material is that the hologram-stamping material must be harder than the hologram-receiving surface, and must be capable of having the hologram-stamping pattern created thereon. The material should also have the necessary hardness and toughness to be used in the stamping process, and to resist the tendency to plastically deform under the pressures associated with the stamping process. The material of the thin layer 60 has a degree of stiffness which ensures that it does not sag when attached to the undersurface of the tool.
In Figure 5A, the thin layer of material 60 is formed onto the undersurface of the tool, using a known forming process. At the uneven portions, the material may stretch slightly and may plastically deform. This stretching of the layer of material can affect the hologram-stamping microstructure. Hence, care must be taken to perform the forming process sufficiently slowly so that the layer is not damaged to an extent that would be detrimental to the ensuing hologram image.
In Figure 6A, the thin layer 60 of hologram-stamping material is attached to the undersurface of the stamping tool 40, as will be described below. In the embodiment, the layer 60 is mechanically attached, and there is preferably no bonding or adhesion. This ensures that the layer can be removed readily.
In Figure 7A, selected portions of the hologram-stamping-microstructure of the thin layer are removed from the even flat portions.
In an alternative in Figure 7B, selected portions of the hologram-stampingmicrostructure of the thin layer are removed from the uneven portions.
The removal of the microstructure can be achieved by a process known as mechanical or laser polishing. In the embodiment, the microstructure need only be removed substantially to the extent that a hologram image is not formed on the coin surface.
It can be appreciated that removing or smoothening the microstructure from the undersurface of the tool is easier to perform that having to create the microstructure directly on the undersurface of the tool. Hence, the embodiment of the invention is easier and cheaper to achieve that earlier known processes.
For those parts of the coin that are to be free of hologram, the corresponding portion of the microstructure of the thin layer 60 on the tool are smoothened.
Whereas, for those parts of the coin that are to have the hologram, the microstructure of the thin layer on the tool 40A is retained in its original form, and is not smoothened.
To create the embodiment of Figure 1A, the microstructure of the hologram-stamping surface is retained only on portions that coirrespond to parts of the hologram-receiving surface that are uneven, so that the hologram is created only on uneven parts of the hologram-receiving surface. Thus, in Figure 7A, the microstructure of the hologram-stamping surface is retained on the undulating portions of the tool, while the flat portions have been smoothened.
Therefore, this arrangement produces the coin of Figure 1A, in which the hologram is found only on the undulating portions 20 of the coin, but not on the flat portions 30 of the coin.
Alternatively, to create the embodiment of Figure 1 B, the hologramstamping surface is retained on portions that correspond to flat parts of the hologram-receiving surface, particularly flat parts that are located between at least two uneven parts. Thus, the hologram is created on flat parts of the surface that are located between the at least two uneven parts of the hologram-receiving surface. In Figure 7B, the microstructure of the hologram-stamping surface has been smoothened on the undulating portions, but has been retained on the flat portions of the tool. Hence, the resulting tool in Figure 8B is able to create the hologram microstructure found in Figure 1 B, in which the hologram is found only on the flat portions 30 of the coin, whereas the undulating portions 20 of the coin Figure 1 B are free of holograms.
In Figures 7A and 7B, the thin layer 60 of material is retained on the entire undersurface of the stamping tool. In other words, the removal of the microstructure does not remove the thin layer itself, but merely smoothens away the microstructure that is required to create the hologram.
Figures 8A, 8B and 8C show the respective stamping tools pressed against the hologram-receiving surface of a coin. The hologram-stamping surface, of the-thin layer is pressed against the hologram-receiving surface of the coin.
This creates the hologram on all parts of the coin that underlie the tool, except for those parts of the coin that underlie the portions of the thin layer where the microstructure has been smoothened.
As can be seen in Figure 3A, 9, 10 and 11, for example, there is a slight rounded surface at the part where the layer 60 of material is bent around the edge 41 of the tool 40. This slight rounding ensures that the thin layer of material is less likely to stick or adhere to the coin surface 10 when the tool is impressed onto the coin.
Figure 9 to 12 illustrate how the thin layer of hologram-stamping material is mechanically attached to the undersurface of the stamping tool.
In Figure 9, the thin layer 60 of material is attached to the undersurface of the tool by inwardly bending the edge margins 62 of the thin layer 60 to grip the tool's edge, as seen in greater detail in Figure 10. The edges 41 of the tool 40 are angled inwardly to form wedge-shaped portions. In Figure 10, the base of the tool is wider at the base than the part further up the tool that has the angled portion. The wedge-shaped angular face of the edges 41 of the tool has an angle d which, in the embodiment, is 5 degrees. The edge margins 62 of the thin layer 60 are bent around the wedge-shaped edge portions 41 of the tool.
Another variation is shown in Figure 11 where the edge of the tool is angled at a angle greater than 5 degrees, to provide a groove 42 into which the edge margins 62 of the thin layer 60 are forced. Thus, the edge margins of the thin layer grip the edge of the tool. The embodiment in Figure 11 is thought to provide a better grip than the embodiment in Figure 10. The angle of 5 degrees has been given as an example only. The angle can vary, provided that it enables the edge margins 62 of the thin layer 60 to adequately grip the edge of the tool Without being restricted to any particularly theory, it is believed that when the edge margins of the thin layer are bent around the edges of the tool, a tension is created within the thin layer which enhances the grip of the layer on the tool.
The embodiments have been advanced by way of example only, and modifications are possible within the scope of the invention as defined by the appended claims.
In the specification, the word "uneven" is used according to its definition-of being "not level". In other words, references to the surface having "uneven" parts means that the surface has parts that may be above and/or below the level of the overall surface. Hence, the uneven parts may include depressed parts, or raised parts, or a combination of both. For instance, in Figures 1A, 1B, 1C and Figure 2, the uneven parts 20 are in the form of raised relief. However, in other modifications, the uneven parts 20 can be configured also as depressions.
Alternatively, the uneven parts 20 may be in the form of raised flat platforms that protrude above thesurface level of the coin face.
In the embodiments described above, the step of creating the arrangement of hologram-stamping microstructure on the thin layer occurs after the step of attaching the thin layer to the undersurface of the tool. However, in another embodiment, the step of creating the microstructure arrangement on the thin layer may occur before the step of attaching the thin layer to the undersurface of the tool. For instance, in an alternative embodiment, the step of smoothening the microstructure of the thin layer can occur before the thin layer is attached to the tool's undersurface. In the example of the horses in Figure 1, the smoothening could be performed to create a pattern of the horses on the thin layer. Then, after this step of selective smoothening, the thin layer is then precisely attached to the coin surface. A template is used to guide and align the attachment process so that the horse illustration on the smoothened thin layer is placed precisely onto the horse illustration on the coin face.
As another modification, before the layer is attached to the tool, the microstructure of the hologram-stamping surface may be created only on portions that correspond to parts of the hologram-receiving surface which are to have the hologram created thereon. As an example of this approach, a layer of thin material is provided. An image of the horses, made up of the microstructure of the hologram-stamping-surface, is laser-etching or laser-cutting onto the smooth layer of the material. Then, after the hologram-stamping microstructure has been created on the layer of material in the shape of the horses, the layer of material is attached to the undersurface of the tool. Thus, the hologram-stamping microstructure can be applied only to the horses of Figure 1A by attaching this layer of material to the undersurface of the tool.
Preferably, the layer of hologram-stamping material is separably attached to the undersurface of the tool. Thus, if the layer has defects, or if the layer becomes worn through use, the layer can be removed, and a new layer can be attached. This avoids the need to discard the entire tool, or to excoriate a bonded layer from the tool which would be an expensive process.
The present invention relates to stamping holograms onto hard surfaces, and does not relate to prior art that involves creating hologram on non-hard surfaces such as paper or other documents that do not require a stamping process. The invention has particular use in stamping holograms onto metallic surfaces or other such hard surfaces found on coins and medallions, but also has other uses where holograms must be created by stamping on hard surfaces.
Other embodiments may be used in relation to any hard surface on which a physical hologram microstructure is to be stamped and impressed, in which the surface has even and uneven parts.
In this specification, merely for ease of understanding the description, wherever possible, the term "portion" has been used to refer to regions on the undersurface of the tool, and the term "part" refers to regions on the hologramreceiving-surface on which the tool is impressed.
Claims (28)
1. A method of selectively stamping a hologram onto at least parts of a hologram-receiving surface that has a surface-topography having flat parts and uneven parts, the method including: providing a stamping tool having an undersurface that has an undersurface-topography which complements and correspondingly fits said surface-topography when the tool is pressed against the hologram-receiving surface; providing a layer of hologram-stamping-material at least one side of which has a hologram-stamping surface having a microstructure adapted to create the hologram on the hologram-receiving surface; attaching the layer to the undersurface of the tool; creating on the layer an arrangement where selected portions of the layer are free of the microstructure of the hologram-stamping-surface which correspond to parts of the hologram-receiving surface that are to be free of the hologram, and where other selected portions of the layer are provided with the microstructure of the hologram-stamping surface which correspond to other parts of the hologram- receiving surface that are to have the hologram created thereon; and pressing the tool against the hologram-receiving surface so that the hologram-stamping-surface of the layer is pressed against the hologram-receiving surface to create the hologram on all parts thereof which underlie the tool except for those parts that underlie the portions that are free of microstructure of the hologram-stamping-surface.
2. A method of claim 1 wherein the layer is attached to the tool by inwardly bending edge margins of the layer to grip edges of the tool.
3. A method of claim 2 wherein the edges of the tool are angled inwardly to form projecting portions around which the edge margins of the layer are bent.
4. A method of claim 3 wherein the projecting portions are wedge-shaped.
A method of any one of claims 1 to 4 wherein the step of creating the arrangement on the layer occurs after the step of attaching the layer to the undersurface of the tool.
6. A method of any one of claims 1 to 4 wherein the step of creating the arrangement on the layer occurs before the step of attaching the layer to the undersurface of the tool.
7. A method of claim 6 wherein the step of creating the arrangement on the layer includes creating the microstructure of the hologram-stamping surface only on portions that correspond to the parts of the hologram-receiving surface which are to have the hologram created thereon.
8. A method of any one of claims 1 to 6 wherein the step of creating the arrangement on the layer includes substantially removing the microstructure from any selected portions of the hologram-stamping-surface that correspond to parts of the hologram-receiving surface which are to be free of the hologram, and retaining the microstructure of the hologram-stamping surface on portions that correspond to other parts of the hologram-receiving surface which are to have the hologram created thereon.
9. A method of any one of claims 1 to 8 wherein, in the arrangement on the layer, the microstructure of the hologram-stamping surface is only on portions that correspond to parts of the hologram-receiving surface that are uneven, so that the hologram is created only on uneven parts of the hologram-receiving surface.
A method of any one of claims 1 to 8 wherein, in the arrangement on the layer, the microstructure of the hologram-stamping surface is only on portions that correspond to flat parts of the hologram-receiving surface including flat parts that are located between at least two uneven parts, so that the hologram is created on flat parts of the surface including flat parts that are located between the at least two uneven parts of the hologram-receiving surface.
11. A method of any one of claims 1 to 10 wherein the uneven parts include depressed parts.
12. A method of any one of claims 1 to 10 wherein the uneven parts include raised parts.
13. A method of any one of claims 1 to 10 wherein the uneven parts include raised and depressed parts.
14. A method of either claim 12 or 13 wherein the raised parts are formed as undulating surface relief.
A method of any one of the preceding claims wherein the layer is separably attached to the undersurface of the tool.
16. A coin, medallion or the like, produced according to the method of claim 9, wherein the coin has the hologram only on uneven parts of the hologram- receiving surface.
17. A coin, medallion or the like, produced according to the method of claim wherein the coin has the hologram on flat parts of the hologram-receiving surface that are located between at least two uneven parts.
18. A hologram-stamping tool that is adapted to selectively stamp a hologram on at least parts of a hologram-receiving surface that has a surface-topography having flat parts and uneven parts, the stamping tool having an undersurface that has an undersurface- topography which complements and correspondingly fits said surface-topography when the tool is pressed against the hologram-receiving surface; a layer of hologram-stamping-material attached to the undersurface of the tool, the layer including a hologram-stamping surface having a microstructure adapted to create the hologram on the hologram-receiving surface; the hologram-stamping surface having selectively smoothened portions of the hologram-stamping-surface that correspond to parts of the hologram- receiving surface which are to be free of the hologram, and portions in which the microstructure of the hologram-stamping surface has been retained that correspond to other parts of the hologram-receiving surface which are to have the hologram created thereon, wherein, the tool is adapted to be used by pressing the tool against the hologram-receiving surface so that the hologram-stamping-surface of the layer is pressed against the hologram-receiving surface to create the hologram on all parts thereof which underlie the tool except for those parts that underlie the portions where the microstructure of the hologram-stamping-material has been smoothened.
19. A method of selectively stamping a hologram onto at least parts of a hologram-receiving surface that has a surface-topography having flat parts and uneven parts, the method including: providing a stamping tool having an undersurface that has an undersurface-topography which complements and correspondingly fits said surface-topography when the tool is brought against the hologram-receiving surface; providing a layer of hologram-stamping-material at least one side of which has a hologram-stamping surface having a microstructure adapted to create the hologram on the hologram-receiving surface; attaching the layer to the undersurface of the tool; substantially removing the microstructure from any selected portions of the hologram-stamping-surface that correspond to parts of the hologram-receiving surface which are to be free of the hologram, and retaining the microstructure of- the hologram-stamping surface on portions that correspond to other parts of the hologram-receiving surface which are to have the hologram created thereon; and bringing the tool against the hologram-receiving surface so that the hologram-stamping-surface of the layer causes deformation of the hologram- receiving surface to create the hologram on all parts thereof which underlie the tool except for those parts that underlie the portions where the microstructure of the hologram-stamping-material has been substantially removed.
A method of claim 19 wherein the layer is attached to the tool by inwardly bending edge margins of the layer to grip edges of the tool.
21. A method of claim 20 wherein the edges of the tool are angled inwardly to form projecting portions around which the edge margins of the layer are bent.
22. A method of claim 21 wherein the projecting portions are wedge-shaped.
23. A method of any one of claims 19 to 22 wherein the step of substantially removing the microstructure occurs before the attachment step.
24. A method of any one of claims 19 to 22 wherein the step of substantially removing the microstructure occurs after the attachment step.
A method of any one of claims 19 to 24 wherein the microstructure of the hologram-stamping surface is retained only on portions that correspond to parts of the hologram-receiving surface that are uneven, so that the hologram is created only on uneven parts of the hologram-receiving surface.
26. A method of any one of claims 19 to 24 wherein the microstructure of the hologram-stamping surface is retained on portions that correspond to flat parts of the hologram-receiving surface that are located between at least two uneven parts, so that the hologram is created on flat parts of the surface that are located between the at least two uneven parts of the hologram-receiving surface.
27. A method of any one of claims 19 to 26 wherein the step of removing the microstructure includes substantially smoothening the microstructure of the hologram-stamping surface.
28. A method of selectively stamping a hologram onto at least parts of a hologram-receiving surface that has a surface-topography having flat parts and uneven parts, the method substantially as hereinbefore described and illustrated with reference to Figures 3A to 12 of the accompanying drawings. DATED this 24th day of October 2001 THE SINGAPORE MINT WATERMARK PATENT TRADEMARK ATTORNEYS 290 BURWOOD ROAD HAWTHORN VICTORIA 3122 AUSTRALIA RCS/RJS/meh Z1430AUOO.DOC
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU83614/01A AU756424B1 (en) | 2001-10-24 | 2001-10-24 | Method and apparatus for creating a hologram on a surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU83614/01A AU756424B1 (en) | 2001-10-24 | 2001-10-24 | Method and apparatus for creating a hologram on a surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU756424B1 true AU756424B1 (en) | 2003-01-09 |
Family
ID=3761520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU83614/01A Expired AU756424B1 (en) | 2001-10-24 | 2001-10-24 | Method and apparatus for creating a hologram on a surface |
Country Status (1)
| Country | Link |
|---|---|
| AU (1) | AU756424B1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106054294A (en) * | 2016-04-29 | 2016-10-26 | 沈阳造币有限公司 | Metal coin or stamp with DOE (Diffraction Optical Element) anti-counterfeit pattern and manufacturing method thereof |
| EP3858184A1 (en) * | 2020-01-27 | 2021-08-04 | B.H. Mayer's Kunstprägeanstalt GmbH | Coin or medal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0421181A1 (en) * | 1989-10-04 | 1991-04-10 | Pamp S.A. | Method for making a holographic image on a metallic object and tool for carrying out the method |
| JPH05254024A (en) * | 1992-03-10 | 1993-10-05 | Kuroda Nobuo | Manufacture of synthetic resin ornamental piece |
| WO1998053719A2 (en) * | 1997-05-29 | 1998-12-03 | Matthiesen, Miriam | Method for impressing microstructures into metals or other hard materials, corresponding impression tool and coin |
-
2001
- 2001-10-24 AU AU83614/01A patent/AU756424B1/en not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0421181A1 (en) * | 1989-10-04 | 1991-04-10 | Pamp S.A. | Method for making a holographic image on a metallic object and tool for carrying out the method |
| JPH05254024A (en) * | 1992-03-10 | 1993-10-05 | Kuroda Nobuo | Manufacture of synthetic resin ornamental piece |
| WO1998053719A2 (en) * | 1997-05-29 | 1998-12-03 | Matthiesen, Miriam | Method for impressing microstructures into metals or other hard materials, corresponding impression tool and coin |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106054294A (en) * | 2016-04-29 | 2016-10-26 | 沈阳造币有限公司 | Metal coin or stamp with DOE (Diffraction Optical Element) anti-counterfeit pattern and manufacturing method thereof |
| EP3858184A1 (en) * | 2020-01-27 | 2021-08-04 | B.H. Mayer's Kunstprägeanstalt GmbH | Coin or medal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5544623B2 (en) | Method for machining a structured surface | |
| PT1467871E (en) | Steel gravure method for the production of a security document, steel gravure plate and intermediate product for the same and method for production thereof | |
| US20160193866A1 (en) | Method for producing a surface structure on a pressing tool by applying metal coatings | |
| WO2002068321A3 (en) | Forming tool for forming a contoured microelectronic spring mold | |
| US6701652B1 (en) | Molded emblem with encapsulated embossed 3-D graphics | |
| WO2007063739A1 (en) | Product with concave-convex pattern on its surface and method of forming the concave-convex pattern | |
| DK1296782T3 (en) | Process for making a sheet comprising an intermediate molding and a final molding | |
| AU756424B1 (en) | Method and apparatus for creating a hologram on a surface | |
| US6361702B1 (en) | Device for producing material having optically varying effects and method of producing the same | |
| EP2146369A3 (en) | Method of forming an in-situ recessed structure | |
| WO2003061986A3 (en) | Device and method for applying patterns and/or labels to a substantially flat surface of an article | |
| JPH01222944A (en) | Resin mold bonded with decorative film and its manufacture | |
| US319306A (en) | Process of making | |
| WO2004056698A3 (en) | Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component | |
| JP2619406B2 (en) | Apparatus for forming embossed pattern on leather member and method of manufacturing the same | |
| US20090004432A1 (en) | Rolling Matrix for a Powder Coating System for Finishing the Surface of a Product and the Relative Method for Its Realisation | |
| US20220043339A1 (en) | Method for roll-to-roll imprinting of components | |
| US7882637B2 (en) | Method of obtaining a string of patterns, and an article, in particular a piece of jewelry, comprising a string of patterns | |
| JP3847829B2 (en) | Anti-counterfeit embossed card and method of manufacturing | |
| EP3141399A1 (en) | Improved process for producing metal moulds, such as sheets, cylinders and the like provided with at least one structured surface and metal stamps obtained with this process | |
| JP4188041B2 (en) | Mark forming method for rubber product and mark forming body used in the method | |
| EP0178741A2 (en) | Method for manufacturing sheet material suitable for the furniture industry and similar | |
| JPH1180988A (en) | Production of micromember made of metal and its use | |
| US378421A (en) | kemble | |
| JP3464194B2 (en) | Pattern foil and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FGA | Letters patent sealed or granted (standard patent) |