WO2004056698A3 - Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component - Google Patents

Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component Download PDF

Info

Publication number
WO2004056698A3
WO2004056698A3 PCT/FR2003/003789 FR0303789W WO2004056698A3 WO 2004056698 A3 WO2004056698 A3 WO 2004056698A3 FR 0303789 W FR0303789 W FR 0303789W WO 2004056698 A3 WO2004056698 A3 WO 2004056698A3
Authority
WO
WIPO (PCT)
Prior art keywords
sacrificial layer
layer
polymer material
making
resulting component
Prior art date
Application number
PCT/FR2003/003789
Other languages
French (fr)
Other versions
WO2004056698A2 (en
Inventor
Philippe Robert
France Michel
Catherine Maeder-Pachurka
Nicolas Sillon
Original Assignee
Commissariat Energie Atomique
Philippe Robert
France Michel
Catherine Maeder-Pachurka
Nicolas Sillon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique, Philippe Robert, France Michel, Catherine Maeder-Pachurka, Nicolas Sillon filed Critical Commissariat Energie Atomique
Priority to EP03799623A priority Critical patent/EP1572578A2/en
Priority to AU2003299341A priority patent/AU2003299341A1/en
Priority to US10/536,890 priority patent/US20060138076A1/en
Publication of WO2004056698A2 publication Critical patent/WO2004056698A2/en
Publication of WO2004056698A3 publication Critical patent/WO2004056698A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00611—Processes for the planarisation of structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0108—Sacrificial polymer, ashing of organics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0118—Processes for the planarization of structures
    • B81C2201/0125—Blanket removal, e.g. polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

The invention concerns a method which consists in successively depositing a polymeric sacrificial layer (2), depositing, on at least part of the substrate (1) and the front surface of the sacrificial layer (2), an embedding layer (6), with a thickness greater than that of the sacrificial layer (2) and performing planarization such that the front surfaces of the sacrificial layer (2) and of the embedding layer (6) form a common planar surface. A forming layer (3) of a suspended structure (5) is deposited on the front face of the common planar surface. The planarization can include chemical mechanical polishing and etching the embedding layer (6). Etching the sacrificial layer (2) can be performed by means of a mask, formed on the front surface of a polymer material layer, removed during the planarization step.
PCT/FR2003/003789 2001-02-27 2003-12-18 Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component WO2004056698A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP03799623A EP1572578A2 (en) 2002-12-18 2003-12-18 Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component
AU2003299341A AU2003299341A1 (en) 2002-12-18 2003-12-18 Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component
US10/536,890 US20060138076A1 (en) 2001-02-27 2003-12-18 Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0216088A FR2849016B1 (en) 2002-12-18 2002-12-18 METHOD FOR MAKING A PLANE SUSPENDED MICRO-STRUCTURE USING A SACRIFICIAL LAYER OF POLYMERIC MATERIAL AND COMPONENT OBTAINED
FR02/16088 2002-12-18

Publications (2)

Publication Number Publication Date
WO2004056698A2 WO2004056698A2 (en) 2004-07-08
WO2004056698A3 true WO2004056698A3 (en) 2004-11-11

Family

ID=32406154

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2003/003789 WO2004056698A2 (en) 2001-02-27 2003-12-18 Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component

Country Status (4)

Country Link
EP (1) EP1572578A2 (en)
AU (1) AU2003299341A1 (en)
FR (1) FR2849016B1 (en)
WO (1) WO2004056698A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2874213B1 (en) * 2004-08-13 2007-03-02 Commissariat Energie Atomique DEVICE COMPRISING AN ENCAPSULATED MICROSYSTEM AND METHOD OF MANUFACTURE
US7271022B2 (en) * 2004-12-21 2007-09-18 Touchdown Technologies, Inc. Process for forming microstructures
US7264984B2 (en) 2004-12-21 2007-09-04 Touchdown Technologies, Inc. Process for forming MEMS
US7245135B2 (en) 2005-08-01 2007-07-17 Touchdown Technologies, Inc. Post and tip design for a probe contact
US7362119B2 (en) 2005-08-01 2008-04-22 Touchdown Technologies, Inc Torsion spring probe contactor design
US7365553B2 (en) 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
US7180316B1 (en) 2006-02-03 2007-02-20 Touchdown Technologies, Inc. Probe head with machined mounting pads and method of forming same
GB2588891B (en) * 2019-10-23 2024-04-24 Smart Photonics Holding B V Manufacturing a semiconductor structure

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5430421A (en) * 1992-12-15 1995-07-04 Asulab S.A. Reed contactor and process of fabricating suspended tridimensional metallic microstructure
US5582678A (en) * 1986-10-20 1996-12-10 Canon Kabushiki Kaisha Process for producing ink jet recording head
WO2000033089A2 (en) * 1998-12-02 2000-06-08 Formfactor, Inc. Lithographic contact elements
US20020047172A1 (en) * 2000-08-23 2002-04-25 Reid Jason S. Transition metal dielectric alloy materials for MEMS
WO2002068321A2 (en) * 2001-02-27 2002-09-06 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5636070A (en) 1994-04-30 1997-06-03 Daewoo Electronics Co, Ltd. Thin film actuated mirror array

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5582678A (en) * 1986-10-20 1996-12-10 Canon Kabushiki Kaisha Process for producing ink jet recording head
US5430421A (en) * 1992-12-15 1995-07-04 Asulab S.A. Reed contactor and process of fabricating suspended tridimensional metallic microstructure
WO2000033089A2 (en) * 1998-12-02 2000-06-08 Formfactor, Inc. Lithographic contact elements
US20020047172A1 (en) * 2000-08-23 2002-04-25 Reid Jason S. Transition metal dielectric alloy materials for MEMS
WO2002068321A2 (en) * 2001-02-27 2002-09-06 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
See also references of EP1572578A2 *
SONG H ET AL: "Wafer level vacuum packaged de-coupled vertical gyroscope by a new fabrication process", PROCEDINGS OF THE IEEE 13TH. ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS. MEMS 2000. MIYAZAKI, JAPAN, JAN. 23-27, 2000, 23 January 2000 (2000-01-23), pages 520 - 524, XP010377181 *

Also Published As

Publication number Publication date
EP1572578A2 (en) 2005-09-14
FR2849016B1 (en) 2005-06-10
WO2004056698A2 (en) 2004-07-08
AU2003299341A1 (en) 2004-07-14
FR2849016A1 (en) 2004-06-25

Similar Documents

Publication Publication Date Title
EP0905756A3 (en) Planarization of a non-conformal device layer in semiconductor fabrication
EP1364702A3 (en) Process for producing array plate for biomolecules having hydrophilic and hydrophobic regions
MY125775A (en) Method for treating substrates for microelectronics and substrates obtained by said method.
WO2002082530A3 (en) In-situ thickness measurement for use in semiconductor processing
MY114849A (en) Surface treatment process of metallic material and metallic obtained thereby
WO2005065436A3 (en) Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
WO2009004560A3 (en) A method for forming a patterned layer on a substrate
EP1253108A3 (en) Method of fabricating suspended microstructures
SE9502258D0 (en) Method for the manufacture of a membrane-containing microstructure
WO2008048928A3 (en) Methods of patterning a material on polymeric substrates
EP1114791A3 (en) Method of forming structure having surface roughness due to nano-sized surface features
WO2004056698A3 (en) Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component
SG151235A1 (en) Glass substrate for magnetic disc and manufacturing method thereof
US7124994B2 (en) Silicon micro-mold
EP2146369A3 (en) Method of forming an in-situ recessed structure
WO2006109343A3 (en) Process for the formation of miniaturized getter deposits and getterdeposits so obtained
EP1168432A3 (en) Method of integrating a thin film resistor in a multi-level metal tungsten-plug interconnect
WO2005061378A3 (en) Equipment and process for creating a custom sloped etch in a substrate
WO2005103818A3 (en) Method for structuring at least one layer and electric component with structures from said layer
EP1342736A3 (en) Prepolymer material, polymer material, imprinting process and their Use
TW200520033A (en) Method of processing substrate and chemical used in the same
EP1398296A3 (en) A method for making three-dimensional structures having nanometric and micrometric dimensions
WO2005013335A3 (en) Method of depositing patterned films of materials using a positive imaging process
EP1327517A3 (en) Method of metal layer formation and metal foil-based layered product
WO2005019351A3 (en) Methods for forming composite coatings on mems devices

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2003799623

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2003799623

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2006138076

Country of ref document: US

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 10536890

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 10536890

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP