CN106054294A - Metal coin or stamp with DOE (Diffraction Optical Element) anti-counterfeit pattern and manufacturing method thereof - Google Patents
Metal coin or stamp with DOE (Diffraction Optical Element) anti-counterfeit pattern and manufacturing method thereof Download PDFInfo
- Publication number
- CN106054294A CN106054294A CN201610279546.4A CN201610279546A CN106054294A CN 106054294 A CN106054294 A CN 106054294A CN 201610279546 A CN201610279546 A CN 201610279546A CN 106054294 A CN106054294 A CN 106054294A
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- China
- Prior art keywords
- doe
- mask plate
- metal
- chapter
- metal die
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
-
- A—HUMAN NECESSITIES
- A44—HABERDASHERY; JEWELLERY
- A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
- A44C21/00—Coins; Emergency money; Beer or gambling coins or tokens, or the like
Abstract
The invention relates to a metal coin or stamp with a DOE (Diffraction Optical Element) anti-counterfeit pattern and a manufacturing method thereof. The characteristics lie in that a DOE is manufactured on the surface of a metal coin or stamp, and the DOE is enabled to be organically combined with a target pattern on the surface of the coin or stamp, so that the anti-counterfeit performance of the coin or stamp is improved, and collection values are improved. The manufacturing method comprises the steps of optical design, laser direct wiring of a mask plate, metal mold processing, labeled mask plate exposure and the like. The manufacturing method for a metal coin or stamp, which is provided with the DOE anti-counterfeit pattern and difficult to be copied, visual and convenient to be recognized and can be suitable for mass large-batch production, and the metal coin and stamp are provided in allusion to deficiencies in the prior art. The manufacturing method not only can be applied to counterfeit prevention, design and production of precious metal coins or stamps, but also can be applied to anti-counterfeit detection for other products besides the metal coins or stamps, thereby providing a new way for anti-counterfeit detection of products with a metal component or part.
Description
Technical field
The present invention relates to a kind of metal coins or chapter and manufacture method thereof, particularly relate to a kind of there is DOE security pattern
Metal coins or chapter and manufacture method thereof.
Background technology
The mid-80 U.S. Lincoln laboratory proposes the concept of binary optical, here it is diffraction optics, due to diffraction
Optics and components and parts thereof have the function that many traditional opticals are difficult to possess on light wave conversion, thus promote optical system
Miniaturization, array and integrated, open the frontier of contemporary optics.
Diffraction optical element (Diffraction Optical Element is called for short DOE) is a kind of diffraction based on light wave
Theory, utilizes computer-aided design and extensive, super large-scale integration manufacturing process, etches generation two at material surface
Individual or the embossment structure of multiple step, thus form the class micro-optical unit device coaxially reproducing and having high diffraction efficiency
Part.
Opto-electronics is flourish in recent years, and the design of domestic existing diffraction optical element is divided into two kinds, and the first is
Two step design modes, this design is simple, it is not necessary to alignment alignment, and design step depth is selected optical maser wavelength
The half of (generally representing with λ) and the ratio of selected materials refractive index (generally representing with n), shortcoming is that figure selecting is limited, only
Can select, about the point-symmetric graphic designs of circle, for not rounded point symmetry figure, about central authorities' primary maximum symmetry two will to be obtained
Individual secondary diffraction pattern, the diffraction efficiency of this figure is low, and two symmetric figure diffraction energies are equal, therefore comes for single figure
Calculating, its diffraction energy is not above the 50% of gross energy；The second is four step design modes, relative to two step design sides
Formula, the making of this design is increasingly complex, needs to expose for three times, and for the first time exposure is to make marks, second time be for
The alignment 1/8n wavelength degree of depth, third time is for the alignment 1/4n wavelength degree of depth, during twice alignment, in order to reduce as far as possible
Registration error, needs to select high accuracy litho machine.
The at present application of diffraction optical element be generally based on some optical materials such as quartz glass, silicon, germanium, zinc selenide and
The optical characteristics of the infra-red materials such as zinc sulfide is studied, and these materials all have intrinsic optical signature, diffraction optics unit
Part designs according to material behavior, and is applied by diffraction optical element on metal coins or chapter in order to false proof or increase reserve value
Research at home and abroad have not been reported.
Along with the development of national economy scale, the demand expanding day to metal coins or chapter, therefore to metal coins or
Chapter, the particularly demand of the false proof update method of a new generation's precious metal coin or chapter are more urgent.Accordingly, it is considered to by diffraction optics unit
Part is applied on metal coins or chapter in order to false proof or increase reserve value.But, it is projeced into metal coins or chapter surface formed
Reflective diffraction light needs not move through material, but is reflected by metal coins or chapter surface, and for its constructional depth,
The twice that light path is transmissive diffraction light of reflective diffraction light process, therefore considers at metal coins or chapter surface forming
During the manufacture method of DOE security pattern, the design of diffraction optical element, the selection of photoresist, the setting of etching parameters and refraction
The selections of rate etc. are all the technological difficulties needing to capture.
Summary of the invention
It is an object of the invention to for the deficiencies in the prior art, it is provided that one is difficult to copy, be intuitively easy to identify, and
A kind of metal coins with DOE security pattern or chapter and the manufacture method thereof produced in enormous quantities can be suitable for.This manufacture method
Can be not only used for the false proof of precious metal coin or chapter and design and produce, it is also possible to remaining product is anti-beyond metal coins or chapter
Pseudo-detection, opens a brand-new road for having the product false proof detection of hardware or parts.
It is an object of the invention to complete by the following technical programs:
A kind of metal coins with DOE security pattern or chapter, including metal coins 1, two or more step embossment structure
DOE security pattern 2, it is characterized in that being fabricated on the surface of metal coins or chapter DOE security pattern 2, make it with coin or
The target pattern on the surface of chapter organically combines.
For reaching a kind of metal coins with DOE security pattern or the manufacture method of chapter of above-mentioned purpose, comprise the steps:
A, optical design: target pattern is converted to by DOE design the PHASE DISTRIBUTION diagram data of DOE；
B, laser direct-writing mask plate: the PHASE DISTRIBUTION diagram data of DOE is converted to for laser direct-writing mach special
The data of form, carry out laser direct-writing mask plate；Described mask plate at least include a labelling mask plate and remaining 2xOpen and cover
Lamina membranacea, described labelling mask plate is first mask plate, and remaining mask plate is pressed wavelength degree of depth sequence order and arranged, and wherein x is
Natural number, when DOE is respectively two steps, four steps, eight step design, the setting of mask plate alignment the most successively；
C, metal die process: after being processed on metal die surface, at metal die surface aluminizer, treat that aluminum film has plated
After, spin coating viscosifier on aluminum film, it is cooled to room temperature, even resist coating after being toasted by metal die, then metal die is toasted
After be cooled to room temperature；
D, labelling mask plate expose: use litho machine by the alignment mark on first mask plate by using litho machine pair
Metalloid die surface exposes, and alignment mark is stayed on aluminum film by corrosion of then developing；
E, by leave on aluminum film alignment mark metal die surface process after, spin coating viscosifier on aluminum film, by metal
After being cooled to room temperature after mould baking, even resist coating, then it is cooled to room temperature after metal die baking；
F, step mask plate exposure etching: utilize alignment mark, metal die surface is placed on litho machine deep by wavelength
Degree order remaining mask plate of alignment one by one；
The imaging effect of metal die surface DOE checked by g, the laser pen of use coupling, uses qualified metal die by DOE
Turn over metal coins or chapter surface.
Optical design in described step a comprises the steps:
1) MATLAB business mathematics software is used to be converted into 8 gray-scale maps in the picture of target pattern；
2) GS iterative algorithm is selected to write Diffraction Calculation program according to graph style；
3) Diffraction Calculation program is used to be calculated the PHASE DISTRIBUTION diagram data of DOE.
In described step b, as x=1, in two step mask plates, first mask plate is 1/8n wavelength degree of depth mask
Plate, second mask plate is 1/4n wavelength degree of depth mask plate.
Described metal die surface processes and includes that the microgranule on surface is removed and is dried.
Described viscosifier are HMDS.
The invention has the beneficial effects as follows: the present invention, by GS new algorithm includes optical design serial iteration algorithm, mixes
The optimization of genetic iteration hill-climbing algorithm and lifting, improve image quality, has reached optimal of optical design and metal material
Join, arrange with accurate technological parameter additionally by ripe processing step, decrease defective products, improve the steady of properties of product
Qualitative, it is provided that one is difficult to copy, directly perceived and be easy to identify, and can be suitable for producing in enormous quantities there is the false proof figure of DOE
The metal coins of case or chapter.This manufacture method can be not only used for the false proof of precious metal coin or chapter and designs and produces, it is also possible to be used for
The anti-counterfeiting detection of remaining product beyond metal coins or chapter, opens one for having the product false proof detection of hardware or parts
Brand-new road.
Accompanying drawing explanation
Accompanying drawing 1 is a set of mask plate completed
Accompanying drawing 2 mask alignment process schematic diagram
Accompanying drawing 3 coating technique schematic diagram
Die after accompanying drawing 4 processing and DOE false proof regional reflex imaging effect
Accompanying drawing 5 stamp surfaces DOE reflects the micro-effect in false proof region
Commemorative coin chapter after accompanying drawing 6 impressing and DOE false proof regional reflex effect
Wherein: 1, metal coins, 2, security pattern, 3, mask plate, 4, ultraviolet light, 5, photoresist, 6, matrix, 7, drip sebific duct,
8, gluing plane is treated, 9, rotary shaft, 10, reflect security pattern effect on metal coins, 11, reflector space, 12, die, 13, die
Upper reflection security pattern effect.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is further described.
Embodiment:
The manufacture method of the metal coins or chapter with security pattern is applied to metal coins false proof, based on clean more than ten thousand grades
Clear space, temperature 20 DEG C ± 2 DEG C, in the environment of relative humidity 45-55%, target pattern is the group of word and simple geometry figure
Close, specifically include following steps:
A, optical design: target pattern is converted to by DOE design the PHASE DISTRIBUTION diagram data of DOE；
Specifically, comprise the following steps:
1) MATLAB business mathematics software is used to be converted into 8 gray-scale maps in the picture of target pattern；
2) GS iterative algorithm self-editing Diffraction Calculation program is selected according to graph style；
3) Diffraction Calculation program is used to be calculated the PHASE DISTRIBUTION diagram data of DOE.
B, laser direct-writing mask plate: the PHASE DISTRIBUTION diagram data of DOE is converted to can be used for laser direct-writing mach specially
By formatted data, data transfer method, with aforementioned MATLAB business mathematics software, selects 650nm laser, 2mm laser straight writing head
50nm laser facula read-write mask plate, a set of mask plate has three mask plates, and first is labelling mask plate, and second is 1/
8n wavelength degree of depth mask plate, the 3rd is 1/4n wavelength degree of depth mask plate；
C, metal die surface process: after metal die surface cleaning, and 120 DEG C are dehydrated 30 minutes in an oven, aluminize
Film 50nm；After aluminum film has plated, spin coating viscosifier HMDS on aluminum film, metal die surface is put in baking oven
After 100 DEG C of bakings were cooled to room temperature after 10 minutes, use 500 revolutions per seconds of rotating speeds of centrifuge stand glue 4 seconds, 6000 revolutions per seconds of rotating speed spin coatings
30 seconds, even resist coating；Reexamining metal die photomask surface glued membrane the most uniform without dirty point, qualified metal die surface is put
Take out after 90 DEG C of hot plates toast 10 minutes and be cooled to room temperature；
D, labelling mask plate expose: use litho machine by the alignment mark on first mask plate by using litho machine pair
Metalloid die surface exposes, and alignment mark is stayed on aluminum film by corrosion of then developing；
Exposure i.e. for the first time: alignment mark is set on the aluminum film on metal die surface, right by first mask plate
Fiducial mark note and the alignment mark exposure on aluminum film, use developing liquid developing corrosion, stayed by alignment mark on aluminum film；Cleaning
And behind dry metal die surface, in the manner aforesaid, spin coating viscosifier on aluminum film, it is cooled to room temperature, evener painting light after baking
Photoresist, is cooled to room temperature after baking；
E, i.e. second time exposure: metal die surface is placed on Canon's double-sided overlay litho machine and carries out alignment, use the
Two mask plates carry out alignment exposure, use developing liquid developing corrosion；
Rear baking: the part not etched on metal die surface is coated protection type photoresist, exposes part to be etched,
Metal die surface is placed on hot plate 140 DEG C toast at least 1 hour；
Etching: after having toasted afterwards, metal die surface is naturally cooled to room temperature, sets the etching of ion etching machine
Parameter, is placed in ion etching machine etching by metal die surface, and etching parameters is: ion beam current 150mA, neutralizes electric current
180mA, plate voltage 350V, accelerate pole tension 500V, argon flow amount 2.5sccm, vacuum 3.0 × 10-2Pa, cooling water temperature
5 DEG C, etching depth 81.25nm, after having etched, takes out metal die surface and cleans；Cleaning dry metal die surface
After, in the manner aforesaid, spin coating viscosifier on aluminum film, it is cooled to room temperature, evener resist coating after baking, after baking, is cooled to room
Temperature；
F, step mask plate exposure etching: utilize alignment mark, metal die surface is placed on litho machine deep by wavelength
Degree order remaining mask plate of alignment one by one；
I.e. third time exposure: be placed on metal die surface on Canon's double-sided overlay litho machine and carry out alignment, uses the 3rd
Open mask plate and carry out alignment exposure, use developer solution corrosion development；
Rear baking: the part not etched on metal die surface is coated protection type photoresist, exposes portion to be etched
Point, metal die surface is placed on hot plate 140 DEG C and toasts at least 1 hour；
Etching: after having toasted afterwards, metal die surface is naturally cooled to room temperature, sets the etching of ion etching machine
Parameter, is placed in ion etching machine etching by metal die surface, and etching parameters is: ion beam current 150mA, neutralizes electric current
180mA, plate voltage 350V, accelerate pole tension 500V, argon flow amount 2.5sccm, vacuum 3.0 × 10-2Pa, cooling water temperature
5 DEG C, etching depth 162.5nm, after having etched, takes out metal die surface and cleans, remove the labelling on aluminum film；
The imaging effect of metal die surface DOE checked by g, the laser pen of use coupling, uses qualified metal die by DOE
Turn over metal coins or chapter surface.
The above-mentioned metal die made is referred to as die, DOE region in stamp surfaces this as can not naked eyes direct
The geometric figure observed and/or word shape, need to be radiated at the DOE region of die by laser, and the pattern reflected is exactly
Layout or the reverse pattern of layout.
DOE is turned over the DOE region on metal coins or chapter surface, metal coins or chapter surface by the qualified die of above-mentioned use
This as can not the geometric figure of direct visual perception and/or word shape, need to be radiated at metal coins or chapter table by laser
DOE region on face, the pattern reflected is exactly layout.
The surface of a kind of metal coins with security pattern or chapter has the above-mentioned metal coins with security pattern or chapter
Manufacture method make, and on metal coins or chapter, there is the DOE that target pattern is corresponding.
The metal coins or the inspection method of chapter that are prepared by said method be: examines with the red laser pen that wavelength is 650nm
Test the imaging effect of DOE on metal die surface；Finished metal die surface is turned on position corresponding on metal coins, use
Wavelength is the imaging effect of the red laser pen irradiation metal coins surface examination DOE of 650nm.
As it was previously stated, inventor overcomes the design of diffraction optical element one by one by substantial amounts of experiment, the choosing of photoresist
Select, the technological difficulties such as the setting of etching parameters and the selection of refractive index, produced reach to use level there is the false proof figure of DOE
The metal coins of case or chapter.
Being described in detail the present invention above in association with accompanying drawing embodiment, those skilled in the art can be according to upper
State and bright the present invention is made many variations example.Thus, some details in embodiment should not constitute limitation of the invention, this
Invent the scope that defines using appended claims as protection scope of the present invention.
Claims (6)
1. there is metal coins or the chapter of DOE security pattern, including metal coins (1), two or more step embossment structure
DOE security pattern (2), it is characterized in that being fabricated on the surface of metal coins or chapter DOE security pattern (2), make it with hard
The target pattern on the surface of coin or chapter organically combines.
2. a metal coins with DOE security pattern or the manufacture method of chapter, it is characterised in that comprise the following steps:
A, optical design: target pattern is converted to by DOE design the PHASE DISTRIBUTION diagram data of DOE；
B, laser direct-writing mask plate: the PHASE DISTRIBUTION diagram data of DOE is converted to for the mach professional format of laser direct-writing
Data, carry out laser direct-writing mask plate；Described mask plate at least include a labelling mask plate and remaining 2xOpen mask plate,
Described labelling mask plate is first mask plate, and remaining mask plate is pressed wavelength degree of depth sequence order and arranged, and wherein x is nature
Number, when DOE is respectively two steps, four steps, eight step design, the setting of mask plate alignment the most successively；
C, metal die process: after being processed on metal die surface, at metal die surface aluminizer, after aluminum film has plated,
Spin coating viscosifier on aluminum film, after being cooled to room temperature after being toasted by metal die, even resist coating, then by cold after metal die baking
But to room temperature；
D, labelling mask plate expose: use litho machine by the alignment mark on first mask plate by using litho machine alignment gold
Belong to die surface exposure, corrosion of then developing, alignment mark is stayed on aluminum film；
E, by leave on aluminum film alignment mark metal die surface process after, spin coating viscosifier on aluminum film, by metal die
After being cooled to room temperature after baking, even resist coating, then it is cooled to room temperature after metal die baking；
F, step mask plate exposure etching: utilize alignment mark, metal die surface is placed on litho machine by the wavelength degree of depth suitable
Sequence remaining mask plate of alignment one by one；
The imaging effect of metal die surface DOE checked by g, the laser pen of use coupling, uses qualified metal die to be turned over by DOE
To metal coins or chapter surface.
A kind of metal coins with DOE security pattern the most according to claim 2 or the manufacture method of chapter, it is characterised in that
Optical design in described step a comprises the steps:
1) MATLAB business mathematics software is used to be converted into 8 gray-scale maps in the picture of target pattern；
2) GS iterative algorithm is selected to write Diffraction Calculation program according to graph style；
3) Diffraction Calculation program is used to be calculated the PHASE DISTRIBUTION diagram data of DOE.
A kind of metal coins with DOE security pattern the most according to claim 2 or the manufacture method of chapter, it is characterised in that
In described step b, as x=1, in two step mask plates, first mask plate is 1/8n wavelength degree of depth mask plate, second
Mask plate is 1/4n wavelength degree of depth mask plate.
The metal coins with security pattern the most according to claim 2 or the manufacture method of chapter, it is characterised in that described gold
Belong to die surface process and include that the microgranule on surface is removed and is dried.
The metal coins with security pattern the most according to claim 2 or the manufacture method of chapter, it is characterised in that described increasing
Stick is HMDS.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610279546.4A CN106054294A (en) | 2016-04-29 | 2016-04-29 | Metal coin or stamp with DOE (Diffraction Optical Element) anti-counterfeit pattern and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610279546.4A CN106054294A (en) | 2016-04-29 | 2016-04-29 | Metal coin or stamp with DOE (Diffraction Optical Element) anti-counterfeit pattern and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN106054294A true CN106054294A (en) | 2016-10-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610279546.4A Pending CN106054294A (en) | 2016-04-29 | 2016-04-29 | Metal coin or stamp with DOE (Diffraction Optical Element) anti-counterfeit pattern and manufacturing method thereof |
Country Status (1)
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107319697A (en) * | 2017-07-04 | 2017-11-07 | 青岛天仁微纳科技有限责任公司 | A kind of metal fittings with anti-counterfeiting information and preparation method thereof |
| CN109848570A (en) * | 2018-12-31 | 2019-06-07 | 沈阳造币有限公司 | Laser blasting method applied to noble metal commemorative coin |
| CN110033548A (en) * | 2019-05-22 | 2019-07-19 | 沈阳造币有限公司 | A kind of micro-structure Antiforge recognizing method on coin or souvenir badge |
| CN111751918A (en) * | 2020-06-17 | 2020-10-09 | 四川芯辰光微纳科技有限公司 | Microstructure diffraction slice and preparation thereof, and anti-counterfeiting device comprising microstructure diffraction slice |
| CN113139635A (en) * | 2020-01-17 | 2021-07-20 | 深圳市百泰国礼文化创意有限公司 | Anti-fake metal or noble metal product and its making process |
| CN113848603A (en) * | 2021-09-18 | 2021-12-28 | 中国科学院长春光学精密机械与物理研究所 | Diffraction element machining and precision compensation method |
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|---|---|---|---|---|
| CN107319697A (en) * | 2017-07-04 | 2017-11-07 | 青岛天仁微纳科技有限责任公司 | A kind of metal fittings with anti-counterfeiting information and preparation method thereof |
| CN107319697B (en) * | 2017-07-04 | 2024-02-20 | 青岛天仁微纳科技有限责任公司 | Metal fitting with anti-counterfeiting information and preparation method thereof |
| CN109848570A (en) * | 2018-12-31 | 2019-06-07 | 沈阳造币有限公司 | Laser blasting method applied to noble metal commemorative coin |
| CN110033548A (en) * | 2019-05-22 | 2019-07-19 | 沈阳造币有限公司 | A kind of micro-structure Antiforge recognizing method on coin or souvenir badge |
| CN113139635A (en) * | 2020-01-17 | 2021-07-20 | 深圳市百泰国礼文化创意有限公司 | Anti-fake metal or noble metal product and its making process |
| CN111751918A (en) * | 2020-06-17 | 2020-10-09 | 四川芯辰光微纳科技有限公司 | Microstructure diffraction slice and preparation thereof, and anti-counterfeiting device comprising microstructure diffraction slice |
| CN113848603A (en) * | 2021-09-18 | 2021-12-28 | 中国科学院长春光学精密机械与物理研究所 | Diffraction element machining and precision compensation method |
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Application publication date: 20161026 |
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