WO1998026638A1 - Verfahren zum reflowlöten von mit smd-bauelementen bestückten leiterplatten - Google Patents
Verfahren zum reflowlöten von mit smd-bauelementen bestückten leiterplatten Download PDFInfo
- Publication number
- WO1998026638A1 WO1998026638A1 PCT/DE1997/001997 DE9701997W WO9826638A1 WO 1998026638 A1 WO1998026638 A1 WO 1998026638A1 DE 9701997 W DE9701997 W DE 9701997W WO 9826638 A1 WO9826638 A1 WO 9826638A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- reflow soldering
- components
- smd components
- printed circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10628—Leaded surface mounted device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the invention is based on a method according to the type specified in the preamble of claim 1.
- SMD Surface Mounted Device
- a method is known from EP 0 419 065 A2 in which a printed circuit board is first printed on its first side in a solder paste printing station with soldering areas at the locations provided for the application of SMD components. Subsequently, the circuit board is provided in an adhesive station between the soldering points with an adhesive drop for fixing the SMD components and then fitted with SMD components in a pick and place device, which are placed on the soldering surfaces and the adhesive. Since the components have to be pressed into the adhesive, the exact placement of the components can be hindered by the adhesive.
- the adhesive is cured and the circuit board is fed to a reflow soldering station, in which the solder applied to the first side is melted and the components are soldered to the circuit board.
- the printed circuit boards are turned over with the second side facing upwards and then again printed with soldering areas and then fitted with SMD components.
- the circuit board is again fed to a reflow soldering station.
- both the solder on the second side and the solder on the lower first side are melted.
- the adhesive between the SMD components located on the first side and the printed circuit board prevents the SMD components already soldered to the first side from being detached from the printed circuit board by their weight when the soldered connections are re-melted.
- a disadvantage of the method known from EP 0 419 065 A2 is that the adhesive is applied to the printed circuit board before the first reflow soldering step, since then the molten solder paste can contract below the components fixed by the adhesive, or the components by the adhesive be pressed out of the molten solder paste. This effect, known as "settling", has the effect that there are no or only inadequate electrical connections between the SMD components and the soldered connection areas on the printed circuit board.
- Another method known in the prior art therefore provides for the adhesive to be applied between the component and the printed circuit board only after the first reflow soldering of the SMD components.
- the adhesive is applied in a bead-like manner in the region of the side edges of the components, so that it connects the SMD components at their edges to the printed circuit board surface.
- Adhesive can get onto the soldering surfaces during application, which can contaminate and contaminate them. During the second reflow soldering step, the quality of the electrical connection between the SMD component and the printed circuit board is reduced by the contamination.
- the method according to the invention for reflow soldering printed circuit boards equipped with SMD components with the characterizing feature of the main claim has the advantage that the adhesive is only applied after the first reflow soldering step and, at the same time, contamination of the soldering surfaces on the first side of the lead provided with the adhesive terplatten is avoided. This is easily achieved by injecting the adhesive after the first reflow soldering from the still freely accessible second side of the printed circuit board through openings provided in the narrow space between the component and the printed circuit board. This advantageously avoids both the settling of the SMD components and an impairment of the electrical conductivity of the solder joints between the component and the printed circuit board caused by the adhesive.
- the method according to the invention can be carried out, for example, in an automatic production line in which the circuit boards on conveyor belts pass through the individual stations one after the other.
- the printed circuit boards have a first and a second side opposite this, both of which are to be equipped with SMD components.
- an opening is provided, which extends from the first side to the second side of the printed circuit board.
- the opening can be designed, for example, as a bore with a diameter of approximately 1 mm.
- the printed circuit board is then fed to an SMD placement device, which attaches SMD components to the soldering areas on the first side using a suction pipette.
- the printed circuit board is fed to a reflow soldering station, in which the components applied on the first side are soldered to the connection areas.
- the circuit board is then turned over and fed to an adhesive station.
- a cannula which is inserted from the second side of the printed circuit board above into the openings now located above the components, is used to inject adhesive into the space between the first side of the printed circuit board and the connection side of the SMD components. In the process carried out in this way, the adhesive can be metered exactly so that it does not flow out of the space between the component and the printed circuit board.
- the adhesive is cured behind the adhesive station in a hardening station.
- adhesives can also be used that are cured in the reflow soldering station.
- the Printed circuit boards are now again fed to a solder paste printing station and printed with solder paste on the connection surfaces of the upward-facing second printed circuit board side.
- the circuit boards are then fitted with SMD components in a placement machine on the second side and again fed to a reflow soldering station. During the second reflow soldering step, the components applied to the second side are soldered to the circuit board.
- solder of the components already soldered to the connection faces of the first side is melted again, the drops of adhesive between the component and the circuit board preventing the SMD components from detaching from the circuit board due to their weight.
- the components are soldered to the connection areas on both sides of the printed circuit board.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10526067A JP2000507750A (ja) | 1996-12-13 | 1997-09-09 | Smd部品を装着したプリント配線板をリフローはんだ付けするための方法 |
EP97943748A EP0903061A1 (de) | 1996-12-13 | 1997-09-09 | Verfahren zum reflowlöten von mit smd-bauelementen bestückten leiterplatten |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19651862.8 | 1996-12-13 | ||
DE19651862A DE19651862A1 (de) | 1996-12-13 | 1996-12-13 | Verfahren zum Reflowlöten von mit SMD-Bauelementen bestückten Leiterplatten |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998026638A1 true WO1998026638A1 (de) | 1998-06-18 |
Family
ID=7814582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1997/001997 WO1998026638A1 (de) | 1996-12-13 | 1997-09-09 | Verfahren zum reflowlöten von mit smd-bauelementen bestückten leiterplatten |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0903061A1 (de) |
JP (1) | JP2000507750A (de) |
KR (1) | KR19990082161A (de) |
CN (1) | CN1209942A (de) |
CZ (1) | CZ251398A3 (de) |
DE (1) | DE19651862A1 (de) |
TW (1) | TW383535B (de) |
WO (1) | WO1998026638A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19828653A1 (de) * | 1998-06-26 | 2000-01-05 | Siemens Ag | Chipmodul zum Einbau in einen Chipkartenträger sowie Verfahren zu dessen Herstellung |
DE19925961A1 (de) * | 1999-05-31 | 2000-12-21 | Siemens Ag | Verfahren zum Aushärten von thermisch aushärtbarem Unterfüllmaterial |
CN100455167C (zh) * | 2005-02-04 | 2009-01-21 | 厦门顶尖电子有限公司 | 打印头电磁铁固定方法及其装置 |
NL2003341A (en) | 2008-08-22 | 2010-03-10 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
CN101827501B (zh) * | 2010-03-31 | 2012-01-04 | 伟创力电子科技(上海)有限公司 | 通孔回流焊接工艺,以及对应的模板和制具 |
DE102013002597B3 (de) * | 2013-02-14 | 2014-07-31 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Verfahren zur beidseitigen Bestückung einer Leiterplatte |
AT515446B1 (de) * | 2014-03-07 | 2019-12-15 | Zkw Group Gmbh | Strukturierung der Lötstoppmaske von Leiterplatten zur Verbesserung der Lötergebnisse |
DE102018110752A1 (de) * | 2018-05-04 | 2019-11-07 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Verfahren zum Herstellen eines Anschlusskontaktes |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1951125A (en) * | 1933-02-18 | 1934-03-13 | Carnation Co | Solder flux applying device |
US4573105A (en) * | 1983-02-16 | 1986-02-25 | Rca Corporation | Printed circuit board assembly and method for the manufacture thereof |
FR2613898A1 (fr) * | 1987-04-13 | 1988-10-14 | Siame Electronique Sa | Procede de soudage de composants pour montage en surface (cms) sur circuit imprime |
EP0376055A2 (de) * | 1988-12-27 | 1990-07-04 | Asea Brown Boveri Ag | Verfahren zum Löten eines drahtlosen Bauelementes sowie Leiterplatte mit angelötetem, drahtlosem Bauelement |
-
1996
- 1996-12-13 DE DE19651862A patent/DE19651862A1/de not_active Withdrawn
-
1997
- 1997-09-09 JP JP10526067A patent/JP2000507750A/ja active Pending
- 1997-09-09 CN CN97191933A patent/CN1209942A/zh active Pending
- 1997-09-09 EP EP97943748A patent/EP0903061A1/de not_active Withdrawn
- 1997-09-09 KR KR1019980705886A patent/KR19990082161A/ko not_active Application Discontinuation
- 1997-09-09 CZ CZ982513A patent/CZ251398A3/cs unknown
- 1997-09-09 WO PCT/DE1997/001997 patent/WO1998026638A1/de not_active Application Discontinuation
- 1997-10-29 TW TW086116035A patent/TW383535B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1951125A (en) * | 1933-02-18 | 1934-03-13 | Carnation Co | Solder flux applying device |
US4573105A (en) * | 1983-02-16 | 1986-02-25 | Rca Corporation | Printed circuit board assembly and method for the manufacture thereof |
FR2613898A1 (fr) * | 1987-04-13 | 1988-10-14 | Siame Electronique Sa | Procede de soudage de composants pour montage en surface (cms) sur circuit imprime |
EP0376055A2 (de) * | 1988-12-27 | 1990-07-04 | Asea Brown Boveri Ag | Verfahren zum Löten eines drahtlosen Bauelementes sowie Leiterplatte mit angelötetem, drahtlosem Bauelement |
Non-Patent Citations (1)
Title |
---|
"Les procédés de montage et de brasure", TOUTE L'ÉLECTRONIQUE, no. 516, September 1986 (1986-09-01), PARIS ( FR ), XP002051269 * |
Also Published As
Publication number | Publication date |
---|---|
CZ251398A3 (cs) | 1999-02-17 |
CN1209942A (zh) | 1999-03-03 |
JP2000507750A (ja) | 2000-06-20 |
DE19651862A1 (de) | 1998-06-18 |
TW383535B (en) | 2000-03-01 |
KR19990082161A (ko) | 1999-11-25 |
EP0903061A1 (de) | 1999-03-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69109137T2 (de) | Oberflächenmontage-Verfahren und Vorrichtung. | |
DE19541334C2 (de) | Verfahren zur Herstellung einer Vielzahl von Leiterplatten sowie Leiterplattenanordnung | |
DE10111718A1 (de) | Elektronisches Schaltungsbauteil | |
DE4028556C1 (de) | ||
EP1393604B1 (de) | Leiterplatte mit einer darauf aufgebrachten kontakthülse | |
DE602004001163T2 (de) | Steckkontakt | |
EP0903061A1 (de) | Verfahren zum reflowlöten von mit smd-bauelementen bestückten leiterplatten | |
EP0951205B1 (de) | Verfahren zum automatischen Bestücken der Ober- und Unterseite von Leiterplatten mit SMD-Bauteilen | |
DE3046341A1 (de) | Elektrische schaltungseinrichtung, sowie herstellverfahren dafuer | |
DE4341867A1 (de) | Verfahren zum Drucken eines Verbindungsmittels | |
EP0218832A1 (de) | Bauelement für die Oberflächenmontage und Verfahren zur Befestigung eines Bauelements für die Oberflächenmontage | |
DE102004005685B4 (de) | Verfahren zum Herstellen einer elektronischen Komponente | |
WO2008012165A2 (de) | Verfahren und wellenlötanlage zum löten von bauteilen auf ober- und unterseite einer leiterplatte | |
DE10313622B3 (de) | Verfahren zur elektrischen und mechanischen Verbindung zweier Leiterplatten | |
DE4341691B4 (de) | Verfahren zum Einsetzen eines elektrischen Drahtverbindungsanschlusses in eine gedruckte Schaltungsplatte | |
DE3813566A1 (de) | Elektrische verbindung zwischen einer hybridbaugruppe und einer leiterplatte sowie verfahren zur deren herstellung | |
DE102012112546A1 (de) | Verfahren zur Herstellung von mischbestückten Leiterplatten | |
EP1796217B1 (de) | Verfahren zur Herstellung von elektrischen Verbindungen zwischen Leiterplatten | |
DE4208594A1 (de) | Verfahren zur herstellung einer elektrischen, vorgefertigten baueinheit und deren befestigung auf einer leiterplatte | |
DE10023220C2 (de) | Verbindungsanordnung | |
EP0986137A2 (de) | Steckerleiste für die Oberflächenmontage auf einer Leiterplatte | |
DE10131945A1 (de) | Verfahren zum gemeinsamen Bearbeiten von Leiterplatten | |
DD151250A1 (de) | Leiterplatte und verfahren zu ihrer herstellung | |
DE3235717A1 (de) | Anschlusselement fuer eine schaltungstraegerplatte | |
DE10201209B4 (de) | Lotformteil und Verfahren zur Bestückung desselben |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 97191933.X Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1997943748 Country of ref document: EP |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): CN CZ JP KR US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1019980705886 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: PV1998-2513 Country of ref document: CZ |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWP | Wipo information: published in national office |
Ref document number: PV1998-2513 Country of ref document: CZ |
|
WWE | Wipo information: entry into national phase |
Ref document number: 09125182 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 1997943748 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1019980705886 Country of ref document: KR |
|
WWR | Wipo information: refused in national office |
Ref document number: PV1998-2513 Country of ref document: CZ |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 1997943748 Country of ref document: EP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 1019980705886 Country of ref document: KR |