WO1997048125A1 - Dispositif destine a transporter au moins un support de composants electroniques et a changer simultanement l'orientation de celui-ci - Google Patents

Dispositif destine a transporter au moins un support de composants electroniques et a changer simultanement l'orientation de celui-ci Download PDF

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Publication number
WO1997048125A1
WO1997048125A1 PCT/NL1997/000317 NL9700317W WO9748125A1 WO 1997048125 A1 WO1997048125 A1 WO 1997048125A1 NL 9700317 W NL9700317 W NL 9700317W WO 9748125 A1 WO9748125 A1 WO 9748125A1
Authority
WO
WIPO (PCT)
Prior art keywords
gripper
carrier
foregoing
frame
orientation
Prior art date
Application number
PCT/NL1997/000317
Other languages
English (en)
Inventor
Wilhelmus Hendrikus Johannes Harmsen
Stijn Klaas Tjeerd Zoethout
Original Assignee
Fico B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico B.V. filed Critical Fico B.V.
Priority to AU29817/97A priority Critical patent/AU2981797A/en
Publication of WO1997048125A1 publication Critical patent/WO1997048125A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the invention relates to a device for simultaneously displacing and changing the orientation of at least one carrier for electronic components, in particular a lead frame.
  • a device for simultaneously displacing and changing the orientation of at least one carrier for electronic components in particular a lead frame.
  • diverse types of manipulators are known.
  • An example hereof is a manipulator in the form of a robot arm with which separate carriers can be engaged and with which it is also possible to change the orienta- tion of the carrier during displacement.
  • the object of the present invention is to provide a device with which at least one carrier can be displaced and with which the orientation of the carrier can be changed simultaneously, which is constructed m simple manner and with which, in the case a plurality of carri ⁇ ers is displaced, the mutual orientation of the carriers can also be changed in one operation.
  • the gripper is preferably fixed to the frame such that the orientation of the grippers in the end positions consists of mutually perpendicular orientations.
  • the displacing means are also preferably movable in a plane parallel to a plane through the carrier.
  • the displacing means preferably consist of a carriage movable along a guide arranged on the frame using a drive, which carriage comprises an assembly of rods to which the gripper is connectable and which is provided with at least one cam for co-action with a cam guide in the frame receiving the cam.
  • the gripper is releasably connectable to the displacing means.
  • the gripper is also very easily possible in this manner to replace a gripper with product-dependent dimensions with a gripper with different product-dependent dimensions.
  • Another advantage is that in the case of breakdown in the gripper, this latter can be replaced very simply by a spare gripper. It is also possible to fix only one gripper to the device or to fix a plurality of grippers to the device subject to the transport requirement .
  • a preferred embodiment of the gripper is provided with at least one suction nozzle, which suction nozzle is connected to controllable suction means.
  • the gripper is a mechanical jaw.
  • the most suitable gripper can be chosen depending on the geometry of the carrier for displacing and whether or not the electronic components situated on the carrier are encapsulated. It is thus for instance conceivable that a carrier with encapsulated electronic components can be engaged in simple manner by a gripper provided with several suction nozzles. The suction nozzles can then engage on the encapsulating parts enclosing the electron ⁇ ic components. However, when the electronic components are not encapsulated it can be more desirable in order to prevent unnecessary damage to the electronic components to equip the grippers with at least one mechanical jaw for gripping the carriers on the periphery.
  • the height-adjusting means preferably consist of an eccentric rotatable using a drive, with interposing of which eccentric the frame is connected to the fixed components.
  • the displacement perpendicular to the carri ⁇ ers of the device need only have a very limited stroke length.
  • An inexpensive and reliable construction is formed by an eccentric.
  • the feed position can preferably consist of a table and the dis ⁇ charge position can preferably consist of a linear con ⁇ veyor.
  • This construction can be advantageous in displac ⁇ ing and changing the mutual orientation of the carriers after they have been processed in a plurality of devices and must subsequently be discharged for instance to be stored in a cassette.
  • Fig. 1 shows a perspective bottom view of the device for engaging two carriers for electronic components
  • Fig. 2 shows a perspective top view of the device shown in fig. 1 after displacement and changing of the mutual orientation of the carriers
  • Fig. 1 shows a device 1 for displacing and changing the mutual orientation of two carriers 3 which are locat ⁇ ed on a table 2 and on which are situated encapsulated electronic components 4. Situated a short distance above carriers 3 is the device 1, although in this figure the device 1 and table 2 are placed at a greater mutual distance to provide a clearer view of the underside of device 1.
  • the device 1 is connected by means of suspen- sion members 5 to fixed components not shown in this figure.
  • Table 2 is generally also connected to the fixed components.
  • the suspension members 5 are connected to a frame 7 of device 1 with interposing of a shaft 6 eccen ⁇ trically rotatable in suspension members 5.
  • a linear guide 8 is arranged on frame 7 .
  • On the underside of carriage 9 are situated two coupling elements 12, 13 rotatable round vertical shafts 10, 11.
  • the rotatable coupling elements 12, 13 are pivot ⁇ ally connected to respective drive rods 14, 15.
  • the sides of drive rods 14, 15 remote from coupling elements 12, 13 are connected to a cam carrier 16 to which is fixed a cam 17.
  • Cam 17 engages in a channel 18 arranged for this purpose in the underside of frame 7.
  • the cam 17 will be controlled in lateral direction by channel 18.
  • the coupling elements 12, 13 will be rotated round vertical shafts 10, 11.
  • the latter comprises on the underside a guide 20 on which cam carrier 16 engages.
  • two grippers 21, 22 which are provided with suction nozzles 23.
  • the suction nozzles 23 engage round the encapsulated electronic components 4.
  • the grippers 21, 22 can be fixed in simple manner to coupling elements 12, 13. Rotation of coupling elements 12, 13 will result in the carriers 3 engaged by grippers 21, 22 also rotating.
  • Figure 2 shows the device 1 in top view after carri ⁇ ers 3 have been displaced from the position shown in fig. 1 and wherein the mutual orientation has also been changed such that they are placed in line on an endless conveyor 24.
  • the suspension members 5 are mounted on fixed components by a plate-like element 25.
  • the shaft 6 is connected eccentrically to a coupling hook 27 such that by rotating this shaft 6 by means of a drive 26 the frame 7, and thus the grippers 22 rigidly connected thereto in vertical direction, are displaceable to a limited extent in vertical direction by coupling hook 27.
  • Frame 7 will be situated in a raised position when carriage 9 is moved between the feed position and the discharge position.
  • grippers 22 can release the engaged carriers 3. This must be controlled by means of suction means (not shown in this figure) which are connected to suction nozzles 23 by means of hoses 28.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Specific Conveyance Elements (AREA)
  • Manipulator (AREA)

Abstract

L'invention concerne un dispositif destiné à transporter au moins un support de composants électroniques et changer simultanément l'orientation de celui-ci, lequel peut être un réseau de conducteurs. Un tel dispositif comprend au moins un outil de préhension destiné à entrer en contact avec le support, des moyens de réglage de hauteur reliés à l'outil de préhension, afin de provoquer le déplacement de cet outil perpendiculairement par rapport au support, des moyens destinés à déplacer l'outil de préhension entre la position d'alimentation et celle de décharge et également à changer l'orientation de cet outil, ainsi qu'un cadre auquel on a relié les moyens de réglage de la hauteur et l'outil de préhension en interposant entre ceux-ci les moyens de déplacement.
PCT/NL1997/000317 1996-06-14 1997-06-05 Dispositif destine a transporter au moins un support de composants electroniques et a changer simultanement l'orientation de celui-ci WO1997048125A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU29817/97A AU2981797A (en) 1996-06-14 1997-06-05 Device for simultaneous transport and change of orientation of at least one carrier for electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1003342A NL1003342C2 (nl) 1996-06-14 1996-06-14 Inrichting voor het gelijktijdig verplaatsen en wijzigen van de oriënta- tie van ten minste één drager voor electronische componenten.
NL1003342 1996-06-14

Publications (1)

Publication Number Publication Date
WO1997048125A1 true WO1997048125A1 (fr) 1997-12-18

Family

ID=19763015

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL1997/000317 WO1997048125A1 (fr) 1996-06-14 1997-06-05 Dispositif destine a transporter au moins un support de composants electroniques et a changer simultanement l'orientation de celui-ci

Country Status (3)

Country Link
AU (1) AU2981797A (fr)
NL (1) NL1003342C2 (fr)
WO (1) WO1997048125A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102315133A (zh) * 2010-06-29 2012-01-11 吴华 集成电路装片机框架输送系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4119211A (en) * 1976-10-22 1978-10-10 Western Electric Company, Inc. Method and apparatus for transferring articles while re-establishing their orientation
JPS5710940A (en) * 1980-06-25 1982-01-20 Toshiba Corp Supplying method for lead frame
EP0278460A2 (fr) * 1987-02-09 1988-08-17 Svg Lithography Systems, Inc. Dispositif de manipulation de plaquettes semi-conductrices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4119211A (en) * 1976-10-22 1978-10-10 Western Electric Company, Inc. Method and apparatus for transferring articles while re-establishing their orientation
JPS5710940A (en) * 1980-06-25 1982-01-20 Toshiba Corp Supplying method for lead frame
EP0278460A2 (fr) * 1987-02-09 1988-08-17 Svg Lithography Systems, Inc. Dispositif de manipulation de plaquettes semi-conductrices

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 6, no. 72 (E - 105) 7 May 1982 (1982-05-07) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102315133A (zh) * 2010-06-29 2012-01-11 吴华 集成电路装片机框架输送系统

Also Published As

Publication number Publication date
NL1003342C2 (nl) 1997-12-17
AU2981797A (en) 1998-01-07

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