WO1997043456A1 - Soudure a base d'etain et contenant de l'argent et de l'indium - Google Patents

Soudure a base d'etain et contenant de l'argent et de l'indium Download PDF

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Publication number
WO1997043456A1
WO1997043456A1 PCT/US1997/007376 US9707376W WO9743456A1 WO 1997043456 A1 WO1997043456 A1 WO 1997043456A1 US 9707376 W US9707376 W US 9707376W WO 9743456 A1 WO9743456 A1 WO 9743456A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead
indium
tin
silver
melting
Prior art date
Application number
PCT/US1997/007376
Other languages
English (en)
Inventor
Gautum Ghosh
Morris E. Fine
Original Assignee
Northwestern University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northwestern University filed Critical Northwestern University
Publication of WO1997043456A1 publication Critical patent/WO1997043456A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P6/00—Arrangements for controlling synchronous motors or other dynamo-electric motors using electronic commutation dependent on the rotor position; Electronic commutators therefor
    • H02P6/04—Arrangements for controlling or regulating the speed or torque of more than one motor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Definitions

  • lead-tin alloys or variants of lead-tin alloys are used in many soldering and joining applications.
  • the soldering technologies using these alloys are highly developed; however, these solders pose environmental and health hazards because they contain lead.
  • Many states have passed legislation that will limit lead in container solders to lOOppm or less and the number of these states is increasing. The concern is leaching of lead into the water supply from landfills and into the atmosphere from incinerates. Electronics industries have been exempted at this time because no viable alternatives to lead-bearing solders are presently available. Even in the absence of any regulation, it is desirable that industries use lead-free solders to minimize lead exposure to employees and indirectly to the public at large.
  • Lead-bearing solders currently in use have many desirable properties, such as, low cost, availability, and engineering performance. However, lead is toxic to humans and wildlife when ingested or inhaled in large doses. Electronic circuits are typically disposed as solid waste in landfills. Waste products are generated during assembly of electronic boards. In lead-bearing solder manufacturing industries, solder dross can generate lead-bearing dust, though the safety in such work areas is strictly controlled by the U.S. Occupational Safety and Health Administration (OSHA) . Due to all these concerns, potential lead-free solders are to be designated to replace the lead-bearing alloys.
  • OSHA U.S. Occupational Safety and Health Administration
  • lead-free solders having different physical and mechanical properties are required for different applications. For example, lead-free solders that melt around 185° C and have a small solidification range are required for chip carrier-to-printed wiring board interconnections.
  • the lead-free solders for automotive applications are required to have higher melting temperatures and better mechanical properties so that the joined components can withstand the thermomechanical fatigue caused by cyclic operation over a wide temperature range. In all cases solderability should be good in order to make the lead-free solder a viable candidate for a particular application.
  • lead-free is here used to mean that lead is not deliberately added in the alloy; however, lead may be present in trace amounts in the elements considered in alloy design e.g., bismuth, copper, indium, silver and tin.
  • the total lead content as impurity in the present alloys does not exceed the Federal specification QQ-S-571E at paragraph 3.2.1.1.1.
  • compositions of lead-free solders of this invention are the melting temperature and the melting/solidification range.
  • the compositions are based on extensive theoretical modelling of phase stability of tin-base binary and ternary phase diagrams. A database describing the phase stability and phase relations as a function of temperature and composition was created.
  • the lead-free solders of this invention were established by imposing the following criteria: (i) melting temperature of the alloy should be less than 210 • C, (ii) melting/solidification range should always be as small as possible (less than 6° C and preferably less than 5° C) , (iii) composition sensitivity to melting point and melting/solidification range should be minimum, and (iv)
  • solders having hierarchical melting temperatures so that they can be used in different applications.
  • the lead-free solders in this invention have good microstructural stability during solid-state aging, good physical properties, and can be manufactured into different shapes and forms, such as pigs, cakes, sheets, wires, powders, etc.
  • the solders of the present invention provide joints with smooth and shiny appearance when Kester RMA flux is used in air.
  • the solder compositions of the present invention exclude lead, cadmium and zinc.
  • the first two elements are toxic and hazardous to health and environment. Even though addition of zinc is helpful in lowering the melting point while keeping the melting range narrow, the wetting characteristics of zinc-containing solders are very poor due to the formation of dross unless highly activated flux is used. Furthermore, zinc-containing solders tend to oxidize excessively while making powders (for the solder paste) .
  • the essential ingredients of the compositions of the present invention are tin, silver, and indium, and optionally bismuth and copper, although other metals may be added to provide other properties.
  • the composition comprises from about 86.2% to 91.8% tin, 3.2% to 3.8% silver, 5% to 5.5% indium, 0% to 3% bismuth, and 0% to 1.5% copper.
  • a particularly desirable composition is 87.6% tin, 3.4% silver, 5% indium, 3% bismuth and 1% copper.
  • Drawing Figure 1 is a differential scanning colorimeter (DSC) thermogram for a lead-free solder composed of 89.8% tin, 3.7% silver, 5% indium, and 1.5% copper.
  • DSC differential scanning colorimeter
  • the alloy compositions of the present invention can be prepared by conventional techniques well known to the art. For example, weighed amounts of tin, silver, indium and bismuth can be placed in a crucible and the metals can be melted together using any conventional heating technique. When the metals have been heated to a temperature at which all the material is liquid, the material is homogonized and made into a powder or cast into suitable mold. After casting the alloy can be manufactured into various desired shapes and forms, such as rods, wires, cakes, sheets, foils etc.
  • Example 1 DSC-7 was used to determine melting and solidification behavior of the alloys.
  • Stainless steel pans were used both in the reference and sample cells. Heating and cooling runs were performed at 5° C/min. In all alloys described below, only one endothermic peak on melting and only one exothermic peak on solidification were observed. The melting temperature was determined by the intersection of tangent of the steepest slope and the baseline on heating. On cooling the alloys exhibit undercooling, the extent to which depends on many factors such as the alloy composition, substrate, cooling rate, etc.
  • the DSC thermograms of 89.8% tin, 3.7% silver, 5% indium and 1.5% copper is shown in Figure 1.
  • the following examples present illustrative but non-limiting embodiments of the present invention. Unless otherwise indicated in the examples and elsewhere in the specification and claims, all parts and percentages are by weight.
  • An alloy having composition 90.4% tin, 3.4% silver, 5.2% indium and 1% bismuth has melting temperature 209° C and a melting range of approximately 2" C.
  • Example 2 An alloy having composition 89.4% tin, 3.4% silver, 5.2% indium, 1% bismuth and 1% copper has melting temperature of 206" C and a melting range of approximately 5° C.
  • Example 3 An alloy having composition 89.8% tin, 3.7% silver, 5% indium and 1.5% copper has melting temperature 206° C and a melting range of approximately 2 ' C.
  • Example 4 An alloy having composition 88.8% tin, 3.7% silver, 5% indium, 1% bismuth and 1.5% copper has melting temperature 205° C and a melting range of approximately 3" C.
  • Example 5 An alloy having composition 88.6% tin, 3.4% silver, 5% indium, 2% bismuth and 1.0% copper has melting temperature 203° C and a melting range of approximately 4" C.
  • Example 6 An alloy having composition 87.6% tin, 3.4% silver, 5% indium, 3% bismuth and 1.0% copper has melting temperature 201° C and a melting range of approximately 6" C.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Control Of Electric Motors In General (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

On décrit des soudures sans plomb possédant des températures de fusion relativement basses, un intervalle de fusion court, un intervalle de solidification également court, ainsi qu'une bonne réponse au flux, toutes caractéristiques rendant ces alliages appropriés à des utilisations de soudure et d'assemblage. Ces compositions comprennent: 86,2 à 91,8 % d'étain, 3,2 à 3,8 % d'argent, 5 à 5,5 % d'indium, 0 à 3 % de bismuth et 0 à 1,5 % de cuivre. Ces alliages possèdent des températures de fusion inférieures à 210 °C et des intervalles de fusion inférieurs à 6 °C.
PCT/US1997/007376 1996-05-13 1997-05-01 Soudure a base d'etain et contenant de l'argent et de l'indium WO1997043456A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1729696P 1996-05-13 1996-05-13
US60/017,296 1996-05-13

Publications (1)

Publication Number Publication Date
WO1997043456A1 true WO1997043456A1 (fr) 1997-11-20

Family

ID=21781816

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1997/007376 WO1997043456A1 (fr) 1996-05-13 1997-05-01 Soudure a base d'etain et contenant de l'argent et de l'indium

Country Status (2)

Country Link
KR (1) KR980006783A (fr)
WO (1) WO1997043456A1 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0953400A1 (fr) * 1998-04-03 1999-11-03 Delphi Technologies, Inc. Alliage sans plomb résistant à la fatigue
EP1038151A1 (fr) * 1997-12-18 2000-09-27 Olin Corporation Projectile d'etain sans plomb
WO2002040213A1 (fr) * 2000-11-16 2002-05-23 Singapore Asahi Chemical And Solder Industries Pte. Ltd. Brasures sans plomb
WO2003006200A1 (fr) * 2001-07-09 2003-01-23 Quantum Chemical Technologies (S'pore) Pte Ltd. Ameliorations apportees ou reliees a des brasures
EP1672685A1 (fr) * 2003-08-26 2006-06-21 Tokuyama Corporation Substrat pour la liaison d'un dispositif, substrat lie a un dispositif, et leur procede de production
US7111771B2 (en) * 2003-03-31 2006-09-26 Intel Corporation Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
WO2008043482A1 (fr) * 2006-10-06 2008-04-17 W.C. Heraeus Gmbh Métal d'apport de brasage tendre sans plomb présentant des propriétés améliorées à des températures élevées
EP1739743A3 (fr) * 2005-06-27 2008-12-24 Fujitsu Limited Boîtier de composants électroniques avec un matériau d'assemblage pour une conductivité thermique plus élevée
US7472817B2 (en) 2004-10-27 2009-01-06 Quantum Chemical Technologies (Singapore) Pte. Ltd Solders
WO2009011392A1 (fr) * 2007-07-18 2009-01-22 Senju Metal Industry Co., Ltd. Brasure sans plomb en contenant pour circuit électronique embarqué
WO2010100855A1 (fr) * 2009-03-04 2010-09-10 パナソニック株式会社 Structure montée et moteur
WO2010122764A1 (fr) * 2009-04-20 2010-10-28 パナソニック株式会社 Matériau de soudure et ensemble composant électronique
CN103212917A (zh) * 2013-03-22 2013-07-24 宁波市鄞州品达电器焊料有限公司 一种添加混合稀土(铼-铈)合金的无铅焊料
US9199340B2 (en) 2013-11-27 2015-12-01 Panasonic Intellectual Property Management Co., Ltd. Solder material and bonded structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0622151A1 (fr) * 1993-04-30 1994-11-02 AT&T Corp. Article comprenant une soudure tendre sans plomb ayant des propriétés mécaniques améliorées
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders

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JPH0778692B2 (ja) * 1983-06-16 1995-08-23 キヤノン株式会社 原稿走査装置
JPS60241784A (ja) * 1984-05-15 1985-11-30 Sanyo Electric Co Ltd 直流サ−ボモ−タの制御装置
US4885793A (en) * 1987-02-10 1989-12-05 Sanyo Electric Co., Ltd. Digital servo system using microcomputer for controlling phase and speed of rotary body
JPH03145990A (ja) * 1989-10-31 1991-06-21 Konica Corp 画像形成装置用モータの速度制御装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0622151A1 (fr) * 1993-04-30 1994-11-02 AT&T Corp. Article comprenant une soudure tendre sans plomb ayant des propriétés mécaniques améliorées
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6439124B1 (en) 1997-12-18 2002-08-27 Olin Corporation Lead-free tin projectile
EP1038151A1 (fr) * 1997-12-18 2000-09-27 Olin Corporation Projectile d'etain sans plomb
EP1038151A4 (fr) * 1997-12-18 2001-03-21 Olin Corp Projectile d'etain sans plomb
EP0953400A1 (fr) * 1998-04-03 1999-11-03 Delphi Technologies, Inc. Alliage sans plomb résistant à la fatigue
CZ297089B6 (cs) * 2000-11-16 2006-09-13 Singapore Asahi Chemical And Solder Industries Pte. Ltd. Bezolovnatá pájecí slitina
WO2002040213A1 (fr) * 2000-11-16 2002-05-23 Singapore Asahi Chemical And Solder Industries Pte. Ltd. Brasures sans plomb
US6843862B2 (en) 2001-07-09 2005-01-18 Quantum Chemical Technologies (Singapore) Pte Ltd Solders
NO337878B1 (no) * 2001-07-09 2016-07-04 Singapore Asahi Chemical & Solder Ind Pte Ltd Hovedsakelig blyfritt loddemetall, fremgangsmåte for preparering derav samt anvendelse av nevnte loddemetall
WO2003006200A1 (fr) * 2001-07-09 2003-01-23 Quantum Chemical Technologies (S'pore) Pte Ltd. Ameliorations apportees ou reliees a des brasures
US7111771B2 (en) * 2003-03-31 2006-09-26 Intel Corporation Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
EP1672685A1 (fr) * 2003-08-26 2006-06-21 Tokuyama Corporation Substrat pour la liaison d'un dispositif, substrat lie a un dispositif, et leur procede de production
EP1672685A4 (fr) * 2003-08-26 2007-08-22 Tokuyama Corp Substrat pour la liaison d'un dispositif, substrat lie a un dispositif, et leur procede de production
US7459794B2 (en) 2003-08-26 2008-12-02 Tokuyama Corporation Substrate for device bonding, device bonded substrate, and method for producing same
US7472817B2 (en) 2004-10-27 2009-01-06 Quantum Chemical Technologies (Singapore) Pte. Ltd Solders
EP1739743A3 (fr) * 2005-06-27 2008-12-24 Fujitsu Limited Boîtier de composants électroniques avec un matériau d'assemblage pour une conductivité thermique plus élevée
WO2008043482A1 (fr) * 2006-10-06 2008-04-17 W.C. Heraeus Gmbh Métal d'apport de brasage tendre sans plomb présentant des propriétés améliorées à des températures élevées
WO2009011392A1 (fr) * 2007-07-18 2009-01-22 Senju Metal Industry Co., Ltd. Brasure sans plomb en contenant pour circuit électronique embarqué
JP4962570B2 (ja) * 2007-07-18 2012-06-27 千住金属工業株式会社 車載電子回路用Ｉｎ入り鉛フリーはんだ
US8888932B2 (en) 2007-07-18 2014-11-18 Senju Metal Industry Co., Ltd. Indium-containing lead-free solder for vehicle-mounted electronic circuits
WO2010100855A1 (fr) * 2009-03-04 2010-09-10 パナソニック株式会社 Structure montée et moteur
US8411455B2 (en) 2009-03-04 2013-04-02 Panasonic Corporation Mounting structure and motor
EP2395823A1 (fr) * 2009-03-04 2011-12-14 Panasonic Corporation Structure montée et moteur
JP2010206006A (ja) * 2009-03-04 2010-09-16 Panasonic Corp 実装構造体及びモータ
CN101960933A (zh) * 2009-03-04 2011-01-26 松下电器产业株式会社 安装结构体及马达
EP2395823A4 (fr) * 2009-03-04 2013-01-23 Panasonic Corp Structure montée et moteur
EP2422918A4 (fr) * 2009-04-20 2012-12-05 Panasonic Corp Matériau de soudure et ensemble composant électronique
CN102066044A (zh) * 2009-04-20 2011-05-18 松下电器产业株式会社 焊锡材料及电子部件接合体
JP5280520B2 (ja) * 2009-04-20 2013-09-04 パナソニック株式会社 はんだ材料および電子部品接合体
US8598464B2 (en) 2009-04-20 2013-12-03 Panasonic Corporation Soldering material and electronic component assembly
WO2010122764A1 (fr) * 2009-04-20 2010-10-28 パナソニック株式会社 Matériau de soudure et ensemble composant électronique
EP2422918A1 (fr) * 2009-04-20 2012-02-29 Panasonic Corporation Matériau de soudure et ensemble composant électronique
CN103212917A (zh) * 2013-03-22 2013-07-24 宁波市鄞州品达电器焊料有限公司 一种添加混合稀土(铼-铈)合金的无铅焊料
US9199340B2 (en) 2013-11-27 2015-12-01 Panasonic Intellectual Property Management Co., Ltd. Solder material and bonded structure
US9789569B2 (en) 2013-11-27 2017-10-17 Panasonic Intellectual Property Managment Co., Ltd. Solder material and bonded structure

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Publication number Publication date
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