WO1997028053A1 - Conditionnement a enveloppe souple et systeme de distribution de masque de soudage liquide photosensible - Google Patents

Conditionnement a enveloppe souple et systeme de distribution de masque de soudage liquide photosensible Download PDF

Info

Publication number
WO1997028053A1
WO1997028053A1 PCT/US1997/000319 US9700319W WO9728053A1 WO 1997028053 A1 WO1997028053 A1 WO 1997028053A1 US 9700319 W US9700319 W US 9700319W WO 9728053 A1 WO9728053 A1 WO 9728053A1
Authority
WO
WIPO (PCT)
Prior art keywords
components
container
reaction product
solder mask
mixed
Prior art date
Application number
PCT/US1997/000319
Other languages
English (en)
Inventor
Ethan J. Mccague
Thimothy C. Burgess
Curtis A. Fischer
David Stone
Original Assignee
Enthone-Omi, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone-Omi, Inc. filed Critical Enthone-Omi, Inc.
Priority to IL12497097A priority Critical patent/IL124970A/en
Priority to KR1019980705705A priority patent/KR100306129B1/ko
Priority to AU15744/97A priority patent/AU732745B2/en
Priority to EP97901958A priority patent/EP0877709A4/fr
Priority to JP9527644A priority patent/JP2000503948A/ja
Publication of WO1997028053A1 publication Critical patent/WO1997028053A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02—Internal fittings
    • B65D25/04—Partitions
    • B65D25/08—Partitions with provisions for removing or destroying, e.g. to facilitate mixing of contents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F31/00—Mixers with shaking, oscillating, or vibrating mechanisms
    • B01F31/55—Mixers with shaking, oscillating, or vibrating mechanisms the materials to be mixed being contained in a flexible bag submitted to periodical deformation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F33/00—Other mixers; Mixing plants; Combinations of mixers
    • B01F33/50—Movable or transportable mixing devices or plants
    • B01F33/501—Movable mixing devices, i.e. readily shifted or displaced from one place to another, e.g. portable during use
    • B01F33/5011—Movable mixing devices, i.e. readily shifted or displaced from one place to another, e.g. portable during use portable during use, e.g. hand-held
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/71—Feed mechanisms
    • B01F35/713—Feed mechanisms comprising breaking packages or parts thereof, e.g. piercing or opening sealing elements between compartments or cartridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/71—Feed mechanisms
    • B01F35/713—Feed mechanisms comprising breaking packages or parts thereof, e.g. piercing or opening sealing elements between compartments or cartridges
    • B01F35/7133—Opening clips which seal openings between the compartments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/32—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents for packaging two or more different materials which must be maintained separate prior to use in admixture
    • B65D81/3261—Flexible containers having several compartments
    • B65D81/3266—Flexible containers having several compartments separated by a common rupturable seal, a clip or other removable fastening device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Definitions

  • the invention is directed to making electronic components such as PWBs wherein one or more steps of the PWB manufacturing procedure requires the application of a reaction product as a coating on the PWB.
  • a reaction product is a solder mask, e.g., liquid photoimageable solder mask
  • the solder mask is prepared as described above and is applied to the circuitry of a PWB using a coating technique such as screen printing, curtain coating or spray coating.
  • Fig. 2 is a side plan view of the package of Fig. 1.
  • a rod 19 is positioned across the width of the bag and partitions the bag in conjunction with clamp 23. Mixing of the components may be done manually or mechanically such as by deforming the bag.
  • the bag package is positioned horizontally and secured at its handles 14 and 16 on a flat solid surface.
  • a roller apparatus as shown in Fig. 5 is then caused to move over the bag 10 and applies force to the bag to mix the components therein.
  • the roller device comprises a plurality of wheels or rollers 37 rotably attached to a rod 38 which is positioned transverse to the longitudinal axis of the bag and which rod is moved by a mechanism which travels back and forth over the length of the bag as shown by the arrows.
  • the bag may be of any size and shape and is generally sized to contain the stoichiometric amounts of each reaction component needed to make the reaction product in the amount needed by the user.
  • the size of compartments 1 1 and 12 will vary depending on the amount of each component 17 and 18 needed to make the reaction product and /or design considerations. For a solder mask product the total amount held in the bag will usually vary up to about 4 kilograms per bag but may be higher.
  • the bag is generally rectangular and has internal dimensions of about 36 inch long and 12 inch wide. When the bag is filled the bag has a height of about 2 inch.
  • a bag 10 was made by overlaying two sheets of LLDPE plastic each sheet having a thickness of about 5 mil. Each sheet has 3 bonded layers comprising 2 LLDPE layers 2 mils thick each and a 1 mil nylon interlayer. Referring to Fig. 1 , the overall length of each sheet is about 39 inches and 14 inch wide except for the neck portion 13. Compartment 11 is about 7 inch, compartment 12 about 21 inch, neck 13 about 8 inch and each handle 14 and 16 about 1.5 inch. The width of the neck portion at edge 20b is about 3 inch. The plastic was heat sealed along edges 20 forming a seal width of about 1 inch. The bag was then partitioned by rod 19 positioned across the width of the bag and rod 19 secured to the bag by clamp 23.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Bag Frames (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

L'invention porte sur un procédé ainsi que sur un système destinés à préparer un produit de réaction pour masque de soudage et d'en approvisionner une machine à sérigraphier, ce produit étant issu de la réaction de deux composants au moins (17 et 18). Le système est constitué d'un récipient unique pliable (10) renfermant les composants et cloisonné (19) pour les séparer. Le procédé consiste à ôter la cloison lorsque le masque de soudage est prêt à être confectionné, à mélanger les composants réactifs dans le récipient, à les transférer dans un récipient de mélangeage si nécessaire et à parachever le mélange pour constituer un mélange de masque de soudage sensiblement homogène et, enfin, à approvisionner de ce mélange, constituant un masque de soudage homogène, la machine à sérigraphier. L'invention porte également sur un conditionnement pour la préparation d'un produit de réaction pour masque de soudage, sur un conditionnement contenant un produit de réaction pour masque de soudage entièrement ou partiellement mélangé ainsi que sur un dispositif permettant la préparation et la distribution du produit de réaction pour masque de soudage.
PCT/US1997/000319 1996-01-30 1997-01-10 Conditionnement a enveloppe souple et systeme de distribution de masque de soudage liquide photosensible WO1997028053A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IL12497097A IL124970A (en) 1996-01-30 1997-01-10 Method and system for liquid PISM distribution
KR1019980705705A KR100306129B1 (ko) 1996-01-30 1997-01-10 액체광영상형성솔더마스크용반응산물준비방법
AU15744/97A AU732745B2 (en) 1996-01-30 1997-01-10 Reaction product preparation method for liquid photoimageable solder mask
EP97901958A EP0877709A4 (fr) 1996-01-30 1997-01-10 Conditionnement a enveloppe souple et systeme de distribution de masque de soudage liquide photosensible
JP9527644A JP2000503948A (ja) 1996-01-30 1997-01-10 リキッドのフォトイメージを造るソルダーマスクのためのソフトパックパッケージ及びディスペンシングシステム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59384196A 1996-01-30 1996-01-30
US08/593,841 1996-01-30

Publications (1)

Publication Number Publication Date
WO1997028053A1 true WO1997028053A1 (fr) 1997-08-07

Family

ID=24376420

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1997/000319 WO1997028053A1 (fr) 1996-01-30 1997-01-10 Conditionnement a enveloppe souple et systeme de distribution de masque de soudage liquide photosensible

Country Status (8)

Country Link
EP (1) EP0877709A4 (fr)
JP (1) JP2000503948A (fr)
KR (1) KR100306129B1 (fr)
CN (1) CN1209783A (fr)
AU (1) AU732745B2 (fr)
CA (1) CA2244775A1 (fr)
IL (1) IL124970A (fr)
WO (1) WO1997028053A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1475177A1 (fr) * 2003-05-09 2004-11-10 Murata Co., Ltd. Appareil et méthode pour former une zone anti-capillarité pour la brasure, et pièce d'électronique
WO2005084787A1 (fr) * 2004-03-08 2005-09-15 Seward Limited Dispositifs pour melanger des matieres et sacs a utiliser dans lesdits dispositifs
EP1679114A1 (fr) * 2005-01-10 2006-07-12 Mark Zajdel Appareil et procédé pour produire des mélanges de substances
WO2018215743A1 (fr) * 2017-05-22 2018-11-29 Cambtek Limited Appareil pour agiter un liquide

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100614299B1 (ko) * 2004-12-29 2006-08-21 대우조선해양 주식회사 반응물탱크를 내장한 액체화학물저장탱크
KR100864782B1 (ko) * 2006-06-08 2008-10-22 목은상 씨리얼과 우유 또는 음료를 함께 먹을 수 있는 우유팩

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3983994A (en) * 1975-01-29 1976-10-05 Ihor Wyslotsky Flexible package
US4795265A (en) * 1985-03-29 1989-01-03 Tatis Plasttatningar Ab Method and device for intimate mixing of two components in a package
US4805767A (en) * 1987-06-18 1989-02-21 Newman Duncan A C Package system
US5158214A (en) * 1991-03-11 1992-10-27 Jnj Industries Inc. Solder paste applicator and mixing tool
US5287961A (en) * 1992-10-23 1994-02-22 W.R. Grace & Co.-Conn. Multi-compartment package having improved partition strip
US5370221A (en) * 1993-01-29 1994-12-06 Biomet, Inc. Flexible package for bone cement components
US5564570A (en) * 1993-06-01 1996-10-15 Burlington Consolidated Limited Incorporation Impact-resistant wrapping system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2932385A (en) * 1956-03-05 1960-04-12 Minnesota Mining & Mfg Multicompartment package with internal breaker strip
US4479983A (en) * 1983-01-07 1984-10-30 International Business Machines Corporation Method and composition for applying coatings on printed circuit boards
DE4204181A1 (de) * 1992-02-13 1993-08-19 Degussa Mischpackbeutel

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3983994A (en) * 1975-01-29 1976-10-05 Ihor Wyslotsky Flexible package
US4795265A (en) * 1985-03-29 1989-01-03 Tatis Plasttatningar Ab Method and device for intimate mixing of two components in a package
US4805767A (en) * 1987-06-18 1989-02-21 Newman Duncan A C Package system
US5158214A (en) * 1991-03-11 1992-10-27 Jnj Industries Inc. Solder paste applicator and mixing tool
US5287961A (en) * 1992-10-23 1994-02-22 W.R. Grace & Co.-Conn. Multi-compartment package having improved partition strip
US5370221A (en) * 1993-01-29 1994-12-06 Biomet, Inc. Flexible package for bone cement components
US5564570A (en) * 1993-06-01 1996-10-15 Burlington Consolidated Limited Incorporation Impact-resistant wrapping system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0877709A4 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1475177A1 (fr) * 2003-05-09 2004-11-10 Murata Co., Ltd. Appareil et méthode pour former une zone anti-capillarité pour la brasure, et pièce d'électronique
WO2005084787A1 (fr) * 2004-03-08 2005-09-15 Seward Limited Dispositifs pour melanger des matieres et sacs a utiliser dans lesdits dispositifs
US7789551B2 (en) 2004-03-08 2010-09-07 Stuart John Ray Devices for blending materials and bags and for use in such devices
EP1679114A1 (fr) * 2005-01-10 2006-07-12 Mark Zajdel Appareil et procédé pour produire des mélanges de substances
WO2006072591A1 (fr) * 2005-01-10 2006-07-13 Mark Zajdel Dispositif et procede de production de melanges de substances
WO2018215743A1 (fr) * 2017-05-22 2018-11-29 Cambtek Limited Appareil pour agiter un liquide

Also Published As

Publication number Publication date
AU1574497A (en) 1997-08-22
AU732745B2 (en) 2001-04-26
JP2000503948A (ja) 2000-04-04
CA2244775A1 (fr) 1997-08-07
IL124970A (en) 2001-04-30
CN1209783A (zh) 1999-03-03
IL124970A0 (en) 1999-01-26
KR100306129B1 (ko) 2002-08-08
EP0877709A1 (fr) 1998-11-18
EP0877709A4 (fr) 2000-04-05
KR19990081987A (ko) 1999-11-15

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