WO1997025841A1 - Composant pour substrats recouverts de cuivre et procede de fabrication de ces substrats - Google Patents

Composant pour substrats recouverts de cuivre et procede de fabrication de ces substrats Download PDF

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Publication number
WO1997025841A1
WO1997025841A1 PCT/US1997/000216 US9700216W WO9725841A1 WO 1997025841 A1 WO1997025841 A1 WO 1997025841A1 US 9700216 W US9700216 W US 9700216W WO 9725841 A1 WO9725841 A1 WO 9725841A1
Authority
WO
WIPO (PCT)
Prior art keywords
sheets
copper
component
aluminum
sheet
Prior art date
Application number
PCT/US1997/000216
Other languages
English (en)
Inventor
James A. Johnston
Albert H. Burgun
Original Assignee
Johnson & Johnston Associates, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson & Johnston Associates, Inc. filed Critical Johnson & Johnston Associates, Inc.
Priority to AU15290/97A priority Critical patent/AU1529097A/en
Publication of WO1997025841A1 publication Critical patent/WO1997025841A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Definitions

  • This invention relates to printed circuit boards in general and more specifically to methods employed in the manufacturing of boards and components used in such manufacturing process.
  • an electric printed circuit board includes, as a component, a dielectric layer of an epoxy resin-impregnated, woven glass fiber which is known as "prepreg".
  • Conductive copper foil sheets are laminated to opposite sides of the prepreg. Subsequently, the copper, through a number of photographic processes, is etched to product conductive paths on the surface of the prepreg layer. When so assembled, the lamination may itself be a component of a more complex board or may be a board per se.
  • the copper foil is uncoiled from a roll, which is moved from side to side relative to the stack of boards in repetitive passes.
  • An initial length of copper is matched edgewise with the lower face of the first layer of prepreg, starting from below, the roll axis is caused to move horizontally.
  • the roll is elevated slightly and its direction reversed 180° making a loop.
  • a second layer of foil is laid on the upper face of the prepreg.
  • a metal separator sheet of anodized aluminum is laid on the copper foil.
  • the roll's direction again is reversed and as another layer of copper foil is unrolled onto the separator sheet with another loop at the end.
  • the process is repeated until the desired number of boards are laid up, each having prepreg, copper on both faces and a separator sheet between adjacent boards.
  • the two ends of the foil are connected to a suitably powered electric generator and pressure is applied to the book.
  • the flow of electricity resistively heats the copper foil which is conducted through each book in the stack and the books then bonded by the resin in the prepreg. After cooling, the separator plates are removed and the looped copper foil is trimmed from the boards which are then further processed.
  • Another problem is wrinkling of the foil when it is being laid out by the moving rolls onto the sheet of prepreg or multilayer board.
  • the rolls go over the edges of the boards which can cause wrinkling because the movement of the rolls is not always at exact right angles to the edge of the sheet or the sheet is not oriented properly to the direction of the roll.
  • the '050 invention is embodied in a component for use in the manufacturing of printed circuit boards and like articles.
  • the component is a laminate constructed of at least one sheet of copper foil which, when fabricated into a printed circuit board, constitutes a functional element of the board, i.e. , the conductive paths.
  • the other element of the laminate is a substrate sheet of aluminum which constitutes a discardable element of a finished printed circuit board.
  • One surface of each of the copper sheet and the aluminum sheet is essentially uncontaminated and are engageable with each other at an interface.
  • the laminated component may be constructed of two sheets of copper foil sandwiching a single sheet of aluminum which constitutes a discardable element.
  • each of the copper sheets and both surfaces of the aluminum sheet are essentially uncontaminated and engageable with each other at interfaces on opposite sides of the aluminum.
  • a central zone from which the conductive wires will be etched. This zone is kept essentially uncontaminated.
  • Flexible adhesive joins the uncontaminated surfaces of the sheets together outside the central zones joining their borders sufficiently to maintain the essentially uncontaminated character of the central zone interiorally of the edges of the sheets.
  • the aluminum substrate provides stiffening for the copper foil and makes handling much easier.
  • This invention is directed to addressing these problems for the loop technique.
  • the invention resides in part in a component for use in manufacturing articles such as printed circuit boards and particularly to boards made by the loop technique. It comprises a laminate constructed of two sheets of copper foil which, in a finished printed circuit board, constitute functional elements. Sandwiched between these sheets is a sheet of aluminum, as a separator, which constitutes a discardable element. One surface of each of the copper sheets and both surfaces of the aluminum sheet are essentially uncontaminated. The uncontaminated surfaces are engagable with each other at interfaces. Each of the uncontaminated interfaces of the sheets has a central zone inwardly of the edges of the sheets. A margin is left on each of the copper foil sheets which extends beyond each of two edges of the aluminum separator sheet and will be joined to establish a continuous electric path through a stack of boards.
  • Adhesive is located between the sheets outwardly of the central zones to maintain the essentially uncontaminated character of the central zones of the component.
  • the adhesive is applied in selected deposit areas which may be a band, either interrupted or uninterrupted near the periphery of the sheets or other equivalent configurations which will maintain the essentially uncontaminated character of the central zones.
  • a method of making the components into printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprises the steps of assembling a multilayer book of dielectric layers and components of conductive copper foil each component sandwiching a layer of aluminum.
  • the dielectric and the components are assembled one on top of another in a press lay-up.
  • the extending margins of the copper foil of each components are joined together with ultrasonic welding or by any technique that brings the copper margin into sufficient metallic contact to be continuously conductive.
  • the margins of the copper sheets of each component are joined to the margins of the component above it with layers of prepreg separating each component. Connections are made on alternating edges of the aluminum sheets to make the conductive path a parallel circuit.
  • the book is then subjected to pressure and current is passed through the copper foil sheets sufficient to heat the entire stack uniformly, fuse the resin and bond the copper foil to both the top and bottom layers of the prepreg or multilayer board if one is used.
  • the completed boards have a layer of copper foil on both the top and bottom sides of the prepreg, the copper forming the uppermost layer coming from the component that was assembled above the prepreg and the bottom surface of the board having been the upper copper layer of the board assembled beneath the prepreg.
  • Figure 1 is a schematic plan view of a component for use in the manufacturing of printed circuit boards embodying the features of the present invention.
  • Figure 2 is a schematic sectional view on enlarged scale of a marginal edge portion of the component of Figure 1.
  • Figure 3 is an expanded schematic cross-section of the component of Figure 1.
  • Figure 4 is an expanded schematic cross-section of a printed circuit board made in accordance with the present invention.
  • Figure 5 is an expanded view of a schematic cross-section of a multilayer lay-up of printed circuit boards being made in accordance with the prior art looped foil method.
  • Figure 6 is an expanded view of a schematic cross-section of a multilayer of printed circuit boards being made in accordance with the present invention.
  • a component 30 for making printed circuit boards will be seen In figures 1 and 2 for specific use in making boards by the technique of electrically heating the copper foil to heat the stack as distinguished from the use of a heated press. It comprises a substrate A ( Figure 2) of commercial grade aluminum. Aluminum from about, 0.010 to 0.015 inches in thickness has been found to be satisfactory, although the aluminum may be from about 0.001 inches to 0.125 inches thick depending upon the end use. Positioned on its upper surface is a sheet of copper foil C which, with this thickness aluminum, would be 1/2 ounce copper. This means that there is 1/2 ounce of copper by weight per square foot of the foil. When evenly distributed, its thickness will be approximately .0007 inches. Generally speaking, this is the industry standard at the present time for printed circuit boards.
  • the outer surface C 0 of the copper shown in Figure 2 as the upper surface, is preoxidized and often has a gray color depending on the oxidizing process employed, although other colors may result depending on the process. This is done to make it more readily adherable to the prepreg to which it will be bonded in the printed circuit board making process.
  • the inner surface of the copper C is essentially uncontaminated, meaning there are no contaminants on the surface that are of a sufficient size or nature so as to interfere with the ultimate functioning of the copper as the conductive paths in the finished boards. This surface in a finished printed circuit board constitutes a functional element and will be etched to produce the desired circuit conductor configuration.
  • the surfaces A s of the aluminum sheet A which engages the surface C t is also essentially uncontaminated.
  • the aluminum sheet A On the bottom surface of the aluminum sheet A is a second sheet of copper foil C, also having an outer oxidized surface C 0 and an essentially uncontaminated inner surface C,.
  • the lower mating surface of the aluminum sheet A is also essentially uncontaminated.
  • the aluminum substrate A terminates at an edge 31 whereas both the upper and the lower sheets of copper foil C have margins beyond the edge 31.
  • the marginal extensions are designated 33 and 35. These extensions exist on each of two edges of the component 30 and in this instance are opposite edges, i.e., the top and bottom of the component 30 as seen in Figure 1.
  • the laminated component 30 is viewed with the oxidized surface C 0 of the copper foil layer facing upwardly and peeled back at one corner.
  • One standard size sheet of copper foil employed in making printed circuit boards today is 12X12 inches while another is 18X24 inches, although sheets as large as 48X72 are used. Sheets 36X48 may be cut into four separate sheets of 18X24. Other in-between sizes are often used as well. The principles of the invention would apply to both smaller and larger sizes.
  • the component 30 includes a substrate layer of commercial grade aluminum A which is illustrated as from about 0.010 to about 0.015 inches in thickness. Overlaying the substrate is a sheet of copper foil which, in the illustrative example, 1/2 ounce copper, i.e., approximately 0.0007 inches in thickness. The principles of this invention would apply to components having copper and aluminum of other thicknesses.
  • the peeled corner exposes the inner essentially uncontaminated surfaces of the copper and the aluminum, respectively.
  • Flexible adhesive such as rubber cement is supplied to selected deposit areas of the interface of the aluminum and the copper. In this case, it extends around the periphery of the component 30 near or at the border of the sheet and joins the uncontaminated surfaces, C, of the copper and the aluminum A, together at their borders.
  • the flexible adhesive 40 is located in an adhesive application zone defined by the dotted line 42 and the edge of the component 30.
  • the zone may be from about 0.10 to 1.0 inches wide depending upon both the end product requirements and the size of the sheets of aluminum and copper being used.
  • the adhesive band interrupted or uninterrupted, from approximately 0.060 to approximately 0.090 inches in width, has been found satisfactory although it may be from about 0.010 inches to 0.500 depending upon the size of the sheets being laminated and from approximately 0.001 to approximately 0.005 inches thick, a thickness of 0.001 to 0.002 has been found satisfactory.
  • a method of assembling a book of boards by the prior art continuous loop process is illustrated in Figure 5.
  • Copper foil, designated C ⁇ from a first roll (not seen) exposed to the ambient conditions of the lay-up room is laid on the upper surface of the bottom press or caul plate 50.
  • a second copper foil designated C 2 is laid on top of the layer C, from a second roll of foil (also not seen).
  • a first anodized aluminum separator plate 52 acting as an insulator is placed in contact with the superimposed layers of copper foil C ⁇ , C 2 When the first roll reaches a point 53 approximately at the right hand edge of the plate 52, it is elevated and moved to the left as viewed in Figure 5.
  • the second roll of copper foil is elevated to a point at approximately 58 in Figure 5 and then proceeds to the left over the upper surface of the sheet of prepreg 56.
  • the second sheet joins and ultimately is electrically secured to the first sheet at point 60.
  • This looping process is repeated until the desired number of boards have been laid one upon another intersected by the foil until the book is completed with separator plate 62 on top of the ends of both foils at 64.
  • the ends are squeezed between the upper caul plate 66 and the separator plate 62. Electricity is applied and the current flows in parallel along the sheets of foil heating the book by the heat generated from the resistance of the copper.
  • One of the principal advantages of the above described looping process is in energy saving. There are far less total watts of energy used when the copper foil is employed as a resistance heater for the entire book of boards than when a press is heated externally.
  • Another advantage is that the heat distribution in the book is uniform. It more closely approaches an isothermal heat condition than the old technique of transferring from a press through heavy conductive plates only at the top and bottom of the book.
  • the fact that the copper which is woven back and forth throughout the entire stack is of uniform thickness and width produces heat generated from top to bottom of the book uniformly. Uniform heating leads to a uniform flow of resin.
  • one of the chief problems with the looping method is that the edges of the stack are open and the copper and aluminum are processed in a potentially dusty environment. That is, prepreg dust, dirt, insects and other contaminants being located on the surface of the copper causing shorts and other defects in the bottom copper leading to defects in the etched wiring. Another problem is wrinkling described above.
  • the component 30 ( Figures 1 and 2) is supplied from the manufacturer with the marginal portions 33 and 35 of copper foil extending past the edges 31 of the aluminum on both sides.
  • the marginal extensions may be joined by the component manufacturer or the component may be shipped by the manufacturer without joining the extensions.
  • the marginal extensions may be joined, for example, by ultrasonic welding, or its equivalent, the inner faces of the copper into good electric conductivity.
  • the joining process may be by spot welding, pressure welding, cold welding or any other equivalent means as long as it brings the extensions 33 and 35 into sufficient electrical contact to permit a continuous flow of electricity.
  • the component 30 will be supplied by the component manufacturer without the marginal extensions of 33 and 35 electrically joined. In this instance, such joining will be performed by the board maker or laminator at the lay-up station.
  • the component 30 includes upper and lower layers of copper foil and an inner layer of aluminum. The extensions of the copper foil 33 and 35 are shown joined at their edges. It will be understood, however, that Figure 3 is illustrative of the relative locations of the foil and aluminum only.
  • the "working" surfaces are protected during the entire board making process because they face inwardly toward the essentially uncontaminated surface of the aluminum sheet and the adhesive maintains the essentially uncontaminated character of the interface and thus, preventing the entry of dust and other contaminants.
  • the press includes a bottom caul plate 74 supporting a first insulator which is illustrated as an oversized piece of anodized aluminum 76. While shown spaced from the call plate 74, the prepreg actually is placed directly upon it.
  • a component 75 described above includes an inner layer of aluminum sandwiched between two copper foils each having marginal extensions 33 and 35. It is placed on top of the anodized aluminum insulator 76. A conductive lead 77 joins the extensions 33 and 35 in electric contact with the caul plate 74.
  • extensions 33 and 35 shown at the left hand side of Figure 6 may be joined directly to the conductive caul plate 74 or by any suitable conductive lead which does not necessarily have to lie benea the anodized aluminum insulator 76.
  • the extensions 33, 35 of the first component 75 and the second component 82 are then joined together by welding as designated by the arrows 83 on the left side of Figure 6. However, the welding process may be delayed until all components are assembled.
  • the laying up of components 30, separated by prepreg or multilayer boards may continue to any height desired within the confines of the press.
  • An insulating separator plate of anodized aluminum 91 separates the uppermost component 85 from the caul plate 88.
  • electricity is applied and current flows in parallel through the upper and lower layers of foil C of each component 30.
  • the book is uniformly heated throughout its height.
  • the surface of the copper foil remains essentially uncontaminated.
  • the upper sheet 90 of the board of Figure 4 was the lower sheet of foil of the component which was assembled above it and the lower sheet of foil 92 was the upper sheet of the component 30 next below it in the book.
  • the aluminum separator sheets in the original components are discarded and may subsequently be employed as drill entry and drill backup material in the subsequent processing of the boards or may be recycled.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention porte sur un composant (30) utilisable dans la fabrication d'articles tels que des plaquettes de circuit imprimé, comportant un stratifié consistant en deux feuilles de clinquant de cuivre (33, 35) qui, dans une plaquette de circuit imprimé achevée, constituent des éléments fonctionnels ainsi qu'en une feuille d'aluminium (31) constituant un élément à jeter. Une des faces de chaque clinquant de cuivre et les deux faces de la feuille d'aluminium sont sensiblement non contaminées, et sont susceptibles d'entrer en contact les unes avec les autres sur des interfaces. Chaque interface non contaminée de ces feuilles possède des zones centrales vers l'intérieur des bords desdites feuilles. Chaque feuille de clinquant de cuivre possède une marge débordant sur les deux feuilles d'aluminium. Un adhésif (40) se trouve placé entre les feuilles vers l'extérieur des zones centrales afin de préserver les caractéristiques de quasi absence de contamination de ces zones. Les marges des feuilles de cuivre sont connectées électriquement (83) selon une configuration telle que, lorsqu'il existe une multiplicité de composants assemblés, par l'intermédiaire d'un matériau diélectrique, en un livre et ce, pour constituer des plaquettes de circuit imprimé, et que ces feuilles de cuivre sont traversées par un courant électrique, le livre chauffe de manière homogène afin de faire fondre et durcir la résine.
PCT/US1997/000216 1996-01-09 1997-01-06 Composant pour substrats recouverts de cuivre et procede de fabrication de ces substrats WO1997025841A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU15290/97A AU1529097A (en) 1996-01-09 1997-01-06 Component for and method of making copper clad substrates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58382396A 1996-01-09 1996-01-09
US08/583,823 1996-01-09

Publications (1)

Publication Number Publication Date
WO1997025841A1 true WO1997025841A1 (fr) 1997-07-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1997/000216 WO1997025841A1 (fr) 1996-01-09 1997-01-06 Composant pour substrats recouverts de cuivre et procede de fabrication de ces substrats

Country Status (3)

Country Link
AU (1) AU1529097A (fr)
TW (1) TW317072B (fr)
WO (1) WO1997025841A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000004749A1 (fr) * 1998-07-14 2000-01-27 Dieter Backhaus Procede de liaison de films en cuivre et de toles de separation
EP1014768A2 (fr) * 1998-12-23 2000-06-28 Robert Bürkle GmbH Procédé et dispositif pour la fabrication de multicouches
ITMI20120194A1 (it) * 2012-02-13 2013-08-14 Cedal Equipment Srl Miglioramenti nella fabbricazione di pile di laminati plastici multistrato per circuiti stampati
CN110603149A (zh) * 2017-06-02 2019-12-20 日立金属株式会社 板材和板材的制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI710295B (zh) * 2020-01-02 2020-11-11 峻立科技股份有限公司 塑膠元件與電路板的結合方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4875283A (en) * 1986-11-13 1989-10-24 Johnston James A Method for manufacturing printed circuit boards
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
WO1993022139A1 (fr) * 1992-05-05 1993-11-11 Cedal, S.R.L. Procede de production de stratifies en plastique a lamelles metalliques, notamment pour circuits imprimes

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4875283A (en) * 1986-11-13 1989-10-24 Johnston James A Method for manufacturing printed circuit boards
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
WO1993022139A1 (fr) * 1992-05-05 1993-11-11 Cedal, S.R.L. Procede de production de stratifies en plastique a lamelles metalliques, notamment pour circuits imprimes

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000004749A1 (fr) * 1998-07-14 2000-01-27 Dieter Backhaus Procede de liaison de films en cuivre et de toles de separation
EP1355520A2 (fr) * 1998-07-14 2003-10-22 Dieter Backhaus Tôle de séparation pour le laminage d'un empilement de multicouches et procédé de scellement d'une feuille de cuivre avec une tôle de séparation
EP1355520A3 (fr) * 1998-07-14 2004-05-26 Dieter Backhaus Tôle de séparation pour le laminage d'un empilement de multicouches et procédé de scellement d'une feuille de cuivre avec une tôle de séparation
EP1014768A2 (fr) * 1998-12-23 2000-06-28 Robert Bürkle GmbH Procédé et dispositif pour la fabrication de multicouches
EP1014768A3 (fr) * 1998-12-23 2002-07-10 Robert Bürkle GmbH Procédé et dispositif pour la fabrication de multicouches
US6537412B1 (en) 1998-12-23 2003-03-25 Robert Burke Gmbh Process and apparatus for producing multilayers
ITMI20120194A1 (it) * 2012-02-13 2013-08-14 Cedal Equipment Srl Miglioramenti nella fabbricazione di pile di laminati plastici multistrato per circuiti stampati
WO2013121450A1 (fr) * 2012-02-13 2013-08-22 Cedal Equipment Srl Améliorations dans la fabrication de piles de stratifiés en matière plastique multicouche pour circuits imprimés
US9326390B2 (en) 2012-02-13 2016-04-26 Cedal Equipment Srl Manufacturing of stacks of multilayer plastic laminates for printed circuits
CN103392385B (zh) * 2012-02-13 2017-03-22 Cedal装置有限责任公司 制造用于印刷电路的多层塑料层压板的堆的改进
KR101907628B1 (ko) 2012-02-13 2018-10-12 세달 이큅먼트 에스알엘 개량된 인쇄 회로용 다층 플라스틱 박막 스택의 제조 방법 및 제조 시스템
CN110603149A (zh) * 2017-06-02 2019-12-20 日立金属株式会社 板材和板材的制造方法

Also Published As

Publication number Publication date
AU1529097A (en) 1997-08-01
TW317072B (fr) 1997-10-01

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