WO1997003788A1 - Metal d'apport de brasage en creme - Google Patents

Metal d'apport de brasage en creme Download PDF

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Publication number
WO1997003788A1
WO1997003788A1 PCT/JP1996/001977 JP9601977W WO9703788A1 WO 1997003788 A1 WO1997003788 A1 WO 1997003788A1 JP 9601977 W JP9601977 W JP 9601977W WO 9703788 A1 WO9703788 A1 WO 9703788A1
Authority
WO
WIPO (PCT)
Prior art keywords
flux
rosin
weight
cream solder
solder
Prior art date
Application number
PCT/JP1996/001977
Other languages
English (en)
Japanese (ja)
Inventor
Haruto Nagata
Akio Furusawa
Tetsuo Fukushima
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7183145A external-priority patent/JPH0929481A/ja
Priority claimed from JP7187271A external-priority patent/JPH0929486A/ja
Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.
Publication of WO1997003788A1 publication Critical patent/WO1997003788A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries

Definitions

  • the present invention relates to a cream solder used for soldering electronic components to an electronic circuit board.
  • the cream is placed at a predetermined position on the circuit board 1.
  • a screen mask 3 having a large number of holes 3a for supplying the solder 2 is placed.
  • the cream solder 2 is swung in the a direction by the squeegee 4 in the direction shown in FIG.
  • the print of the cream solder 2a is printed on the substrate 1. This mark is used for reflow soldering.
  • the solder is heated by passing it through a reflow furnace, and soldered to the board 1. Append o
  • the electronic parts mounted on a substrate tend to be smaller and more precise.
  • the chip parts As described above, the chip parts
  • the present invention relates to a cream comprising at least a flux comprising a rosin, an activator, a thixotropic agent and a solvent, and a solder alloy powder.
  • the flux is at least one selected from the group consisting of palmitic acid and stearic acid as a lubricant by at least 0.5. It is characterized by containing up to 30% by weight.
  • the cream solder of the present invention contains a polymerized rosin having a softening point of 110 ° C. or higher.
  • the content of this polymerized rosin is preferably in the range of 50% by weight to 90% by weight of all the rosins in the flux.
  • FIG. 1 is a schematic cross-sectional view for explaining a cream solder printing process.
  • FIG. 2 is a schematic sectional view showing a printed state of the cream solder.
  • FIG. 3 is a schematic cross-sectional view showing a state after a conventional cream solder is printed with a fine pitch.
  • Fig. 4 shows a state in which printing was performed normally on the fine pitch. This is a schematic sectional view.
  • FIG. 5 is a graph showing the relationship between the content of stearic acid in the flux and the rate of defective printing.
  • FIG. 6 is a graph showing the relationship between the palmitic acid content in the flux and the defective plate removal rate.
  • Fig. 7 shows the percentage of lubricant and the rate of plate removal failure in a flux containing stearic acid and halmicinic acid as lubricants in a ratio of 1: 1. It is a figure which shows a relationship.
  • Fig. 8 is a graph showing the relationship between the content of rosin at a softening point of 110 ° C and the incidence of chipping for all rosins.
  • Figure 9 shows the relationship between the rosin content at a softening point of 145 ° C and the incidence of chipping for all rosins. Best mode for carrying out the invention
  • the flux that constitutes the cream solder of the present invention is mainly a resin that gives fluidity and stickiness, a small amount of activator, and a chip for maintaining shape. Guar and lubricant. Approximately 30 to 70% by weight of solid components such as lumitic acid and / or stearic acid, and thickeners added if necessary, 70 to 30% by weight.
  • the activator various substances can be used.
  • organic compounds especially diphenyl, are used.
  • a thixotrope castor You can use a non-woven polybutene, or a power rod.
  • the solvent examples include 2-ethyl 1, 3-alcohols such as hexandione.
  • Propylene glycol monophenol Glycolic solvents such as quinolone or hexinolate ether are used.
  • Solder alloy powder is as follows. Use this kind of solder such as Pb—Sn—Ag alloy or Pb—Sn eutectic alloy as shown in the examples below. Anything you can use. This solder alloy powder and flux are mixed at a weight ratio of about 9: 1 to produce a cream solder.
  • a polymerized rosin is used as the rosin.
  • Polymerization B di emissions of This .. b di emissions Ah Ru resin acid components, and dimerization of the main and to be so Oh Ru c This was due Ri dimerization polymerization reaction ⁇ Bie Ji phosphate softening point also c polymerized have a have openings di down ratio that is Do high not ho throat softening point rather high the of Ru Ah at 9 0 ° C before and after.
  • the polymerization initiator used in the present invention preferably has a softening point of 110 ° C or higher.
  • the chixotropy index is determined from the viscosity (expressed in the common logarithm) of the change in viscosity due to the change in the shearing speed from the diagram of the viscosity-shearing speed curve. .
  • the content of stearic acid and / or Z or palmitic acid in the flux is 0.5 to 30% by weight in total. I like it. If the content is less than 0.5% by weight, stearic acid and / or pazoremitic acid will not act sufficiently as a lubricant, and the printing will be performed at the time of printing. Liability tends to decrease. On the other hand, if the above content exceeds 30% by weight, the content of rosin, a solvent, etc., which is a component of the flux, is reduced, so that the original flux is not used. The function will be degraded.
  • the adhesive strength of the cream solder is improved, and the microelectrons are reduced. Since the holding force of the component on the substrate is enhanced, it is possible to reduce chip standing defects.
  • the flux was prepared by mixing so that the ratio as shown in 1 was obtained.
  • the proportion of stearic acid added was adjusted by changing the proportion of rosin.
  • the flux prepared in this manner is mixed with a solder alloy powder having an average particle size of about 30 to 40 zm at a weight ratio of 9:91 to form a cream. Solder was made. The composition of the solder alloy powder used here was 3116.2% by weight,? 36% by weight. Ag 2% by weight. Comparative Example 1
  • a flux was prepared in the same manner as in Example 1 except that stearic acid was not added, and a cream solder was prepared.
  • a printing experiment was performed using the above-mentioned cream solder. That is, a circle having a diameter of 0.2 mm and a square having a side force of 0.2 mm.
  • For a fine pitch substrate with 40 turns each and a screen thickness of 150 zm Using a screen mask, automatic printing was performed 20 times on a copper-pasted substrate by an automatic printing machine. At that time, the mask after printing was observed from above the mask, and the cream was attached to the side of the mask, but it was small because it was attached to it.
  • the open area was measured, and the ratio of the actual open area of the screen mask to the actual open area was calculated as the blanking rate.
  • the higher the plate removal rate the smaller the amount of cream solder left on the mask, and the better the printing.
  • Table 1 shows the plate removal rates and the above-mentioned chic tropic indices.
  • Fig. 5 shows the relationship between the stearic acid content of the flux and the engraving rate.
  • Lubricant (stearic acid) 0 0.2 0.4 0.5 1.0 2.0 4.0 10.0 20.0 30.0 31.0 or more Flux solvent 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 Composition Rosin 54.8 54.6 54.4 54.3 53.8 52.8 50.8 44.8 34.8 24.8 23.8 or less Thixotropic 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 Activator 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2
  • a flux having a composition shown in Table 2 was prepared in the same manner as in Example 1 except that palmitic acid was used as a lubricant, and a cream solder was produced. Comparative Example 2
  • a flux was prepared in the same manner as in Example 2 except that palmitic acid was not added, and a cream solder was prepared. Using these cream solders, a printing experiment was performed under the same conditions as in Example 1.
  • Table 2 shows the plate removal rate and the chixotropic index.
  • Figure 6 shows the relationship between the palmitic acid content of the flux and the engraving rate.
  • Lubricant (C. noremitic acid) 0 0.2 0.4 0.5 1.0 2.0 4.0 10.0 20.0 30.0 31.0 or more Flux Solvent 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0
  • Example 3 The same as Example 3 except that neither stearic acid nor palmitic acid was added. A printing experiment was performed using these cream solders under the same conditions as in Example 1. Table 3 shows the plate removal rate and the chic tropic index as in Example 1. Fig. 7 shows the relationship between the flux content and the plate blanking rate.
  • a rosin having a softening point of 95 ° C and a rosin having a softening point of 110 ° C were mixed at various ratios, and the contents of these two types of rosins were reduced to 50%.
  • the flux was prepared with the stearic acid content of 4.8% by weight as a lubricant, and as a thixotropic agent, force stylus was prepared.
  • diphenyl guanidine hydrobromide was used, and as the solvent, diethylene glycol-zole 2 -ethyl hexinole ether was used.
  • a flux having the composition shown in Table 4 was prepared. These fluxes and the solder alloy powder used in Example 1 were mixed at a weight ratio of 9:91 to prepare a cream solder.
  • cream solders we conducted an evaluation experiment on chip standing.
  • the above-mentioned cream solder was supplied by printing onto a test substrate having electrodes for a chip capacitor, and the chip was then placed on the test board.
  • the pc capacitor was mounted on the mounting machine. After passing this through a reflow furnace in a nitrogen atmosphere, the rate of chip standing was examined. Rif In a low furnace, the test substrate is pre-heated at 150 ° C for 1 minute, then heated at a peak temperature of 230 ° C, and immediately cooled by air when it exits the furnace.
  • chip incidence rate was determined by the following equation.
  • Chip breakage rate (number of chip breaks total number of mounted chips) X 100 C%] ⁇
  • Table 4 shows the incidence of chip standing when using each type of cream solder.
  • Fig. 8 shows the relationship between the content of mouth gin at a softening point of 110 ° C in the mouth gin and the incidence of chipping.
  • the napping incidence rate is reduced by containing 70% by weight or more of rosin with a softening point of 110 ° C in the total rosin. It can be reduced to less than 1/2. Also, because it contains 4.8% by weight of stearic acid, it has good releasability. O In addition, only the rosin with a softening point of 110 ° C is used. In this case, the viscosity of the cream solder increases, so that the fluidity during printing deteriorates and it becomes difficult to supply the cream solder onto the substrate. Therefore, the polymerized rosin must be kept at 90% or less of the total amount of rosin.
  • Lubricant (stearic acid) 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 Flux Solvent 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 Composition Rosin (softening point 95 ° C) 50.0 45.0 40.0 35.0 30.0 25.0 20.0 15.0 10.0 5.0 0 (% by weight) Rosin (softening point 110 ° C) 0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0 Thixotropic agent 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0
  • the procedure is similar to that of the fourth embodiment except that the resin having a softening point of 95 ° C and the mouth having a softening point of 144 ° C are used in various ratios.
  • Racks were prepared and cream solder was prepared.
  • Table 5 shows the composition of each flux and the chip incidence measured under the same conditions as in Example 4.
  • Figure 9 shows the relationship between the content of rosin at a softening point of 144 ° C in rosin and the incidence of chipping.
  • the tip having a softening point of 45 ° C. or more containing 50% by weight or more of the rosin having a softening point of not less than 50% by weight is contained.
  • the incidence can be reduced to less than 1/2.
  • since it contains 4,8% by weight of stearic acid the plate formability is good. If the mouth resin is made of only the resin with a softening point of 1 45 ° C, the viscosity of the cream solder will increase and the fluidity during printing will increase. It becomes worse, and supply on the substrate becomes difficult.
  • the polymerized rosin must be kept at 90% or less relative to the total rosin.
  • Lubricant (stearic acid) 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 4.8 Flux Solvent 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 40.0 Composition Rosin (softening point 95 ° C) 50.0 45.0 40.0 35.0 30.0 25.0 20.0 15.0 10.0 5.0 0 (wt%) Rosin (softening point 145 ° C) 0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0
  • the printability of the printing plate is improved. In other words, it reduces joint strength reduction due to shortage, shortage of solder fillet, and poor chip standing. The frequency of cleaning the socks can also be reduced.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Métal d'apport de brasage en crème, utilisé pour souder des composants électroniques à des plaquettes de circuit. Ledit métal d'apport de brasage est composé d'un alliage de soudage en poudre et d'un flux comprenant de la colophane, un activateur, un agent thixotropique et un solvant. Le flux contient en outre 0,5 à 30 % en poids d'acide palmitique et/ou stéarique en tant que lubrifiant.
PCT/JP1996/001977 1995-07-20 1996-07-15 Metal d'apport de brasage en creme WO1997003788A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP7183145A JPH0929481A (ja) 1995-07-20 1995-07-20 クリームはんだ
JP7/183145 1995-07-20
JP7187271A JPH0929486A (ja) 1995-07-24 1995-07-24 クリームはんだ
JP7/187271 1995-07-24

Publications (1)

Publication Number Publication Date
WO1997003788A1 true WO1997003788A1 (fr) 1997-02-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1996/001977 WO1997003788A1 (fr) 1995-07-20 1996-07-15 Metal d'apport de brasage en creme

Country Status (1)

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WO (1) WO1997003788A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19731151C1 (de) * 1997-07-21 1999-01-21 Degussa Lotpaste zum Hartlöten und Beschichten von Aluminium und Aluminiumlegierungen
WO2002098598A2 (fr) * 2001-06-07 2002-12-12 Alpha Fry Limited Procede ameliore d'impression par soudage
KR100475423B1 (ko) * 1997-03-27 2005-06-16 닛폰 에쿠스란 고교 가부시키가이샤 흡수성아크릴섬유
US6936115B2 (en) 2001-06-07 2005-08-30 Fry's Metals, Inc. Soldering flux vehicle additive and fine pitch printing method
US20230060880A1 (en) * 2021-08-24 2023-03-02 Robert Bosch Gmbh Flattening surface of pasted track in stencil printing process

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01157798A (ja) * 1987-12-15 1989-06-21 Showa Denko Kk クリームはんだ
JPH05318170A (ja) * 1992-05-26 1993-12-03 Matsushita Electric Ind Co Ltd 無洗浄クリーム半田
JPH0775894A (ja) * 1993-09-03 1995-03-20 Nippon Handa Kk クリームはんだ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01157798A (ja) * 1987-12-15 1989-06-21 Showa Denko Kk クリームはんだ
JPH05318170A (ja) * 1992-05-26 1993-12-03 Matsushita Electric Ind Co Ltd 無洗浄クリーム半田
JPH0775894A (ja) * 1993-09-03 1995-03-20 Nippon Handa Kk クリームはんだ

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100475423B1 (ko) * 1997-03-27 2005-06-16 닛폰 에쿠스란 고교 가부시키가이샤 흡수성아크릴섬유
DE19731151C1 (de) * 1997-07-21 1999-01-21 Degussa Lotpaste zum Hartlöten und Beschichten von Aluminium und Aluminiumlegierungen
US6656290B1 (en) 1997-07-21 2003-12-02 Degussa Aktiengesellschaft Soldering paste for hard-soldering and coating aluminum and aluminum alloys
WO2002098598A2 (fr) * 2001-06-07 2002-12-12 Alpha Fry Limited Procede ameliore d'impression par soudage
WO2002098598A3 (fr) * 2001-06-07 2003-09-25 Alpha Fry Ltd Procede ameliore d'impression par soudage
US6936115B2 (en) 2001-06-07 2005-08-30 Fry's Metals, Inc. Soldering flux vehicle additive and fine pitch printing method
US20230060880A1 (en) * 2021-08-24 2023-03-02 Robert Bosch Gmbh Flattening surface of pasted track in stencil printing process

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