WO1996036964A1 - Ensemble de tete magnetique, assemblage pour cette derniere, appareil d'assemblage et disque magnetique - Google Patents

Ensemble de tete magnetique, assemblage pour cette derniere, appareil d'assemblage et disque magnetique Download PDF

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Publication number
WO1996036964A1
WO1996036964A1 PCT/JP1996/001280 JP9601280W WO9636964A1 WO 1996036964 A1 WO1996036964 A1 WO 1996036964A1 JP 9601280 W JP9601280 W JP 9601280W WO 9636964 A1 WO9636964 A1 WO 9636964A1
Authority
WO
WIPO (PCT)
Prior art keywords
magnetic head
connection terminal
wire
head slider
head assembly
Prior art date
Application number
PCT/JP1996/001280
Other languages
English (en)
Japanese (ja)
Inventor
Yasuo Amano
Naotake Ebinuma
Koji Serizawa
Ichiro Miyano
Naoki Maeda
Yukimori Umakoshi
Osamu Narisawa
Shuichi Sugahara
Original Assignee
Hitachi, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi, Ltd. filed Critical Hitachi, Ltd.
Publication of WO1996036964A1 publication Critical patent/WO1996036964A1/fr

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4853—Constructional details of the electrical connection between head and arm

Definitions

  • Magnetic head assembly Description Magnetic head assembly, method for assembling the same, apparatus for assembling the same, and magnetic disk apparatus
  • the present invention relates to a magnetic head assembly, a method for assembling the same, a device for assembling the same, and a magnetic disk drive.
  • Magnetic disk drives are used as indispensable devices for computers and word processors, but in recent years, as the amount of information has increased, higher storage capacity, higher performance, and smaller size have been required.
  • the magnetic disk device is composed of a magnetic disk unit and a magnetic head unit. As performance and size are reduced, the magnetic head unit is also required to have higher precision and smaller size. .
  • a magnetic disk device is an information storage device, which has at least one rotating disk having concentric data tracks containing information, and a magnetic disk for reading data from each track or writing data to each track.
  • a head slider ; and an actuator for holding the magnetic head slider, moving to a desired track, and positioning a magnetic head portion during a read or write operation.
  • a magnetic head assembly body that has not been subjected to bonding is referred to as a work, that is, a work is a thin film magnetic transducer and a first connection terminal circuit pattern formed on an end surface perpendicular to the air bearing surface.
  • a magnetic head slider provided with a wiring pattern and a suspension provided with a second connection terminal circuit pattern at an end thereof; The magnetic head slider is so suspended that the surface of the thin-film magnetic conversion element is orthogonal to the surface of the thin film magnetic conversion element and the end of the second connection terminal circuit pattern surface in the lateral direction of suspension is parallel to the surface of the thin-film magnetic conversion element. It is configured above.
  • FIG. 13 A conventional magnetic head assembly used for the magnetic head section will be described with reference to FIGS. 13 to 20.
  • FIG. 13 A conventional magnetic head assembly used for the magnetic head section will be described with reference to FIGS. 13 to 20.
  • FIG. 13 is a perspective view of a conventional magnetic head assembly
  • FIG. 14 is an enlarged view of a magnetic head slider of the magnetic head assembly of FIG.
  • 11 is a magnetic head slider
  • 12 is a core slider
  • 13 is a thin-film magnetic transducer
  • 14 is a suspension
  • 15 is a connection terminal circuit pattern
  • 16 is a lead wire.
  • 17 is a protective tube
  • 18 is a flexible member
  • ⁇ 19 is a floating surface
  • 50 is a work.
  • the magnetic head slider 11 of the magnetic head assembly used in the magnetic disk device is composed of, for example, a core slider 12 made of ceramic and a thin-film magnetic transducer 13, and the lower surface thereof is a floating surface 19.
  • the suspension member of the magnetic head slider 11 is composed of a flat suspension 14 and a flexible member 18. One end of the suspension 14 is connected to an actuator arm (not shown), and the other end is connected.
  • the magnetic head slider 11 is connected to the bending member 18 for supporting the same.
  • the suspension member 14 acts as an elastic panel that presses the top surface 19 of the magnetic head slider 11 against the disk surface, while the flexure member 18 acts as the magnetic head slider 11. When the flying surface 19 rides on an air cushion between the flying surface 19 and the rotating disk, the magnetic head slider 11 gives flexibility.
  • the magnetic head slider 11 is fixed to the flexible member 18 with an adhesive or the like.
  • Circuit connection terminal pattern 1 provided on the magnetic head slider 1 1 5 and a magnetic disk main body (not shown) are connected by a lead wire 16, and the detected electrical signal from the thin-film magnetic transducer 13 is sent to the lead wire 16 via the circuit connection terminal pattern 15, It is transmitted to the magnetic disk body.
  • the lead wire 16 is coated with an insulating material such as a resin to electrically insulate the metal suspension 14 and is further passed through a protective tube 17 such as a pineal tube for mechanical protection. It is fixed to.
  • the protective tube 17 is fixed to the suspension 14 by mechanical means such as caulking.
  • connection terminal circuit pattern 15 Since there is no protective tube 17 between the connection terminal circuit pattern 15 and the protective tube 1, the lead wire 16 is insulated by the insulating coating.
  • the connection between the connection terminal circuit pattern 15 and the lead wire 16 is made by soldering or ultrasonic bonding.
  • the magnetic head slider 11 has also been required to be smaller and have higher performance. Accordingly, it is required that the mounting space of the lead wire 16 be as small as possible in the direction perpendicular to the suspension 14. Conventionally, since the lead wire 16 from the magnetic head slider 11 to the protection tube 17 fixed to the tip of the suspension 14 is formed in a predetermined shape, the lead wire 16 is in the plane of the suspension 14. In addition to this, mounting space is required in the vertical direction, which has been a bottleneck for downsizing the equipment.
  • the miniaturization of the magnetic head slider 11 and the miniaturization of the mounting space of the lead wire 16 have progressed to such an extent that the rigidity and elasticity of the lead wire 16 cannot be ignored.
  • the magnetic head slider 11 uses the elastic force of the suspension 14 to follow the magnetic disk while absorbing a slight runout of the disk while floating slightly above the surface of the disk.
  • the miniaturization of the magnetic head slider 11 and the suspension 14 reduces the force.
  • the vinyl tube 17 and the lead wire 16 are fixed in a predetermined shape, and generate a force in a direction opposite to the elastic force of the suspension 14. As described above, as miniaturization progresses, the force in the opposite direction cannot be ignored.
  • FIG. 15 is a perspective view of a conventional magnetic hybrid assembly of a composite structure. ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇
  • the electric leads 3 ⁇ ⁇ ⁇ ⁇ patterned on the suspension 14 are wired from one end of the suspension 14 to a portion connected to the magnetic head slider 11.
  • FIG. 6 is an enlarged view of an electrical connection portion of the magnetic head slider shown in FIG. 5;
  • FIG. 17 is a perspective view showing the non-floating surface of the magnetic head slider not shown in FIG. 15;
  • reference numeral 15a denotes a wiring pattern
  • 32 denotes a base of the suspension 14
  • 33 denotes an anti-floating surface
  • 34 denotes a first electrically insulating layer
  • 35 denotes a
  • 36 is a connection terminal
  • 3.7 is a solder pole
  • 341 is a first electrically insulating layer.
  • a wiring pattern 15a is provided on the surface opposite to the flying surface 19 of the magnetic head slider 11, that is, on the anti-flying surface 33.
  • a first electrical insulating layer 34 is provided on a base 14 of a suspension 14 and a conductive layer 35 patterned thereon, and further thereon. Then, a second electrically insulating layer 341 is formed.
  • the first and second insulating layers 34, 341 are formed of a polyimide layer, and the patterned conductor layer 35 is formed of a vapor-deposited copper film.
  • the second insulating layer 341 was not formed in a portion where electrical connection with the magnetic head slider 11 was made, and the conductor layer 35 was exposed, and the connection terminal portion 36 was not formed. Is formed.
  • a solder pole 37 is arranged at a connection portion between the terminal portion 36 and the wiring pattern 15a of the magnetic head slider 11, and is heated and melted for electrical connection.
  • c first 8 diagram for explaining another example of the magnetic head slider 1 1 of the connection method is an enlarged view of another example of the electrical connection portion of the head assembly to magnetically shown in the first 5 Figure .
  • a suspension 14 having wiring patterned in the same manner as in the example of FIG. 16 is used, and the structure is almost the same as that of the example of FIG.
  • the same reference numerals as those in FIG. 16 denote the same parts, and a description thereof will be omitted, but only a new reference numeral will be described.
  • 38 is an adhesive.
  • the mechanical connection between the magnetic head slider 11 and the suspension 14 is connected by an adhesive 38. Further, the electrical connection is made between the connection terminal pattern 15 on the same surface as the magnetic element 13 of the magnetic head slider 11 and the terminal portion 36 provided on the suspension 14 as described in FIG. 16 described above. As shown, the solder poles 37 are fused and connected.
  • connection structure As described above, as the miniaturization proceeds, three problems newly arise in the connection structure using the composite structure or the laminated structure.
  • the first of the above three problems is that the magnetic head is mechanically attached and mechanically connected at the time of electrical connection.
  • a solder hole 3 is provided between the connection terminal pattern 15 located on the thin film magnetic transducer surface of the magnetic head slider 11 and the terminal portion 36 on the suspension 14.
  • a problem arises that stress is applied to the magnetic head slider 11 due to contraction and expansion of the connection member during curing, and the shape is deformed.
  • the magnetic head slider 11 is attached to the substrate 32 of the suspension 14 via the first electrically insulating layer 34, the conductor layer 35, and the second electrically insulating layer 34 1, and the adhesive 3
  • the adhesive is mechanically connected at 8
  • the anti-floating surface 33 of the magnetic head slider 11 contracts more than the floating surface 19 due to the contraction of the adhesive during curing.
  • the slider surface 1 of the magnetic head 1 has its flying surface 19 deformed in a convex shape with respect to the upper side.
  • the convex shape greatly affects the performance when the magnetic head slider 11 flies above the magnetic disk, that is, the flying characteristics.
  • the height of the convex shape is managed by adjusting the application amount of the adhesive 38, adjusting the bonding area of the suspension 14 and the like. Conversely, a concave shape will damage the magnetic disk.
  • FIG. 19 is a diagram showing a convex shape deformation amount when a low melting point solder is used for a connection member. As shown in the figure, it can be seen that, after soldering, the convex shape deformation amount is deformed in a decreasing direction. Its amount is between 10 nm and 40 nm.
  • the low solder used was a tin- and bismuth-based solder with a melting point of about 14 O'C. This low melting point solder has a property of expanding about 3% when it is solidified. ⁇ The expansion force at the time of solidification is the direction in which the thin-film magnetic transducer of the magnetic head slider 11 is pushed and the direction in which the convex shape is reduced. To work.
  • FIG. 20 is a diagram showing the amount of convex deformation when a conductive adhesive (silver epoxy-based) is used. As shown in FIG. 20, it can be seen that the convex shape is deformed in the direction of increasing the contrary to the case of FIG.
  • the epoxy adhesive hardens and shrinks when it is solidified in the opposite direction to the case of the low melting point solder, the direction in which the thin film magnetic transducer surface of the magnetic head slider 11 is pulled, the direction in which the convex shape increases. This is because the contraction force is applied to
  • the second of the three issues is the thermal issue.
  • the heat-resistant temperature of the magnetic head currently under study is said to be approximately 15 CTC. Therefore, the commonly used eutectic solder cannot be used in the connection method by soldering because the melting temperature is 18 CTC. —On the other hand, the use of a low melting point solder as described above solves the above-mentioned temperature problem, but has a problem of poor reliability depending on the use condition.
  • the third issue is the problem of assembly costs.
  • FIG. 16 The example described in FIG. 16 is an example in which an electrical connection terminal pattern 15 a is provided on the anti-floating surface 33 of the magnetic head slider 11, and the mechanical connection and the electrical connection are simultaneously performed. .
  • the structure of the magnetic head slider 11 shown in FIG. 17 is described above. Due to the assembling process, the electrical connection pattern 15 is formed on the same surface as the thin-film magnetic transducer 13 in many cases. Since the magnetic heads are manufactured at the same time, it is simple and cheap.
  • connection terminal pattern 15a on the anti-floating surface 33 is performed by forming a single piece of magnetic slider and then depositing a pattern from the thin-film magnetic conversion element surface. For example, there was a problem that the assembly cost would be extremely expensive.
  • the present invention has been made to solve the above-mentioned problems of the prior art, and has a low mechanical stress at the time of mechanically attaching and electrically connecting a magnetic head slider, at a low temperature and at a low stress.
  • a magnetic head assembly an assembling method, an assembling apparatus, and an assembling apparatus, and a magnetic disk apparatus capable of performing electrical contact on a thin film magnetic transducer surface of a magnetic head slider without problems and at low cost. That is the purpose. Disclosure of the invention
  • a magnetic head assembly comprises a magnetic head slider provided with a first connection terminal circuit pattern, a wiring pattern and a second connection terminal circuit pattern.
  • a wire is formed from the provided suspension and a wire is arranged between the first and second connection terminal circuit patterns.
  • a bending function part is provided in a part of the suspension, and the wiring between the first and second connection terminal circuit patterns is configured to absorb expansion and contraction of the wiring. It is characterized by
  • a discard pad is provided on the same plane as the first circuit connection terminal pattern and at a position outside the magnetic head slider, and the discard pad is disposed with the first circuit connection terminal pattern. Wire bonding is performed between the pads, the wire is cut between the first circuit connection terminal pattern and the discarded pad, and the wire is bent at a right angle to form a work, and the second circuit connection terminal pattern is formed.
  • the present invention is characterized in that the wire is formed by edge bonding.
  • the magnetic head assembly according to any one of the preceding items, wherein the wiring between the first and second connection terminal circuit patterns has a diameter of 10 to 70 ⁇ for a gold wire and a diameter of 10 to 30 for a aluminum wire.
  • copper wire is characterized by being wired overhead with conductive wires having a diameter in the range of 10 to 40 m.
  • the magnetic head assembly according to any one of the preceding items, wherein the second connection terminal circuit pattern is located closer to the magnetic head than the bending function portion. .
  • the configuration of the method for assembling a magnetic head assembly according to the present invention is the method for assembling a magnetic head assembly according to any one of the preceding items, wherein: First wire bonding is performed, and then, the work is rotated 90 degrees so that the second connection terminal circuit pattern is on the upper side, and second wire bonding is performed, It is characterized by wiring.
  • the structure of the magnetic head assembly assembling apparatus is a magnetic head assembly comprising: a fixing means for fixing a work; and a wire wiring means for bonding a magnetic head slider and a suspension of the work to each other.
  • a first wire bonding is provided on a first connection terminal circuit pattern of the magnetic head slider, and the first wire bonding includes the first connection terminal circuit pattern and a second connection terminal circuit pattern on the suspension.
  • the workpiece is rotated 90 degrees around the intersection on a vertical line on each surface as a center of rotation, and a second wire bonding is provided on the second connection terminal circuit pattern to enable wire wiring. It features a child.
  • Another configuration of the apparatus for assembling a magnetic head assembly includes a fixing means for fixing a magnetic head slider, and a metal tape used for a discard pad positioned on the same plane as a magnetic element surface of the magnetic head slider.
  • a magnetic head assembly assembling device comprising: a positioning means for causing the magnetic tape to wind up the metal tape; and a circuit connection terminal pattern of a magnetic head slider on the fixing means and the positioned metal mold. Wire bonding means for bonding between the discard pads of the attached tape; cutting means for cutting the bonding wire between the pattern and the discard pad; and fixing means with the magnetic head slider fixed.
  • Rotating means for rotating the magnetic head slider by 90 degrees around an intersection line between the magnetic head slider surface and the discard pad surface It is characterized in that it comprises a bonding means for ⁇ edge-bonding and the other end of the wire which is a bonding on the circuit connection terminal pattern of the suspension.
  • the configuration of the magnetic disk drive according to the present invention includes at least one rotating disk having concentric data tracks containing information mounted on a housing, and a magnetic head for reading or writing data from the data tracks.
  • a magnetic head for reading or writing data from the data tracks.
  • the magnetic head assembly according to claim 1 A magnetic head assembly according to any one of claims 5 to 10 is characterized.
  • a magnetic head assembly comprising a magnetic head slider and a suspension, wherein a connection of a thin film magnetic transducer surface of the magnetic head slider is provided.
  • the suspension is provided with the flexure function portion, the connection terminal circuit pattern of the suspension and the magnetic head slider do not relatively move, so that the suspension can be connected to the magnetic head slider without being deformed.
  • the conductive wire expands and contracts and absorbs a change in the distance between the connecting portions due to a difference in linear expansion between the magnetic head slider and the suspension, the stress is not applied to the magnetic head slider. It can be connected to the head slider without deformation.
  • the stress due to the difference in linear expansion between the magnetic head slider and the suspension is determined by the longitudinal elastic modulus of the conductive wire, so that the stress can be reduced.
  • the conductive wire is connected with a slack, the stress due to a difference in linear expansion between the magnetic head slider and the suspension is reduced by the conductive force. Since the stress is determined by the bending elastic modulus of the wire, the stress can be reduced.
  • the vibration of the suspension can be reduced by setting the circuit connection terminal pattern of the suspension closer to the magnetic head slider than the flexure function part. Since there is no change in the distance between the joints due to vibration, the conductive wire is not deformed.
  • the magnetic head slider when the magnetic head slider travels while flying above the magnetic disk, the magnetic head slider applies a force in a direction to press the magnetic head slider against the magnetic disk, and the magnetic head slider is moved between the floating surface and the magnetic disk. Apply force in the direction of floating with the air cushion between the disk and the other side. Therefore, the irregularities and runout of the magnetic disk are absorbed by the flexure function of the suspension, and there is no cutting of the wire or deformation of the magnetic head slider.
  • the magnetic head assembly according to the above can be assembled in a thin film process for assembling a magnetic head element, and at low cost. I can make it.
  • the first wire bonding is performed on the circuit connection terminal pattern on the surface of the magnetic conversion element, and the second wiring is mounted on the suspension.
  • Wire bonding, and a wire with looseness between them can be formed, and the intersection point on the vertical line of each bonding is set as the center of rotation, so if the position of the first wire bonding is determined, The position of the second wire bonding can be determined.
  • FIG. 1 is a perspective view of a main part of a magnetic head assembly according to the present invention
  • FIG. 2 is a schematic explanatory view of a manufacturing apparatus of the magnetic head assembly of FIG. 1
  • FIG. FIG. 2 is an explanatory view of a bonding connection in the magnetic head assembly manufacturing apparatus of FIG. 2
  • FIG. 4 is an enlarged view of a bonding connection portion of FIG. 3
  • FIG. 5 is a drawing of FIG.
  • FIG. 6 is a diagram showing the amount of deformation of the air bearing surface due to bonding
  • FIG. 6 is a perspective view of a main part of a magnetic head assembly according to another embodiment of the present invention
  • FIG. FIG. 8 is an enlarged view of a bonding connection portion of the head assembly.
  • FIG. 1 is a perspective view of a main part of a magnetic head assembly according to the present invention
  • FIG. 2 is a schematic explanatory view of a manufacturing apparatus of the magnetic head assembly of FIG. 1
  • FIG. 2 is an explanatory
  • FIG. 8 is a structural view of a rotating jig of an assembling apparatus used for bonding the magnetic head assembly of FIG. 6, and FIG. FIG. 8 is an explanatory view of bonding by a rotating jig of the assembling apparatus shown in FIG. 8;
  • Fig. 11 is a model diagram of a head slider that is a simple beam.
  • 13 is a perspective view of a conventional magnetic head assembly, and FIG. 14 is a perspective view of a conventional magnetic head assembly;
  • FIG. 13 is a magnetic head assembly of the magnetic head assembly of FIG.
  • FIG. 15 is an enlarged view of a slider.
  • FIG. 15 is a perspective view of a conventional magnetic head assembly of a composite structure.
  • FIG. 16 is a perspective view of the magnetic head assembly shown in FIG. FIG.
  • FIG. 17 is an enlarged view of an electric connection portion
  • FIG. 17 is a perspective view showing a non-floating surface of the magnetic head slider shown in FIG. 15, and
  • FIG. 18 is a magnetic head shown in FIG.
  • FIG. 19 is an enlarged view of another example of the electrical connection part of the assembly
  • FIG. FIG. 20 is a diagram showing a convex shape ⁇ shape amount when a solder is used
  • FIG. 20 is a diagram showing a convex shape deformation amount when a conductive adhesive (silver epoxy resin) is used. .
  • Embodiments of the present invention will be described with reference to FIGS. 1 to 12.
  • a description will be given of a magnetic head assembly that presses a floating surface against a lower surface of a magnetic disk surface.
  • FIG. 1 is a perspective view of a main part of a magnetic head assembly according to the present invention, in which (a) is a perspective view showing a state before assembling, and (b) is a partially enlarged view after assembling.
  • the same reference numerals as those in FIG. 15 denote the same parts, and a description thereof will be omitted, and only new reference numerals will be described.
  • A is the both sides of the tip of the suspension 14
  • B is the center of the tip of the suspension 14
  • C is the inner garden of the tip of the suspension 14
  • 40 is a connection terminal circuit pattern with the magnetic disk main body
  • Reference numeral 41 denotes a connection terminal circuit pattern with the magnetic head slider 11.
  • an electric lead 31 which is a patterned wiring on the upper surface of a metallic suspension 14 and a magnetic disk main body (not shown) at one end.
  • a connection terminal circuit pattern 40 for electrical connection (hereinafter referred to as the magnetic disk side) and another inner end portion C at one end of the terminal C are connection terminals for electrical connection to the magnetic head slider 11.
  • a circuit pattern 41 (hereinafter referred to as a distal end side) is provided, and the electric lead 31 connects the two connection terminal circuit patterns 40 and 41.
  • connection terminal circuit patterns 40 and 41 are, for example, vapor-deposited or fitted with gold or the like, the surface thereof is exposed, and the other portions are covered with an insulating layer.
  • the suspension 14 drives the magnetic head slider 11 by its panel force.
  • a pressing force is generated to press the magnetic disk surface (not shown), and when the magnetic head slider 11 travels on the magnetic disk surface, an air cushion is formed between both surfaces. With this air cushion, the magnetic head slider 11 travels while floating.
  • the deflection angle in the circumferential direction of the disk is absorbed by both side portions A at the front end side of the suspension 14 and the deflection in the direction perpendicular to the traveling direction.
  • the angle is absorbed at the center B on the distal end side of the suspension 14.
  • the tip side inner court part C of the suspension 14 moves in the same manner as the magnetic head slider 11, and its position does not change relatively. In other words, it works the same as the flexure 18 of the prior art.
  • the magnetic head slider 11 will be described in detail with reference to FIG. 1 (b).
  • the magnetic head slider 11 is formed by forming a wafer from a material such as silicon carbide, alumina, or alumina titanium carbide as a base material, and forming a thin film magnetic layer on the wafer in the same process as the IC manufacturing process.
  • the conversion element 13 and a connection terminal circuit pattern 15 for electrical connection with the thin-film magnetic conversion element 13 on the same plane as the thin-film magnetic conversion element 13 (hereinafter, simply referred to as a magnetic head element surface). are formed in four places.
  • the thin-film magnetic transducer 13 and the connection terminal circuit pattern 15 are simultaneously formed in a plurality (approximately 100 or more).
  • the wafer including the plurality of thin-film magnetic transducers 13 and the connection terminal circuit patterns 55 is formed so as to include the thin-film magnetic transducers ⁇ 13 and the four connection terminal circuit patterns 515.
  • cutting is performed so as to form one rectangular member on a surface orthogonal to the magnetic head element surface. Two surfaces of a rectangular member continuous with the cut surface and orthogonal to the magnetic head element surface are polished as a floating surface 19 and an anti-floating surface 33, respectively.
  • the floating surface 1 9 In order to improve the characteristics, minute irregularities are formed by sputtering or the like.
  • the magnetic head of this embodiment uses alumina titanium carpite as a base material.
  • the front surface of the magnetic head element surface has a width of about lm ni. It has a height of 0.3 mm and a length of 11.2 mm.
  • the width of one of the circuit connection patterns 1'5 on the magnetic head element surface is about 130.
  • the anti-floating surface 33 is arranged such that the magnetic head element surface is orthogonal to the tip inner yard C of the suspension 14 and parallel to the tip end side. It is fixed to the inner courtyard C with adhesive.
  • connection terminal circuit pattern 15 and the connection terminal circuit pattern 41 are connected to each other by a gold wire 43 so that the connection terminal circuit pattern 15 is first bonded.
  • 1 is the second bonding, which is connected in the air.
  • the aerial connection line is arranged so as to change its direction at a right angle, with each vertical axis intersection of the connection terminal circuit pattern 15 and the connection terminal circuit pattern 41 as a bending point.
  • the thickness of the gold wire used for the connection is 25 m in diameter.
  • FIG. 2 illustrates an apparatus for assembling the magnetic head assembly of FIG.
  • the assembling apparatus shown in FIG. 2 includes a rotating jig on the left side of the figure, a pole bonding apparatus on the right side of the figure, and a common base.
  • reference numeral 44 denotes a rotary actuator for rotational driving
  • 50 denotes a member in which a magnetic head slider 11 is mounted on a suspension 14. 7
  • Reference numeral 51 denotes a fixed block for fixing the work 50
  • 52 denotes a rotating block
  • 59 denotes a mounting base
  • D denotes a rotation center axis of the rotary actuator 44.
  • 53 is an ultrasonic pole bonding portion
  • 54 is a horn
  • 55 is a gold wire of a bonding material
  • 56 is a spool
  • 57 is a cabillary
  • 58 is a lever.
  • the work 50 is fixed to the work fixing block 51 by vacuum suction or a fixing claw (neither is shown in detail).
  • a fixing claw either is shown in detail.
  • the connection terminal circuit pattern 15 of the magnetic head slider 11 is located upward.
  • the work fixing block 51 is fixed to a rotation block 52, and the rotation block 52 is connected to a rotary actuator 44.
  • the rotary actuator 44 rotates the rotary block 52 90 degrees about a rotation center axis D.
  • the work fixing block 5: 1 is provided with a heating means (not shown) for heating to about 150 ° C. Further, a mounting base 59 is provided on the rotating block 52.
  • the rotating jig thus configured is fixed to a mounting frame 59, and is fixed to a common frame 60 for the mounting frame 59 and the ultrasonic pole bonding portion 53.
  • the ultrasonic pole bonding portion 53 is a general device, and transmits vibration from an ultrasonic vibrator (not shown) in the upward direction of the work 50.
  • Horn 54 is arranged. At the tip of the horn 54, a capillary 57 is located.
  • the gold wire 55 of the bonding material is introduced from the spool 56 into the cavity 57.
  • the horn 54 is configured to move up and down by a lever 58 provided below the pole bonding portion 53.
  • FIG. 3 is an explanatory view of bonding connection by the assembling apparatus of FIG.
  • the same reference numerals as those in FIGS. 1 and 2 denote the same parts, and a detailed description thereof will be omitted.
  • connection terminal circuit pattern 15 is positioned upward as described above.
  • the held capillaries 57 are lowered, and the first bonding is performed on the connection terminal circuit pattern 15.
  • the lowered cable carrier 57 is raised to extend the bonding wire.
  • the bonding position of the connection terminal circuit pattern 15 and the suspension 14 The work 50 is rotated 90 degrees around the intersection with the bonding position of the connection terminal circuit pattern 41 on the tip side.
  • the cable carrier 57 is lowered again, and the second bonding is performed on the surrounding terminal circuit pattern 41.
  • connection terminal circuit pattern 15 and the connection terminal circuit pattern 41 on the suspension 14 are electrically connected.
  • FIG. 4 is an enlarged view of the bonding connection according to FIG.
  • Reference numeral 32 denotes a stainless steel plate base
  • reference numeral 34 denotes an insulating layer
  • reference numeral 38 denotes an adhesive.
  • the suspension 14 is composed of a stainless steel plate base 32, and the magnetic head slider 11 is fixed to the base 32 with an adhesive 38 via an insulating layer 34.
  • connection terminal circuit pattern 15 of the magnetic head slider 11 is used as a first bonding
  • connection terminal circuit pattern 41 on the distal end side of the suspension 14 is used as a second bonding
  • gold wires 43 are used.
  • the two patterns 15 and 41 are connected.
  • the path of the gold wire 43 is drawn out from the first bonding so as to be orthogonal to the magnetic head element surface, and is bent at a right angle so as to be orthogonal to the connection terminal circuit pattern 41 on the way.
  • the bonding has been completed and the above connection has been completed.
  • FIG. 5 is a diagram showing the amount of deformation of the flying surface due to the bonding of FIG.
  • FIG. 5 shows the deformation amount (nm) of the air bearing surface before and after connection on the vertical axis, and the deformation amount can be suppressed to 5 nm or less, which is not a problem.
  • the terminal circuit pattern 4 1 on the tip of the suspension 14 4 is magnetic Since it is the same as on a flexible member that does not move with the head slider 11, no stress is applied to the gold wire 43.
  • this bonding method can be connected at room temperature to 15 (low TC level), so it does not apply thermal stress to the magnetic head.
  • the magnetic head element surface and the connection terminal circuit pattern 15 Therefore, it can be manufactured using only the same process as the IC process, so it is inexpensive.
  • FIG. 6 is a perspective view of a main part of a magnetic head assembly according to another embodiment of the present invention
  • FIG. 7 is an enlarged view of a bonding connection portion of the magnetic head assembly of FIG. 1 are the same as those in FIG. Only new codes will be described.
  • 6 1 is an aluminum wire.
  • the structure of the work 50 including the magnetic head slider 11 and the suspension 14 is almost the same as that of [Example 1] in FIG.
  • the aluminum wire 61 is edge-bonded to the same plane as the connection terminal circuit pattern 15 of the magnetic head slider 11, that is, the edge bonding is performed on the magnetic head element surface, and the aluminum wire 61 is formed on the wiring pattern 41 of the suspension 14.
  • Edge bonding is performed, and an arc shape with a radius of curvature having both points of the connection terminal circuit pattern 15 and the connection terminal circuit pattern 41 as tangent lines is maintained.
  • FIG. 8 is a structural view of a rotating jig of an assembly apparatus used for bonding the magnetic head assembly of FIG.
  • 1 1 is a magnetic head
  • 6 2 is a lower block
  • 6 3 is an upper holding block
  • 6 4 is a rotary actuator
  • 6 5 is a stand block
  • 6 6 is gold-plated tape
  • 6 7 is a take-up reel
  • 68 is a ⁇ edge tool
  • 69 is a 7 Lumi wire
  • 70 is a wire cutter.
  • the lower block 62 has a rectangular shape, and is an oblique cross section from one upper side of one surface in the longitudinal direction of the rectangular shape to a predetermined position below the facing surface. Is provided.
  • the gantry block 65 has a shape in which a quadrangular pyramid protrudes from one surface in the longitudinal direction of the rectangular parallelepiped, the upper surface of the rectangular pyramid is continuous with the upper surface of the rectangular solid, and the side surface of the rectangular pyramid is It is configured to be continuous with each of the other two surfaces of the rectangular body orthogonal to the surface on which the quadrangular pyramid is protruded.
  • the slope of the quadrangular pyramid is formed from the upper surface of the rectangular body to a predetermined position of the quadrangular pyramid protruding surface in the longitudinal direction of the rectangular body.
  • the oblique section of the lower block 62 and the upright surface connected thereto come into contact with the inclined surface of the quadrangular pyramid protruding from the gantry block 65 and the upright surface connected thereto.
  • the magnetic head slider 11 is fixed by one surface in the longitudinal direction of the lower block 62 and the upper holding block 63 so that the magnetic element surface faces upward.
  • the lower block 62 and the upper holding block 63 have a structure that can be rotated 90 degrees with respect to the gantry block 65 by a rotary actuator 64 while holding the magnetic head slider 11. I have.
  • a tape 66 that is gold-plated is positioned in parallel with the magnetic head slider 11, and is wound on a take-up reel 67. Further, this rotating jig is attached to a common mount (not shown) together with an ultrasonic bonder (not shown) to form an assembling apparatus.
  • an edge tool 68, an aluminum wire 69, and a cutter 70 for cutting the wire 69 are provided on the magnetic element surface of the magnetic head slider 11 described above. Position at right angles to Have been.
  • FIG. 9 is an explanatory view of bonding by a rotating jig of the assembling apparatus of FIG.
  • FIG. 9 is a view of the rotary odor of the assembling apparatus shown in FIG. 8 as viewed from the direction of the arrow shown in the drawing.
  • the magnetic head slider 11 has the lower block 6 2 and the upper holding block 6 3.
  • the upper holding block 63 is omitted for simplicity of illustration.
  • connection between the circuit pattern 15 of the magnetic head slider 11 and the gold-plated tape 66 is made with aluminum wire 69 as a bonding material and with an edge tool 68. Ultrasonic bonding. The bonded gold-plated tape 66 is later discarded as a discard pad.
  • connection step is performed for all of the connection terminal circuit patterns 15 of the magnetic head slider 11. In this embodiment, there are four places.
  • the gold-plated tape 66 which is a discard pad, is wound around the take-up reel 67. With this winding, the aluminum wire portion on the second bonding side bonded to the discard pad is also wound on the winding reel 67.
  • the lower block 62 is connected to the mounting block 65 by the connection terminal circuit of the magnetic head slider 11 Rotate 90 degrees around the side of the gold-plated tape 66 of pattern 15. With this rotation, the aluminum wire 69 is bent 90 ° and plastically deformed.
  • FIG. 9 (d) when the magnetic head slider 11 is removed from the bonding apparatus in this state, the aluminum wire 69 is bonded on one side to the terminal pattern 15 of the magnetic head slider 11, 90 degrees bent Take out as a single item in a bent state.
  • the aluminum wire 69 is positioned such that one end of the aluminum wire 69 is placed on the connection terminal circuit pattern 41 on the suspension 14 in a state of this single piece, and is bonded. Fix with agent 38.
  • connection terminal circuit pattern 41 of the suspension 14 with the ⁇ edge tool 68 is again performed from above the connection terminal circuit pattern 41 of the suspension 14 with the ⁇ edge tool 68.
  • an aluminum wire is used, but a gold wire, a copper wire, or a wire gold-plated to copper can be similarly connected.
  • the flying surface 19 of the magnetic head slider 11 travels while flying above the surface of the magnetic disk via the air cushion, and the flying amount is also referred to as a number ⁇ . Therefore, the surface accuracy of this air bearing surface is required to be very high.
  • the flying surface is required to have high accuracy.
  • changes in surface accuracy due to environmental changes due to changes in temperature, temperature, etc. after assembly and adjustment must be minimized.
  • FIG. 10 is a model diagram in which the magnetic head slider is a simple beam.
  • (a) is a side view of a magnetic head beam
  • (b) is a cross-sectional view of a magnetic head simple beam.
  • b is head beam width to the magnetic, specifically 1/1 0 3 (mm)
  • h is head beam height to magnetic, in particular 3 1 0 4 (mm)
  • L is , the length of Uz de beams to magnetic, specifically 1. 2Z10 3 (mm)
  • E is Young's modulus of the magnetic head support, 40 X 1 0 1. (Poisson's ratio)
  • the allowable amount of deflection Y of the magnetic head is 5 nm
  • the load W N, Newton
  • the load W must not be applied with a force greater than 1Z10 1 , that is, 0.125 (N).
  • FIG. 11 is a model diagram of a wire wiring without slack in bonding of a magnetic head slider.
  • 71 is a magnetic head slider
  • 72 is a suspension
  • 73 is a wire
  • 74 is an adhesive
  • c is the length of the wire 73 in the longitudinal direction of the support plate panel 2
  • d Is the vertical length of the wire 73 to the support panel 72.
  • the linear expansion coefficient of each part will differ due to environmental temperature changes, so a tensile or compressive force will be applied to the wire 73, and a force in the direction perpendicular to the magnetic head 71, that is, the load W This affects the shape accuracy of the air bearing surface of the magnetic head 71.
  • the elastic coefficient and linear expansion coefficient of each material are shown in [Table 1].
  • the magnetic head slider 71 and the suspension 72 are made of alumina titanium carbide, stainless steel, and the wire 73 is made of gold, copper, and aluminum.
  • environmental temperature difference 6 0 ° C, load W is, 1 Z 1 0 1 (N)
  • the allowable amount of deflection change amount Y and 5 nm follow the above [equation 1]
  • the diameter of the wire 7 3 Calculated.
  • I in [Equation 1] is as follows.
  • the calculation shows that the diameter is 67 ⁇ for gold, 39 ⁇ for copper, and 29 for aluminum.
  • FIG. 12 is a model diagram of wire wiring having slack in bonding of a magnetic head slider.
  • the wire wiring shown in FIG. 12 (a) can be approximated to a tough beam as shown in FIG. 12 (b).
  • the magnetic head slider and the connection terminal circuits respectively provided on the suspension positioned at right angles to the magnetic head slider
  • the pattern is wired with conductive wires to absorb expansion and contraction, and the connection terminal circuit pattern on the suspension is positioned on a member with a flexure function, so that electrical connection can be made without applying stress to the magnetic head slider
  • the amount of deformation of the wiring wire due to the stress on the magnetic head slider caused by the difference in the linear expansion coefficient due to the temperature change is reduced, and no thermal stress is applied because bonding is performed at a low temperature. Since it can be manufactured in the same process as the IC process, an inexpensive magnetic head assembly, an assembling method, an assembling apparatus, and a magnetic disk device can be provided.

Landscapes

  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)

Abstract

L'invention a pour objet de fournir un ensemble de tête magnétique économique du type dans lequel un curseur de tête magnétique et une suspension sont connectés par des fils conducteurs, de manière à absorber les phénomènes d'extension et de contraction. Un élément (50) est constitué à partir d'un curseur (11) de tête magnétique pourvu d'un circuit (15) de borne de connexion, et d'une suspension (14) pourvue d'un câblage (31) et d'un circuit (41) de borne de connexion. Les deux circuits de bornes de connexion sont connectés par des soudages de connexion et des parties flexibles A et B sont disposées au niveau d'une partie de la suspension (14), de sorte que les câblages (43) entre les deux circuits (15 et 41) de bornes de connexion absorbent l'extension et la contraction des câblages (43).
PCT/JP1996/001280 1995-05-16 1996-05-15 Ensemble de tete magnetique, assemblage pour cette derniere, appareil d'assemblage et disque magnetique WO1996036964A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7/116960 1995-05-16
JP11696095A JPH08315343A (ja) 1995-05-16 1995-05-16 磁気ヘッド組立体およびその組立方法及びその組立装置並びに磁気ディスク装置

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WO1996036964A1 true WO1996036964A1 (fr) 1996-11-21

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WO (1) WO1996036964A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7301731B2 (en) 2002-06-18 2007-11-27 Fujitsu Limited Head assembly having microactuator

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3532439B2 (ja) * 1999-03-02 2004-05-31 アルプス電気株式会社 磁気ヘッド

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63113917A (ja) * 1986-10-28 1988-05-18 インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション デ−タ記録ディスク・ファイルのためのスライダ−サスペンション組立体
JPH02139708A (ja) * 1988-11-19 1990-05-29 Nippon B T Ee Kk 磁気ヘッドリードワイヤ止着装置
JPH05282642A (ja) * 1992-04-02 1993-10-29 Sony Corp 磁気ディスク装置
JPH0729341A (ja) * 1993-07-12 1995-01-31 Hitachi Ltd 回転円板記憶装置及びそのヘッドサスペンション
JPH07220258A (ja) * 1993-03-31 1995-08-18 Hitachi Ltd 磁気ヘッド組立体及び磁気ディスク装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63113917A (ja) * 1986-10-28 1988-05-18 インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション デ−タ記録ディスク・ファイルのためのスライダ−サスペンション組立体
JPH02139708A (ja) * 1988-11-19 1990-05-29 Nippon B T Ee Kk 磁気ヘッドリードワイヤ止着装置
JPH05282642A (ja) * 1992-04-02 1993-10-29 Sony Corp 磁気ディスク装置
JPH07220258A (ja) * 1993-03-31 1995-08-18 Hitachi Ltd 磁気ヘッド組立体及び磁気ディスク装置
JPH0729341A (ja) * 1993-07-12 1995-01-31 Hitachi Ltd 回転円板記憶装置及びそのヘッドサスペンション

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7301731B2 (en) 2002-06-18 2007-11-27 Fujitsu Limited Head assembly having microactuator

Also Published As

Publication number Publication date
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