WO1996019314A1 - Metal de brasage et son utilisation pour realiser une jonction par brasage entre deux objets - Google Patents

Metal de brasage et son utilisation pour realiser une jonction par brasage entre deux objets Download PDF

Info

Publication number
WO1996019314A1
WO1996019314A1 PCT/DE1995/001742 DE9501742W WO9619314A1 WO 1996019314 A1 WO1996019314 A1 WO 1996019314A1 DE 9501742 W DE9501742 W DE 9501742W WO 9619314 A1 WO9619314 A1 WO 9619314A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal component
metal
component
solder
melting point
Prior art date
Application number
PCT/DE1995/001742
Other languages
German (de)
English (en)
Inventor
Holger HÜBNER
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1996019314A1 publication Critical patent/WO1996019314A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3033—Ni as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3053—Fe as the principal constituent
    • B23K35/3093—Fe as the principal constituent with other elements as next major constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • connections with a higher melting temperature above 450 ° C can be realized with hard solders.
  • the processing temperatures at which the braze melts and alloys with the parts to be joined are in the range of the melting point of the braze. This also eliminates this possibility if the connection has to be implemented in a temperature-sensitive environment. When using high temperatures comes structural changes and thus a weakening of the parts to be connected.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un métal de brasage qui comprend plusieurs constituants: un premier métal (1), un second métal (2) et une charge (3), le premier métal (1) ayant un point de fusion plus élevé que le second métal (2). A une température de traitement inférieure au point de fusion du premier métal (1), le premier métal (1) et le second métal (2) fondu forment une phase intermétallique (4) dont le point de fusion est supérieur à la température de traitement. La charge (3) peut être imprégnée par le second métal (2) liquide et est sensiblement insoluble à la température de traitement. Le métal de brasage s'utilise pour réaliser une jonction par brasage entre deux objets. A une température de l'ordre du point de fusion du second métal (2), la jonction par brasage est effectuée par solidification isotherme sous forme de matrice provenant de la phase intermétallique (4), dans laquelle la charge (3) est incorporée pour former une surface intérieure.
PCT/DE1995/001742 1994-12-22 1995-12-05 Metal de brasage et son utilisation pour realiser une jonction par brasage entre deux objets WO1996019314A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4446068 1994-12-22
DEP4446068.6 1994-12-22

Publications (1)

Publication Number Publication Date
WO1996019314A1 true WO1996019314A1 (fr) 1996-06-27

Family

ID=6536773

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1995/001742 WO1996019314A1 (fr) 1994-12-22 1995-12-05 Metal de brasage et son utilisation pour realiser une jonction par brasage entre deux objets

Country Status (1)

Country Link
WO (1) WO1996019314A1 (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0981159A1 (fr) * 1998-08-18 2000-02-23 Siemens Building Technologies AG Procédé de fabrication de microconnections, système microélectronique, et détecteur d'infrarouge fabriqué selon ce procédé
WO2002020211A1 (fr) * 2000-09-07 2002-03-14 Infineon Techonologies Ag Brasure a utiliser dans des procedes de brasage par diffusion, et procede pour realiser des assemblages par brasage a l'aide de ladite brasure
DE10115482A1 (de) * 2001-03-29 2002-10-10 Fraunhofer Ges Forschung Lotzusammensetzung und Verfahren zur Herstellung desselben
WO2003066274A1 (fr) * 2002-02-06 2003-08-14 Endress + Hauser Gmbh + Co. Kg Materiau de brasage et joint brase
WO2003072487A2 (fr) * 2002-02-27 2003-09-04 Honeywell International Inc. Procede de metallisation de systemes microelectromecaniques (mems) et de dispositifs a base de mems
WO2003072288A1 (fr) * 2002-02-28 2003-09-04 Infineon Technologies Ag Connexion comportant un joint brase de diffusion et procede permettant de le produire
EP1600249A1 (fr) * 2004-05-27 2005-11-30 Koninklijke Philips Electronics N.V. Composition de soudure et méthode de fabriquer un raccordement de soudure
WO2007101799A2 (fr) * 2006-03-03 2007-09-13 Deutsches Zentrum für Luft- und Raumfahrt e.V. Matériau composite métal-aérogel
WO2008095531A1 (fr) * 2007-02-06 2008-08-14 Siemens Aktiengesellschaft Composition de brasure et procédé de brasage fort pour super-alliages
DE102009054068A1 (de) * 2009-11-20 2011-05-26 Epcos Ag Lotmaterial zur Befestigung einer Außenelektrode bei einem piezoelektrischen Bauelement und piezoelektrisches Bauelement mit einem Lotmaterial
EP2423160A1 (fr) * 2010-08-31 2012-02-29 Commissariat à l'Énergie Atomique et aux Énergies Alternatives Assemblage d'objets par l'intermediaire d'un cordon de scellement comportant des composes intermetalliques
DE102017004626A1 (de) * 2017-05-15 2018-11-15 Pfarr Stanztechnik Gmbh Bleifreie Lötfolie zum Diffusionslöten

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2202860A (en) * 1987-03-25 1988-10-05 Tdk Corp Solder composition
DE3740773A1 (de) * 1987-12-02 1989-06-15 Philips Patentverwaltung Verfahren zum herstellen elektrisch leitender verbindungen
US4863090A (en) * 1988-10-17 1989-09-05 Hughes Aircraft Company Room temperature attachment method employing a mercury-gold amalgam
US5053195A (en) * 1989-07-19 1991-10-01 Microelectronics And Computer Technology Corp. Bonding amalgam and method of making
DE4301728A1 (en) * 1992-01-22 1993-07-29 Hitachi Ltd Printed circuit board used in electronic switches - comprises solder contact metal layer contg. two metals
FR2706139A1 (fr) * 1993-06-08 1994-12-16 Thomson Csf Matériau pour brasure.

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2202860A (en) * 1987-03-25 1988-10-05 Tdk Corp Solder composition
DE3740773A1 (de) * 1987-12-02 1989-06-15 Philips Patentverwaltung Verfahren zum herstellen elektrisch leitender verbindungen
US4863090A (en) * 1988-10-17 1989-09-05 Hughes Aircraft Company Room temperature attachment method employing a mercury-gold amalgam
US5053195A (en) * 1989-07-19 1991-10-01 Microelectronics And Computer Technology Corp. Bonding amalgam and method of making
DE4301728A1 (en) * 1992-01-22 1993-07-29 Hitachi Ltd Printed circuit board used in electronic switches - comprises solder contact metal layer contg. two metals
FR2706139A1 (fr) * 1993-06-08 1994-12-16 Thomson Csf Matériau pour brasure.

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
C.A. MACKAY: "Amalgams for Improved Electronics Interconnection", IEEE MICRO, vol. 13, no. 2, NEW YORK US, pages 46 - 58, XP000355418 *

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0981159A1 (fr) * 1998-08-18 2000-02-23 Siemens Building Technologies AG Procédé de fabrication de microconnections, système microélectronique, et détecteur d'infrarouge fabriqué selon ce procédé
US6872464B2 (en) 2000-09-07 2005-03-29 Infineon Technologies Ag Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agent
WO2002020211A1 (fr) * 2000-09-07 2002-03-14 Infineon Techonologies Ag Brasure a utiliser dans des procedes de brasage par diffusion, et procede pour realiser des assemblages par brasage a l'aide de ladite brasure
DE10115482A1 (de) * 2001-03-29 2002-10-10 Fraunhofer Ges Forschung Lotzusammensetzung und Verfahren zur Herstellung desselben
WO2003066274A1 (fr) * 2002-02-06 2003-08-14 Endress + Hauser Gmbh + Co. Kg Materiau de brasage et joint brase
WO2003072487A2 (fr) * 2002-02-27 2003-09-04 Honeywell International Inc. Procede de metallisation de systemes microelectromecaniques (mems) et de dispositifs a base de mems
WO2003072487A3 (fr) * 2002-02-27 2004-04-15 Honeywell Int Inc Procede de metallisation de systemes microelectromecaniques (mems) et de dispositifs a base de mems
US6793829B2 (en) 2002-02-27 2004-09-21 Honeywell International Inc. Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices
US7132721B2 (en) 2002-02-27 2006-11-07 Honeywell International, Inc. Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices
WO2003072288A1 (fr) * 2002-02-28 2003-09-04 Infineon Technologies Ag Connexion comportant un joint brase de diffusion et procede permettant de le produire
DE10208635B4 (de) * 2002-02-28 2010-09-16 Infineon Technologies Ag Diffusionslotstelle, Verbund aus zwei über eine Diffusionslotstelle verbundenen Teilen und Verfahren zur Herstellung der Diffusionslotstelle
US7368824B2 (en) 2002-02-28 2008-05-06 Infineon Technologies Ag Diffusion solder position, and process for producing it
EP1600249A1 (fr) * 2004-05-27 2005-11-30 Koninklijke Philips Electronics N.V. Composition de soudure et méthode de fabriquer un raccordement de soudure
WO2005115679A1 (fr) * 2004-05-27 2005-12-08 Koninklijke Philips Electronics N.V. Composition de brasure tendre et procede de conception d'une connexion soudee
US9943930B2 (en) 2004-05-27 2018-04-17 Koninklijke Philips N.V. Composition of a solder, and method of manufacturing a solder connection
US9095933B2 (en) 2004-05-27 2015-08-04 Koninklijke Philips N.V. Composition of a solder, and method of manufacturing a solder connection
US8298680B2 (en) 2004-05-27 2012-10-30 Koninklijke Philips Electronics N.V. Composition of a solder, and method of manufacturing a solder connection
WO2007101799A3 (fr) * 2006-03-03 2008-03-13 Deutsch Zentr Luft & Raumfahrt Matériau composite métal-aérogel
DE102006009917B4 (de) * 2006-03-03 2014-04-10 Deutsches Zentrum für Luft- und Raumfahrt e.V. Metall-Aerogel-Metallschaum-Verbundwerkstoff
DE102006009917A1 (de) * 2006-03-03 2008-01-17 Deutsches Zentrum für Luft- und Raumfahrt e.V. Metall-Aerogel-Verbundwerkstoff
WO2007101799A2 (fr) * 2006-03-03 2007-09-13 Deutsches Zentrum für Luft- und Raumfahrt e.V. Matériau composite métal-aérogel
US7946471B2 (en) 2007-02-06 2011-05-24 Siemens Aktiengesellschaft Brazing composition and brazing method for superalloys
WO2008095531A1 (fr) * 2007-02-06 2008-08-14 Siemens Aktiengesellschaft Composition de brasure et procédé de brasage fort pour super-alliages
DE102009054068A1 (de) * 2009-11-20 2011-05-26 Epcos Ag Lotmaterial zur Befestigung einer Außenelektrode bei einem piezoelektrischen Bauelement und piezoelektrisches Bauelement mit einem Lotmaterial
US8823245B2 (en) 2009-11-20 2014-09-02 Epcos Ag Solder material for fastening an outer electrode on a piezoelectric component and piezoelectric component comprising a solder material
EP2423160A1 (fr) * 2010-08-31 2012-02-29 Commissariat à l'Énergie Atomique et aux Énergies Alternatives Assemblage d'objets par l'intermediaire d'un cordon de scellement comportant des composes intermetalliques
FR2964094A1 (fr) * 2010-08-31 2012-03-02 Commissariat Energie Atomique Assemblage d'objets par l'intermediaire d'un cordon de scellement comportant des composes intermetalliques
US9181088B2 (en) 2010-08-31 2015-11-10 Commissariat A L'energie Atomique Et Aux Energies Alternatives Objects assembly through a sealing bead including intermetallic compounds
DE102017004626A1 (de) * 2017-05-15 2018-11-15 Pfarr Stanztechnik Gmbh Bleifreie Lötfolie zum Diffusionslöten
WO2018210361A1 (fr) 2017-05-15 2018-11-22 Pfarr Stanztechnik Gmbh Feuille de brasage sans plomb destinée au brasage-diffusion et son procédé de fabrication

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