WO1995017993A1 - Procede et appareil de production continue d'une multiplicite de types d'articles - Google Patents

Procede et appareil de production continue d'une multiplicite de types d'articles Download PDF

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Publication number
WO1995017993A1
WO1995017993A1 PCT/JP1994/002210 JP9402210W WO9517993A1 WO 1995017993 A1 WO1995017993 A1 WO 1995017993A1 JP 9402210 W JP9402210 W JP 9402210W WO 9517993 A1 WO9517993 A1 WO 9517993A1
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WO
WIPO (PCT)
Prior art keywords
work area
work
transfer system
processing
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP1994/002210
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English (en)
Japanese (ja)
Inventor
Yoichiro Tamoto
Sadao Shimoyashiro
Hiroyasu Sasaki
Takemasa Iwasaki
Masao Sakata
Tomoyuki Masui
Hiroyoshi Matsumura
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Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of WO1995017993A1 publication Critical patent/WO1995017993A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q41/00—Combinations or associations of metal-working machines not directed to a particular result according to classes B21, B23, or B24
    • B23Q41/02—Features relating to transfer of work between machines
    • H10P72/3216—
    • H10P72/0612—

Definitions

  • the present invention relates to a production and manufacturing system, and more particularly to a multi-product continuous production method and a multi-product continuous production method for realizing a suitable production system for a multi-product variable quantity production line having a long working process and a repetitive process. .
  • production lines for semiconductors and thin-film process products have, for example, processes for processing, transporting and storing workpieces (e-ha) as disclosed in Japanese Patent Application Laid-Open No. 56-196355.
  • the equipment was separated into a work area that requires a clean atmosphere, where equipment is installed, and a maintenance area that does not require a high degree of cleanliness, where ancillary equipment utilities are installed. Therefore, in order to arrange them efficiently, a structure called a pay system was adopted, in which a work area (pay) and a maintenance area were alternately provided on both sides of the central passage.
  • the processing equipment was arranged in a so-called job shop system in which equipment for performing the same kind of processing was arranged in one bay.
  • the wafer that has completed the process in this process is transported to the processing equipment in the next process by Bay transport and inter-pay transport, and is connected to the entrance and exit of the bay, which is the connection point.
  • the cassettes are transported between the processing devices, and the transport between the bays transports the cassettes from the stocking force of each bay to the stocking force of another bay.
  • the transfer of wafers from the processing apparatus to the processing apparatus was performed by a route such as a transport vehicle in a bay, a stocker, a transport vehicle between bays, a stocking force, and a transport vehicle in a bay.
  • the transport route between bays becomes complicated as shown in Fig. 19, and You will spend time on In FIG. 19, the zigzag solid line indicates the transport route of the wafer.
  • the state of the device in the preceding process and the device in the subsequent process cannot be known, it is difficult to synchronize the processing between the devices. As a result, the amount of work in progress for each bay increases, and as a result, there is a problem that the completion (time until the product is completed) becomes longer.
  • the time required for processing varies greatly depending on the processing step. For example, heat treatment for making the ion concentration distribution in the wafer uniform takes several hours, but the step of implanting ions in the wafer takes only several minutes. In order to make the tact the same in the flow line, If the processing time differs greatly, the idle time of the processing apparatus having a short processing time increases, and the operation rate decreases significantly. Furthermore, even if a single device can process multiple processes, since the devices are arranged in the order of processes, the number of devices required for each process is required, and there is a problem that the number of devices in the entire line increases. . ⁇
  • the present invention provides a method and apparatus for efficiently producing products of each type. Disclosure of the invention
  • the present invention has considered a method of producing a semiconductor like a flow line.
  • six means of 1) flow rectification, 2) module creation, 3) module grouping, 4) equipment arrangement method, 5) transport method and 6) control will be described.
  • Flow rectification We focused on the uniqueness of the flow of the process of repeating the same type of process in the same device as typified by semiconductor manufacturing (see Fig. 11).
  • Semiconductors are manufactured by laminating multiple layers of thin films. Each layer is formed in the order of film formation (diffusion process, deposition process) ⁇ circuit creation (photolithography process) ⁇ removal process (etching process). (This is called one cycle.) By repeating this cycle, thin layers are successively stacked. The flow of this process is rectified by the following procedure.
  • each process (diffusion process, photolithography process, etching process, etc.) always exists in each cycle unit, assuming the same flow, the classification shown in Fig. 12 is performed. In this case, the process that does not exist is the passing process.
  • Each layer shall consist of 11 steps of cleaning, diffusion, low pressure C VD, C VD, photolithography (coating, exposure, development), inbra, cleaning, etching, and removal. By the way, if cleaning, diffusion, CVD, and etching are not in the process flow (Fig. 11) as in layer 8, it is assumed that the process without them is passed.
  • Module creation A cycle unit of each layer is defined as a module.
  • Module grouping Here, the same process flow and the same equipment used in the process are grouped together. In this case, there are 4 groups of 15 modules.
  • Equipment arrangement Similar to the conventional job shop method, the same type of equipment is put together (Figs. 1 and 2), and the equipment is classified and arranged by module group (Fig. 5 Example) A combination arrangement method in which a certain module uses a job shop method and a certain module uses a module-by-module method (the example in FIG. 7) may be used.
  • Transport means Provide a dedicated transport system for each module group (Fig. 1, Fig. 2 Figure, example of Figure 5). However, if the module groups are similar, the transfer system may be shared (shared) (examples in FIGS. 4, 6, and 7). When the transport system is shared and used, control is performed so that a dedicated transport system for each module group exists. The following example is given as the similarity of the module group.
  • Control means Consists of the following three main means. 1) Means for determining between modules, 2) Means for transferring tact within a module, 3) Means for selecting a processing device. Means for determining between modules: Based on the unique processing (flow) of the product (semiconductor), determine which module to use and in which module order.
  • In-module tact transfer means A means for transferring each module within the product tact.
  • Processing device selection means Selects a device to use the conveyed product.
  • Figure 14 shows a simple flow of the product.
  • the manufacturing process is cut by a single flow to create a cycle.
  • a similar cycle is put together to create a module. This will rectify the flow of the traditionally complicated line and make it easier to control the flow.
  • the transport system since a buffer is provided for each module and the flow flows to the tact, the transport system does not control the overall process order but simply transports to the next process. Control becomes easy.
  • the product is transported from the processing area where the process was performed to an area where the next process is performed by a dedicated transport system that transports the product in the order of processes, and the next process is performed.
  • the dedicated transport path supplies products that have been processed at a fixed time interval (tact) to successive processes, so that products are supplied without interruption to each area, and products are processed at the same production speed in each processing area. Can be processed.
  • Fig. 15 shows a comparison between the conventional method (job shop method) and the example of the present invention (module device classification method 'partial module method'). According to the method of the present invention, the length can be shortened and the production variation is small as compared with the conventional method. This is due to module flow.
  • FIG. 1 is an overall configuration diagram of a first embodiment of the present invention
  • FIG. 2 is a second embodiment of the present invention, and shows a line configuration in which work areas are arranged in a processing order
  • FIG. 3 is a diagram of the present invention.
  • FIG. 3 is a diagram showing a line configuration using an arbitrary combination of transport paths according to a third embodiment.
  • FIG. 4 is a fourth embodiment of the present invention, which is a line using one transport path.
  • FIG. 5 is a view showing a configuration
  • FIG. 5 is a view showing a fifth embodiment of the present invention, and is a view showing a line configuration for performing continuous processing in an area.
  • FIG. 6 is a sixth embodiment of the present invention, showing a part of an area.
  • FIG. 1 is an overall configuration diagram of a first embodiment of the present invention
  • FIG. 2 is a second embodiment of the present invention, and shows a line configuration in which work areas are arranged in a processing order
  • FIG. 3 is a diagram of the
  • FIG. 7 is a diagram showing a line configuration as a single process
  • FIG. 7 is a diagram showing a seventh embodiment of the present invention, showing a line configuration by one transport path
  • FIG. 8 is a diagram showing a relationship between a process and the number of equipment.
  • FIG. 9 is a diagram showing a working procedure
  • FIG. 10 is a diagram of a communication form
  • FIG. 11 is a schematic diagram of a semiconductor manufacturing procedure (flow) diagram
  • FIG. 12 is a diagram of the flow of FIG. Classification division diagram
  • Fig. 13 is process rectification diagram
  • Fig. 14 is product flow diagram
  • Fig. 15 is comparison diagram of conventional technology and the present invention
  • Fig. 16 and Fig. 17 are the present invention
  • Fig. 18 is a Gantt chart of module production status
  • Fig. 19 is an explanatory diagram of the prior art.
  • FIG. 1 shows a layout of a semiconductor manufacturing apparatus, for example.
  • Each work area 6 includes a plurality of processing units 3 of the same type, and each processing apparatus 3 is connected by the transfer system 2 in the work area.
  • the transport system 2 in the work area is connected to a controller 7a in the work area via a communication cable 8.
  • An ID reader 11 is provided in the work area 6 to read a code attached to a product (a semiconductor wafer or a cassette for transporting a wafer) to be carried into the work area 6, and to read the code. Notify the controller 7a.
  • Each work area 6 is provided with an inter-transport system maintenance device 4 for carrying in and out the products to and from the work area, and the inter-transport system connecting device 4 is connected by an inter-work area transport system 5.
  • the transport system 5 between the rice II II areas is not fixed, and a dedicated transport system with the highest efficiency is constructed according to the processing form of the product.
  • FIG. 1 it is shown that six types of transport systems from transport system A to transport system F are prepared as the transport system 5 between work areas.
  • the host computer 1 controls each transport system via the inter-work area transport system controller 7d.
  • This device has two main functions. One is the process of cutting a flow into partial flows at the time of line design, combining the cut partial flows, and creating a flow line called a module in this unit. The other is a process that controls the progress of products for each module and controls transport during actual production so that production can be performed in tact. First, the procedure for line design will be described.
  • Figure 11 shows the schematic semiconductor manufacturing procedure (flow).
  • a semiconductor consisting of 15 layers is shown.
  • “Layer 1” cleaning, diffusion, low-pressure CVD (chemical vapor deposition), photolithography (exposure), etching, removal (resist) Removal).
  • the formation of such a layer is repeated 15 times to complete one semiconductor.
  • the results are shown in FIG.
  • the order of the steps is as follows: cleaning (for diffusion), diffusion, low-pressure CVD, photolithography, inbra (ion implantation), cleaning (for etching), etching, and removal.
  • the first cycle consists of the first and second layers (because there is no photolithography process).
  • the flow is cut like this, “Layer 2 cleaning” comes after “Layer 1 removal”, and the cleaning process (for diffusion) is duplicated. With such duplication of processes, this first cycle does not become a flow line. Therefore, the second layer is divided into the second cycle using the division rule (2).
  • the first layer consists of six steps: cleaning, diffusion, low-pressure CVD, photolithography, etching, and removal
  • the second layer consists of three steps: cleaning, diffusion, and impeller.
  • the process flow is cut and divided into first to fifteenth cycles.
  • the result of this division is stored in the module definition file.
  • cycles 1, 3, 6, and 11 can be categorized as module C, which consists of cleaning, diffusion, low pressure CVD, photolithography, etching, and removal.
  • module C which consists of cleaning, diffusion, low pressure CVD, photolithography, etching, and removal.
  • module name for each cycle is shown in the upper part of FIG.
  • This section describes the number of modules C and the buffer capacity.
  • the target production quantity is given. This is to determine the production volume produced by this production line in advance and set it as the target production volume.
  • module C handles four cycles. Number of cycles>
  • Fig. 18 shows the production status of this module in the form of a Gantt chart based on the obtained number of facilities.
  • the horizontal axis represents time (in the case of the figure, 36 minutes, which is one tick per tact)
  • the vertical axis represents the arrangement of processes, and the equipment for each process.
  • the first lot is processed for 77 minutes in the washing 1 facility and then stored in a buffer.
  • the cleaning process is performed in units of one unit
  • the diffusion process is performed in units of six lots. Therefore, a buffer is provided between the cleaning process and the diffusion process to temporarily store the lot.
  • the diffusion process and the low pressure CVD process are batch processes, 'Lots are not sent on time. However, if you think about 6 tacts (2 16 minutes), 6 lots will be sent to the next process during 6 tacts, so it looks like a flow line.
  • the six lots that came out of the low-pressure CVD process are divided and timed, so that lots can be created as if for each tact time.
  • Low-pressure C VD process Produced as if it were paid off.
  • the size of the buffer obtained as described above is stored in the module definition file.
  • the procedure is as follows.
  • a series of processing operations are performed several times in the entire manufacturing process.
  • the following series of processing operations can be mentioned (washing ⁇ diffusion ⁇ resist coating ⁇ exposure-development).
  • a series of processing consists of the processing equipment (process (e), process (f), process (a), process (mouth), and process (c)) shown in Fig. 1, a special work area connecting these The transport system 5 is provided (here, the transport system 5a).
  • the product moves to the next process through the inter-work area transfer system 5a in a predetermined order in a series of processes.
  • the transport system 5a between the work areas transports the product with the specified tact.
  • the transfer of the product to the transfer system 5a between the work areas in each processing device 3 can be performed with a predetermined tact via the transfer system connection device 4.
  • Each product has a code attached to the wafer or cassette that carries the wafer so that it can be distinguished from other products.
  • the processing apparatus notifies the controller 7a in the work area of the completion (Step 1).
  • the controller 7a in the work area asks whether the product can be transferred to the transfer system 2 in the work area (Step 2). If the answer is “No” from the transport system 2 in the work area, the product is waiting in the processing equipment 3.
  • the controller 7a in the work area instructs the processing device 3 and the transport system 2 in the work area to transfer the product to the transport system 2 in the work area. (Step 4).
  • Step 7 Made When the controller 7a in the work area confirms that the product has been transferred to the transfer system 2 in the work area (Ste P 5), a command is issued to the transfer system 2 in the work area to carry the product to the transfer system intermediary device 4. Yes (Step 6). Execute it in Step 7.
  • the controller 7a in the work area and the host computer 1 receive a transfer completion signal from the transfer device 4 (Step 8).
  • the host computer 1 determines the next work area 6 and the transport system 5 between the work areas to be transported there, and in Step 10 the controller 7a in the work area and the transport system controller between the work areas are transported there. 7 Instruct d.
  • the inter-transfer system controller 7c asks the inter-work carrier controller 7d whether the inter-work carrier system 5 can transfer the product (Step 1). If the answer from the inter-work area transfer system controller 7d is "No", the product is put on standby in the transfer system interlocking device 4, and if "Yes", the product is transferred to the inter-work area transfer system 5 (St mark 12) (Step 13) . When the transfer is completed, it is transported to the next area (Step 14 to Step 20).
  • Step 21 When the product is transferred to the transfer system connecting device 4 in the next work area, the wafer is checked again (the identification code is checked) (Step 21). If it is wrong, the transfer system controller 7c puts the product on standby in the transfer system 4 and notifies the host computer 1 via the controller 7a in the work area, Computer 1 informs the outside (worker) (Step 22). If the product is correct, indicate the arrival of the product to the next controller 7a in the work area, indicate the ID and tact, and request processing (Step 23). .
  • the controller 7a in the work area listens to the processing device 3 for the acceptance of the product (Step 24). If any of the processing devices 3 is not accepted, the product is delivered. Controller 7a in the work area instructs the transfer system 2 in the work area to send the product to the processing device 3 if it is ⁇ waited '' by the transmission intermediary device 4-(Step 25 to Step 34) . When the transfer is completed, the controller 7a in the work area instructs the processing device 3 to process (Step 35).
  • a dedicated transport system 5 between the work areas is provided (in Fig. 1, transport systems 5a to 5f).
  • Each inter-work area transfer system 5 a to 5 ⁇ ⁇ is controlled to operate at each tact.
  • the next series of processing is started (for example, the transport system 5a ⁇ the transport system 5b).
  • the host computer 1 completes a series of processes from the transport system controller 7 in the ⁇ ⁇ area of the transport system 5a, checks the status of the transport system 5 from the transport system controller 7 in the work area of the transport system 5b, and moves. If it can be loaded, transfer the product. If not, wait until the transport system B becomes empty.
  • the product is changed one after another by changing the transfer system 5 between the work areas, that is, a series of processing is performed from one to the next, and the product is completed.
  • the above-mentioned series of operations is, for example, 5a ⁇ 5b ⁇ 5c ⁇ 5d ⁇ 5b ⁇ 5c ⁇ 5a.
  • the production volume to be manufactured per day is determined by the production plan, and here, it is assumed that 900 wafers are Z days.
  • Semiconductors are usually assembled into 25 units of wafers in one unit (lot) and transported in a transport cassette. That is, the production number is 36 lots a day. Assuming 24 hours a day operation, production must be carried out at a production rate of 1.5 lots Zh from the time the product is put into the line to the time it is paid out.
  • the transfer tact of each transfer system is 0.75 lots / h for transfer system 5a, 0.75 lots for transfer system 5b / h, 0.5 lot / h for transfer system 5c and 1.5 lot / h for transfer system 5d.
  • the transport system 5c includes work areas for process (a), process (mouth), process (c), process (h), process (g), and process (f).
  • the number of processing devices is also set so that this series of operations is performed with the specified tact, and in accordance with the tact in hardware.
  • the processing speed of the processing device 3 is faster than the tact, the product waits in the transfer system connecting device 4, and the transfer system connecting device 4 is transferred to the interworking transfer system 5a to match the tact. At this time, whether to wait in the transfer system connection device 4 for processing or to wait after finishing the processing differs depending on each product. Conversely, if the processing speed of the processing unit 3 is slower than the tact time, the processing unit 3 in the work area 6 is added to shorten the apparent processing time (for example, if a certain processing unit takes twice the tact time) Use two processing units instead of one). When one work area is used by a number of transport systems, the number of processing devices 3 is set so that the products in each transport system can be handled at once.
  • FIG. 6 Another embodiment is shown in FIG.
  • the work areas 6 are arranged in the order of a series of processes, and the work areas are connected.
  • the transport system between the cells is linear, and the product is moved by reciprocating movement instead of circulation. I do.
  • the product enters the next series of processing in the transfer system connection device 4.
  • the process (e) ⁇ the process (f) ⁇ the process (a) — the process (mouth) ⁇ the process (c) are arranged in order, and the work area Intermediate transfer system 5 Subtract a.
  • the product is conveyed in a reciprocating motion, and the product that has completed a series of processing is transferred to the next series of processing (for example, the conveying system 5a to the conveying system 5b) on the conveying system connecting device 4.
  • FIG. 5 Another embodiment is shown in FIG.
  • the transfer system 5 between work areas is provided with a transfer system 5 between work areas that arbitrarily connects the work area 6 with another work area 6.
  • the transport system is selected and turned around in order by selecting the transport system.
  • the process (e) and the process (h), the process (h) and the process (a), the process (a) and the process (mouth), the process Products are flowed in the order of the process by selecting the transfer system that connects the (mouth) and the process (c).
  • FIG. A transfer system between work areas is provided virtually, not physically, and only one transfer system 5 between work areas is provided.
  • This transport system enables transport between any areas.
  • the host computer 1 controls the transport system 5 between the dedicated work areas as if it were.
  • the transport system 5 between work areas is composed of several transport vehicles, and one transport vehicle cannot carry one unit of power.
  • This one unit ⁇ eha may be either a single unit or a lot unit.
  • the processed product is placed on the transport trolley of the interworking transfer system 5 via the interworking transfer device 4 for the work area and transferred to the next work area.
  • the transfer system connecting device 4 reads the identification of the product and sends the data to the host computer 1.
  • the host computer 1 is a product of this series of processing.
  • the host computer 1 When the signal of "received" returns, the host computer 1 allows the transport inter-connection device 4 to flow the processed product Xi to the inter-work area transport system 5, and transports the "unreceived" signal.
  • the intermediary device 4 is put on standby. At this time, even if the product Y (j) of another series of processing is completed after the product X (i) in the same area, the processing was completed immediately before in the next work error in that series of processing work If the product Y (j-1) has been received, it shall flow to the inter-work area transport system 5 first.
  • the inter-work area transfer systems 5a to 5f shown in the first embodiment virtually exist in the present embodiment.
  • the transport system 5a and the transport system 5b use the same work area process (e).
  • the product for the transport system 5a has been processed and should be transported to the next process (F), but there is no signal from the controller 7a in the work area of the process (F) that received the preprocessing and product. In this case, the product waits in the transfer system connecting device 4. If the processing of the product for the transport system 5b is completed after the product for the transport system 5a, and there is already a signal that the pre-processed product has been received from the next work area process (a), the transport system The splicer 4 first feeds the products of the transfer system 5 b to the transfer system 5 between work areas. In this way, the product flows as if several transport systems exist.
  • FIG. 6 of the previous embodiment is optional continuous
  • the equipment will consist of equipment that sequentially and sequentially processes multiple series of processes (A, B, C).
  • an apparatus of the same kind of repetition process cleaning-diffusion ⁇ resist coating-exposure-development
  • a transport system will be provided to directly splice these five types of equipment. This transport system is only instructed to transfer the product from cleaning to diffusion ⁇ resist coating ⁇ exposure ⁇ development. This washing ⁇ diffusion ⁇ resist coating ⁇ exposure ⁇ development is apparently performed as one continuous apparatus.
  • FIG. Another embodiment is shown in FIG.
  • the processing apparatuses required for a series of processing are collected instead of being arranged consistently as shown in the previous embodiment.
  • These processing devices 3 and one shared transfer system connection device 4, and the transfer system connection device 4 work and a transfer system in a work area that connects several processing devices 3 to each other.
  • the transfer system 2 in the work area is installed radially with respect to the transfer system connecting device 4, and the processing device 3 is connected to each transfer system connecting device 4.
  • Products undergoing a series of processing are transferred to the next processing apparatus 3 via the shared transfer system connecting apparatus 4.
  • the products that have completed a series of processing are transferred to another work area 6 via the shared transfer system connection device 4.
  • FIG. 7 shows still another embodiment of the present invention.
  • work areas 6 having different processes are grouped to form a work area 9 in which one continuous process is apparently executed.
  • six ⁇ areas 9 a to 9 ⁇ are formed. These work areas are connected by a single work area transfer system similar to that shown in the embodiment of FIG.
  • the control method of the transfer system is the same as that of the embodiment of FIG.
  • a line with a small amount of work in process and a short time can be realized with a simple transfer system without providing a dedicated production line for each product type and without changing the line layout.
  • FIG. 8 shows one effect of the present invention.
  • FIG. 8 shows the results and the number of devices when a semiconductor production line producing 680 wafers per day is realized by a job shop, a flow shop, and the present invention.
  • job completion in the case of a job shop, there is no special consideration on how to flow products, so waiting occurs for each process, and the job completion is greatly lengthened.
  • the present invention since the product flows at the tact time, there is an effect that the completion is greatly reduced.

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  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
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Abstract

Procédé de production de semi-conducteurs permettant de déplacer des produits entre des dispositifs de traitement respectifs, comme s'il y avait des ateliers monogamme, de manière à réduire les heures de travail entre les procédés respectifs, à améliorer la fiabilité par un approvisionnement stable et à assurer la production rapide d'une multiplicité de types d'articles. Ledit procédé de production prévoit une zone de travail comprenant les dispositifs de traitement, des systèmes de transfert permettant de relier entre elles lesdites zones de travail, et des dispositifs permettant de relier ces dernières aux systèmes de transfert. On empêche le traitement global d'être interrompu seulement suite à une défaillance d'une partie des dispositifs de traitement grâce à un ordinateur de commande qui permet de réaliser un programme de production (cadence) d'une manière prédéterminée, et finalement de réduire le temps de déroulement du processus. On peut, par ailleurs, résoudre le problème posé par une série de processus pour des produits respectifs au moyen d'un logiciel et, assurer une production rapide d'une multiplicité de types d'articles du fait qu'il n'est pas nécessaire de réajuster les dispositifs et de modifier les chemins de transfert.
PCT/JP1994/002210 1993-12-27 1994-12-26 Procede et appareil de production continue d'une multiplicite de types d'articles Ceased WO1995017993A1 (fr)

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JP5/330626 1993-12-27
JP33062693 1993-12-27

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0810632A3 (fr) * 1996-05-28 1998-06-10 Applied Materials, Inc. Procédé et appareil pour transférer des plaquettes dans une installation de traitement de plaquettes
US6131052A (en) * 1996-10-08 2000-10-10 Mitsubishi Denki Kabushiki Kaisha Semiconductor manufacturing non-processing apparatuses with storage equipment
CN108529191A (zh) * 2017-03-01 2018-09-14 东洋自动机株式会社 中继装置

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