WO1995017993A1 - Method and apparatus for continuously producing a multiplicity of types - Google Patents

Method and apparatus for continuously producing a multiplicity of types Download PDF

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Publication number
WO1995017993A1
WO1995017993A1 PCT/JP1994/002210 JP9402210W WO9517993A1 WO 1995017993 A1 WO1995017993 A1 WO 1995017993A1 JP 9402210 W JP9402210 W JP 9402210W WO 9517993 A1 WO9517993 A1 WO 9517993A1
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WO
WIPO (PCT)
Prior art keywords
work
eria
system
transport system
processing
Prior art date
Application number
PCT/JP1994/002210
Other languages
French (fr)
Japanese (ja)
Inventor
Yoichiro Tamoto
Sadao Shimoyashiro
Hiroyasu Sasaki
Takemasa Iwasaki
Masao Sakata
Tomoyuki Masui
Hiroyoshi Matsumura
Original Assignee
Hitachi, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP33062693 priority Critical
Priority to JP5/330626 priority
Application filed by Hitachi, Ltd. filed Critical Hitachi, Ltd.
Publication of WO1995017993A1 publication Critical patent/WO1995017993A1/en

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Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/4189Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by the transport system
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q41/00Combinations or associations of metal-working machines not directed to a particular result according to classes B21, B23, or B24
    • B23Q41/02Features relating to transfer of work between machines
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67276Production flow monitoring, e.g. for increasing throughput

Abstract

A semiconductor production method for moving products between respective processing devices as if there were some flow shops to thereby reduce labor hours between respective processes, improve reliability through stable supply and promptly deal with production of a multiplicity of types which comprises a work area comprising the processing devices, transfer systems for connecting work areas with each other and devices for connecting the work areas with the transfer systems, whereby the entire processing is prevented from totally getting down only due to the failure of a part of the processing devices through control by a computer to thereby fullfil a production schedule (tact) in a predetermined fashion, eventually resulting in reduction of time required for completion of the process. In addition, a series of processes for respective products can be solved through software, and since there is needed no rearrangement of devices and change to the transfer paths, it is possible to promptly deal with production of a multiplicity of types.

Description

Akira fine manual wide variety of continuous production methods and apparatus

Technical field ' '

The present invention production relates to a manufacturing system, in particular, in the working process long process, the order to realize a suitable production system for multi-product variable production line with a repetition process relates to high-mix continuous production method 及 Pi device .

BACKGROUND

Conventionally, production line of semiconductor and thin-film process products, for example, JP-5 6 - 1 9 6 3 As seen in 5 discloses, processing a workpiece (Ueha), conveyance and processing for storing high cleanliness that require a clean atmosphere that established a device such as a work Eria and incidental facilities Ya Interview one utility is installed has been separated to the preservation area that does not require. Therefore, since these are efficiently placed, the structure of the work area (pay) and conservation areas on both sides of a central passage called pay scheme provided alternately have convex. Arrangement of the processing apparatus was arranged apparatus for performing the same type of treatment in one Tsunobe I was called job shop type.

Further, the base I scheme, the Uweha the completion of the processing of the step, the conveyance to the processing device of the next step, carried out by a transport between base I 內 transport and Pei, Uweha the entrance of the base I, which is a connection point thereof the has been provided a stocker for accommodating the storage and cassette. That is, base I in the transfer is intended for transporting the cassettes between the Sutotsu force and processing device provided at the entrance of the pay, base I between conveyance of the base I from list Tsu force other Bei Sutotsu it is intended to convey the cassette to the force. In general, the transfer of the wafer to the processing unit from the processing unit has been carried out by the route, such as that the transport vehicle of the transport vehicle → Sutotsu force → base within the I between the transport vehicle → stocker → base I in the base I.

However, there is a problem shown below in these conventional production methods.

First, semiconductor manufacturing processes have many number of processing steps, further, since repetition of the same steps is large, the conventional such base I scheme conveyance path between flatly I as shown in the first 9 Figure complicated, the transport It will be to spend time in. Solid zigzag in the first 9 drawing shows a conveyance path of Uweha. Further, since the device of the previous steps of the apparatus and later step is not known state, the synchronization processing between devices bets made Rinikuku. Therefore, increasing the amount of rent-process at each base I, as a result, there is a problem that E can (time-to-market is completed) is longer.

To solve this problem, document (Electrical Gakkai: Electrical Engineering Handbook New Edition (1988 years), 1 6 6 6 pages) as described in the production line, and laying out apparatus in order of steps, a constant supplying the product time interval (tact) of processed, it is also conceivable to so-called flow-shop system for performing production in series of flow operations. Since the process off port one is different for each type of product in the case of flow-shop type, it is necessary to provide each of the respective process flow line arranged processing apparatus in response, difficult correspondence to the multi-product production is there.

Further, in the processing such as semiconductor products, the time required for processing by the processing steps are significantly different. For example, heat treatment or the like for the uniform ion density distribution in Ueha is take several hours, the step of implanting ions into Ueha is several minutes. To the same tact in the flow line, when such a processing time in about Kakue differ significantly from, increases the play time of the short processing apparatus processing time, operating rate resulting in a greatly reduced . Furthermore, even if that can process multiple steps in a single apparatus, for arranging the device in the order of processes, a need for an apparatus for the number of the number as E, Ru mower problems overall device number line is increased . -

Further, in correspondence with the multi-product production, the literature (Nikkan Kogyo Shimbun: diversified production system (1970 years), 7 1-8 6 pages) as described in, aggregate processing similar varieties Therefore, the aggregate varieties with machining sequence similarity, constitutes a line to group I spoon processing apparatus corresponding thereto, there is a production system according to group Techno port di one approach. Thus, the number of steps when the semiconductors Doing grouping many, since differs process sequence for each breed, the number of groups is enormous.

The present invention provides a method and apparatus for efficiently producing the product of each variety. Disclosure of the Invention

In order to solve the above problems, the present invention, considered a method of producing rather 如 flowline semiconductor. Here, 1) rectifying the flow, 2) module creation, 3) module grouping, 4) method for arranging equipment, 5) will be described conveyance method and 6) control of six means.

Flow rectifying I human: focused the same type of processing as typified by semiconductor manufacturing special properties of the flow of processing is repeated at DoSo location (see the first 1 Figure). The semiconductor is fabricated on top making a thin film several layers, each layer deposition (diffusion step, depot step) and → circuit created (photolithographic process) → order (which one cycle of the removal step (etching step) made hereinafter), Yuku superimposed layers of after another and the thin film by repeating this cycle. The flow of this process rectifies the following procedure.

(1) always each step in the cycle unit assumes (diffusion process, photolithographic process, Etsuchin grayed step, etc.) there is, assuming that flows the same flow, performs a classification shown in the first 2 FIG. In this case, no process is the passing step. Each layer is a cleaning and diffusion 'low C VD-C VD' photolithography (application 'photosensitive' development ') Inbura' washed 'etching' consisting of one first step of removal '. Incidentally, the washing 'diffusion · C VD · etching as layer 8 is not in the process flow (first 1 view), they no step is passed.

(2) Further, assuming that there is a facility for each layer unit, creating a flow of lots is not complicated.

The (1), the procedure by an one of backtracking, as shown in the first FIG. 3, the rectification of the step in the flow (2).

Module creation: is defined as the cycle unit of each layer module.

Module Gurupuihi: Here use the process flow is in the same as and process device to a group having the same. In this case, 1 5 module can 4 group.

Equipment located: As a conventional job shop type, how to put together the same type of unit (Figure 1, first example of FIG. 2), a method of placing classified for each module group (of FIG. 5 example) there is. Further, a module adopts Jobusho-up method, a module is may be positioned method combination of using modules each method (example of FIG. 7).

Transport means: a dedicated transport system for each module group (FIG. 1, FIG. 2, an example of FIG. 5). However, if the module group are similar good also serve the transfer system (shared) (FIG. 4, FIG. 6, an example of FIG. 7). When using shared the transfer system performs 如 rather control a dedicated transport system of each module group exists. A similar module group include the following as an example.

· Configure module group, but the process is the same as the equipment used is different.

'When the step of forming one module group includes a step of forming another module group.

Control means: is constituted by the following three main unit. 1) inter-module determination means, 2) module tact transport means, 3) the processing-apparatus selecting means. Inter-module determination means: products (semiconductors) specific processing with the a (flow) on the basis, or to use any module, also determines whether to perform in the order of which module.

Module tact transport means: means you transported within the product tact for each module.

Processing-apparatus selecting means: forces choose to use any device the conveyed product. A simple flow of products to the first 4 FIG.

Hereinafter, the operation of the present invention.

To create a cycle performed by go-between cutting the manufacturing process in the flow of the full opening one. Here are collectively a similar cycle to the one to create a module. This rectifies the flow of the line, which has been complicated in the past, you easier to understand the flow control manner. Further, since the flow things in tact in the buffer provided in each module, the transfer system without having to manage the sequence of the entire process, the control is facilitated since only it Re be conveyed to the next step.

Treatment of the product of a process has ended, the processing from the processing area went, to Eria processing the next, the next processing is conveyed by only the conveyance system that conveys the product in the order of steps is performed. Dedicated transport path, the product has completed processing at predetermined time intervals (tact), since the supply to sequentially subsequent step, for each area is supplied without product stagnates, in each processing area, the product at the same production rate it can be processed.

Prior to the first 5 Figure shows a comparison of examples of (job shop type) and the present invention (module device classification scheme 'per Virtual modularity). Can and variations in production is less shorter than the conventional in the manner of the present invention. This is due to flow of the module.

In the method of Mojiyunore device classification is performed in series one by one the 3 steps as seen in the example of the first 7 view, establish that the line does not stop due to a failure is 3 4. 3%. The virtual modular contrary, it is possible to use the device in parallel, it is possible to avoid a line stop due to equipment failure. Confidence be performed in this case three steps in each Santai extends and 9 2. 1%. It shows this rationale in the first 6 FIG. BRIEF DESCRIPTION OF THE DRAWINGS

Overall configuration diagram of a first embodiment of Figure 1 the present invention, FIG. 2 second is an embodiment diagram showing a line configuration tasks Eria are arranged in order of processing the present invention, FIG. 3 is the present invention the third is an embodiment diagram showing a line configuration by the transport path of any combination, Figure 4 shows a fourth an embodiment one of the transport path by the line structure of the present invention FIG, Fig. 5 present the fifth is an embodiment diagram showing a line configuration for continuous processing in Eria the invention, Figure 6 is a sixth diagram showing a line configuration for a single handle some are areas an embodiment of the present invention , FIG. 7 is a seventh an example diagram showing a line configuration according to one transport path of the present invention, Figure 8 shows the equipment number of vehicles related to the process diagram, FIG. FIG. 9 is showing a work procedure the first 0 Figure communications embodiment FIG first 1 Figure semiconductor manufacturing procedure Moshikyi匕 (flow) FIG, first Fig. 2 flow in the first 1 Figure Classification split view of over the first 3 Figure rectifying view of a step, the first 4 figures comparison diagram, the first 6 view and first 7 diagram of a first 5 Figure flowchart of products prior art and the present invention is present equipment group illustration of the invention, the first 8 FIG Gantt chart view of the module production situation, the first 9 is an explanatory view of a prior art. BEST MODE FOR CARRYING OUT THE INVENTION

The present invention will be described in detail with reference to the drawings.

Example 1

Figure 1 shows the layout of a semiconductor manufacturing apparatus, for example. Each work Eria 6 includes a plurality of the same type of processing device 3, the processing unit 3 are connected by the work Eria the conveying system 2. Working Eria the conveying system 2 is continuously in the work area in the controller 7 a via the communication cable 8.

The work area 6, provided with the ID reader 1 1 to read the code attached to the product to be transported into the working area 6 (cassette for transporting semiconductor © E one tooth, or Ueha), the work area notify the inner controller 7 a.

In the embodiment of FIG. 1 shows an example of work Eria 6 is prepared 7 force plants.

Each work Eria 6, carried to the product of the work Eria, a conveying system between Wei TECHNICAL device 4 for discharge, the transfer system between the splicing device 4, Ru connected by the transport system 5 between the working Eria.

In the present invention, rice ^ II area between the transport system 5 is not fixed, depending on the processing mode of the product, the transport system of the most efficient dedicated Ru constructed. In the embodiment of FIG. 1, as the transport system 5 between the working area, indicating that six of the conveyance system shown in conveying system F from the conveying system A are prepared. The host computer 1 via the transfer system controller 7 d between the work area, and controls the respective carrier.

Next, a description will be given of the operation of the device.

The apparatus consists of two major functions. One is to cut the flow portion flows during line design, it is collectively cut portions flows, a process for creating a flow line called modules in the combined unit. Second, during the actual production, it manages progress of the product for each module, by controls the conveyance, is a process that allows for the production tact. First, the procedure will be explained at the time of line design.

Schematized the semiconductor manufacturing procedure (flow) shown in the first 1 FIG. Here shows a semiconductor consisting of one 5-layer, the "layer 1" corresponds to the first layer, washed, diffusion, low pressure C VD (chemical vapor deposition), photolithography (exposure), Wetsuchingu, dividing removed by (resist It consists of six steps of removal). Such formation of the layers is repeated 1 five times, one of the semiconductor is completed.

Next, divide the flow (first Figure 1) focuses on photolithographic process to Saikunore (units forming the one layer). The rules for the division are shown below.

(1) photolithographic process is divided into a reference.

(2) washing, the order of the steps of diffusion or the like is divided into partial flows flows to prevent reverse rotation.

The results are shown in 1 2 Fig. The order of steps Ni will be described at the top, wash (diffusion), diffusion, low pressure C VD, photolithography, Inbura (ion Note ON), washed (for etching), etching, becomes in the order of removal.

Therefore, when attention is paid only to the photolithographic process, the first cycle, the first layer and the second layer (since there is no photolithographic process) becomes a cycle. When the Tokoro force cleavage of such flow would come the "layer 2 wash" after "the layer 1 is removed", the cleaning step (for diffusion) may overlap. Such, when there is an overlap process, the first cycle is not a flow line. Therefore, using the preceding division rule (2), dividing the second layer in the second cycle. As a result is shown in the first 2 FIG. That is, the first layer'm urchin washed mentioned above, diffusion, low pressure CVD, photolithography, etching, Ri Do the six steps of the removal, the second layer is washed, diffusion becomes 3 steps Inbura. Similarly cutting the process flow is divided into a 1 to 1 5 cycles.

The divided result is stored in the module definition file.

Next, the process comes out to each layer (washing, diffusion, photolithographic, etc.) focused on, grouping similar cycle, to the module. For example, this is summarized in the module with the following rules. The method of this module Summary utilizes computer facilities number from a large amount of combinations may be searched combinations that minimized. (1) focuses on Inbura process, and a module with Inbura step, divided into no module.

(2) diffusion, focusing on the low-pressure C VD process, there only diffusion process module is only low pressure C VD process module is divided into modules with both diffusion process and low C VD process.

When classifying cycle the two rules can be classified four modules shown below the first 2 Figure (A, B, C, D) to. For example, cycle 1, 3, 6, 1 1, can be classified washed, diffusion, low pressure C VD, photolithography, etching, the module C consisting removal. Similarly shows the module name for each cycle in the upper part of the first 2 FIG.

The results of the classification of this cycle is also stored in the module definition file.

Next described of determining the number of facilities and the buffer capacity of each step in the module.

Here, a description will be given equipment number and buffer capacity of the modules C. First, it gives a target production quantity. This is, to determine the production amount that is produced in this production line in advance, the target production amount.

Ingredients target production volume>

2 5 0 sheets day (2 five Z lot) = 1 0 Lot Z Date

In module C as previously described, to process the four cycles. Ku number of cycles>

4 cycles (cycles 1, 3, 6, 1 1) <target tact>

2 4 H r X 6 0 minutes Z l 0 Lot Z 4 cycles = 3 6 min • The processing time of each process, the process outlet Wattage is as follows (Ku cleaning>

Processing time: - 7 7 minutes

Processing π Tsu Bok number: 1 π Tsu Bok

Ingredients diffusion>

Processing time: 3 6 0 minutes

Processing opening Tsu Bok number: 6 π Tsu Bok

<Low pressure C VD>

Processing time: 3 6 0 minutes

Processing the number of lots: 6 Lot

<Photolithography>

Processing time: 5 5 minutes

Processing opening Tsu Bok: 1 lock Bok

Ingredients etching>

Processing time: 7 0 minutes

Processing the number of lots: one lot

<Removed>

Processing time: 7 7 minutes

Processing opening Wattage: 1 Lot

Therefore, equipment number of each step is determined by the following equation. Facilities Number = [processing time] <equipment number of steps> ÷ [target tact] ÷ [number of processing lots] For example, in the cleaning step,

7 7 ÷ 3 6 + 1 = 2. 1 4 units

So, the three necessary.

The same diffusion process,

3 6 0 ÷ 3 6 ÷ 6 = 1. 6 7 units

So, it is necessary two.

To store the equipment number obtained in the above procedure in the module definition file. Next, based on the facility number obtained, a representation graphically that the production status of the module Gantt chart is a first 8 FIG. This figure, the horizontal axis represents time (in the case of FIG represents 3 6 minutes 1 scale 1 tact), represents the sequence of steps in the vertical axis, the equipment in each step. For example, first lot is treated 7 7 min wash 1 equipment, then are pooled in the buffer. Here, while the cleaning process is a process of single-necked bit basis, the diffusion process is the process of 6 batches, the temporary store lots by providing a buffer between the cleaning step and the diffusion step.

6 lots are sent to the diffusion step at ivy time Tama 6 lots in this buffer. If you were mosquitoes, different viewpoint, the buffer In the diffusion process, the lot from the washing step every 3 6 minutes are considered to have been sent to the next step. It cleaning process and the diffusion process is that operating as a flow line. Thus, If we lot is paid out on time tact between each step, work-in-progress is not generated between the process, it can be produced as flow lines. .

However, diffusion process and low C VD process are the batch processing step, no go sent lot data 'transfected time. While with force, given by becoming at 6 tact (2 1 6 min), since 6 lots between 6 tact is sent to the next step, apparently it has become flow line.

In addition, by providing a buffer between the low-pressure C VD process and photolithographic process, by dividing the 6 lots came out together from the low C VD process, yet that achieve timing, is as if the lot every tact time It produced as if they are paid out step force these low C VD.

By performing in this way the production of the module, can be operated one module as flow one line.

Storing the size of the buffer determined as described above in the module definition Fairu.

Of the two major features of this device, two functions are operational decided procedure of when you operate the production line. This procedure is as follows.

(1) work record update: When processing of the lot was completed in the equipment of each of the steps, tell the progress management system in the host computer the finished report via the controller work area. The progress management system, altered during transport the lot status of the lot from being processed.

(2) transport destination calculated: then in progress management system obtains the module definition file or al transfer destination process, then washed out the corresponding equipment to the process. (3) transport instruction: instructs the transport control system urchin I for transporting the port Tsu preparative to equipment which is determined by the transport destination is calculated, the progress management system. In accordance with the instructions, it is transported by the transport system.

(4) production instruction: When the port Tsu preparative arrives at device transport destination instructs the work area in the controller a production instruction for the port Tsu retrieved from the host computer.

In the procedure as described above, it is the control of production you Yopi logistics in the module. It will be described in detail by connexion present invention in Figure 1 to the first 0 following drawings.

In semiconductor manufacturing, 'a series of processing operations as described above is carried out several times in about the entire production E. A series of processing operations in the following can be mentioned as examples (washing → diffusion → resist coating → exposure - development). Processor with a certain series of processes in Fig. 1 (step (e), step (to), the step (I), step (mouth), step (c)) when the consist, between dedicated work Eria connecting these providing a transport system 5 (conveying system 5 a in this case). Products through the working E rear between the transport system 5 a in a predetermined order a series of processing proceeds to the next process.

Working area between the transport system 5 a conveys the product on tact defined. In this case, transfer to the working Eria between conveying system 5 a product at each processing apparatus 3 through the transfer system between the splicing device 4, and summer as performed in a defined tact. The concrete flows along in FIG. 9 will be described.

Each product code so as to identify the other products are attached to a cassette for transporting the Uweha or Uweha. When the product processing is completed, the processing device notifies the fact of the working area in the controller 7 a navel (Step l). Work area § within the controller 7 a listen Utsuri载 possible or the product to work E Li Ryonai transport system 2 (Step 2). If from the work area in the transport system 2 of the answer "No", the product waiting in the processor 3. Instruct the time, work Eria the controller 7 a to transfer the product to the working area in the transport system 2 in the conveying system 2 and the processing unit 3 working Eria obtained a signal "permitted" from the work area in the transport system 2 to (Step 4). When that product is Utsuri载in the conveying system 2 work Eria work Eria the controller 7 a verify (Ste P 5), into the work area in the transport system 2 so as to transport the product to the transport system between splicing device 4 command (Step 6). To run it in Step 7.

The work area in the controller 7 a and the host computer 1 receives the signal of the transfer completion from the transfer system between Wei TECHNICAL device 4 (Step8). Host Combi Interview one motor 1 at Step9 determines the working Eria between conveying system 5 for carrying thereto the next task Eria 6, the work area in the controller 7 a and the work E rear between transfer system controller to transfer thereto at STEPL 0 to instruct the 7 d. Transfer system between splicing device controller 7 c is the conveyor system 5 between the working Eria hear product Utsuri载 possible or work Eria between conveying system controller 7 d (Stepl 1). Reply work area between transfer system controller 7 d is transferred to the work area between the transport system 5 if allowed to wait for the product if "No" in the transport system between splicing device 4 "possible" (St mark 12) (Step 13) . Once the transfer is complete and conveyed to the next area (Step 14~Step 20).

When the product to the transport system between splicing device 4 of the following tasks area is transferred to the check again © E Doha (check identification code) (Step 21). If the wrong things the transfer system between the splicing device controller 7 c If the to wait the product in splicing equipment 4 between the transport system, .. informs the host computer 1 to that effect through the working area in the controller 7 a, host computer 1 causes known to the outside (workers) (Step22). As long as the product is correct, the next work area controller 7 a shows the product of arrival our Yopi ID tact, the request for processing (Step 23). .

Work area in the controller 7 a is to the processing unit 3 acceptance of the product hear "possible" force (Step24). Which processor 3 is also waiting conveyance system between splicing device 4 products if acceptance is "No", "Yes" if urchin work Eria the controller 7 a by sending the product to the processing unit 3 is conveyed in the working Eria instruct the system 2 - (Step 2 5~Step 3 4). Working area in the controller 7 a After completing the transfer instructs to process the processing unit 3 (Step 3 5).

This series of processing operations provided some provided a work area between the transport system 5 own dedicated (conveying system 5 A~5 f in Figure 1). Conveying system 5 a~5 ί between each work area is controlled so as to operate in each tact. A series of processing enters the next of a series of processing when you are finished (for example transport system 5 a → transport system 5 b). The host computer 1 receives the completion series of processing from the transport system 5 a of ^ Y area conveying system controller 7, ascertained from the working Eria the transfer system controller 7 of the transport system 5 b the status of the transport system 5, transfer to transfer the placing possible product, to wait for an available the conveying system B if impossible. Products are changing the transport system 5 between one after another work E Ria, that I and complete perform a series of processing from the next to the next.

Here shows a specific method of setting tact. There series of operations described above in the manufacture of products, for example 5 a → 5 b → 5 c → 5 d → 5 b → 5 c → 5 a force Rana Rutosuru. Production of manufacturing a day defined by production planning, here, the Uwe Nono 9 0 0 Like Z day. Semiconductors normally Ueha 2 5 sheets together as a unit (lot), are conveyed are accommodated in the cassette for transport. In other words, the number of production is 3 6 Rottono date. When 2 a day 4 hours operation, 1.5 must be carried out production in the lot Zh of the production rate from was put on line until payout. The series work 5 a → 5 b → 5 c → 5 d → 5 b - → 5 c → 5 transportable for respective carrier in a feed tact transport system 5 a in 0.75 Lot / h, conveying system 5 b at 0.75 Lot / h, transport system 5 c in 0.5 lot / h, the transport system 5 d at 1.5 lot / h.

It will now be described processing functions of the area. Gel on taking the transfer system 5 c as an example. Conveying system 5 c the step (I), step (mouth), step (c), step (h), consisting of the work area of ​​the step (g), step (to). Also set the number of processing devices to match the tact performed by the 'sea urchin hard surface in tact this series of operations is found set.

If the processing speed of the processor 3 is faster than tact, product waits in the transfer system between the splicing device 4, the transfer system between the splicing device 4 to suit the tact transfers to the transport system 5 a between work Eria. Either process waits this time by the transport system between splicing device 4, or waits to end the treatment varies with each product. Further, if the processing speed of the processor 3 conversely slower than tact, work Eria process installing additional equipment 3 in 6, shortens the apparent processing time (for example, processor if such double tact , to two instead of one processing unit) to fit in tact. In the case of using the a number of conveying system one work area, set the number of processing devices 3 to accommodate even pottery products respective carrier arrives at a time.

Example 2

Another embodiment shown in Figure 2. Mobile work in the arrangement method of area 6, to place the work Eria 6 in the order of processing is a series, connecting the working Eria ^ a ¾ E Re § between transport system in a straight line, back and forth motion instead of circulating the product to. In the transfer system between the splicing device 4 product enters the following sequence of processes. For example, in the transport realized by the transport system 5 a shown in Example 1, step (e) → step (to) → step (I) - step (mouth) → step (c) was lined up in sequence, the work area draw between the transport system 5 a. Products are conveyed in a reciprocating motion, the product series processing has been completed is moved to the next series of processing (e.g., the transport system 5 a → conveying system 5 b) placing on the conveying system between splicing device 4.

Example 3

Another embodiment is shown in Figure 3. Working Eria between conveying system 5 provided work Eria between the transport system 5 splicing optionally and during other work Eria 6 between work Eria 6.

One set of processes is around in order to select the transport system to the required process. The transport is realized by the transport system 5 a shown in Example 1 For example, process (to) step (e), step (to) and the step (I), step (I) and step (mouth), step (mouth) and flow the product in process order by selecting a transport system connecting the step (c). Example 4

Another embodiment is shown in Figure 4. Between working area transport system, physical and virtually provided no, the transfer system 5 between the work area provided only one. It allows the transport between arbitrary area in the transporting system. The host computer 1 controls so that though the transport system 5 between dedicated work area.

It is shown below as an example of a control method. Working Eria between transport system 5 is by connexion configured into several transport vehicle, one of the conveyance carriage can not put Ueha to force a unit. It may be either a lot single-position of the case in a single unit of this one unit Ueha. Products completed processing is Serra ride on the conveyance carriage work Eria between transfer system 5 through the transfer system between the splicing device 4 of the work E Ria is conveyed to the next working area. At this time, and it reads the identity of the splicing device 4 Yoko product between the transport system, and sends the data to the host computer 1. The host computer 1 This product is the product or (cold Example 1 Idei cormorants, which I Lou product of the transport system 5 between areas) of any series of processing and recognition, just before of this product in the work area 6 to be sent to the next product X between (i) the already transfer system between then sends the transport system working Eria 6 from 5 splicing device 4 to receive one was whether this task Eria the controller 7 a and conveying system Wei TECHNICAL device controller 7 processes ended with the listen to c.

If you came back a signal referred to as "received", the host computer 1 is permitted to flow through the processed product X i to work Eria between the transport system 5 in the conveyance system between the splicing device 4, transport if the signal of "non-receipt" to wait intersystem splicing device 4. At this time in the same area, another series of processing of a product Y (j) were completed processes from after the product X (i),. And treated most recently completed in the next task Eria in that the series of processing operations product Y - if has received (j 1), it is assumed to flow in the transport system 5 between the work previously area. For example, a virtually present work area § between the transport system 5 a~5 f shown in Example 1 of the present embodiment. Transport system 5 b and the conveying system 5 a are the same working area step (e).

While products for conveyance system 5 a is intended to be conveyed in the following will been processed to step (to), treatment before the work area in the controller 7 a step (to), the signal Do is received the goods. Kere if the product is to wait conveying system between splicing device 4. Processing products for the transport system 5 b after the conveyance system 5 product for a is completed, if the signal already that from this task E rear step (I) taken delivery pretreatment products, transport system during splicing device 4 to the flow of product in the conveyance system 5 b above the working Eria between conveyor system 5. As some of the transport system this way exists though, to flow the product.

[Example 5]

Another embodiment shown in Figure 5. Working Eria 6 of the previous example is to configure collect multiple series of steps (A, B, C) successive and process equipment for any continuous. For example, Kurikae Shi process of the same type in a semiconductor manufacturing to place a device (cleaning - diffusion → resist coating - - exposure and development) in one operation Eria 6. Providing a transport system for the flow of splicing the 5 types of devices directly. The transport system is a product, cleaning - are only instruction that transfers into the diffusion → resist coating → exposure → development. The washing → diffusion → resist coating → exposure → process as the one apparently developed continuous apparatus is performed.

Example 6

Another embodiment is shown in Figure 6. An apparatus method for arranging 該見 over on one continuous apparatus of the previous embodiment (i.e. in the working area), instead of placing consistently turned into and shown in the previous example, collect process apparatus requiring a series of processes, a transfer system between the splicing device 4 that shares of the processor 3 and one of these, Ru working Eria the conveying system 2 power Rana connecting adoptive device 4 working and some of the processor 3 between the transport system. Working placed radially in a conveying system 2 to the conveying system between splicing device 4 Eria, succeed to the processing unit 3 to respective carrier between splicing device 4. The products during the series of processes via the shared transport system between splicing device 4 is transferred to the next processing unit 3. Further, the transferred products completed processing of a series via the shared transport system between splicing device 4 to another work area 6.

Conversely, products that require a series of processes in this work Eria 6 obtains the transfer system between the splicing device 4 from the conveying system 5 between the working Eria, enters the work area. By placing the device on the radiation shape, it can increase the efficiency of arrangement space used. Further, the product is failure of the processing apparatus 3 before embodiment will be stopped in the working area within 6, shared transport system between splicing device 4 in the present method can be transferred to the processing equipment 3 Usable not be stopped in the work area. Further, there is a method of preparation for failure of the processing unit providing a buffer or the like, in the previous example requires a buffer for each device, the buffer performed by the transfer system between the splicing device 4 in this embodiment, the buffer cost and space can be saved.

Figure 7 shows a further alternative embodiment of the present invention.

In the present device forms a working area Ryo 9 consecutive processing one apparent processing of different tasks Eria 6 to group I spoon is executed. In this embodiment, six ^^ areas 9 a ~ 9 ί is formed. Then, those connecting these tasks Eria the same single work Eria between the transfer system to that shown in the embodiment of Figure 4. The method of conveying system is similar to the embodiment of Figure 4. In the present invention, without providing a dedicated production line for each model, without changing the line layout, less WIP quantity, can be realized short line of E complete with easy prime to the transport system. One effect of the present invention; a ¾ shown in Figure 8. Figure 8 is a semiconductor production line production scale perform production of Uweha number 6 8 0 Like Ζ date, job shop, flow shop shows the device table number and E complete in the case of realization of the present invention. For E completed, in the case of job shop, waiting is generated for each process for especially not taken into account for the way flow of products, significantly E Kan is prolonged. In contrast, in the present invention, because the flowing product in tact, E End is effective to be greatly shortened. In the case of flow shop, be capable of processing a plurality of steps in one device, with respect to device number for the number of steps that are necessary, in the present invention, it can be processed in one area such Therefore, it is possible to process the plurality of steps in one device, there is an effect there is no increase in the number of apparatuses. Another advantage of the present invention, even if the failure is one of the processing device in the area, since the other processing units can be substitute, never the entire process stops. The series of processes corresponding to each product can be resolved on a soft, reordering example of the apparatus, Ru immediate action can be effectively mower high-mix manufacturing since it is not necessary to change the conveying path.

Claims

The scope of the claims
1. Continuously at the production step of performing work, collecting equipment having the same processing function Umate creates several work areas, tied binding Pi, the transfer system between the area with some of the conveyance system wide variety continuous production method characterized by production supply and the product at the same production rate between Renako work Eria.
2. The working area between the other I Lou area between the conveying system arbitrarily splicing provided, the type of products subjected to working, performs the combination of work Eria that the same production rate, though there is a dedicated transport system Yo controls the transport of products, many kinds continuous production method characterized in that supplying and produce products of combination was the area at the same production rate.
3. A transport system is one of the transport system in the range 2 claims, such that there is a dedicated transport system may Ata any series work, many kinds continuous production method characterized by controlling the transport system at the same time .
4. In working Eria of claim 1, wherein, work in Eria is a wide variety continuous production method characterized by configured to collect equipment for processing by successive multiple series of steps any you continuously.
5. Working area of ​​claims 4 consists of equipment group of repeating steps of the same type-mix continuous production method comprising Rukoto.
6. A plurality of work area § configured together a plurality of devices for performing the same type of process, the work Eria the transport system for transporting the product for each processing unit in the working Eria, the control of the working Eria and the controller work Eria performed, tasks and work Eria between transport system for transporting the product between Eria, and transport between the splicing device splicing between work Eria in the transport system and the conveyance system between working Eria, the transfer system between the splicer controller and a controller in the conveyance system between the work area, comprising a host computer that controls the whole production equipment-mix continuous production. between work area conveying system, there a dedicated transport system splicing each work area Te, product-mix continuous production apparatus according to claim 6, wherein, wherein the conveyed sequentially to each work Eria by dedicated transport system according to a series of processing steps. . Working Eria between transport system is a transport system splicing between each work Eria by a straight line, the claims product to feature to be conveyed in a reciprocating motion the transfer system according to a series of treatment steps 6 wide variety of continuous production apparatus as claimed.
. Working Eria between transport system is a transport system that arbitrarily take over between individual work Eria, product of claims 6 wherein the to feature to be conveyed by any route in accordance with the sequence of processing steps wide variety of continuous production equipment.
0. Between work area transport system shall apply in transport systems take over the work area virtually, that the product will be by connexion transported to the transport pathway of the virtual that will be built by the host computer in response to a series of process steps range 6 claims, wherein Symbol
1. Work area is configured to collect a plurality of devices to be processed by successive multiple series of processing steps of any continuous, characterized in that the working area in the transport system is a transport device succeed each device directly various kinds according to claim 6, wherein to
2. Working Eria is a feature that a series of formed collects processing apparatus requiring the treatment, the work Eria the conveyance system to a single transport between splicing device provided in the work Eria is connected to the radially various kinds according to claim 6, wherein the
3. Work area is the work area contiguous treated one apparently working area of ​​different treatment groups I spoon is executed, a virtual working soil Ria the apparent conveyance system between the work area wide variety continuous production apparatus according to claim 6, wherein which is a transport system that succeed in.
PCT/JP1994/002210 1993-12-27 1994-12-26 Method and apparatus for continuously producing a multiplicity of types WO1995017993A1 (en)

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JP5/330626 1993-12-27

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EP0810632A2 (en) * 1996-05-28 1997-12-03 Applied Materials, Inc. Method and apparatus for transferring wafers in a wafer processing facility
US6131052A (en) * 1996-10-08 2000-10-10 Mitsubishi Denki Kabushiki Kaisha Semiconductor manufacturing non-processing apparatuses with storage equipment

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US3889355A (en) * 1973-02-05 1975-06-17 Ibm Continuous processing system

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0810632A2 (en) * 1996-05-28 1997-12-03 Applied Materials, Inc. Method and apparatus for transferring wafers in a wafer processing facility
EP0810632A3 (en) * 1996-05-28 1998-06-10 Applied Materials, Inc. Method and apparatus for transferring wafers in a wafer processing facility
US5975740A (en) * 1996-05-28 1999-11-02 Applied Materials, Inc. Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
US6201998B1 (en) 1996-05-28 2001-03-13 Applied Materials, Inc. Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
US6360132B2 (en) 1996-05-28 2002-03-19 Applied Materials, Inc. Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
US6449520B1 (en) 1996-05-28 2002-09-10 Applied Materials, Inc. Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
US6580955B2 (en) 1996-05-28 2003-06-17 Applied Materials, Inc. Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
US6131052A (en) * 1996-10-08 2000-10-10 Mitsubishi Denki Kabushiki Kaisha Semiconductor manufacturing non-processing apparatuses with storage equipment
DE19706990C2 (en) * 1996-10-08 2000-10-26 Mitsubishi Electric Corp Semiconductor manufacturing system and semiconductor manufacturing method for processing semiconductor wafers on a lot-by-lot basis

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